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21. 发明申请

WO2007085563A1 VERFAHREN ZUM AUFBRINGEN EINES LOTDEPOTS AUS EINEM LOTWERKSTOFF AUF EIN SUBSTRAT DURCH KALTGAS S PRI T Z EN SOWIE PULVERFÖRMIGER LOTWERKSTOFF , WOBEI DER LOTWERKSTOFF PULVERFÖRMIGES WEICHLOT UND PULVERFÖRMIGES ALUMINIUM ENTHÄLT 审中-公开
标题翻译：方法用于施加焊料沉积由焊料材料由KALTGAS小号PRIŤžEN和粉状焊料材料，焊接材料服用粉状焊料和粉状铝包含基板
公开(公告)号：WO2007085563A1
公开(公告)日：2007-08-02
申请号：PCT/EP2007/050513
申请日：2007-01-18
申请人： ROBERT BOSCH GMBH , NUECHTER, Wolfgang , KONRAD, Heike , BEREK, Harry
发明人： NUECHTER, Wolfgang , KONRAD, Heike , BEREK, Harry
IPC分类号： B23K1/00 , B23K1/20 , B23K3/06 , B05B7/14 , B23K35/02 , C23C24/04 , H05K3/34
CPC分类号： B23K1/0016 , B23K1/20 , B23K3/0607 , B23K35/262 , B23K35/264 , B23K35/268 , B23K2201/42 , C23C24/04 , H05K3/3484 , H05K2201/0215 , H05K2203/0425 , H05K2203/1344
摘要： Die Erfindung betrifft ein Verfahren zum Aufbringen eines Lotdepots (4) aus einem Aluminium enthaltenden Lotwerkstoff (6) auf ein Substrat (8), bei dem das Lotdepot (4) durch Kaltgasspritzen des pulverförmigen Lotwerkstoffs (6) mit einem Prozessgas auf das Substrat (8) aufgebracht wird. Die Erfindung betrifft weiter einen pulverförmigen Lotwerkstoff (6). Es ist vorgesehen, dass der Lotwerkstoff (6) pulverförmiges Weichlot und pulverförmiges Aluminium enthält.
摘要翻译：本发明涉及一种用于施加焊料沉积物（4）含铝焊料材料（6）的基板（8）上，其中，所述焊料沉积物（4）的粉末状钎焊材料的冷气喷涂（6）（具有工艺气体在基板8上的）被施加。本发明还涉及一种粉末状的钎焊材料（6）。据设想，该焊料材料（6）包含粉末状软焊料和粉状铝。

22. 发明申请

WO2004047507A3 COATING COMPOSITIONS FOR SOLDER SPHERES, POWDERS AND PREFORMS, METHODS OF PRODUCTION AND USES THEREOF 审中-公开
标题翻译：用于焊球，粉末和预制件的涂料组合物，其生产方法及其用途
公开(公告)号：WO2004047507A3
公开(公告)日：2004-08-26
申请号：PCT/US0337663
申请日：2003-11-13
申请人： HONEYWELL INT INC , FLINT JAMES
发明人： FLINT JAMES
IPC分类号： C21D1/613 , C21D1/667 , C21D9/34 , C22C13/00 , H05K3/34 , B23K31/02 , B32B15/08 , C08J7/04
CPC分类号： C22C13/00 , B23K35/0244 , B23K35/268 , B23K35/3612 , B23K35/3613 , C21D1/613 , C21D1/667 , C21D9/34 , H01L2924/0002 , H05K3/3478 , H05K3/3489 , H01L2924/00
摘要： A solder material has been produced and is described herein that comprises a conventional solder component, such as a solder sphere, solder ball, solder powder, solder preform, some other suitable material or form of solder or a combination thereof and a coating composition. Solder parts and/or solder materials described herein may be produced by a) providing a solder component, b) providing a coating precursor material, c) providing a solvent, d) blending the coating precursor material and the solvent, such that the coating precursor material is substantially solvated, to form a coating composition, and e) applying or coupling the coating composition to the solder component.
摘要翻译：已经生产并且在此描述的焊料材料包括常规的焊料组分，例如焊球，焊球，焊料粉末，焊料预制件，一些其它合适的材料或形式的焊料或其组合以及涂料组合物。本文所述的焊料和/或焊料材料可以通过以下方式制备：a）提供焊料组分，b）提供涂层前体材料，c）提供溶剂，d）共混涂覆前体材料和溶剂，使得涂层前体材料被基本上溶剂化，以形成涂料组合物，和e）将涂料组合物施加或耦合到焊料组分。

