专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

11. 发明申请

WO2004070304A2 REMOVEABLE HEAT SPREADER SUPPORT MECHANISM AND METHOD OF MANUFACTURING THEREOF 审中-公开
标题翻译：可拆卸散热器支撑机构及其制造方法
公开(公告)号：WO2004070304A2
公开(公告)日：2004-08-19
申请号：PCT/US2004001044
申请日：2004-01-14
申请人： COOLIGY INC , UPADHYA GIRISH , MUNCH MARK , ZHOU PENG , GOODSON KENNETH , KENNY THOMAS W JR
发明人： UPADHYA GIRISH , MUNCH MARK , ZHOU PENG , GOODSON KENNETH , KENNY THOMAS W JR
IPC分类号： F28F20060101 , F28F7/00 , H05K7/20 , F28F
CPC分类号： H01L23/36 , H01L23/10 , H01L2924/0002 , H01L2924/00
摘要： A mounting assembly comprises a rigid support bracket configured to substantially surround a heat source. The rigid support bracket is coupled to a circuit board. The mounting assembly also comprises a removable lid that is coupled to the rigid support bracket and configured to provide selective access to the heat source. The mounting assembly further comprises a heat exchanger coupled to the heat source, wherein the heat exchanger is positioned between the heat source and the removable lid. The removable lid is preferably configured and has a desired stiffness to urge the heat exchanger in contact by a substantially constant force with the heat source and prevents unwanted movement of the heat source. Further, the support bracket structure is configured to transfer the substantially constant force over a relatively large surface area on the circuit board thereby protecting the heat source from bending, breaking or collapsing from the substantially constant force. The removable lid is preferably made of a material, including but not limited to copper, which accommodates a desired amount of heat transfer from an area within the support bracket.
摘要翻译：安装组件包括构造成基本上围绕热源的刚性支撑支架。刚性支撑托架连接到电路板。安装组件还包括可拆卸盖，其被连接到刚性支撑托架并且构造成提供对热源的选择性接近。安装组件还包括耦合到热源的热交换器，其中热交换器位于热源和可移除盖之间。可移动盖优选地构造并且具有期望的刚度，以通过与热源的基本上恒定的力来促使热交换器接触，并且防止热源的不期望的移动。此外，支撑托架结构构造成在电路板上相对较大的表面积上传递基本上恒定的力，从而保护热源免受基本恒定的力的弯曲，破坏或塌陷。可移除盖优选地由包括但不限于铜的材料制成，其适应从支撑托架内的区域的期望量的热传递。

12. 发明申请

WO2004042304A3 METHOD AND APPARATUS FOR EFFICIENT VERTICAL FLUID DELIVERY FOR COOLING A HEAT PRODUCING DEVICE 审中-公开
标题翻译：用于冷却热生产装置的有效的垂直流体输送的方法和装置
公开(公告)号：WO2004042304A3
公开(公告)日：2004-08-12
申请号：PCT/US0334742
申请日：2003-10-30
申请人： COOLIGY INC
发明人： KENNETH GOODSON E , KENNY THOMAS WILLIAM JR , ZHOU PENG , UPADHYA GIRISH , MUNCH MARK , MCMASTER MARK , HOM JAMES , SHOOK JAMES GILL , CORBIN DAVID , LOVETTE JAMES
IPC分类号： F04B17/00 , F04B19/00 , F28D15/00 , F28D15/02 , F28F3/02 , F28F3/08 , F28F3/12 , F28F13/18 , G06Q20/20 , H01L23/473 , H04L29/06 , F28F7/00
CPC分类号： F04B17/00 , F04B19/006 , F28D15/00 , F28D15/0266 , F28D21/0015 , F28D2021/0029 , F28F3/02 , F28F3/086 , F28F3/12 , F28F13/06 , F28F13/185 , F28F2210/10 , F28F2245/04 , F28F2260/02 , G06Q20/20 , H01L23/473 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A method and apparatus for cooling a heat source configured along a plane. The heat exchanger comprising an interface layer (102) that perform thermal exchange with the heat source and configured to pass fluid from a first side to a second side. The manifold layer (106) comprises a first layer in contact with the heat source and has an appropriate thermal conductivity to pass heat to the interface layer. The manifold layer further comprises a second layer coupled to the first layer and in contact with the second side to the interface layer. The first layer comprises a recess area having a heat conducting region in contact with the heat exchanging layer. The first layer includes at least one inlet and/or outlet port. The second layer includes at least one inlet and/or outlet port. At least one inlet and/or outlet port is positioned substantially parallel or perpendicular with respect to the plane.
摘要翻译：一种用于冷却沿着平面配置的热源的方法和装置。所述热交换器包括界面层（102），所述界面层与所述热源进行热交换，并被配置为将流体从第一侧传递到第二侧。歧管层（106）包括与热源接触的第一层，并具有适当的导热性以将热量传递到界面层。歧管层还包括耦合到第一层并与第二侧接触到界面层的第二层。第一层包括具有与热交换层接触的导热区域的凹部区域。第一层包括至少一个入口和/或出口。第二层包括至少一个入口和/或出口。至少一个入口端口和/或出口端口相对于该平面基本平行或垂直地定位。

