专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2015009874A9 COUNTERFEITING DETERENT AND SECURITY DEVICES SYSTEMS AND METHODS 审中-公开
标题翻译：相反的检测和安全设备系统和方法
公开(公告)号：WO2015009874A9
公开(公告)日：2016-04-14
申请号：PCT/US2014046919
申请日：2014-07-16
申请人： MICROFABRICA INC
发明人： SCHMITZ GREGORY P , LOCKARD MICHAEL S , WU MING-TING , MILLER ERIC C , COHEN ADAM L
IPC分类号： B42D15/00
CPC分类号： B32B15/01 , B33Y10/00 , B33Y40/00 , B33Y70/00 , B33Y80/00 , C25D1/003 , C25D1/08 , C25D5/022 , C25D5/48 , C25D7/005
摘要： A counterfeiting deterrent device according to one implementation of the disclosure includes a plurality of layers formed by an additive process. Each of the layers may have a thickness of less than 100 microns. At least one of the layers has a series of indentations formed in an outer edge of the layer such that the indentations can be observed to verify that the device originated from a predetermined source. According to another implementation, a counterfeiting deterrent device includes at least one raised layer having outer edges in the shape of a logo. A light source is configured and arranged to shine a light through a slit in a substrate layer of the device and past an intermediate layer to light up the outer edge of the raised layer. The layers of the device are formed by an additive process and have a thickness of less than 100 microns each.
摘要翻译：根据本公开的一个实施方式的防伪装置包括通过添加过程形成的多个层。每个层可以具有小于100微米的厚度。层中的至少一个具有形成在层的外边缘中的一系列凹痕，使得可以观察到凹痕以验证装置源自预定源。根据另一个实施方案，一种防伪装置包括至少一个具有标志形状的外边缘的凸起层。光源被配置和布置成将光照射穿过设备的基底层中的狭缝并且经过中间层以照亮凸起层的外边缘。装置的层通过添加工艺形成，并且具有小于每个100微米的厚度。

2. 发明申请

WO2014113508A3 METHODS OF FORMING PARTS USING LASER MACHINING 审中-公开
标题翻译：使用激光加工形成零件的方法
公开(公告)号：WO2014113508A3
公开(公告)日：2014-09-12
申请号：PCT/US2014011738
申请日：2014-01-15
申请人： MICROFABRICA INC
发明人： VEERAMANI ARUN S , JENSEN HEATH A , FRODIS URI , WIITA CHRISTOPHER G , LOCKARD MICHAEL S , BOGUSLAVSKY IRINA , LEMBRIKOV PAVEL , SMALLEY DENNIS R , CHEN RICHARD T
IPC分类号： B23K26/36 , B23K26/38 , B23K26/40 , G01R3/00
CPC分类号： B23K26/38 , B23K26/0624 , B23K26/18 , B23K26/40 , B23K2201/40 , B23K2203/50 , G01R1/06738 , G01R1/06744 , G01R3/00
摘要： Embodiments are directed to the formation micro-scale or millimeter scale structures or method of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).
摘要翻译：实施例涉及形成微尺度或毫米级结构或制造这种结构的方法，其中结构由至少一个片状结构材料形成，并且可以包括附加的片状结构材料或沉积的结构材料，其中所有或部分图案化的结构材料通过激光切割发生。在一些实施例中，使用选择性沉积来提供图案化的一部分。在一些实施例中，结构材料或结构材料由牺牲桥接材料（例如金属）从下方限定，并且可能由上面由牺牲性封盖材料（例如金属）限定。

