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    • 7. 发明申请
    • APPARATUSES AND METHODS FOR MEASURING AND CHARACTERIZING ULTRASOUND
    • 用于测量和表征超声波的装置和方法
    • WO2015103690A1
    • 2015-07-16
    • PCT/CA2015/000004
    • 2015-01-07
    • SMILESONICA INC.
    • SCURTESCU, CristianUTKIN, Ilya
    • G01H17/00
    • G01K11/22A61C7/00G01H3/10G01K17/00G10K11/02
    • Apparatuses and methods for measuring and characterizing ultrasound using thermoacoustic sensors are provided. Thermoacoustic sensors can include heat flux sensors for detecting a temperature difference (between the front and back of the heat flux senor) and an absorber layer attached to the heat flux sensor for absorbing ultrasound, converting it to heat, and also acting as an acoustic impedance matching layer. An heat sink can also be used. In some embodiments, thermoacoustic sensors can be arranged into an acoustic integrating sphere and face inward to form a cavity. The sphere can have an opening to the cavity, wherein ultrasound emitted through the opening can cause a temperature difference that can be detected by the thermoacoustic sensors. These apparatuses and others can provide for methods of measuring ultrasound power and/or methods of determining an ultrasound profile as the angular distribution of emitted ultrasound power generated by an ultrasound transducer.
    • 提供了使用热声传感器测量和表征超声波的装置和方法。 热声传感器可以包括热通量传感器,用于检测温度差(在热通量传感器的前面和后面之间)和附接到热通量传感器的吸收层,用于吸收超声波,将其转换成热,并且还用作声阻抗 匹配层。 也可以使用散热器。 在一些实施例中,热声传感器可以被布置成声学积分球并面向内以形成空腔。 球体可以具有通向腔的开口,其中通过开口发射的超声可引起可由热声传感器检测的温度差。 这些装置和其它装置可以提供测量超声功率的方法和/或确定超声轮廓的方法作为由超声换能器产生的发射的超声功率的角分布。
    • 10. 发明申请
    • METHOD AND SYSTEM FOR MEASURING HEAT FLUX
    • 测量热通量的方法和系统
    • WO2014194077A2
    • 2014-12-04
    • PCT/US2014/040002
    • 2014-05-29
    • KLA-TENCOR CORPORATION
    • SHARRATT, StephenQULI, FarhatJENSEN, EarlSUN, Mei
    • G01K7/01
    • G01K19/00G01K17/00
    • A heat flux sensor equipped measurement wafer includes a substrate, a cover thermally coupled to a portion of the substrate, a sensor cavity formed between the substrate and the cover, a thermal barrier disposed within at least a portion of the sensor cavity, a bottom temperature sensor thermally coupled to the substrate and insulated from the cover by a portion of the thermal barrier and a top temperature sensor thermally coupled to the cover and insulated from the substrate by an additional portion of the thermal barrier, wherein a temperature difference between the bottom temperature sensor and the top temperature sensor is related to a heat flux passing through the substrate and cover proximate to the sensor cavity.
    • 配备有热量传感器的测量晶片包括基板,热耦合到基板的一部分的盖,形成在基板和盖之间的传感器腔,设置在传感器腔的至少一部分内的热障,底部温度 传感器热耦合到衬底并且由热屏障的一部分与盖隔离,并且顶部温度传感器热耦合到盖并通过热障的另外部分与衬底绝缘,其中底部温度 传感器和顶部温度传感器与通过基板和靠近传感器腔的盖子的热通量有关。