13. 发明申请

WO2007098077A3 LIQUID COOLING LOOPS FOR SERVER APPLICATIONS 审中-公开
标题翻译：液体冷却液用于服务器应用
公开(公告)号：WO2007098077A3
公开(公告)日：2008-09-18
申请号：PCT/US2007004236
申请日：2007-02-16
申请人： COOLIGY INC , UPADHYA GIRISH , MUNCH MARK , CHOW NORMAN , TSAO PAUL , WERNER DOUGLAS E , MCMASTER MARK , LANDRY FREDERIC , SPEARING IAN , SCHRADER TIM
发明人： UPADHYA GIRISH , MUNCH MARK , CHOW NORMAN , TSAO PAUL , WERNER DOUGLAS E , MCMASTER MARK , LANDRY FREDERIC , SPEARING IAN , SCHRADER TIM
IPC分类号： H05K7/20
CPC分类号： H05K7/20781 , H01L2924/0002 , H05K7/20727 , H05K7/20772 , H01L2924/00
摘要： Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is a liquid based cooling system. Each liquid based cooling system includes a server pump and one or more microchannel cold plates (MCP) coupled together via fluid lines. The liquid based cooling system for each electronics server includes a rejector plate configured with micro-channels. The MCPs, the server pump and the rejector plate form a first closed loop. The rejector plate is coupled to a chassis cold plate via a thermal interface material. In a multiple electronics server configuration, the rejector plates for each of the electronics servers are coupled to the chassis cold plate configured with fluid channels which are coupled via fluid lines to a liquid-to-air heat exchanging system to form a second closed loop.
摘要翻译：液体冷却溶液，用于将一个或多个发热装置产生的热量从一个或多个电子服务器传递到环境。每个电子服务器包括一个或多个发热装置。集成到每个电子服务器上是一种基于液体的冷却系统。每个基于液体的冷却系统包括服务器泵和通过流体管线连接在一起的一个或多个微通道冷板（MCP）。用于每个电子服务器的基于液体的冷却系统包括配置有微通道的排出板。 MCP，服务器泵和排料板形成第一个闭环。排料板通过热界面材料连接到底盘冷板。在多电子服务器配置中，用于每个电子服务器的排放板联接到配置有流体通道的底盘冷板，流体通道经由流体管线耦合到液体 - 空气热交换系统以形成第二闭合回路。

