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31. 发明申请

WO2008017682A3 VERFAHREN UND VORRICHTUNG ZUM VERLEGEN VON DÜNNEM DRAHT 审中-公开
公开(公告)号：WO2008017682A3
公开(公告)日：2008-02-14
申请号：PCT/EP2007/058204
申请日：2007-08-07
申请人： MÜHLBAUER AKTIENGESELLSCHAFT , ULRICH, Reinhard , FLÖCK, Thomas
发明人： ULRICH, Reinhard , FLÖCK, Thomas
IPC分类号： H05K3/10 , H05K7/06
摘要： Beim maschinellen Verlegen von Draht auf einem Substrat muss der mit Kleber vorbeschichtete Draht eng an das Substrat angedrückt werden, ohne den Draht zu verletzen. Mit abnehmendem Drahtdurchmesser (

32. 发明申请

WO2008017682A2 METHOD AND DEVICE FOR LAYING THIN WIRE 审中-公开
标题翻译：方法和设备铺设细线
公开(公告)号：WO2008017682A2
公开(公告)日：2008-02-14
申请号：PCT/EP2007058204
申请日：2007-08-07
申请人： MUEHLBAUER AG , ULRICH REINHARD , FLOECK THOMAS
发明人： ULRICH REINHARD , FLOECK THOMAS
IPC分类号： H05K3/10 , H05K7/06
CPC分类号： H05K3/103 , H05K3/386 , H05K2201/0129 , H05K2201/10287 , H05K2203/105 , H05K2203/1105
摘要： The invention relates to a method and a device for laying thin wire. During the automatic laying of wire onto a substrate, the wire that is pre-coated with adhesive has to be pressed tightly against the substrate without damaging the wire. This becomes increasingly difficult with decreasing wire diameters (
摘要翻译：用于铺设细线的方法和装置。在预涂覆用胶水线的基板上自动铺设电线必须紧密压在基板上，而不会损坏导线。这成为随金属丝直径（<0.1 MM）越来越困难。导线被敷设（1）被静电按压于基板表面（4）。为了这个目的，导线和电极（29）之下的衬底被连接到一个电压。电吸引力推动导线到表面如此低，以致它可以连续地从敷设头（20）在预定的张力进行调整。而在电线的支撑部分（33）的吸引作用时，基底表面的金属丝以熔化粘合剂和粘结线下加热。该方法适合于在玻璃上的大张的微电子元件的几乎看不见电连接线，以及用于玻璃纤维的敷设和聚合物上电子线路板。

33. 发明申请

WO2007129421A1 電気接続箱审中-公开
标题翻译：电气连接盒
公开(公告)号：WO2007129421A1
公开(公告)日：2007-11-15
申请号：PCT/JP2006/323269
申请日：2006-11-22
申请人：住友電装株式会社 , 加藤大詞
发明人：加藤大詞
IPC分类号： H02G3/16 , B60R16/02 , H05K7/06
CPC分类号： H01R9/226 , H01R9/24
摘要：　電気接続箱１０のケース１１の下面１１ｂには縦バスバー２１～２３の差込用スリット１５～１７を左右方向に連続させて設け、該縦バスバー２１～２３の上端あるいは／および下端に上下方向に突出する縦向きタブ２５、２６を突設していると共に、縦バスバー２２、２３の左右両側端縁あるいは左右いずれかの一方側端縁に横向きタブ２６を突設し、ケース１１の側面１１ｃには縦バスバー２２、２３の横向きタブ２６を突出させている横向きコネクタ収容部１８を突設し、該コネクタ収容部１８の周壁１９の少なくとも先端部２０をスリットの無い枠状としていることを特徴とする。
摘要翻译：用于插入垂直母线（21-23）的狭缝（15-17）设置在电接线盒（10）的壳体（11）的下侧（11b）中，以便在左右方向上连续。在垂直母线（21-23）的上端和/或下端突出在上下方向上突出的垂直突片（25,26）。横向突片（26）突出在垂直汇流条（22,23）的左右侧边缘或左右侧边缘中的任一个上。通过突出垂直汇流条（22,23）的侧向突出部（26）形成的横向连接器接收部分（18）设置在壳体（11）的侧面（11c）上。至少连接器接收部分（18）的周壁（19）的前端部分（20）具有没有狭缝的框架形状。

