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1. 发明申请

WO2015193433A4 MICRO ASSEMBLED HIGH FREQUENCY DEVICES AND ARRAYS AND METHOD OF MAKING THE SAME 审中-公开
标题翻译：微组装的高频装置和阵列及其制造方法
公开(公告)号：WO2015193433A4
公开(公告)日：2016-04-21
申请号：PCT/EP2015063708
申请日：2015-06-18
申请人： CELEPRINT LTD X
发明人： BOWER CHRISTOPHER , MEITL MATTHEW
IPC分类号： H01L21/683 , H01G4/30 , H01L49/02
CPC分类号： H01Q21/0093 , H01G4/38 , H01L21/6835 , H01L28/60 , H01L2221/68318 , H01L2221/68354 , H01L2221/68368 , H01L2224/32145 , H01L2224/48091 , H01L2224/73265 , H01Q3/34 , Y10T29/4902 , H01L2924/00014
摘要： Phased-array antenna systems can be constructed using transfer printed active components. Phased-array antenna systems benefit from a large number of radiating elements (e.g., more radiating elements can form sharper, narrower beams (higher gain)). As the number of radiating elements increases, the size of the part and the cost of assembly increases. High throughput micro assembly(e.g. by micro-transfer printing)mitigates costs associated with high part-count. Micro assembly is advantaged over monolithic approaches that form multiple radiating elements on a semiconductor wafer because micro assembly uses less semiconductor material to provide the active components that are necessary for the array. The density of active components on the phased-array antenna system is small. Micro assembly provides a way to efficiently use semiconductor material on a phased array, reducing the amount of non-active semiconductor area (e.g.,the area on the semiconductor material that does not include transistors, diodes, or other active components).
摘要翻译：相控阵天线系统可以使用转印印刷有源元件构建。相控阵天线系统受益于大量的辐射元件（例如，更多的辐射元件可以形成更尖锐，更窄的光束（更高的增益））。随着辐射元件数量的增加，零件尺寸和装配成本增加。高通量微组装（例如通过微转移印刷）减轻了与高部件数相关的成本。因为微组件使用较少的半导体材料来提供阵列所需的有源组件，所以微组件比单片方法有利于在半导体晶片上形成多个辐射元件。相控阵天线系统中有源元件的密度很小。微组件提供了在相控阵上有效使用半导体材料的方法，减少了非有源半导体区域（例如，不包括晶体管，二极管或其他有源组件的半导体材料上的区域）的量。

2. 发明申请

WO2015193435A4 SYSTEMS AND METHODS FOR CONTROLLING RELEASE OF TRANSFERABLE SEMICONDUCTOR STRUCTURES 审中-公开
标题翻译：用于控制可转移半导体结构释放的系统和方法
公开(公告)号：WO2015193435A4
公开(公告)日：2016-02-25
申请号：PCT/EP2015063710
申请日：2015-06-18
申请人： CELEPRINT LTD X
发明人： BOWER CHRISTOPHER , MEITL MATTHEW
IPC分类号： B81C99/00
CPC分类号： H01L21/7813 , B81C99/008 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L21/6836 , H01L24/83 , H01L2221/68368
摘要： The disclosed technology relates generally to methods and systems for controlling the release of micro devices. Prior to transferring micro devices to a destination substrate, a native substrate is formed with micro devices thereon. The micro devices can be distributed over the native substrate and spatially separated from each other by an anchor structure. The anchors are physically connected/secured to the native substrate. Tethers physically secure each micro device to one or more anchors, thereby suspending the micro device above the native substrate. In certain embodiments, single tether designs are used to control the relaxation of built-in stress in releasable structures on a substrate, such as Si (1 1 1). Single tether designs offer, among other things,the added benefit of easier break upon retrieval from native substrate in micro assembly processes. In certain embodiments, narrow tether designs are used to avoid pinning of the undercut etch front.
摘要翻译：所公开的技术一般涉及用于控制微器件释放的方法和系统。在将微器件转移到目标衬底之前，在其上形成有微器件的天然衬底。微器件可以分布在天然衬底上并且通过锚结构在空间上彼此分离。锚固体物理地连接/固定到天然基底。系带将每个微型装置物理地固定到一个或多个锚固件上，从而将微型装置悬挂在天然基底之上。在某些实施例中，单系链设计用于控制衬底（例如Si（111））上的可释放结构中内置应力的松弛。除了别的以外，单系链设计还提供了在微装配过程中从原生衬底检索更容易断裂的附加益处。在某些实施例中，使用窄的绳索设计来避免底切蚀刻前端的钉扎。