23. 发明申请

WO2004068643A1 VEHICULAR GLAZING PANEL 审中-公开
标题翻译：车身玻璃面板
公开(公告)号：WO2004068643A1
公开(公告)日：2004-08-12
申请号：PCT/GB2004/000207
申请日：2004-01-21
申请人： PILKINGTON PLC , COOK, Andrew, John , DAY, Stephen, Roland , LYON, Michael
发明人： COOK, Andrew, John , DAY, Stephen, Roland , LYON, Michael
IPC分类号： H01R4/62
CPC分类号： H05B3/84 , B23K35/262 , B23K35/264 , B23K35/268 , B32B17/10036 , B32B17/10174 , C03C27/046 , C22C11/06 , C22C12/00 , C22C13/00 , H01Q1/1271 , H01Q1/325 , H01R4/625 , H05B2203/016
摘要： A vehicular glazing panel comprises a pane of glass, first and second electrically conductive components and lead-free solder which joins the second electrically conductive component to the first (which exists on a surface of the pane of glass). The lead-free solder includes a mechanical stress modifier, selected from bismuth, tin or antimony, which inhibits the occurrence of a stress fault in the pane of glass in the region of the solder, and contains tin in an amount less than 90 % by weight. The first and second electrically conductive components are often a busbar and an electrical connector, or an antenna element and an antenna connector, respectively.
摘要翻译：车辆玻璃板包括玻璃板，第一和第二导电部件和将第二导电部件连接到第一（存在于玻璃板的表面上）的无铅焊料。无铅焊料包括选自铋，锡或锑的机械应力调节剂，其抑制焊料区域中的玻璃板中的应力缺陷的发生，并且含有以小于90％的量的锡重量。第一和第二导电部件通常分别是母线和电连接器，或天线元件和天线连接器。

24. 发明申请

WO2004034427A2 SEMICONDUCTOR PACKAGES; LEAD-CONTAINING SOLDERS AND ANODES; AND METHODS OF REMOVING ALPHA-EMITTERS FROM MATERIALS 审中-公开
标题翻译：半导体封装铅包装和阳极; 和从材料中去除发光体的方法
公开(公告)号：WO2004034427A2
公开(公告)日：2004-04-22
申请号：PCT/US2003/030783
申请日：2003-09-25
申请人： HONEYWELL INTERNATIONAL INC.
发明人： WEISER, Martin, W. , DEAN, Nancy, F. , CLARK, Brett, M. , BOSSIO, Michael, J. , FLEMING, Ronald, H. , FLINT, James, P.
IPC分类号： H01L
CPC分类号： H01L24/10 , B23K35/025 , B23K35/26 , B23K35/268 , C22B13/06 , C25C1/18 , H01L23/3128 , H01L23/49816 , H01L24/13 , H01L2224/05568 , H01L2224/05573 , H01L2224/13 , H01L2224/13099 , H01L2224/16225 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/01088 , H01L2924/01092 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H05K3/3463 , H05K3/3484 , H01L2924/00 , H01L2224/05599
摘要： The invention includes solder materials having low concentrations of alpha particle emitters, and includes methods of purification of materials to reduce a concentration of alpha particle emitters within the materials. The invention includes methods of reducing alpha particle flux in various lead-containing and lead-free materials through purification of the materials. The invention also includes methods of estimating the fractionation of a low concentration of one or more alpha particle emitters during purification of a material.
摘要翻译：本发明包括具有低浓度α粒子发射体的焊料材料，并且包括纯化材料以降低材料内的α粒子发射体浓度的方法。本发明包括通过纯化材料来减少各种含铅和无铅材料中的α粒子通量的方法。本发明还包括在纯化材料期间估计低浓度的一种或多种α粒子发射体的分馏的方法。