34. 发明申请

WO2006110622A2 LAYERED LABEL STRUCTURE WITH TIMER 审中-公开
标题翻译：带定时器的层状标签结构
公开(公告)号：WO2006110622A2
公开(公告)日：2006-10-19
申请号：PCT/US2006/013236
申请日：2006-04-10
申请人： AVESO, INC. , PENNAZ, Thomas, J. , SIME, David, G.
发明人： PENNAZ, Thomas, J. , SIME, David, G.
IPC分类号： H05K7/06
CPC分类号： G09F9/30 , G04F13/04 , G09F3/0294 , G09F3/208 , H01M6/40 , H01M10/425 , H05K1/182 , H05K1/189 , H05K3/284 , H05K2201/10037 , H05K2201/10128 , H05K2203/1311
摘要： The present invention relates to a thin, layered, variable label structure with built- in electronic functionality. The display and/or other functional elements in the structure may be formed by printing processes. The label structure includes a thin, layered structure with an active display, comprising a base layer and a cover layer of material and a display component situated between the base layer and the cover layer. The display is formed with a layer of electrochromic ink and a pair of spaced apart electrodes. The cover layer includes a window to allow for the layer of electrochromic ink to be visible through the cover layer. The label also is configured to respond to an actuating event by completing an electrical connection between a power source and the pair of spaced apart electrodes of the display component, thereby causing the display to change its appearance. The actuating event may include a variety of occurrences, such as: pressing a switch on the label, introducing a power source to activate the display, and a sensor sensing a condition near the label.
摘要翻译：本发明涉及具有内置电子功能的薄的，分层的可变标签结构。结构中的显示器和/或其他功能元件可以通过印刷工艺形成。标签结构包括具有主动显示器的薄的分层结构，其包括基底层和材料覆盖层以及位于基底层和覆盖层之间的显示部件。显示器形成有电致变色油墨层和一对间隔开的电极。覆盖层包括允许电致变色墨水层通过覆盖层可见的窗口。标签还被配置为通过完成电源和显示部件的一对间隔开的电极之间的电连接来响应致动事件，从而使显示器改变其外观。启动事件可以包括各种事件，例如：按下标签上的开关，引入电源以激活显示器，以及传感器感测标签附近的状况。

35. 发明申请

WO2006091940A1 INTEGRATED CIRCUIT PACKAGE WITH LEAD STOPS 审中-公开
标题翻译：集成电路包与引脚
公开(公告)号：WO2006091940A1
公开(公告)日：2006-08-31
申请号：PCT/US2006/006853
申请日：2006-02-27
申请人： TEXAS INSTRUMENTS INCORPORATED , LANGE, Bernhard , BOYD, William, David
发明人： LANGE, Bernhard , BOYD, William, David
IPC分类号： H01L23/495 , H01L23/36 , H05K1/18 , H05K7/06
CPC分类号： H05K3/308 , H01L23/49555 , H01L24/49 , H01L2224/49175 , H01L2924/00014 , H01L2924/01046 , H01L2924/01079 , H01L2924/14 , H05K2201/10689 , H05K2201/10787 , H05K2201/10871 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit (IC) package (100) comprises an IC (102) and leads (104) coupled to the IC. Each lead has a first end (106) configured to be coupled to the integrated circuit and a second end (108) configured to pass through one of a plurality of mounting holes (110) extending through a mounting board (112). The leads comprise at least one positioning lead (114) comprising a stop (118) being a continuous part of the positioning lead and having a lateral dimension (120) greater than a diameter (122) of a first hole (124) of the plurality of mounting holes. The leads further comprise at least one non-positioning lead (116) having a continuous uniformly shaped body (130) with a lateral dimension (132) less than a diameter (134) of a second hole (136) of the plurality of mounting holes. The stop limits an extension of the non-positioning lead through the second hole.
摘要翻译：集成电路（IC）封装（100）包括耦合到IC的IC（102）和引线（104）。每个引线具有被配置为耦合到集成电路的第一端（106）和被配置为穿过延伸穿过安装板（112）的多个安装孔（110）中的一个的第二端（108）。引线包括至少一个定位引线（114），该定位引线（114）包括作为定位引线的连续部分的止动件（118），并且具有大于多个第一孔（124）的直径（122）的横向尺寸（120）的安装孔。引线还包括至少一个具有连续均匀成形的主体（130）的非定位引线（116），其横向尺寸（132）小于多个安装孔中的第二孔（136）的直径（134）。停止限制非定位导线通过第二个孔的延伸。