3. 发明申请

WO2016046283A2 COMPOUND MICRO-ASSEMBLY STRATEGIES AND DEVICES 审中-公开
标题翻译：化合物微组装策略和装置
公开(公告)号：WO2016046283A2
公开(公告)日：2016-03-31
申请号：PCT/EP2015071909
申请日：2015-09-23
申请人： CELEPRINT LTD X
发明人： BOWER CHRISTOPHER , MEITL MATTHEW
IPC分类号： H01Q3/26
CPC分类号： H01L25/50 , H01L21/485 , H01L21/6835 , H01L22/14 , H01L22/20 , H01L23/5382 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/82 , H01L25/0753 , H01L25/167 , H01L25/18 , H01L2221/68368 , H01L2221/68372 , H01L2221/68381 , H01L2224/24137 , H01Q1/2283 , H01Q3/267 , H01Q21/0087
摘要： The disclosed technology relates generally to designs and methods of assembling devices utilizing compound micro-assembly. Functional elements are micro-assembled to form an array of individual micro-systems on an intermediate substrate, then the microsystems are transferred (one or more at a time) to a destination or device substrate. For example, for a display device, each micro-system may be an individual pixel containing red, blue, and green micro LEDs and a silicon drive circuit. An array of pixels may be formed by micro-transfer printing functional elements onto the intermediate substrate and electrically connecting them via fine lithography, then the individual pixels may be micro-transfer printed onto the destination substrate.
摘要翻译：所公开的技术一般涉及使用复合微组件的组装装置的设计和方法。功能元件被微组装以在中间衬底上形成单个微系统的阵列，然后将微系统（一次一个或多个）转移到目的地或器件衬底。例如，对于显示装置，每个微系统可以是包含红色，蓝色和绿色微型LED和硅驱动电路的单独像素。像素阵列可以通过微转移打印功能元件形成到中间基板上，并通过精细光刻电连接它们，然后各个像素可以被微转印到目的基板上。