25. 发明申请

WO01089757A1 VARIABLE MELTING POINT SOLDERS AND BRAZES 审中-公开
标题翻译：可变熔炼点焊机和布
公开(公告)号：WO01089757A1
公开(公告)日：2001-11-29
申请号：PCT/CA2001/000721
申请日：2001-05-24
IPC分类号： B22F1/00 , B23K35/02 , B23K35/14 , B23K35/26 , B23K35/28 , B23K35/30 , H05K3/34
CPC分类号： B23K35/3033 , B22F1/0003 , B23K35/0227 , B23K35/0233 , B23K35/0244 , B23K35/025 , B23K35/262 , B23K35/264 , B23K35/268 , B23K35/28 , B23K35/288 , B23K35/302 , H05K3/3463 , H05K3/3484 , H05K2201/0272
摘要： Variable melting point solders and brazes having compositions comprising a metal or metal alloy powder having a low melting point with a metal powder having a higher melting point. Upon heating, in-situ alloying occurs between the low and high melting point powders such that solidification occurs at the solder or braze temperature thus creating a new, higher solidus (or melting) temperature with little or no intermetallic formation. A solder comprising Sn powder mixed with a Sn-Bi eutectic powder having a composition of 63wt.% Sn: 57wt.% Bi such that the bulk composition of the mixture is 3 wt.% Bi has an initial melting point of 140 DEG C and a re-melt temperature of 220 DEG C after heating due to in-situ alloying. A composition of Pb powder mixed with a Pb-Sn eutectic powder having a composition of 62wt.% Sn:58wt.% Pb such that the bulk composition of the mixture is 15 wt.% Sn has an initial melting point of 183 DEG C and a re-melt temperature of 250 DEG C.
摘要翻译：可变熔点焊料和钎料具有包含具有低熔点的金属或金属合金粉末与具有较高熔点的金属粉末的组合物的组合物。在加热时，在低熔点和高熔点粉末之间发生原位合金化，使得在焊料或钎焊温度下发生固化，从而产生具有很少或没有金属间化合物的新的更高的固相（或熔融）温度形成。一种焊料，其包含与Sn-Bi共晶粉末混合的Sn粉末，Sn-Bi共晶粉末的组成为63重量％Sn：57重量％Bi，使得混合物的本体组合物为3重量％，Bi的初始熔点为140℃，由于原位合金化，加热后再熔化温度为220℃。 Pb粉末与Pb-Sn共晶粉末组合物，其组成为62重量％Sn：58重量％Pb，使得混合物的本体组合物为15重量％Sn，初始熔点为183℃，再熔化温度250℃

26. 发明申请

WO1994020257A1 HIGH-STRENGTH SOLDERING ALLOY 审中-公开
标题翻译：高强度焊接合金
公开(公告)号：WO1994020257A1
公开(公告)日：1994-09-15
申请号：PCT/JP1994000172
申请日：1994-02-04
申请人： NIHON ALMIT CO., LTD. , KAWAGUCHI, Toranosuke , HAYASHI, Takayuki , ROBEEN, Gene , HIYAMA, Reiko
发明人： NIHON ALMIT CO., LTD.
IPC分类号： B23K35/26
CPC分类号： B23K35/268 , B23K35/262
摘要： A high-strength soldering alloy exhibiting high mechanical strengths and high toughness even under severe conditions. The alloy comprises 0.8-7.0 wt. % of Ag and Ge in total (both of Ag and Ge being contained in an amount of greater than 0 wt. %), 0-3.0 wt. % of Sb, 0-3.0 wt. % of Bi, 30-70 wt. % of Sn, 0-2.5 wt. % of In, and the balance comprising Pb.
摘要翻译：即使在恶劣条件下也能显示高机械强度和高韧性的高强度焊接合金。该合金含有0.8-7.0wt。 Ag和Ge总量的％（含有大于0重量％的Ag和Ge），0-3.0重量％ Sb％，0-3.0wt。 Bi％，30-70wt。％的Sn，0-2.5wt。 In的百分比，余量包括Pb。

