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    • 5. 发明申请
    • NANOWIRE LED PIXEL
    • WO2017111827A1
    • 2017-06-29
    • PCT/US2015/000385
    • 2015-12-26
    • INTEL CORPORATIONAHMED, KhaledMAJHI, Prashant
    • AHMED, KhaledMAJHI, Prashant
    • H01L33/02H01L33/12H01L33/32H05B37/00H05B33/14
    • H01L27/156H01L33/007H01L33/08H01L33/18H01L33/32
    • Substrates, assemblies, and techniques for enabling a nanowire LED pixel are disclosed herein. For example, some embodiments include growing a buffer layer on a support substrate, growing an N-type GaN layer on the buffer layer, growing a core of N-type GaN rods from the N-type GaN layer, growing an active emitting region (AER) around a portion of the N-type GaN core nanorods to create a blue AER LED, growing a AER around a portion of the N-type GaN core nanorods to create a green AER LED, and growing a AER around a portion of the N-type GaN core nanorods to create a red AER LED. This allows for the fabrication of RGB pixels on wafers monolithically (i.e., on a single wafer). The RGB pixels may then be transferred all at once, from source wafers to TFT backplanes.
    • 本文公开了用于启用纳米线LED像素的基板,组件和技术。 例如,一些实施例包括在支撑衬底上生长缓冲层,在缓冲层上生长N型GaN层,从N型GaN层生长N型GaN棒的核心,生长有源发射区域( AER)围绕N型GaN核心纳米棒的一部分形成蓝色AER LED,在N型GaN核心纳米棒的一部分周围生长AER以形成绿色AER LED,并且围绕一部分N型GaN核心纳米棒生长AER N型GaN核心纳米棒创建一个红色的AER LED。 这允许单片地(即,在单个晶片上)在晶片上制造RGB像素。 RGB像素可以一次全部传输,从源晶圆到TFT背板。
    • 10. 发明申请
    • LOW-PROFILE HINGE FOR AN ELECTRONIC DEVICE
    • 用于电子设备的低剖面铰链
    • WO2015148057A1
    • 2015-10-01
    • PCT/US2015/018204
    • 2015-02-28
    • INTEL CORPORATION
    • LIM, Min SuetCHEAH, Bok EngLOO, Howe YinKONG, Jackson Chung PengOH, Poh Tat
    • H05K7/16G06F1/16
    • G06F1/1681G06F1/1616G06F1/1618G06F1/1637Y10T16/547
    • Particular embodiments described herein provide for an electronic device, such as a notebook computer or laptop, that includes a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.}. One particular example implementation of the electronic device may include a Sow-profile hinge design that includes a first segment that connects to a first element using a first coupler and to a second segment that connects to the first segment using a second coupler, where the second segment connects to a second element using a third coupler. The first coupler, the second coupler, and the third coupler may each have a first coupling arm and a second coupling arm and the first coupling arm can be offset from a plane of the second coupling arm by about five degrees to about forty-five degrees.
    • 本文描述的特定实施例提供了一种电子设备,例如笔记本电脑或笔记本电脑,其包括耦合到多个电子组件(其包括任何类型的组件,元件,电路等)的电路板。 该电子设备可以包括母线型铰链设计,其包括使用第一耦合器连接到第一元件的第一段和使用第二耦合器连接到第一段的第二段,其中第二段连接到 第一联接器,第二联接器和第三联接器可以各自具有第一联接臂和第二联接臂,并且第一联接臂可以从第二联接臂的平面偏移约五分之一 度至约四十五度。