4. 发明申请

WO2016012409A3 APPARATUS AND METHODS FOR MICRO-TRANSFER PRINTING 审中-公开
标题翻译：微转印打印设备及方法
公开(公告)号：WO2016012409A3
公开(公告)日：2016-03-24
申请号：PCT/EP2015066566
申请日：2015-07-20
申请人： CELEPRINT LTD X
发明人： BOWER CHRISTOPHER , MEITL MATTHEW , KNEEBURG DAVID , GOMEZ DAVID , BONAFEDE SALVATORE
IPC分类号： H01L21/683 , H01L21/58 , H01L21/98 , H01L23/31
CPC分类号： B41F16/00 , B25J15/00 , B41F16/0046 , B41F16/006 , B41F16/0073 , B41K3/04 , B41K3/12 , H01L21/3065 , H01L21/52 , H01L21/565 , H01L21/568 , H01L21/67103 , H01L21/683 , H01L21/6835 , H01L23/293 , H01L23/3171 , H01L24/75 , H01L24/83 , H01L24/97 , H01L25/50 , H01L31/1892 , H01L2221/68318 , H01L2221/68354 , H01L2221/68368 , H01L2221/68377 , H01L2221/68381 , H01L2224/32225 , H01L2224/32245 , H01L2224/75315 , H01L2224/7598 , H01L2224/83001 , H01L2224/83011 , H01L2224/83013 , H01L2224/83024 , H01L2224/832 , H01L2224/83894 , H01L2224/83895 , H01L2924/10253 , H01L2924/1032 , H01L2924/10328 , H01L2924/10329 , H01L2924/10332 , H01L2924/10335 , H01L2924/10336 , H01L2924/10337 , H01L2924/10338 , H01L2924/1034
摘要： An appartus and method for assembling a semiconductor device on a destination substrate using micro-transfer-printing is described. A conformable transfer device (102) such as an elastomer or visco-elastomer stamp includes an array of posts (114) for picking up printable semiconductor elements (104) from a native substrate (108) which is used for fabricating the printable semiconductor elements (104) and transferring the printable semiconductor elements (104) to a destination substrate (110). In certain embodiments, the printable semiconductor elements (104) are encapsulated in a polymer layer (106) before they are picked up. In certain embodiments a plasma treatment (e.g. atmospheric plasma) can be performed during micro transfer printing. The plasma can be applied to bottom surfaces of devices that are attached to an elastomer transfer-element. This treatment of bottom surfaces can be used to provide improved bonding between the devices and destination substrate, to clean the bottom surface of devices that have been fabricated using epitaxial lift-off methods, and to remove thin layers of oxides. In certain embodiments, if the devices have a backside metal, the semiconductor elements are printed to a destination substrate with mating metal pads that have been coated with a flux. After transferring the devices, the flux can be reflowed thereby leaving a good metal connection between the pads and the backside metal on the devices. In certain embodiments, the disclosed technology includes transfer devices designed to eliminate or reduce issues related to crowning. In certain embodiments, the crown is cut with a razor so that printable semiconductor elements are not picked up by the crown during a print operation.
摘要翻译：描述了使用微转印技术在目的基板上组装半导体器件的方法和方法。诸如弹性体或粘弹性体印模的适形传送装置（102）包括用于从用于制造可印刷半导体元件的天然衬底（108）拾取可印刷半导体元件（104）的柱（114）阵列 104）并将可印刷半导体元件（104）传送到目的基板（110）。在某些实施例中，可打印的半导体元件（104）在拾取之前被封装在聚合物层（106）中。在某些实施例中，可以在微转印中进行等离子体处理（例如大气等离子体）。等离子体可以施加到附接到弹性体转移元件的装置的底表面上。底表面的这种处理可用于提供装置和目的基板之间的改进的结合，以清洁已经使用外延剥离方法制造的装置的底表面，以及去除薄层的氧化物。在某些实施例中，如果器件具有背面金属，则半导体元件被印刷到具有已经涂覆有焊剂的配合金属焊盘的目标衬底。在转移器件之后，焊剂可被回流，从而在焊盘和器件上的背面金属之间留下良好的金属连接。在某些实施例中，所公开的技术包括被设计成消除或减少与隆起有关的问题的转移装置。在某些实施例中，用剃刀切割表冠，使得可打印半导体元件在打印操作期间不被表冠拾取。

5. 发明申请

WO2015193433A3 MICRO ASSEMBLED HIGH FREQUENCY DEVICES AND ARRAYS AND METHOD OF MAKING THE SAME 审中-公开
标题翻译： MICRO组装的高频器件和阵列及其制造方法
公开(公告)号：WO2015193433A3
公开(公告)日：2016-02-18
申请号：PCT/EP2015063708
申请日：2015-06-18
申请人： CELEPRINT LTD X
发明人： BOWER CHRISTOPHER , MEITL MATTHEW
IPC分类号： H01L21/683 , H01G4/30 , H01L49/02
CPC分类号： H01Q21/0093 , H01G4/38 , H01L21/6835 , H01L28/60 , H01L2221/68318 , H01L2221/68354 , H01L2221/68368 , H01L2224/32145 , H01L2224/48091 , H01L2224/73265 , H01Q3/34 , Y10T29/4902 , H01L2924/00014
摘要： Phased-array antenna systems can be constructed using transfer printed active components. Phased-array antenna systems benefit from a large number of radiating elements (e.g., more radiating elements can form sharper, narrower beams (higher gain)). As the number of radiating elements increases, the size of the part and the cost of assembly increases. High throughput micro assembly(e.g. by micro-transfer printing)mitigates costs associated with high part-count. Micro assembly is advantaged over monolithic approaches that form multiple radiating elements on a semiconductor wafer because micro assembly uses less semiconductor material to provide the active components that are necessary for the array. The density of active components on the phased-array antenna system is small. Micro assembly provides a way to efficiently use semiconductor material on a phased array, reducing the amount of non-active semiconductor area (e.g.,the area on the semiconductor material that does not include transistors, diodes, or other active components).
摘要翻译：相控阵天线系统可以使用传输印刷的有源组件构建。相控阵天线系统受益于大量的辐射元件（例如，更多的辐射元件可以形成更清晰，更窄的波束（更高的增益））。随着辐射元件的数量增加，部件的尺寸和组装成本增加。高通量微组件（例如通过微转移印刷）减少与高部件数量相关的成本。微组件优于在半导体晶片上形成多个辐射元件的单片方法，因为微组件使用更少的半导体材料来提供阵列所需的有源元件。相控阵天线系统中有源元件的密度很小。微组件提供了在相控阵上有效地使用半导体材料的方法，减少了非有源半导体区域（例如，不包括晶体管，二极管或其它有源部件的半导体材料上的区域）的量。

