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31. 发明申请

WO01088970A1 SEMICONDUCTOR WAFER THINNING METHOD, AND THIN SEMICONDUCTOR WAFER 审中-公开
标题翻译： SEMICONDUCTOR WAFER THINNING METHOD，AND THIN SEMICONDUCTOR WAFER
公开(公告)号：WO01088970A1
公开(公告)日：2001-11-22
申请号：PCT/JP2001/003947
申请日：2001-05-11
IPC分类号： B24B7/22 , B24B37/30 , H01L21/304 , H01L21/687
CPC分类号： H01L21/304 , B24B7/228 , B24B41/068 , B24B49/00 , H01L21/6835 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10S438/928 , Y10S438/959 , Y10S438/977
摘要： A method for thinning a semiconductor wafer having a semiconductor element (2) on its surface, by polishing the back thereof. This method comprises bonding the surface of the semiconductor wafer (1) to a support (4) through an adhesive layer; polishing the back of the semiconductor wafer while holding the support; and separating the thinned semiconductor wafer from the support. Preferably, a semiconductor wafer is employed as the support, and a thermally separable double-coated sheet is employed as the adhesive layer. The semiconductor wafer is heated and separated after ground. As a result, the semiconductor wafer having a thickness of 120 ñm or less can be manufactured at a low cost while suppressing the cracking or chipping to a minimum at the working step. Thus, there is provided a semiconductor wafer which is made thinner than those of the prior art while having a diameter as large as 150 mm or more.
摘要翻译：一种通过对其表面进行抛光来在其表面上稀薄具有半导体元件（2）的半导体晶片的方法。该方法包括通过粘合剂层将半导体晶片（1）的表面粘合到支撑体（4）上; 在保持支撑件的同时抛光半导体晶片的背面; 以及将薄化的半导体晶片与支撑体分离。优选地，使用半导体晶片作为支撑体，并且使用可热分离的双层片作为粘合剂层。研磨后将半导体晶片加热分离。结果，可以以低成本制造厚度为120μm以下的半导体晶片，同时在工作步骤中将破裂或碎裂抑制到最小。因此，提供了一种比现有技术薄的半导体晶片，同时具有大至150mm或更大的直径。

32. 发明申请

WO01083165A1 APPARATUS FOR MECHANICALLY TREATING A SURFACE, AS WELL AS A METHOD FOR MECHANICALLY TREATING A SURFACE 审中-公开
标题翻译：用于机械地处理表面的装置，作为机械地处理表面的方法
公开(公告)号：WO01083165A1
公开(公告)日：2001-11-08
申请号：PCT/IB2001/000700
申请日：2001-04-25
IPC分类号： B24B7/18 , B24B7/22 , B24B41/047 , B24B49/00 , B28D1/18 , E01C23/088
CPC分类号： B24B7/188 , B24B7/22 , B24B41/047 , B24B49/00 , B28D1/181 , E01C23/088
摘要： The present invention relates to an apparatus (1) for mechanically treating a surface, in particular milling, scouring, grinding and/or polishing the same, using a treatment device (3-9) which rotates about a horizontal axis, which treatment device (3-9) is mounted on a steerable frame (2). The present invention furthermore relates to a method for mechanically treating a surface.
摘要翻译：本发明涉及一种用于使用围绕水平轴线旋转的处理装置（3-9）机械处理表面，特别是铣削，冲刷，研磨和/或抛光该装置的装置（1），该处理装置 3-9）安装在可操纵的框架（2）上。本发明还涉及一种用于机械处理表面的方法。

