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    • 64. 发明申请
    • INDUCTION COOKING DEVICE FOR TEMPERATURE-CONTROLLED COOKING
    • 用于温度控制烹调的感应烹饪器
    • WO2012092683A3
    • 2012-11-15
    • PCT/CH2011000309
    • 2011-12-28
    • INDUCS AGTHOMANN ALBERTVOGEL ANDREASFUCHS CHRISTIAN
    • THOMANN ALBERTVOGEL ANDREASFUCHS CHRISTIAN
    • H05B6/06G05D23/20H05B1/02
    • H05B6/06G01K7/38G01K15/005G01K17/00G01K2207/06G05D23/26H05B1/0266H05B6/062H05B2213/07
    • The invention relates to a method for determining and regulating the temperature of an article with inductive properties which is heated inductively by means of an induction device, wherein the induction device contains an induction coil, means for producing an induction resonant circuit and a support element arranged above the induction coil and having a first side, which acts as support face for the article, and a second side, which is directed towards the inductive coil. At least one temperature sensor is fitted to the second side. The resonant frequency of the induction resonant circuit is measured via detection means and the temperature of the article is calculated from the measured resonant frequency, wherein the resonant frequency is related to the temperature of the article by virtue of a mathematical function, and the function is determined by determining at least two absolute temperature calibration values of the article at respectively different resonant frequencies. The temperature calibration values are calculated from temperature measured values of the sensor.
    • 本发明涉及一种用于确定和调节带感性属性的对象,其被感应地通过感应单元加热的温度,其特征在于,所述感应装置的感应线圈装置,用于产生感应振荡电路和感应线圈上方设置具有第一侧,其作为支撑元件 使用物体的支撑表面,以及指向感应线圈的第二侧包含。 至少有一个温度传感器连接到第二面。 关于检测装置检测谐振电路所测量的感应与物体的距离测量的谐振频率的温度的谐振频率,谐振频率是通过数学函数与所述对象的温度的关系连接,并且通过在每个确定所述物体的至少两个绝对温度校准值的函数 确定不同的共振频率。 温度校准值根据传感器的温度读数计算得出。
    • 65. 发明申请
    • THERMAL MANAGEMENT SYSTEM
    • 热管理系统
    • WO2012138486A2
    • 2012-10-11
    • PCT/US2012030218
    • 2012-03-23
    • MICROSOFT CORP
    • YEE DAWSON
    • G05D23/20
    • G05D23/192
    • Various embodiments are disclosed for a thermal management system and related multiple thermally conductive, ferrous particles. The carrier fluid is configured to align at least a portion of the thermally conductive, ferrous particles when the electromagnet generates a magnetic field that attracts the particles, method for selectively thermally isolating and thermally connecting a target component. One embodiment of a system includes a first component having a first surface proximate to a target component, and an electromagnet between the first surface and the target component. A second component is spaced apart from the first component to form a gap that serves as a thermal boundary between the first component and the second component. A carrier fluid disposed within the gap includes and to displace at least a portion of the particles when the electromagnet generates a magnetic field that repels the particles.
    • 公开了用于热管理系统和相关的多个导热的亚铁颗粒的各种实施例。 载体流体被配置为当电磁体产生吸引颗粒的磁场时,对准至少一部分导热的亚铁颗粒,用于选择性地热隔离和热连接目标组分的方法。 系统的一个实施例包括具有靠近目标部件的第一表面的第一部件和在第一表面和目标部件之间的电磁体。 第二部件与第一部件间隔开以形成用作第一部件和第二部件之间的热边界的间隙。 当电磁体产生排斥颗粒的磁场时,布置在间隙内的载体流体包括并移动至少一部分颗粒。
    • 70. 发明申请
    • APPARATUS AND METHOD FOR CONTROLLING TEMPERATURE IN A WAFER AND A DEVICE UNDER TEST USING INTEGRATED TEMPERATURE SENSITIVE DIODE
    • 用于控制波形温度的装置和方法以及使用集成温度敏感二极管测试的器件
    • WO02005051A2
    • 2002-01-17
    • PCT/US2001/021317
    • 2001-07-06
    • G01R31/26G01R31/28G01R31/30G05D23/20H01L21/66H01L21/822H01L27/04G05D23/00
    • G05D23/20G01R31/2891G05D23/1934
    • An apparatus and method for controlling temperature in a device under test (DUT) having an integrated circuit chip die includes a temperature sensing device, such as a temperature sensitive diode, integrally formed in the chip die. A sensing circuit senses a signal from the diode indicative of temperature of the chip die. The sensing circuit can be part of a testing circuit in a system being used to test the DUT. The sensing circuit sends a control signal to a temperature control system used to control the temperature of a DUT temperature control medium. The temperature control medium can be, for example, a stream of temperature-controlled air directed onto the package of the DUT. In response to the control signal, the temperature control system controls the temperature of the air at a desired temperature to control the temperature of the DUT.
    • 用于控制具有集成电路芯片管芯的待测器件(DUT)中的温度的装置和方法包括一体地形成在芯片管芯中的温度感测器件,例如温度敏感二极管。 感测电路感测来自二极管的指示芯片芯片的温度的信号。 感测电路可以是用于测试DUT的系统中的测试电路的一部分。 感测电路将控制信号发送到用于控制DUT温度控制介质的温度的温度控制系统。 温度控制介质可以是例如被引导到DUT的封装上的受温度控制的空气流。 响应于控制信号,温度控制系统将空气的温度控制在期望的温度以控制DUT的温度。