3. 发明申请

WO2014004763A1 MEMS MICRO DEBRIDER DEVICES AND METHODS OF TISSUE REMOVAL 审中-公开
标题翻译： MEMS微型脱屑器装置和组织移除方法
公开(公告)号：WO2014004763A1
公开(公告)日：2014-01-03
申请号：PCT/US2013/048066
申请日：2013-06-27
申请人： MICROFABRICA INC.
发明人： SCHMITZ, Gregory, P. , WU, Ming, T. , CHEN, Richard, T. , VEERAMANI, Arun
IPC分类号： A61B17/14
CPC分类号： A61B17/32002 , A61B17/1617 , A61B17/1622 , A61B17/1624 , A61B17/1628 , A61B17/1671
摘要： Medical devices for shearing tissue into small pieces are provided. One exemplary device includes oppositely rotating first and second rotatable members, each located at least partially within a distal housing. The device also includes first and second circular axle portions, and first and second blades that are directly adjacent to one another and positioned to partially overlap such that tissue may be sheared between the first and second blades, between the first blade and the second axle portion and between the second blade and the first axle portion. The rotatable members are configured to engage tissue from a target tissue site with teeth of the first and second blades, rotate towards one another and inwardly to direct tissue from the target tissue site through a tissue engaging opening and into an interior portion of the distal housing. Methods of fabricating and using the above device are also disclosed.
摘要翻译：提供用于将组织切成小块的医疗装置。一个示例性装置包括相对旋转的第一和第二可旋转构件，每个至少部分地位于远侧壳体内。该装置还包括第一和第二圆形轴部分，以及第一和第二叶片，其彼此直接相邻并且定位成部分重叠，使得组织可以在第一和第二叶片之间，第一叶片和第二轴部分之间剪切并且在第二叶片和第一轴部分之间。可旋转构件构造成使得来自目标组织部位的组织与第一和第二叶片的齿啮合，朝向彼此和向内旋转以将组织从目标组织部位通过组织接合开口引导到远侧壳体的内部。还公开了制造和使用上述装置的方法。

4. 发明申请

WO2010151251A8 MINIATURE SHREDDING TOOL FOR USE IN MEDICAL APPLICATIONS AND METHODS FOR MAKING 审中-公开
公开(公告)号：WO2010151251A8
公开(公告)日：2010-12-29
申请号：PCT/US2009/048347
申请日：2009-06-23
申请人： MICROFABRICA INC. , LOCKARD, Michael, S. , FRODIS, Uri , COHEN, Adam , CHEN, Richard, T. , WU, Ming-Ting , SCHMITZ, Gregory, P. , MILLER, Eric, C.
发明人： LOCKARD, Michael, S. , FRODIS, Uri , COHEN, Adam , CHEN, Richard, T. , WU, Ming-Ting , SCHMITZ, Gregory, P. , MILLER, Eric, C.
IPC分类号： A61B10/00
摘要： The present invention relates generally to the field of micro-scale or millimeter scale devices and to the use of multi-layer multi-material electrochemical fabrication methods for producing such devices with particular embodiments relate to shredding devices and more particularly to shredding devices for use in medical applications. In some embodiments, tissue removal devices are used in procedures to removal spinal tissue and in other embodiments, similar devices are used to remove thrombus from blood vessel.

5. 发明申请

WO2006031280A2 PROBE ARRAYS AND METHOD FOR MAKING 审中-公开
标题翻译：探索阵列和制作方法
公开(公告)号：WO2006031280A2
公开(公告)日：2006-03-23
申请号：PCT/US2005/023706
申请日：2005-06-30
申请人： MICROFABRICA INC. , KUMAR, Ananda, H. , KRUGLICK, Ezekiel, J., J. , COHEN, Adam, L. , KIM, Kieun , ZHANG, Gang , CHEN, Richard, T. , BANG, Christopher, A. , ARAT, Vacit , LOCKARD, Michael, S. , FRODIS, Uri , LEMBRIKOV, Pavel, B. , THOMPSON, Jeffrey, A.
发明人： KUMAR, Ananda, H. , KRUGLICK, Ezekiel, J., J. , COHEN, Adam, L. , KIM, Kieun , ZHANG, Gang , CHEN, Richard, T. , BANG, Christopher, A. , ARAT, Vacit , LOCKARD, Michael, S. , FRODIS, Uri , LEMBRIKOV, Pavel, B. , THOMPSON, Jeffrey, A.
IPC分类号： G01R31/02
CPC分类号： G01R1/07378 , G01R1/06744 , G01R3/00 , H01L23/66 , H01L2224/0554 , H01L2224/05567 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00014 , H01L2924/09701 , H01L2924/18165 , H01L2924/3011 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.
摘要翻译：本发明的实施例涉及在临时衬底上形成微探针（即柔性电气或电子接触元件），切割各个探针阵列，然后将阵列转移到空间变压器或其它永久衬底。在将探针从其上形成探针的临时基底分离出来之前，本发明的一些实施例将探针转移到永久性基底上，而其他实施方案相反。一些实施例，在转移之前去除牺牲材料，而其它实施例在转移之后去除牺牲材料。一些实施例涉及使用一个或多个具有增强的纵横比（即，高度与宽度比）的焊料凸块将第一和第二电气部件结合在一起的结果，所述焊料凸块至少部分地由保持材料的环围绕凸块。保留材料可以用作焊接掩模材料。