33. 发明申请

WO01072472A2 CARRIER HEAD WITH MULTI-PART FLEXIBLE MEMBRANE 审中-公开
标题翻译：带有多层柔性膜的载体头
公开(公告)号：WO01072472A2
公开(公告)日：2001-10-04
申请号：PCT/US2001/007974
申请日：2001-03-12
IPC分类号： B24B7/22 , B24B37/30 , F16J3/02 , H01L21/304 , B24B37/04 , B24B41/06
CPC分类号： B24B37/30 , F16J3/02
摘要： A carrier head (100) for a chemical mechanical polishing apparatus includes a flexible membrane (150) that applies a load to a substrate. The substrate backing assembly (112) includes an internal membrane (150), an external membrane (152), an internal membrane support structure (160), an upper membrane spacer ring (162), a lower membrane spacer ring (164), and an edge control ring (166). The volume between the base assembly (104) and the internal membrane (150) forms the upper chamber (154) and the internal chamber (156), and the volume between the internal membrane (150) and the external membrane (152) forms the outer chamber (158). The internal membrane (150) includes a circular central portion (170), a relatively thick annular portion (174), an annular inner flap (176) that extends from the corner of the thick portion (174), an annular outer flap (178) that extends from the outer rim of the thick portion (174) and an annular connector portion (172). The inner flap (176) and the outer flap (178) can be formed of a first elastomer, whereas the thick portion (174) and connector portion (172) can be formed of a second elastomer.
摘要翻译：用于化学机械抛光装置的承载头（100）包括向衬底施加负荷的柔性膜（150）。衬底背衬组件（112）包括内膜（150），外膜（152），内膜支撑结构（160），上膜间隔环（162），下隔膜间隔环（164）和边缘控制环（166）。基部组件（104）和内膜（150）之间的体积形成上室（154）和内室（156），并且内膜（150）和外膜（152）之间的体积形成外室（158）。内膜（150）包括圆形中心部分（170），相对厚的环形部分（174），从厚壁部分（174）的角部延伸的环形内部折片（176），环形外部折片），其从所述厚部分（174）的外缘延伸并且环形连接器部分（172）延伸。内翼片（176）和外翼片（178）可以由第一弹性体形成，而厚部分（174）和连接器部分（172）可以由第二弹性体形成。

34. 发明申请

WO00054932A1 AUTOMATIC SMOOTHING AND POLISHING SYSTEM FOR PLATES AND BLOCKS MADE OF MARBLE, GRANITE AND STONE IN GENERAL 审中-公开
标题翻译：大理石，石灰岩和石材板块和块的自动平滑和抛光系统
公开(公告)号：WO00054932A1
公开(公告)日：2000-09-21
申请号：PCT/IT2000/000082
申请日：2000-03-14
IPC分类号： B24B7/06 , B24B7/22
CPC分类号： B24B7/224 , B24B7/06
摘要： Automatic smoothing and polishing system for plates and blocks, generally of large sizes, made of marble, granite and plate in general, wherein during the translation of plates or blocks arranged along a conveyor belt (2), at least two rows of tool-holder heads (18) are made simultaneously interact so that the plates are worked along longitudinal portions to the advancement motion thereof. The tool-holder heads (8) arranged at the same height with respect to the plate advancement direction are provided with the same abrasive grain; moreover, the heads are made reciprocally integral by means of a carriage (6) provided with oscillating motion that is independent and transverse with respect to the advancement motion of the plates to be abraded.
摘要翻译：通常由大理石，花岗岩和板材制成的通常为大尺寸的板和块的自动平滑和抛光系统，其中在沿传送带（2）布置的板或块的平移期间，至少两排工具架头部（18）被同时相互作用，使得板沿纵向部分被加工成其前进运动。相对于板前进方向布置在相同高度的工具架头（8）设置有相同的磨粒; 此外，通过具有摆动运动的滑架（6）使头部相互整体成一体，该摆动运动相对于被磨削板的推进运动是独立的和横向的。

35. 发明申请

WO00036637A1 METHOD OF PROCESSING SEMICONDUCTOR WAFERS TO BUILD IN BACK SURFACE DAMAGE 审中-公开
标题翻译：加工半导体波形的方法来构建背面损伤
公开(公告)号：WO00036637A1
公开(公告)日：2000-06-22
申请号：PCT/US1999/027513
申请日：1999-11-19
IPC分类号： B24B7/22 , B24B37/00 , H01L21/304 , H01L21/306
CPC分类号： H01L21/02013 , H01L21/02008 , H01L21/02024
摘要： A method of processing a semiconductor wafer sliced from a single-crystal ingot includes lapping front and back surfaces of the wafer to reduce the thickness of the wafer and to improve the flatness of the wafer. The front surface is subjected to fine grinding to reduce the damage on the front surface while leaving damage on the back surface intact. The front and back surfaces are simultaneously polished to improve the flatness of the wafer and to reduce wafer damage on the front and back surfaces. The wafer damage remaining on the back surface is greater than the wafer damage on the front surface. The wafer damage remaining on the back surface facilitates gettering.
摘要翻译：处理从单晶锭切片的半导体晶片的方法包括研磨晶片的前表面和后表面以减小晶片的厚度并提高晶片的平坦度。前表面进行细磨以减少前表面的损伤，同时在背面完好无损地损坏。前表面和后表面被同时抛光以提高晶片的平整度并减少前表面和背面上的晶片损坏。背面残留的晶片损伤大于前表面上的晶片损坏。背面残留的晶片损伤有助于吸气。