14. 发明申请

WO2007120530A3 INTEGRATED LIQUID TO AIR CONDUCTION MODULE 审中-公开
标题翻译：集成液体到空气导流模块
公开(公告)号：WO2007120530A3
公开(公告)日：2008-08-21
申请号：PCT/US2007008190
申请日：2007-03-30
申请人： COOLIGY INC , HOM JAMES , UPADHYA GIRISH , WERNER DOUGLAS E , MUNCH MARK , TSAO PAUL , CONWAY BRUCE , ZHOU PENG , BREWER RICHARD
发明人： HOM JAMES , UPADHYA GIRISH , WERNER DOUGLAS E , MUNCH MARK , TSAO PAUL , CONWAY BRUCE , ZHOU PENG , BREWER RICHARD
IPC分类号： F28F27/00
CPC分类号： H05K7/20281 , G06F1/20 , G06F2200/201 , H01L23/467 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An integrated cooling system for cooling systems such as laptops or subsystems such as a graphics card is disclosed. An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer to which a number of air fins are attached. The invention includes a pump that is connected to the fluid path forming a closed path for circulating a fluid through the first layer. Within the first layer, the fluid path will contain a plurality of fluid fins which control the flow of a fluid within the fluid path. Within the fluid path, a structure providing a double-counter flow adjacent to one or more electronic devices.
摘要翻译：公开了一种用于诸如笔记本电脑或诸如图形卡的子系统之类的冷却系统的集成冷却系统。集成冷却系统包括具有被配置为联接到热源的接触区域的第一层，其中第一层具有与热源与第一层热接触的接触区域相邻的流体路径。耦合到第一层是附接有多个空气翅片的第二层。本发明包括连接到流体路径的泵，其形成用于使流体循环通过第一层的封闭路径。在第一层内，流体路径将包含多个流体翅片，其控制流体路径内的流体的流动。在流体路径内，提供与一个或多个电子设备相邻的双计数器流的结构。

15. 发明申请

WO2006026460A3 PUMPED FLUID COOLING SYSTEM AND METHOD 审中-公开
标题翻译：泵送流体冷却系统及方法
公开(公告)号：WO2006026460A3
公开(公告)日：2007-11-29
申请号：PCT/US2005030465
申请日：2005-08-24
申请人： COOLIGY INC , WERNER DOUGLAS , GOODSON KENNETH , MUNCH MARK , UPADHYA GIRISH
发明人： WERNER DOUGLAS , GOODSON KENNETH , MUNCH MARK , UPADHYA GIRISH
IPC分类号： F28F7/00 , F28D15/00 , H05K7/20
CPC分类号： F28F9/0263 , F28F3/12 , F28F2260/02
摘要： The present invention is a pumped fluid cooling system and method. The pumped fluid cooling system and method includes new relative magnitudes of advection, convection and spreading components of the resistance for a pumped fluid system. The pumped fluid cooling system and method also includes adjusting the chemical composition of the working fluid, specifically adjusting the composition and viscosity as the sensitivity to the fluid heat capacity per unit mas increases.
摘要翻译：本发明是一种泵送流体冷却系统和方法。泵送流体冷却系统和方法包括泵送流体系统的电阻的平流，对流和扩散分量的相对量级。泵送流体冷却系统和方法还包括调整工作流体的化学成分，特别是调整组成和粘度，因为每单位流体热容量的敏感度增加。