6. 发明申请

WO2004101857A2 METHODS AND APPARATUS FOR FORMING MULTI-LAYER STRUCTURES USING ADHERED MASKS 审中-公开
标题翻译：使用附加掩模形成多层结构的方法和装置
公开(公告)号：WO2004101857A2
公开(公告)日：2004-11-25
申请号：PCT/US2004014360
申请日：2004-05-07
申请人： MICROFABRICA INC
发明人： COHEN ADAM L , THOMASSIAN JILL R , LOCKARD MICHAEL S , KILGO MARVIN M III , FRODIS URI , SMALLEY DENNIS R
IPC分类号： C25D1/00 , C25D5/02 , C25D5/10 , C25D5/14 , C25D5/48 , C25D5/50 , C25D
CPC分类号： C25D1/003 , C25D1/00 , C25D1/20 , C25D5/02 , C25D5/022 , C25D5/10 , C25D5/14 , C25D5/48 , C25D5/50
摘要： Numerous electrochemical fabrication methods and apparatus are provided for producing multi-layer structures (e.g. having meso-scale or micro-scale features) from a plurality of layers of deposited materials using adhered masks (e.g. formed from liquid photoresist or dry film), where two or more materials may be provided per layer where at least one of the materials is a structural material and one or more of any other materials may be a sacrificial material which will be removed after formation of the structure. Materials may comprise conductive materials that are electrodeposited or deposited in an electroless manner. In some embodiments special care is undertaken to ensure alignment between patterns formed on successive layers.
摘要翻译：提供了多种电化学制造方法和装置，用于使用粘附的掩模（例如由液体光致抗蚀剂或干膜形成）从多层沉积材料制备多层结构（例如具有中尺度或微尺度特征），其中两个或者可以在每层中提供更多的材料，其中至少一种材料是结构材料，并且任何其它材料中的一种或多种可以是在形成结构之后被去除的牺牲材料。材料可以包括以无电解方式电沉积或沉积的导电材料。在一些实施例中，特别注意确保在连续层上形成的图案之间的对准。

7. 发明申请

WO2012058682A1 SELECTIVE TISSUE REMOVAL TOOL FOR USE IN MEDICAL APPLICATIONS AND METHODS FOR MAKING AND USING 审中-公开
标题翻译：用于医疗应用的选择性组织移除工具及其制造和使用方法
公开(公告)号：WO2012058682A1
公开(公告)日：2012-05-03
申请号：PCT/US2011/058635
申请日：2011-10-31
申请人： MICROFABRICA INC. , SCHMITZ, Gregory, P. , MILLER, Eric, C. , CHEN, Richard, T. , WU, Ming, T.
发明人： SCHMITZ, Gregory, P. , MILLER, Eric, C. , CHEN, Richard, T. , WU, Ming, T.
IPC分类号： A61B17/50
CPC分类号： A61B17/3205 , A61B17/00234 , A61B17/16 , A61B17/1671 , A61B17/22031 , A61B17/221 , A61B17/32002 , A61B90/361 , A61B2017/00261 , A61B2017/003 , A61B2017/00553 , A61B2017/1602 , A61B2017/22039 , A61B2017/22044 , A61B2017/22077 , A61B2017/2927 , A61B2017/320048 , A61B2017/320775 , A61M1/0056 , A61M2210/1025 , A61M2210/1042
摘要： The present disclosure relates generally to the field of tissue removal and more particularly to methods and devices for use in medical applications involving selective tissue removal. One exemplary method includes the steps of providing a tissue cutting instrument capable of distinguishing between target tissue to be removed and non- target tissue, urging the instrument against the target tissue and the non-target tissue, and allowing the instrument to cut the target tissue while automatically avoiding cutting of non-target tissue. Various tools for carrying out this method are also described.
摘要翻译：本公开一般涉及组织去除领域，更具体地涉及用于涉及选择性组织去除的医学应用中的方法和装置。一个示例性方法包括以下步骤：提供能够区分要移除的目标组织和非目标组织的组织切割仪器，将仪器推向目标组织和非目标组织，并允许仪器切割靶组织同时自动避免切割非目标组织。还描述了用于执行该方法的各种工具。