36. 发明申请

WO2005072111A3 IMPROVED POPULATED PRINTED WIRING BOARD AND METHOD OF MANUFACTURE 审中-公开
标题翻译：改进的人口印刷接线板及其制造方法
公开(公告)号：WO2005072111A3
公开(公告)日：2006-07-20
申请号：PCT/US2004043797
申请日：2004-12-28
申请人： MOTOROLA INC , GOUDARZI VAHID
发明人： GOUDARZI VAHID
IPC分类号： H05K7/02 , H05K3/28 , H05K3/34 , H05K7/06
CPC分类号： H05K3/341 , H05K3/282 , H05K3/3463 , H05K3/3484 , H05K2201/10189 , H05K2201/10371 , H05K2201/10674 , Y02P70/613 , Y10T29/5313
摘要： A populated printed wiring board (PWB) (100) and method of manufacturing the populated PWB are taught. The populated PWB is manufactured by fabricating a PWB (102, 402) with exposed copper pads (302), coating the copper pads with an organic solderability preservative (OSP) (404), depositing a solder paste that includes lead-free solder on the OSP covered copper pads (406), placing components (408) and heating the PWB above a liquidous temperature of the lead-free solder in an air atmosphere (410). The process allows very close spacing of components and component leads while forming reliable solder joints to components that are mechanically stressed and components that have non-negligible planarity or coplanarity tolerances.
摘要翻译：教导了一种填充印刷电路板（PWB）（100）和制造该PWB的方法。通过用暴露的铜焊盘（302）制造PWB（102,402），用有机可焊性防腐剂（OSP）涂覆铜焊盘（404），将含有无铅焊料的焊膏沉积在 OSP覆盖的铜焊盘（406），放置部件（408）并且在空气气氛中将PWB加热到无铅焊料的液态温度（410）以上。该过程允许部件和部件引线的非常紧密的间隔，同时对机械应力的部件形成可靠的焊点，并且具有不可忽视的平面度或共面性公差的部件。

37. 发明申请

WO2006074477A2 INTEGRATED PACKAGED DEVICE HAVING MAGNETIC COMPONENTS 审中-公开
标题翻译：具有磁性元件的集成包装设备
公开(公告)号：WO2006074477A2
公开(公告)日：2006-07-13
申请号：PCT/US2006000912
申请日：2006-01-10
申请人： IXYS CORP , HUMBERT DONALD , FURNIVAL COURTNEY R
发明人： HUMBERT DONALD , FURNIVAL COURTNEY R
IPC分类号： H05K7/06
CPC分类号： H01F27/2804 , H01F27/292 , H01F2019/085 , H01L23/3128 , H01L23/49822 , H01L23/50 , H01L24/48 , H01L25/16 , H01L2224/48227 , H01L2224/48235 , H01L2924/00014 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/15311 , H01L2924/19041 , H01L2924/19105 , H05K1/165 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A packaged device is obtained using an innovative package approach that allows iniegratiou ?i immature planar magnetics into standard iow-cost semiconductor packages (BGA, PDIP, SOIC, etc.) with electronic and electrical components, where those components can be C & W and/or SMD types. The packaged device includes a planar magnetic substrate having first and second dielectric layers, the first dielectric layer having a first winding defined thereon, the second dielectric layer having a second winding defined thereon. A magnetic component is provided in the substrate. A package material provided at least partly around the substrate and the magnetic component to protect the substrate and magnetic component. The magnetic component is an inductor or transformer. The packaged device further includes at least one semiconductor component provided on the first dielectric layer.
摘要翻译：使用创新的封装方法获得封装器件，该方法允许将未成熟的平面磁体与电子和电气元件（标准的低成本半导体封装（BGA，PDIP，SOIC等））集成，其中这些组件可以是C＆W和 /或SMD类型。封装的器件包括具有第一和第二电介质层的平面磁性衬底，第一介电层具有限定在其上的第一绕组，第二介电层具有限定在其上的第二绕组。在基板中设置磁性部件。至少部分地设置在所述基板和所述磁性部件周围的封装材料，用于保护所述基板和所述磁性部件。磁性部件是电感器或变压器。封装器件还包括设置在第一介电层上的至少一个半导体部件。