27. 发明申请

WO1994018350A1 ALLOY TO BE PLATED, ITS PLATING METHOD AND PLATING SOLUTION 审中-公开
标题翻译：合金涂层，镀层方法和镀层解决方案
公开(公告)号：WO1994018350A1
公开(公告)日：1994-08-18
申请号：PCT/JP1993000129
申请日：1993-02-03
申请人： WORLD METAL CO., LTD. , UEDA, Shigeaki , HAYASHIDA, Hidenori
发明人： WORLD METAL CO., LTD.
IPC分类号： C22C13/00
CPC分类号： H05K3/3473 , B23K35/007 , B23K35/262 , B23K35/268 , C23C30/00 , H05K3/3463
摘要： When an electronic component and a wiring board are connected to each other by soldering, the present invention uses, as an alloy to be plated, an alloy containing 0.01 to 90 wt% of palladium in lead, tin or their alloy as a thin film to be formed on a to-be-plated portion of the electronic component or the wiring board so as to effectively carry out the connection. Particularly preferred is an alloy containing 0.1 to 70 wt% of lead, 0.1 to 90 wt% of tin and 0.01 to 90 wt% of palladium. Furthermore, when this alloy further contains 0.1 to 20 wt% of phosphorus or 0.01 to 10 wt% of boron, the drop of solderability of the alloy due to heat can be much more reduced. When 0.1 to 20 wt% of indium is contained, the melting point of the alloy can be lowered and when 0.1 to 20 wt% of silver is contained, leaching can be reduced. This alloy to be plated is preferably formed on the to-be-plated portion by electrolytic or electroless plating by the use of a plating solution for the alloy to be plated which contains 0.001 to 2 mols/l of a palladium compound, 0.001 to 3 mols/l of a tin compound and or 0.001 to 2 mols/l of a lead compound. In the case of electroless plating, it is preferred to use a plating solution additionally containing 0.01 to 1 mol/l of a reducing agent.
摘要翻译：当通过焊接将电子部件和布线板彼此连接时，本发明使用作为镀覆合金的含有0.01〜90重量％的铅，锡或其合金中的钯作为薄膜的合金，形成在电子部件或布线基板的被镀覆部上，以有效地进行连接。特别优选含有0.1〜70重量％的铅，0.1〜90重量％的锡和0.01〜90重量％的钯的合金。此外，当该合金还含有0.1〜20重量％的磷或0.01〜10重量％的硼时，可以大大降低合金由于热而引起的可焊性降低。当含有0.1〜20重量％的铟时，合金的熔点可以降低，并且当含有0.1〜20重量％的银时，可以降低浸出。该镀合金优选通过使用含有0.001〜2摩尔/升钯化合物的镀覆合金的镀液进行电解或无电镀来形成在被镀层上，0.001〜3 摩尔/升的锡化合物和0.001至2摩尔/升的铅化合物。在化学镀的情况下，优选使用另外含有0.01〜1mol / l还原剂的电镀液。

