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    • 80. 发明申请
    • MULTI-LAYERED THIN FILM PIEZOELECTRIC DEVICES & METHODS OF MAKING THE SAME
    • 多层薄膜压电器件及其制造方法
    • WO2015026437A1
    • 2015-02-26
    • PCT/US2014/043893
    • 2014-06-24
    • FUJIFILM DIMATIX, INC.
    • LI, Youming
    • H01L41/083H01L41/18
    • H01L41/0471H01L41/0805H01L41/083H01L41/0973H01L41/098H01L41/27
    • Multi-layered thin film piezoelectric material stacks and devices incorporating such stacks. In embodiments, an intervening material layer is disposed between two successive piezoelectric material layers in at least a portion of the area of a substrate over which the multi-layered piezoelectric material stack is disposed. The intervening material may serve one or more function within the stack including, but not limited to, inducing an electric field across one or both of the successive piezoelectric material layers, inducing a discontinuity in the microstructure between the two successive piezoelectric materials, modulating a cumulative stress of the piezoelectric material stack, and serving as a basis for varying the strength of an electric field as a function of location over the substrate.
    • 多层薄膜压电材料堆叠和结合这样的堆叠的装置。 在实施例中,中间材料层设置在衬底的至少一部分区域中的两个连续的压电材料层之间,多层压电材料堆叠设置在该区域上。 中间材料可以在堆叠内用于一个或多个功能,包括但不限于在一个或两个连续的压电材料层上引起电场,从而引起两个连续的压电材料之间的微结构的不连续性, 压电材料堆的应力,并且作为改变作为衬底上位置的函数的电场强度的基础。