会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 35. 发明申请
    • PROCESS AND DEVICE FOR THE WAVE OR VAPOUR-PHASE SOLDERING OF ELECTRONIC UNITS
    • METHOD AND APPARATUS FOR波和/或电子部件汽相焊接
    • WO1996037330A1
    • 1996-11-28
    • PCT/DE1996000968
    • 1996-05-24
    • FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.SCHEEL, WolfgangRING, KarlHAFNER, WilliLEICHT, Helmut
    • FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
    • B23K01/015
    • B23K1/015B23K2101/40H05K3/3415H05K3/3468H05K3/3494H05K2203/088
    • The invention describes a process and a device for wave and/or reflow soldering in the form of vapour-phase soldering for electronic units. In prior art processes and devices, either wave soldering or vapour-phase soldering alone can be performed in a single chamber. For electronic units which contain both components which are to be wave soldered and those to be reflow soldered, at least two soldering devices and two process steps are necessary. There is the further drawback that temperature-sensitive components impose either a limitation on the soldering temperature and hence the solders which can be used or laborious post-fitting. The invention performs wave soldering and vapour-phase soldering as a form of reflow soldering in a single chamber, in which an electronic unit can be placed and/or the portion of the volume of the chamber filled with the saturated vapour of a primary fluid can be controlled in such a way that, at the worst, temperature-sensitive components of the unit lie only partly in the saturated vapour and the connections of the electronic components of the unit are in the saturated vapour during soldering. The invention permits the soldering of surface-fitted, penetrating and temperature-sensitive components, e.g. large electrolytic capacitors, in a single chamber and in a single process stage and is therefore eminently suitable for economical mass production with high soldering quality.
    • 本发明描述的方法和在用于电子组件汽相焊接的形式波和/或回流焊接的装置。 在在一个单一的室中仅波峰焊或仅气相焊接已知方法和装置或者是可行的。 对于包含于波峰焊和回流焊接两个部件的电子组件,从而至少两个焊接设备,因此需要两个工艺步骤。 还存在温度敏感设备或者需要在钎焊温度的限制,因此为所述可选择的焊接材料,或进行复杂的改造必要的缺点。 本发明实现了波峰焊和汽相焊接作为在单一腔室回流焊接的形式中,电子组件可被放置成和/或填充有所述室的主液体体积分数的饱和蒸汽被如此调节使得组件中的温度敏感元件至多部分地 位于饱和蒸汽,并且该连接被焊接模块的电子部件的软钎焊过程中位于饱和蒸汽。 本发明允许安装面的焊接,通过配合和温度敏感的组分,例如 大电解电容器,在一个单一的腔室,并在单一的工艺步骤,并且因此非常适合于廉价的大量生产具有非常好的焊接质量。
    • 39. 发明申请
    • PLASMA REACTOR
    • 等离子体反应器
    • WO1996023318A1
    • 1996-08-01
    • PCT/DE1995001786
    • 1995-12-08
    • FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.WILD, ChristofFÜNER, MichaelKOIDL, Peter
    • FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
    • H01J37/32
    • H01J37/32229H01J37/32192H01J37/32247
    • The invention concerns a plasma reactor for generating and maintaining plasma. The plasma reactor comprises a resonant cavity (11) whose cross-section tapers in summit regions (13, 16) in which the wall (14) of the resonant cavity (11) is closed to such an extent that an excited field mode in the region of the cross-sectional tapered portions displays main peaks (15, 31) whose maximum field intensity is increased with respect to the field intensity of adjacent secondary peaks. A reaction unit (18) is provided in the region of a main peak (31) with a substrate (21) which is to be processed and which can be coated in the gas phase of the plasma (32). As a result of the field intensity distribution brought about by a resonant cavity (11) of the given shape, with main peaks (15, 31) which are greatly increased with respect to secondary peaks, process parameters such as gas pressure and coupled electromagnetic power can be selected very largely independently of one another when the plasma (32) is in a stable situation, without the plasma (32) igniting undesirably in the region of secondary peaks. Furthermore, the comparatively homogeneous field intensity distribution in the main peak (31) maintaining the plasma (32) causes the substrate (21) to be processed uniformly.
    • 在用于产生和维持等离子体的等离子体反应器中,谐振腔(11)设置,其横截面在顶点区域(13,16)是锥形的。 在顶点区域(13,16)的空腔(11)的壁(14)关闭的程度,在横截面收缩的,其最大磁场强度相比相邻的次要最大值的场强是过度的区域主要最大值(15,31)的激发模式字段。 在主最大(31)的区域中具有包括被处理基板(21)的反应单元(18)被提供,其是从等离子体(32)的气相涂覆的。 通过处理特定形状产生的场强分布的谐振腔(11)相对于次级最大值过高主峰(15,31)是过程参数,例如气体压力和在等离子体(32)在很大程度上独立选择的稳定位置发射电磁功率,而不 涉及到在二次最大值的区域中的等离子体(32)的不希望的点火。 更设有由相对均匀的磁场强度分布实现,其中在等离子体(32)娱乐主最大(31)的基板(21)的均匀处理。