16. 发明申请

WO2007089869A2 TAPE-WRAPPED MULTILAYER TUBING AND METHODS FOR MAKING THE SAME 审中-公开
标题翻译： TAPE-WRAPPED MULTILAYER TUBING AND METHODS FOR MANTING THE SAME
公开(公告)号：WO2007089869A2
公开(公告)日：2007-08-09
申请号：PCT/US2007002701
申请日：2007-01-30
申请人： COOLIGY INC , WERNER DOUGLAS E , FIROUZI ALI , MUNCH MARK , CICHOCKI ZBIGNIEW
发明人： WERNER DOUGLAS E , FIROUZI ALI , MUNCH MARK , CICHOCKI ZBIGNIEW
IPC分类号： F16L11/00
CPC分类号： F16L59/029 , B29C47/0023 , B29C47/0064 , B29C47/021 , B29C47/065 , B29C63/065 , B29C65/02 , B29C65/18 , B29C66/133 , B29C66/4322 , B29C66/71 , B29C66/72321 , B29C66/7234 , B29C66/73715 , B29C66/83413 , B29D23/001 , B29K2101/12 , B29K2995/0069 , B29L2009/00 , B29L2023/22 , B32B1/08 , B32B15/08 , B32B15/20 , B32B25/08 , B32B27/08 , B32B27/32 , B32B27/34 , B32B2307/5825 , B32B2307/7246 , B32B2597/00 , F16L11/04 , F16L2011/047 , Y10S138/10 , B29K2077/00 , B29K2067/00 , B29K2027/14 , B29K2027/12 , B29K2027/08 , B29K2025/06 , B29K2023/16 , B29K2023/0633 , B29K2023/06 , B29K2023/00 , B29K2021/003 , B29K2019/00 , B29K2009/06 , B29K2009/00
摘要： The multi-layer tape wrapped tubing for effectively impeding the diffusion of vapor is made in a continuous in-line process and has three distinct layers: an inner tubing layer, a middle diffusion barrier layer and an outer jacketing layer. The inner tubing layer comes into contact with liquid and vapor. Vapor that might ordinarily diffuse through the tubing is impeded by the diffusion barrier layer. The diffusion barrier layer is a laminate comprising a diffusion barrier film with a very low vapor diffusion rate sandwiched between layers of thermoplastic. The diffusion barrier layer is wrapped around the inner tubing one or more times. The outer jacket layer is a polymeric jacket which is extruded onto the diffusion barrier layer wrapped inner tubing.
摘要翻译：用于有效阻止蒸汽扩散的多层带包裹管道以连续的在线方法制造，并且具有三个不同的层：内管层，中间扩散阻挡层和外护套层。内管层与液体和蒸气接触。可能通过管道扩散的蒸气被扩散阻挡层阻碍。扩散阻挡层是包含夹在热塑性层之间的非常低的蒸气扩散速率的扩散阻挡膜的层压体。扩散阻挡层围绕内管缠绕一次或多次。外护套层是聚合物护套，其被挤压到扩散阻挡层包裹的内管上。

17. 发明申请

WO2004076857A3 METHOD AND APPARATUS FOR LOW-COST ELECTROKINETIC PUMP MANUFACTURING 审中-公开
标题翻译：低成本电动泵制造方法与装置
公开(公告)号：WO2004076857A3
公开(公告)日：2006-01-05
申请号：PCT/US2004002855
申请日：2004-01-29
申请人： COOLIGY INC , LOVETTE JAMES , MUNCH MARK , SHOOK JAMES GILL , ZENG SHULIN , DOUGLAS WERNER , CICHOCKI ZBIGNIEW , LIN TIEN-CHIH ERIC
发明人： LOVETTE JAMES , MUNCH MARK , SHOOK JAMES GILL , ZENG SHULIN , DOUGLAS WERNER , CICHOCKI ZBIGNIEW , LIN TIEN-CHIH ERIC , KENNY THOMAS W JR
IPC分类号： F04F99/00 , F04B17/00 , F28D15/02 , F28F19/00 , H01L23/473 , H05K7/20 , F04B37/02
CPC分类号： F04B17/00 , F28D15/0266 , F28F19/006 , H01L23/473 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： An electroosmotic pump (22) used in a closed loop cooling system (10). The pump includes a fluid chamber, a pumping element (104), an inlet electrode (1 12A), an outlet electrode (112B), and means for providing electrical voltage to the inlet electrode and the outlet electrode to produce an electrical field therebetween. The pumping element is configured to pump fluid therethrough, and the pumping element is positioned to segment the fluid chamber into an inlet chamber (142) including a fluid inlet port (126) and an outlet chamber (140) including a fluid outlet port (124). The size of the inlet chamber is proportional to a predetermined residence time of the inlet chamber. The inlet electrode is positioned within the inlet chamber and a predetermined distance from the first surface of the pumping element. The outlet electrode is positioned within the outlet chamber and a predetermined distance from a second surface of the pumping element.
摘要翻译：一种用于闭环冷却系统（10）中的电渗泵（22）。泵包括流体室，泵送元件（104），入口电极（12A），出口电极（112B），以及用于向入口电极和出口电极提供电压以在其间产生电场的装置。泵送元件构造成泵送流体通过其中，并且泵送元件被定位成将流体室分隔成包括流体入口端口（126）和出口室（140）的入口室（142），入口室包括流体出口（124））。入口室的尺寸与入口室的预定停留时间成比例。入口电极定位在入口室内并与泵送元件的第一表面预定距离。出口电极定位在出口室内并且距离泵送元件的第二表面预定的距离。