36. 发明申请

WO2000020167A3 METHOD AND APPARATUS FOR AUTOMATICALLY POLISHING MAGNETIC DISKS AND OTHER SUBSTRATES 审中-公开
公开(公告)号：WO2000020167A3
公开(公告)日：2000-04-13
申请号：PCT/US1999/023182
申请日：1999-10-05
申请人： EXCLUSIVE DESIGN COMPANY, INC.
发明人： WILLIAMS, Roger, O. , HOWARD, Jeff , SINGH, Tarlochan , JONES, Nathan , AVEN, James, R. , SERPA, Leroy, J. , LEE, Lawrence , VANTUYL, Mike , HAMILTON, Lindsey , O'DONNELL, Sean , HERRMANN, Michael, J. , THOMPSON, Kevin , NYSTEDT, Jon, F. , RICHARDSON, Matt
IPC分类号： B24B7/22 , B24B41/06 , B24B49/08
摘要： A substrate polishing apparatus for sequentially polishing both sides of a substrate, such as a magnetic disk, and method therefor, are provided. The apparatus according to the present invention may be conveniently considered in terms of it's subassemblies. The apparatus includes a cassette/disk handling robot (104), a disk flip and rinse station (106), an orbiter (110) including disk polish heads (112), a main gantry robot (108) and a magazine (114) having a polish platen (116) and supplying a polish tape or web tape (115) on which the substrate is polished. The disk flip and rinse station (106) receives a substrate from the cassette/disk handling robot (104) and subsequently releases the substrate back to the cassette/disk handling robot (104). The main gantry robot (108) moves the orbiter (110) and the disk polish head (112) to retrieve the substrate from the disk flip and rinse station (106) for polishing and to release the substrate back to the disk flip and rinse station (106) after polishing. The method according to the invention generally comprises the steps of polishing the first side of a substrate, automatically inverting the substrate and polishing the second side.

37. 发明申请

WO99039873A1 GRINDING SPINDLE 审中-公开
标题翻译：磨削主轴
公开(公告)号：WO99039873A1
公开(公告)日：1999-08-12
申请号：PCT/DE1998/000592
申请日：1998-02-27
IPC分类号： B24B41/04 , B23Q5/04 , B24B7/22
CPC分类号： B24B41/04
摘要： The invention relates to a grinding spindle, comprising a spindle housing and two coaxial shafts which are driven by a drive motor. A concentric grinding disk is fixed to each of said shafts. The shafts can be moved in an axial direction in relation to each other with a lifting or lowering movement in order to engage one grinding disk or the other. The inner shaft is connected to the drive motor as a main shaft (1) whilst the outer shaft (8) is coupled to said main shaft (1) by a carrier device (10). In addition, a bush (4) is coaxially semi-mounted on the spindle housing (3), the outer shaft (8) is pivotably mounted on the bush (4) with a pivot bearing (9) and the bush (4) is provided with an actuator (13) which executes the lifting or lowering movement.
摘要翻译：本发明涉及一种具有主轴壳体一个磨削主轴，并且由驱动马达轴驱动的，对其中的每一个被由两个同心的砂轮固定在两个同轴的，并且其是相对于轴向方向上彼此通过提升或下降运动中移动，从而使任选的一个或另一个砂轮可以作为一个主轴相接合与内轴（1）连接到所述驱动马达，所述外轴（8）由一个驱动装置（10），在主轴（1），耦合到一个衬套（4 ）同轴地被钩住在主轴壳体（3），所述外轴（8）的插座（4）由一旋转轴承的装置（9）上可旋转地安装，套管（4）（具有致动器13）被提供时，解除上或下降运动执行。

