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11. 发明申请

WO2013101851A1 SYSTEM ARCHITECTURE FOR COMBINED STATIC AND PASS-BY PROCESSING 审中-公开
标题翻译：用于组合静态和通过处理的系统架构
公开(公告)号：WO2013101851A1
公开(公告)日：2013-07-04
申请号：PCT/US2012/071684
申请日：2012-12-26
申请人： INTEVAC, INC. , LEAHEY, Patrick , LAWSON, Eric , LIU, Charles , BLUCK, Terry , FAIRBAIRN, Kevin, P. , RUCK, Robert, L. , HARKNESS, IV., Samuel, D.
发明人： LEAHEY, Patrick , LAWSON, Eric , LIU, Charles , BLUCK, Terry , FAIRBAIRN, Kevin, P. , RUCK, Robert, L. , HARKNESS, IV., Samuel, D.
IPC分类号： H01L21/677
CPC分类号： C23C14/34 , C23C14/50 , C23C14/566 , C23C14/568
摘要： Disclosed is a substrate processing system which enables combined static and pass-by processing. Also, a system architecture is provided, which reduces footprint size. The system is constructed such that the substrates are processed therein vertically, and each chamber has a processing source attached to one sidewall thereof, wherein the other sidewall backs to a complementary processing chamber. The chamber system can be milled from a single block of metal, e.g., aluminum, wherein the block is milled from both sides, such that a wall remains and separates each two complementary processing chambers.
摘要翻译：公开了一种能够组合静态和通过处理的衬底处理系统。此外，还提供了一种减小占位面积的系统架构。该系统构造成使得基板在其中垂直处理，并且每个室具有附接到其一个侧壁的处理源，其中另一个侧壁返回到互补处理室。室系统可以从单块金属例如铝碾磨，其中块从两侧铣削，使得壁保持并分离每两个补充处理室。

12. 发明申请

WO2013086432A2 HIGH THROUGHPUT LOAD LOCK FOR SOLAR WAFERS 审中-公开
标题翻译：用于太阳能晶圆的高通量负载锁
公开(公告)号：WO2013086432A2
公开(公告)日：2013-06-13
申请号：PCT/US2012/068595
申请日：2012-12-07
申请人： INTEVAC, INC. , SHAH, Vinay , RUNSTADLER, William Jr. , FAIRBAIRN, Kevin, P. , BLUCK, Terry , COOKE, Richard, Henry
发明人： SHAH, Vinay , RUNSTADLER, William Jr. , FAIRBAIRN, Kevin, P. , BLUCK, Terry , COOKE, Richard, Henry
IPC分类号： H01L21/677
CPC分类号： H01L21/67736 , H01L21/67126 , H01L21/67201 , H01L21/67271 , H01L21/67288
摘要： A system for transporting substrates from an atmospheric pressure to high vacuum pressure and comprising: a rough vacuum chamber having an entry valve and an exit opening; a high vacuum chamber having an entry opening, the high vacuum chamber coupled to the rough vacuum chamber such that the exit opening and the entry opening are aligned; a valve situated between the exit opening and the entry opening; a first conveyor belt provided in the rough vacuum chamber; a second conveyor provided in the high vacuum chamber; a sensing element provided in the high vacuum chamber to enable detection of broken substrates on the second conveyor; and, a mechanism provided on the second conveyor belt enabling dumping of broken substrates onto the bottom of the high vacuum chamber.
摘要翻译：一种用于将衬底从大气压力传送到高真空压力的系统，包括：具有入口阀和出口开口的粗真空室; 具有入口开口的高真空室，高真空室耦合到粗真空室，使得出口开口和入口开口对齐; 位于出口和入口之间的阀门; 设置在粗真空室中的第一传送带; 设置在高真空室中的第二输送机; 设置在所述高真空室中的感测元件，以能够检测所述第二输送机上的损坏的基板; 以及在第二传送带上提供的机构，使得能够将破碎的基板倾倒到高真空室的底部。

13. 发明申请

WO2013067218A1 SOLAR WAFER ELECTROSTATIC CHUCK 审中-公开
标题翻译：太阳能电熨斗
公开(公告)号：WO2013067218A1
公开(公告)日：2013-05-10
申请号：PCT/US2012/063114
申请日：2012-11-01
申请人： INTEVAC, INC. , CHO, Young, Kyu , JANAKIRAMAN, Karthik , BLUCK, Terry , KEDLAYA, Diwakar
发明人： CHO, Young, Kyu , JANAKIRAMAN, Karthik , BLUCK, Terry , KEDLAYA, Diwakar
IPC分类号： H02N13/00
CPC分类号： H02N13/00 , H01J2237/16 , H01L21/6833 , H01L31/18 , Y10T29/49117
摘要： An electrostatic chuck is disclosed, which is especially suitable for fabrication of substrates at high throughput. The disclosed chuck may be used for fabricating large substrates or several smaller substrates simultaneously. For example, disclosed embodiments can be used for fabrication of multiple solar cells simultaneously, providing high throughput. An electrostatic chuck body is constructed using aluminum body having sufficient thermal mass to control temperature rise of the chuck, and anodizing the top surface of the body. A ceramic frame is provided around the chuck's body to protect it from plasma corrosion. If needed, conductive contacts are provided to apply voltage bias to the wafer. The contacts are exposed through the anodization.
摘要翻译：公开了一种静电卡盘，其特别适用于以高产量制造基板。所公开的卡盘可以用于同时制造大的基板或几个较小的基板。例如，所公开的实施例可以同时用于制造多个太阳能电池，从而提供高通量。使用具有足够热质量的铝体来控制卡盘的温度升高并且阳极氧化主体的顶表面构成静电卡盘体。在卡盘的主体周围设置陶瓷框架，以防止其等离子体腐蚀。如果需要，提供导电触点以向晶片施加电压偏压。触点通过阳极氧化暴露。