18. 发明申请

WO2004083742A3 BOILING TEMPERATURE DESIGN IN PUMPED MICROCHANNEL COOLING LOOPS 审中-公开
标题翻译：泵送微通道冷却机的沸腾温度设计
公开(公告)号：WO2004083742A3
公开(公告)日：2005-11-24
申请号：PCT/US2004006746
申请日：2004-03-05
申请人： COOLIGY INC
发明人： ZHOU PENG , ZENG SHULIN , KENNY THOMAS W JR , MUNCH MARK , UPADHYA GIRISH , GOODSON KENNETH , SANTIAGO JUAN G
IPC分类号： F25B20060101 , F25B41/04 , F25D23/12 , F28D15/00 , F28D15/02 , F28D15/06 , H01L23/473
CPC分类号： H01L23/473 , F28D15/0266 , F28D15/06 , H01L2924/0002 , H01L2924/00
摘要： A method of cooling at least one heat generating device (220) using a cooling system (200) is disclosed. The method comprises the steps of using at least one pump (240) to cause a fluid to flow in at least on heat exchanger (210) and adjusting a pressure of the fluid to correspondingly adjust a boiling point temperature of the fluid in the at least one heat exchanger. The method can also include the step of providing at least one heat rejector (230) for rejecting heat from the system, the at least one heat rejector being situated downstream of the at least one heat exchanger. The step of adjusting a pressure of the fluid can comprise adjusting a pressure of the fluid during charging and sealing of the system. Further, the step of adjusting a pressure of the fluid can comprise adjusting a composition and volume of a gas and liquid introduced during charging of the system.
摘要翻译：公开了一种使用冷却系统（200）冷却至少一个发热装置（220）的方法。该方法包括以下步骤：使用至少一个泵（240）使流体至少在热交换器（210）上流动，并且调节流体的压力以相应地调节至少在该流体中的流体的沸点温度一个热交换器。该方法还可以包括提供至少一个用于从系统排出热量的热排出器（230）的步骤，所述至少一个热排出器位于至少一个热交换器的下游。调节流体压力的步骤可以包括在系统充电和密封期间调节流体的压力。此外，调节流体压力的步骤可以包括调节在系统充电期间引入的气体和液体的组成和体积。