38. 发明申请

WO2006028643A2 CIRCUIT MODULE SYSTEM AND METHOD 审中-公开
标题翻译：电路模块系统和方法
公开(公告)号：WO2006028643A2
公开(公告)日：2006-03-16
申请号：PCT/US2005/028547
申请日：2005-08-10
申请人： STAKTEK GROUP L.P. , GOODWIN, Paul , CADY, James , WEHRLY, James, Douglas, Jr.
发明人： GOODWIN, Paul , CADY, James , WEHRLY, James, Douglas, Jr.
IPC分类号： H05K7/06 , H05K7/10
CPC分类号： H05K1/189 , G11C5/04 , H01L25/105 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H05K1/0203 , H05K1/118 , H05K1/181 , H05K3/0061 , H05K2201/056 , H05K2201/1056 , H05K2201/10734 , H05K2201/2018 , H05K2203/1572 , H01L2224/0401
摘要： Flexible circuitry is populated with integrated circuits (ICs) disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection to the ICs. Preferably, the flexible circuitry is disposed about an edge of a rigid, thermally-conductive substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. In alternative, but also preferred embodiments, the ICs on the side of the flexible circuit closest to the substrate are disposed, at least partially, in what are windows, pockets, or cutaway areas in the substrate. Other embodiments may only populate one side of the flexible circuit or may remove substrate material to reduce module profile. In preferred embodiments, the contacts distributed along the flexible circuitry are configured for insertion into an edge connector socket such as those found in general purpose and server computers. Preferred substrates are comprised of thermally conductive material. Extensions from the substrate in preferred embodiments can be expected to reduce thermal module loading and encourage reduced thermal variations amongst the integrated circuits of the module during operation.
摘要翻译：灵活的电路填充有沿其主要一侧或两侧设置的集成电路（IC）。沿柔性电路分布的触点提供与IC的连接。优选地，柔性电路围绕刚性的导热基底的边缘设置，因此将集成电路置于衬底的一侧或两侧，在衬底的一侧或两侧上具有一层或两层集成电路。在替代方案中，也是优选实施例中，最靠近基板的柔性电路侧的IC至少部分地设置在基板中的窗口，凹穴或切口区域中。其他实施例可以仅填充柔性电路的一侧或者可以移除衬底材料以减少模块轮廓。在优选实施例中，沿着柔性电路分布的触点被配置为插入到诸如在通用和服务器计算机中找到的边缘连接器插座中。优选的衬底由导热材料构成。预期在优选实施例中，来自衬底的延伸可以减少热模块负载并且促进在操作期间模块的集成电路之间的热变化减小。