28. 发明申请

WO1993003884A1 LEAD-BASED SOLDER ALLOY AND ITS USE IN SOFT SOLDERING 审中-公开
标题翻译：基于铅的焊接合金及其在软焊中的使用
公开(公告)号：WO1993003884A1
公开(公告)日：1993-03-04
申请号：PCT/GB1992001459
申请日：1992-08-06
申请人： MULTICORE SOLDERS LIMITED , ARBIB, Gordon , STEEN, Hector, Andrew, Hamilton
发明人： MULTICORE SOLDERS LIMITED
IPC分类号： B23K35/26
CPC分类号： H05K3/3468 , B23K35/268 , H05K3/3463 , H05K2203/086
摘要： Wave soldering of electronic component in particular if carried out in a substantially oxygen-free inert atmosphere utilising a quaternary solder alloy consisting of 1 to 15 wt% tin, 1 to 13 wt% antimony, 1 to 15 wt% bismuth with the balance being lead.
摘要翻译：电子元件的波峰焊，特别是在基本上无氧的惰性气氛中进行，使用由1至15重量％锡，1至13重量％锑，1至15重量％铋，余量为铅组成的四价焊料合金。

29. 发明申请

WO2017143168A1 LASER MANUFACTURING OF SOLDER PREFORMS 审中-公开
标题翻译：激光制造焊料预制件
公开(公告)号：WO2017143168A1
公开(公告)日：2017-08-24
申请号：PCT/US2017/018339
申请日：2017-02-17
申请人： MATERION CORPORATION
发明人： KOTHANDAPANI, Ramesh , TAN, SinLi , LEE, Chee Kong
IPC分类号： B23K35/02 , B23K35/30 , H01L23/10
CPC分类号： B23K35/0222 , B23K1/19 , B23K26/16 , B23K26/38 , B23K26/40 , B23K35/0233 , B23K35/268 , B23K35/3013 , B23K2203/52 , C22C5/02 , H01L21/4817 , H01L23/053 , H01L23/10
摘要： Methods of making solder preforms are disclosed. A ribbon (102) of raw material is received, and a first annular solder preform is formed by laser cutting the ribbon. The edges (112,114) of the first annular solder preform can then be cleaned. The cutout section removed from the middle of the first annular solder preform can then be laser cut to form a second annular solder preform that is smaller than the first annular solder preform.
摘要翻译：公开了制造焊料预制件的方法。接收原料带（102），并且通过激光切割带来形成第一环形焊料预成型件。然后可以清洁第一环形焊料预制件的边缘（112,114）。然后可以激光切割从第一环形焊料预制件的中间去除的切口部分，以形成比第一环形焊料预制件小的第二环形焊料预制件。

30. 发明申请

WO2017003549A1 ADAPTIVE INTERPOSER AND ELECTRONIC APPARATUS 审中-公开
标题翻译：自适应插座和电子设备
公开(公告)号：WO2017003549A1
公开(公告)日：2017-01-05
申请号：PCT/US2016/029656
申请日：2016-04-28
申请人： RAYTHEON COMPANY
发明人： WONG, Tse E. , TESHIBA, Kenneth T. , CHEN, Shea
IPC分类号： H05K3/30 , H05K1/14 , H05K3/40 , H05K3/34 , H01L23/498 , H01L23/00
CPC分类号： H05K1/181 , B23K35/262 , B23K35/268 , C22C11/06 , C22C13/00 , H01L23/15 , H01L23/49827 , H01L23/49866 , H01L24/80 , H05K1/111 , H05K1/141 , H05K3/3436 , H05K3/3463 , H05K3/4061 , H05K2201/10378 , H05K2201/2081 , Y02P70/613
摘要： An adaptive interposer 60 is provided to be operably disposable between first and second solder materials 40, 50 of first and second electronic devices 20, 30, respectively. The adaptive interposer includes a plate element formed to define cavities and third solder material 72 disposable in the cavities to be electrically communicative with the first and second solder materials. The third solder material is more compliant and has a higher melting temperature than at least the second solder materials.
摘要翻译：提供自适应插入器60以分别在第一和第二电子设备20,30的第一和第二焊料材料40,50之间可操作地一次性使用。自适应插入器包括形成为限定空腔的板元件和在空腔中一次性与第一和第二焊料材料电连通的第三焊料材料72。第三焊料材料更柔顺并且具有比至少第二焊料材料更高的熔化温度。

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