8. 发明申请

WO2010151250A1 MINIATURE SHREDDING TOOL FOR MEDICAL APPLICATIONS 审中-公开
标题翻译：微型工具用于医疗应用
公开(公告)号：WO2010151250A1
公开(公告)日：2010-12-29
申请号：PCT/US2009/048346
申请日：2009-06-23
申请人： MICROFABRICA INC. , LOCKHARD, Michael, S. , FRODIS, Uri , COHEN, Adam , CHEN, Richard, T.
发明人： LOCKHARD, Michael, S. , FRODIS, Uri , COHEN, Adam , CHEN, Richard, T.
IPC分类号： A61B17/3207
CPC分类号： A61B17/32002 , A61B10/02 , A61B17/14 , A61B17/1659 , A61B17/1671 , A61B17/221 , A61B17/320725 , A61B17/320758 , A61B90/361 , A61B2017/00261 , A61B2017/003 , A61B2017/00327 , A61B2017/00526 , A61B2017/00539 , A61B2017/00553 , A61B2017/2212 , A61B2017/2215 , A61B2017/320048 , A61B2017/320064 , A61B2017/320775 , B33Y80/00 , F16H55/06 , F16H55/18 , Y10T74/19623
摘要： The present invention relates generally to the field of micro-scale or millimeter scale devices and to the use of multi-layer multi-material electrochemical fabrication methods for producing such devices with particular embodiments relate to shredding devices and more particularly to shredding devices for use in medical applications. In some embodiments, tissue removal devices are used in procedures to removal spinal tissue and in other embodiments, similar devices are used to remove thrombus from blood vessel.
摘要翻译：本发明一般涉及微尺度或毫米级装置的领域，以及使用多层多材料电化学制造方法来制造这种装置，具体实施方案涉及粉碎装置，更具体地说涉及用于医疗应用。在一些实施例中，在去除脊髓组织的过程中使用组织去除装置，并且在其他实施例中，类似的装置用于从血管中去除血栓。