19. 发明申请

WO2004042306A3 METHOD AND APPARATUS FOR ACHIEVING TEMPERATURE UNIFORMITY AND HOT SPOT COOLING IN A HEAT PRODUCING DEVICE 审中-公开
标题翻译：在制热装置中实现温度均匀性和热点冷却的方法和装置
公开(公告)号：WO2004042306A3
公开(公告)日：2004-11-11
申请号：PCT/US0334874
申请日：2003-10-30
申请人： COOLIGY INC
发明人： GOODSON KENNETH , KENNY THOMAS , ZHOU PENG , UPADHYA GIRISH , MUNCH MARK , MCMASTER MARK , HOM JAMES
IPC分类号： B21D53/02 , F04B19/00 , F28F7/00 , F28F13/18 , F28F19/02 , G05D23/00 , H01L23/427 , H01L23/473
CPC分类号： F28F3/048 , F04B19/006 , F28D15/00 , F28F3/12 , F28F2260/02 , H01L23/427 , H01L23/473 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A method of controlling temperature of a heat source in contact with a heat exchanging surface of a heat exchanger, wherein the heat exchanging surface is substantially aligned along a plane. The method comprises channeling a first temperature fluid to the heat exchanging surface, wherein the first temperature fluid undergoes thermal exchange with the heat source along the heat exchanging surface. The method comprises channeling a second temperature fluid from the heat exchange surface, wherein fluid is channeled to minimize temperature differences along the heat source. The temperature differences are minimized by optimizing and controlling the fluidic and thermal resistances in the heat exchanger. The resistances to the fluid are influenced by size, volume and surface area of heat transferring features, multiple pumps, fixed and variable valves and flow impedance elements in the fluid path, pressure and flow rate control of the fluid, and other factors.
摘要翻译：一种控制与热交换器的热交换表面接触的热源的温度的方法，其中所述热交换表面沿着平面基本上对齐。该方法包括将第一温度流体引导到热交换表面，其中第一温度流体沿着热交换表面与热源进行热交换。该方法包括从热交换表面引导第二温度流体，其中流体被引导以最小化沿着热源的温度差。通过优化和控制热交换器中的流体和热电阻来最小化温差。对流体的阻力受传热特征，多个泵，固定和可变阀以及流体路径中的流量阻抗元件，流体的压力和流量控制等因素的尺寸，体积和表面积的影响。

20. 发明申请

WO2004042303A3 INTERWOVEN MANIFOLDS FOR PRESSURE DROP REDUCTION IN MICROCHANNEL HEAT EXCHANGERS 审中-公开
标题翻译：微型通风换热器减压减压阀
公开(公告)号：WO2004042303A3
公开(公告)日：2004-07-15
申请号：PCT/US0332128
申请日：2003-10-10
申请人： COOLIGY INC
发明人： KENNY THOMAS WILLIAM JR , SHOOK JAMES GILL , MUNCH MARK , UPADHYA GIRISH , ZHOU PENG , KENNETH GOODSON E , CORBIN DAVID
IPC分类号： F04B19/00 , F28D15/02 , F28F3/12 , H01L23/473 , F28F7/00
CPC分类号： F28D15/0266 , F04B19/006 , F28F3/12 , F28F2260/02 , H01L23/473 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A microchannel heat exchanger coupled to a heat source and configured for cooling the heat source comprising a first set of fingers for providing fluid at a first temperature to a heat exchange region, wherein fluid in the heat exchange region flows toward a second set of fingers and exits the heat exchanger at a second temperature, wherein each finger is spaced apart from an adjacent finger by an appropriate dimension to minimize pressure drop in the heat exchanger and arranged in parallel. The microchannel heat exchanger includes an interface layer having the heat exchange region. Preferably, a manifold layer includes the first set of fingers and the second set of fingers configured within to cool hot spots in the heat source. Alternatively, the interface layer includes the first set and second set of fingers configured along the heat exchange region.
摘要翻译：耦合到热源并被构造用于冷却热源的微通道热交换器，其包括用于将第一温度下的流体提供给热交换区域的第一组指状物，其中热交换区域中的流体朝向第二组手指流动，在第二温度下离开热交换器，其中每个指状物与相邻手指分开适当的尺寸，以使热交换器中的压降最小化并且平行设置。微通道热交换器包括具有热交换区域的界面层。优选地，歧管层包括第一组指状物，并且第二组指状物构造成用于冷却热源中的热点。或者，界面层包括沿着热交换区域配置的第一组和第二组手指。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式