39. 发明申请

WO2005091913A2 MIDSPAN PATCH PANEL WITH COMPENSATION CIRCUIT FOR DATA TERMINAL EQUIPMENT, POWER INSERTION AND DATA COLLECTION 审中-公开
标题翻译：带数据终端设备补偿电路的MIDSPAN贴片面板，电源插入和数据收集
公开(公告)号：WO2005091913A2
公开(公告)日：2005-10-06
申请号：PCT/US2005006595
申请日：2005-03-02
申请人： HUBBELL INC , ABUGHAZALEH SHADI , BAXTER ROBERT , MAHMOOD REHAN , MILLER ALAN , O'CONNOR MICHAEL
发明人： ABUGHAZALEH SHADI , BAXTER ROBERT , MAHMOOD REHAN , MILLER ALAN , O'CONNOR MICHAEL
IPC分类号： H05K1/00 , H05K1/02 , H05K1/16 , H05K7/06
CPC分类号： H05K1/0228 , H04Q1/13 , H05K1/0231 , H05K1/0298 , H05K1/162 , H05K2201/09236 , H05K2201/10189 , Y10S439/941
摘要： A compensating advanced feature patch panel (12) that can include removable modular (50) or fixed electronic components (46) located directly on the patch panel which are separately or in combination capable of providing advanced features such as device detection and power insertion. The patch panel provides communications between an insulation displacement connector (IDC) at a PD/User end (84), and any standard interface type using unshielded twisted pair cables, such as an RJ45 connector at a switch end (86) at performance levels of at least category 3, 5, 5e, 6 and/or higher (e.g. 6e or 7) and equivalent performance levels as required by compensating for the active electronics used in providing advanced features through the use of inductive, capacitive and reactive circuit elements to compensate for advanced feature electronics.
摘要翻译：一种补偿性高级特征接线板（12），其可以包括直接位于接线板上的可移动模块化（50）或固定电子部件（46），它们分开或组合能够提供诸如设备检测和电力插入之类的高级特征。接线板提供PD /用户端（84）处的绝缘位移连接器（IDC）和使用非屏蔽双绞线电缆（例如交换机端（86）处的RJ45连接器）的任何标准接口类型之间的通信，至少是类别3,5,5e，6和/或更高（例如6e或7）以及通过使用电感性，电容性和电抗性电路元件来补偿用于提供高级特征的有源电子元件所需要的等效性能水平用于高级功能电子。

40. 发明申请

WO2005082034A2 AN INTERCONNECT STRUCTURE AND METHOD FOR CONNECTING BURIED SIGNAL LINES TO ELECTRICAL DEVICES 审中-公开
标题翻译：将连接信号线连接到电气设备的互连结构和方法
公开(公告)号：WO2005082034A2
公开(公告)日：2005-09-09
申请号：PCT/US2005/006021
申请日：2005-02-24
申请人： AGILENT TECHNOLOGIES, INC.
发明人： ROSENAU, Steven, A.
IPC分类号： H01R12/00 , H05K1/00 , H05K1/02 , H05K1/11 , H05K1/14 , H05K3/34 , H05K7/02 , H05K7/06 , H05K7/08 , H05K7/10
CPC分类号： H05K1/112 , H05K1/0237 , H05K1/0298 , H05K3/3421 , H05K3/3436 , H05K2201/09472 , H05K2201/10704 , H05K2201/10734 , H05K2203/049
摘要： An electrical component, such as a trace, signal line, or contact pad (202) connected to the trace or signal line, is covered by one or more layers (106, 110). The electrical component is connected directly to an electrical device by forming an opening (114) through the one or more layers (106, 110). The opening (114) exposes a portion of the electrical component. A connector, such as a solder ball (410), a pin contact (618), or a wire bond (502), is then attached to the exposed portion of the electrical component. The connector connects directly to another electrical device to create an electrical connection between the electrical component and the electrical device. The electrical device may be configured, for example, as a second signal line or contact pad (412) in another stripline circuit, a microstrip circuit, an integrated circuit, or an electrical component.
摘要翻译：连接到迹线或信号线的电子部件，例如迹线，信号线或接触焊盘（202）被一个或多个层（106,110）覆盖。通过形成穿过所述一个或多个层（106,110）的开口（114），所述电气部件直接连接到电气装置。开口（114）暴露电气部件的一部分。然后将诸如焊球（410），销触点（618）或引线接合（502）的连接器附接到电气部件的暴露部分。连接器直接连接到另一个电气设备，以在电气部件和电气设备之间形成电连接。电气设备可以被配置为例如另一个带状线电路中的第二信号线或接触焊盘（412），微带电路，集成电路或电气部件。

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