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    • 22. 发明申请
    • CURABLE CYANOACRYLATE COMPOSITIONS AND METHOD OF DETECTING CURE
    • 可固化的氰基丙烯酸酯组合物和检测固化的方法
    • WO2003062318A1
    • 2003-07-31
    • PCT/US2002/034717
    • 2002-10-29
    • HENKEL LOCTITE CORPORATIONWOJCIAK, Stan
    • WOJCIAK, Stan
    • C08L33/18
    • C08K5/0041C08L33/22
    • Cyanoacrylate composition, having a cure indicator within the composition, is disclosed herein. The cyanoacrylate composition is "self-indicating" with respect to its ability to allow the end user to visually inspect the composition to determine whether, and the extent to which, cure has occurred. The composition includes a cyanoacrylate component, and a dye dissolved in the cyanoacrylate component. The cyanoacrylate composition has an initial color, oftentimes colorless or substantially so to the nake eye, and when cured, the cured cyanoacrylate composition has a different or second color. Observation of the second or diffferent color is indicative that cure has occurred and the extent of the color change can be used to determine the degree of cure that has occurred.
    • 本文公开了在组合物内具有固化指示剂的氰基丙烯酸酯组合物。 氰基丙烯酸酯组合物相对于其允许最终用户目视检查组合物以确定是否发生固化的程度和程度的能力是“自我指示的”。 该组合物包括氰基丙烯酸酯组分和溶解在氰基丙烯酸酯组分中的染料。 氰基丙烯酸酯组合物具有初始颜色,通常为无色或基本上如此,在固化时,固化的氰基丙烯酸酯组合物具有不同的或第二种颜色。 第二种或不同颜色的观察表明已经发生固化,并且可以使用颜色变化的程度来确定发生的固化程度。
    • 26. 发明申请
    • HEAT SINK AND THERMAL INTERFACE HAVING SHIELDING TO ATTENUATE ELECTROMAGNETIC INTERFERENCE
    • 具有屏蔽功能的散热和热接口以减少电磁干扰
    • WO2002102125A1
    • 2002-12-19
    • PCT/US2002/007608
    • 2002-03-13
    • LOCTITE CORPORATION
    • FLYNN, Gary, E.
    • H05K7/20
    • H05K9/0024H01L23/3737H01L23/552H01L2924/0002Y10T428/24917Y10T428/28H01L2924/00
    • Heat sink (14) and electrically non-conducting thermal interface (10) having shielding to attenuate electromagnetic interference. The interface comprises a generally planar substrate (18) having first and second outwardly facing surfaces. The substrate is formed from a material, preferably a polymer, that is both thermally conductive and has a high dielectric strength. Formed upon the outwardly facing surfaces are layers (16-20) of a thermally conductive compound for facilitating heat transfer. The invention further comprises an improved heat sink comprising a baseplate (52) coupled with a folded-fin assembly, the latter being compressively bonded thereto via a pressure clip and pressure spreader assembly. The baseplate is attachable to a heat-dissipating component (12), and may optionally include a ground contact connection for use with components that are not already grounded.
    • 散热器(14)和具有屏蔽功能以衰减电磁干扰的非导电热接口(10)。 界面包括具有第一和第二向外表面的大致平面的基底(18)。 衬底由材料,优选聚合物形成,其既是导热的并且具有高介电强度。 形成在面向外的表面上是用于促进热传递的导热化合物的层(16-20)。 本发明还包括一种改进的散热器,其包括与折叠翅片组件联接的底板(52),该折叠翅片组件经由压力夹和压力扩张器组件压缩结合到其上。 底板可附接到散热部件(12),并且可以可选地包括用于与未接地的部件一起使用的接地接触连接。
    • 27. 发明申请
    • THERMAL INTERFACE, METHOD OF MAKING AND USING
    • 热接口,制造和使用方法
    • WO2002100631A1
    • 2002-12-19
    • PCT/US2002/007568
    • 2002-03-13
    • LOCTITE CORPORATION
    • RAUCH, Robert, A.
    • B32B7/02
    • H01L23/4275H01L21/4878H01L2924/0002Y10T29/4935Y10T428/24612H01L2924/00
    • A thermal interface wafer (10) for facilitating heat transfer from an electronic component to a heat sink. The wafer (10) is formed from at least one elongate, vertically-oriented strip (18) of thermally conductive material having a layer of conformable, heat-conducting material (20) formed thereon. Preferably, the strip (18) comprises a metal foil, such as aluminum or some other thermally-conductive metal, that is formed as a flat, spiral-like coil. Such a strip may further be configured to have a serpentine configuration, or may alternatively be formed from a multiplicity of strips (18). The present invention further provides for methods of transferring heat from an electronic component (12) to a heat sink (14), as well as methods for fabricating the thermal interface wafers (10) of the present invention.
    • 一种用于促进从电子部件到散热器的热传递的热接口晶片(10)。 晶片(10)由导热材料的至少一个细长的垂直取向的条带(18)形成,其具有形成在其上的一致的导热材料层(20)。 优选地,带(18)包括形成为扁平的螺旋状线圈的金属箔,例如铝或一些其它导热金属。 这种条带还可以被配置为具有蛇形结构,或者可替代地由多个带(18)形成。 本发明还提供了将热量从电子部件(12)传递到散热器(14)的方法以及用于制造本发明的热界面晶片(10)的方法。
    • 30. 发明申请
    • DISPENSING PROCESS PARTICULARLY FOR A SEALING/ADHESIVE PRODUCT
    • 特别适用于密封/粘合产品的分配过程
    • WO1992002306A1
    • 1992-02-20
    • PCT/EP1991001372
    • 1991-07-23
    • LOCTITE CORPORATIONNKE S.R.L.FIGINI, AldoBEYLIS, Renato
    • LOCTITE CORPORATIONNKE S.R.L.
    • B05C11/10
    • F04B43/1292B01D19/0036B05C11/10B05C11/1036
    • The invention relates to a dispensing process particularly for a sealing/adhesive product (14) which comprises at least one step of pumping the sealing/adhesive product to allow a step of distribution thereof onto at least one part to be sealed, such as for example a motor-vehicle mechanical component (5), an intermediate step of deaeration of the sealing/adhesive product, so as to optimize its distribution on the part to be sealed, is provided between the pumping step and the distribution step. The apparatus for dispensing the sealing/adhesive product (14) comprises elements (2) for feeding the sealing/adhesive product to elements (4) for distributing it onto at least one part (5) to be sealed and sealing/adhesive product deaeration means (3) which cooperate with the pumping and distribution elements for the uniform deposition of the sealant/adhesive on the part.
    • 本发明涉及一种特别用于密封/粘合剂产品(14)的分配方法,其包括至少一个步骤,泵送密封/粘合剂产品以允许将其分配到至少一个待密封部件上的步骤,例如 在泵送步骤和分配步骤之间提供机动车辆机械部件(5),密封/粘合产品的脱气的中间步骤,以便优化其在待密封部件上的分布。 用于分配密封/粘合剂产品(14)的装置包括用于将密封/粘合产品供给到元件(4)的元件(2),用于将其分配到要密封的至少一个部分(5)上,并且密封/粘合产品脱气装置 (3),其与泵送和分配元件协作以使密封剂/粘合剂均匀地沉积在部件上。