38. 发明申请

WO99034954A1 STONE TILE FINISHING SYSTEM 审中-公开
标题翻译：石材修整系统
公开(公告)号：WO99034954A1
公开(公告)日：1999-07-15
申请号：PCT/CA1999/000002
申请日：1999-01-05
IPC分类号： B23Q1/62 , B23Q3/18 , B24B7/22 , B24B9/06 , B24B27/00 , B28D1/00 , B28D1/04 , B23Q1/25 , B24B41/04 , B28D1/30
CPC分类号： B28D1/047 , B23Q1/626 , B23Q3/186 , B24B7/22 , B24B9/06 , B24B27/0076 , B28D1/003
摘要： A stone tile finishing system (1) includes an apparatus and a group of different tools usable in the apparatus for various tile finishing operations. The apparatus itself has a motor (21), a tool mount rotated by the motor (21) and a tile support (37) movable relative to the motor (21). The tool mount has capacity to receive any one of the different tools. The motor (21) is swingably held within the apparatus by a height adjustable motor (21) mount (19) which enables moving of the motor (21) to different working positions relative to the tile (37) support for carrying out the various tile finishing operations.
摘要翻译：石瓦整理系统（1）包括可用于各种瓦片整理操作的装置中的设备和一组不同的工具。该装置本身具有马达（21），由马达（21）旋转的工具架和相对于马达（21）可移动的瓦片支撑件（37）。工具支架有能力接收任何一种不同的工具。马达（21）通过高度可调的马达（21）安装件（19）可摆动地保持在设备内，使得马达（21）能够相对于瓦片（37）支撑而移动到不同的工作位置，以执行各种瓦片整理作业。

39. 发明申请

WO99015312A1 POLISHING MACHINE INCLUDING A PLATFORM ASSEMBLY MOUNTED ON THREE COLUMNS 审中-公开
标题翻译：抛光机，包括安装在三个柱上的平台装配
公开(公告)号：WO99015312A1
公开(公告)日：1999-04-01
申请号：PCT/US1998/017931
申请日：1998-08-28
IPC分类号： B24B41/02 , B24B7/17 , B24B7/22 , B24B37/08
CPC分类号： B24B37/08 , B24B7/17 , B24B7/228
摘要： A polishing machine includes a platform assembly (60) slidably mounted on three support columns (32-36). The assembly (60) includes first and second platforms (64, 66) joined together and slidably movable toward and away from each other. A lift plate (114) is supported above the uppermost platform (64) by a coil spring, which allows adjustment of the pressure applied on an upper polish plate (20) which is suspended from the lift plate (114) by a supporting element which passes through the assembly (60). Drive shafts (72-76) are suspended from an overlying superstructure and engage the upper platform (64) so as to raise and lower the assembly (60) and the upper polish plate (20).
摘要翻译：抛光机包括可滑动地安装在三个支撑柱（32-36）上的平台组件（60）。组件（60）包括连接在一起并且可滑动地相互移动和移开的第一和第二平台（64,66）。升降板（114）通过螺旋弹簧支撑在最上平台（64）上方，该螺旋弹簧允许调节施加在由提升板（114）悬挂的上抛光板（20）上的压力由支撑元件通过组件（60）。驱动轴（72-76）悬挂在上层结构上并与上平台（64）接合，以便升高和降低组件（60）和上抛光板（20）。

40. 发明申请

WO2022234609A1 SURFACE FINISHING TOOL 审中-公开
公开(公告)号：WO2022234609A1
公开(公告)日：2022-11-10
申请号：PCT/IT2022/050119
申请日：2022-05-05
申请人： TENAX S.P.A.
发明人： FIORATTI, Stefano
IPC分类号： B24B41/047 , B24B7/22 , B24D7/06 , B24D7/10 , B24B55/03
摘要： The invention concerns a tool for surface finishing containing a body (20) to which there is attached a surface finishing element (30) which in turn includes at least one abrasive member (31) equipped with a respective abrasive surface (32) intended to slide in contact against the ceramic or glass material to be treated.

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