9. 发明申请

WO2006031280A3 PROBE ARRAYS AND METHOD FOR MAKING 审中-公开
标题翻译：探索阵列和制作方法
公开(公告)号：WO2006031280A3
公开(公告)日：2007-03-01
申请号：PCT/US2005023706
申请日：2005-06-30
申请人： MICROFABRICA INC , KUMAR ANANDA H , KRUGLICK EZEKIEL J J , COHEN ADAM L , KIM KIEUN , ZHANG GANG , CHEN RICHARD T , BANG CHRISTOPHER A , ARAT VACIT , LOCKARD MICHAEL S , FRODIS URI , LEMBRIKOV PAVEL B , THOMPSON JEFFREY A
发明人： KUMAR ANANDA H , KRUGLICK EZEKIEL J J , COHEN ADAM L , KIM KIEUN , ZHANG GANG , CHEN RICHARD T , BANG CHRISTOPHER A , ARAT VACIT , LOCKARD MICHAEL S , FRODIS URI , LEMBRIKOV PAVEL B , THOMPSON JEFFREY A
IPC分类号： G01R31/02
CPC分类号： G01R1/07378 , G01R1/06744 , G01R3/00 , H01L23/66 , H01L2224/05567 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00014 , H01L2924/09701 , H01L2924/18165 , H01L2924/3011 , H01L2924/00 , H01L2224/05599
摘要： Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate (306), dicing individual probe arrays (300), and then transferring the arrays to space transformers or other permanent substrates (310). Some embodiments of the invention transfer probes (302) to permanent substrates (310) prior to separating the probes (302) from a temporary substrate (306) on which the probes (302) were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material (308) prior to transfer while other embodiments remove sacrificial material (308) after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.
摘要翻译：本发明的实施例涉及在临时衬底（306）上形成微探针（即柔性电子或电子接触元件），切割各个探针阵列（300），然后将阵列转移到空间变压器或其它永久衬底（310）。在将探针（302）与其上形成有探针（302）的临时衬底（306）分离之前，本发明的一些实施例将探针（302）转移到永久衬底（310），而其他实施例相反。一些实施例，在转移之前去除牺牲材料（308），而其他实施例在转移之后去除牺牲材料（308）。一些实施例涉及使用一个或多个具有增强的纵横比（即，高度与宽度比）的焊料凸块来将第一和第二电气部件接合在一起，这是由于至少部分地由保持材料的环围绕凸块而得到的。保留材料可以用作焊接掩模材料。

10. 发明申请

WO2005065436A3 METHOD AND APPARATUS FOR MAINTAINING PARALLELISM OF LAYERS AND/OR ACHIEVING DESIRED THICKNESSES OF LAYERS DURING THE ELECTROCHEMICAL FABRICATION OF STRUCTURES 审中-公开
标题翻译：在结构电化学制造过程中维护层平行和/或实现层厚度的方法和装置
公开(公告)号：WO2005065436A3
公开(公告)日：2006-04-06
申请号：PCT/US2005000086
申请日：2005-01-03
申请人： MICROFABRICA INC , KUMAR ANANDA H , COHEN ADAM L , LOCKARD MICHAEL S
发明人： KUMAR ANANDA H , COHEN ADAM L , LOCKARD MICHAEL S
IPC分类号： B05D1/38 , C08K3/00 , C25D3/30 , C25D3/38 , C25D3/48 , C25D5/02 , C25D5/10 , C25D21/12 , H01L21/288 , H01L21/301 , H01L21/302 , H01L21/4763 , H01L21/768 , B24B53/00
CPC分类号： C25D5/48 , B33Y10/00 , B81C1/00492 , B81C99/0065 , B81C2201/0104 , B81C2201/0197 , C25D1/00 , C25D1/003 , C25D5/022 , C25D5/10 , C25D21/12 , H01L21/2885 , H01L21/76885 , Y10T156/1052
摘要： Some embodiments of the present invention provide processes and apparatus for electrochemically fabricating multilayer structures (98) (e.g. mesoscale or microscale structures) with improved endpoint detection and parallelism maintenance for materials (e.g. layers) that are planarized during the electrochemical fabrication process. Some methods involve the use of a fixture during planarization that ensures that planarized planes of material are parallel to other deposited planes within a given tolerance. Some methods involve the use of an endpoint detection fixture (292, 294, 296, 298) that ensures precise heights of deposited materials relative to an initial surface of a substrate (82), relative to a first deposited layer, or relative to some other layer formed during the fabrication process. In some embodiments planarization may occur via lapping while other embodiments may use a diamond fly cutting machine (408).
摘要翻译：本发明的一些实施例提供了用于电化学制造多层结构（98）（例如中尺度或微结构）的方法和装置，其具有改进的端点检测和在电化学制造过程中被平坦化的材料（例如层）的并行维护。一些方法涉及在平坦化期间使用夹具，其确保材料的平面化平面平行于给定公差内的其它沉积平面。一些方法涉及使用端点检测固定装置（292,294,296,298），其相对于第一沉积层相对于衬底（82）的初始表面或相对于某些其它材料确保沉积材料的精确高度在制造过程中形成的层。在一些实施例中，平面化可以通过研磨发生，而其他实施例可以使用金刚石切片机（408）。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式