6. 发明申请

WO2015193436A9 SYSTEMS AND METHODS FOR PREPARING GAN AND RELATED MATERIALS FOR MICRO ASSEMBLY 审中-公开
标题翻译：用于制备微量组件的甘油和相关材料的系统和方法
公开(公告)号：WO2015193436A9
公开(公告)日：2016-02-11
申请号：PCT/EP2015063711
申请日：2015-06-18
申请人： CELEPRINT LTD X
发明人： BOWER CHRISTOPHER , MEITL MATTHEW
IPC分类号： H01L33/00 , H01L21/78 , H01L21/98 , H01L25/03
CPC分类号： H01L33/007 , H01L21/187 , H01L21/2007 , H01L21/6835 , H01L21/7806 , H01L24/81 , H01L25/50 , H01L33/0079 , H01L33/22 , H01L33/44 , H01L2221/68354 , H01L2221/68368 , H01L2924/00011 , H01L2924/13055 , H01L2933/0025 , H01L2924/00 , H01L2224/81805
摘要： The disclosed technology relates generally to a method and system for micro assembling GaN materials and devices to form displays and lighting components that use arrays of small LEDs and high-power, high- voltage, and or high frequency transistors and diodes. GaN materials and devices can be formed from epitaxy on sapphire, silicon carbide, gallium nitride, aluminum nitride, or silicon substrates. The disclosed technology provides systems and methods for preparing GaN materials and devices at least partially formed on several of those native substrates for micro assembly.
摘要翻译：所公开的技术通常涉及用于微组装GaN材料和器件的方法和系统，以形成使用小型LED和高功率，高电压和/或高频晶体管和二极管阵列的显示器和照明部件。 GaN材料和器件可以由蓝宝石，碳化硅，氮化镓，氮化铝或硅衬底上的外延形成。所公开的技术提供了用于制备GaN材料的系统和方法，并且至少部分地形成在几个用于微组装的天然衬底上的器件。

7. 发明申请

WO2015193434A3 MICRO ASSEMBLED LED DISPLAYS 审中-公开
标题翻译： MICRO组装LED显示屏
公开(公告)号：WO2015193434A3
公开(公告)日：2016-02-11
申请号：PCT/EP2015063709
申请日：2015-06-18
申请人： CELEPRINT LTD X
发明人： BOWER CHRISTOPHER , MEITL MATTHEW , GOMEZ DAVID , BONAFEDE SALVATORE , KNEEBURG DAVID , FECIORU ALIN , PREVATTE CARL
IPC分类号： H01L25/075 , H01L33/00
CPC分类号： H01L33/385 , F21K9/50 , F21V9/08 , F21Y2101/025 , F21Y2105/003 , F21Y2105/10 , F21Y2113/13 , F21Y2115/10 , G02B26/04 , G02F1/167 , G09G3/22 , G09G3/32 , G09G2300/0452 , G09G2300/0842 , G09G2310/0264 , H01L25/0753 , H01L25/167 , H01L27/156 , H01L33/20 , H01L33/36 , H01L33/38 , H01L33/405 , H01L33/48 , H01L33/50 , H01L33/502 , H01L33/508 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/18 , H01L2224/73267 , H01L2224/92244 , H05B33/089 , H05K1/0306 , H05K1/09 , H05K1/181 , H05K1/182 , H05K5/0017 , H05K2201/0329 , H05K2201/10106 , H05K2201/10128 , H05K2201/10166
摘要： The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.
摘要翻译：所公开的技术提供微组装的微型LED显示器和照明元件，其使用太小的微型LED阵列（例如，宽度或直径为10μm至50μm的微型LED），许多或易碎的组装通过常规手段。所公开的技术提供了使用微转印技术组装的微型LED显示器和照明元件。微型LED可以在天然衬底上制备并印刷到显示衬底（例如，塑料，金属，玻璃或其他材料）上，从而避免在显示衬底上制造微型LED。在某些实施例中，显示器基板是透明和/或柔性的。

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