14. 发明申请

WO2013067201A2 SYSTEM ARCHITECTURE FOR PLASMA PROCESSING SOLAR WAFERS 审中-公开
标题翻译：等离子体处理太阳能波束的系统架构
公开(公告)号：WO2013067201A2
公开(公告)日：2013-05-10
申请号：PCT/US2012/063090
申请日：2012-11-01
申请人： INTEVAC, INC. , CHO, Young, Kyu , JANAKIRAMAN, Karthik , BLUCK, Terry , KEDLAYA, Diwakar
发明人： CHO, Young, Kyu , JANAKIRAMAN, Karthik , BLUCK, Terry , KEDLAYA, Diwakar
IPC分类号： H01L21/3065
CPC分类号： H01L31/18
摘要： A system for plasma processing of wafers at high throughput, particularly suitable for processing solar cells. A loading station has a loading conveyor, a loading transport mechanism, and a chuck loading station accepting transportable electrostatic chucks, wherein the loading transport mechanism is configured to remove wafers from the conveyor and place them on the transportable electrostatic chucks. The transportable chuck is delivered to at least one processing chamber to perform plasma processing of wafers. An unloading station has an unloading conveyor, an unloading transport mechanism, and a chuck unloading station accepting the transportable electrostatic chucks from the processing chamber, wherein the unloading transport mechanism is configured to remove wafers from the transportable electrostatic chucks and place them on the conveyor. A chuck return module configured for transporting the transportable electrostatic chucks from the chuck unloading station to the chuck loading station.
摘要翻译：用于高通量处理晶片的系统，特别适用于处理太阳能电池。装载站具有装载传送装置，装载传送机构和接受可移动静电卡盘的卡盘装载站，其中装载传送机构构造成从输送机移除晶片并将它们放置在可运送的静电卡盘上。可移动卡盘被输送到至少一个处理室以执行晶片的等离子体处理。卸载站具有卸载输送机，卸载输送机构和从处理室接收可运输静电卡盘的卡盘卸载站，其中卸载输送机构构造成从可移动静电卡盘移除晶片并将其放置在输送机上。卡盘返回模块，其构造成将可移动静电卡盘从卡盘卸载站运送到卡盘装载站。

15. 发明申请

WO2007027436A3 PROCESSING THIN WAFERS 审中-公开
公开(公告)号：WO2007027436A3
公开(公告)日：2007-03-08
申请号：PCT/US2006/031974
申请日：2006-08-17
申请人： INTEVAC, INC. , BLUCK, Terry , SCOLLAY, Stuart , TONG, Edric
发明人： BLUCK, Terry , SCOLLAY, Stuart , TONG, Edric
IPC分类号： H01L21/306 , C23C16/00
摘要： There is described a wafer processing system for thinned wafers that are easily broken during handling. The system protects against breakage during handling and provides for temperature controls during processing.

16. 发明申请

WO2007027436A2 PROCESSING THIN WAFERS 审中-公开
标题翻译：加工薄晶片
公开(公告)号：WO2007027436A2
公开(公告)日：2007-03-08
申请号：PCT/US2006031974
申请日：2006-08-17
申请人： INTEVAC INC , BLUCK TERRY , SCOLLAY STUART , TONG EDRIC
发明人： BLUCK TERRY , SCOLLAY STUART , TONG EDRIC
IPC分类号： H01L21/306 , C23C16/00
CPC分类号： H01L21/67751 , H01L21/67161 , H01L21/67173 , H01L21/6719 , H01L21/67201 , H01L21/67745 , H01L21/6831 , Y10S414/135 , Y10S414/136 , Y10S414/139 , Y10S414/141
摘要： There is described a wafer processing system for thinned wafers that are easily broken during handling. The system protects against breakage during handling and provides for temperature controls during processing.
摘要翻译：描述了用于在处理期间容易破裂的变薄晶片的晶片处理系统。该系统可防止在处理过程中发生破损，并在加工过程中提供温度控制。

17. 发明申请

WO2015130532A1 SPUTTERING SYSTEM AND METHOD USING DIRECTION-DEPENDENT SCAN SPEED OR POWER 审中-公开
标题翻译：使用方向依赖扫描速度或功率的溅射系统和方法
公开(公告)号：WO2015130532A1
公开(公告)日：2015-09-03
申请号：PCT/US2015/016448
申请日：2015-02-18
申请人： INTEVAC, INC. , SHAH, Vinay , RIPOSAN, Alexandru , BLUCK, Terry , KUDRIAVTSEV, Vladimir
发明人： SHAH, Vinay , RIPOSAN, Alexandru , BLUCK, Terry , KUDRIAVTSEV, Vladimir
IPC分类号： C23C14/35 , H01J37/34
CPC分类号： H01J37/3455 , C23C14/352 , C23C14/568 , H01J37/32779 , H01J37/3405 , H01J37/3408 , H01J37/3435 , H01J37/345
摘要： A sputtering system having a processing chamber with an inlet port and an outlet port, and a sputtering target positioned on a wall of the processing chamber. A movable magnet arrangement is positioned behind the sputtering target and reciprocally slides behind the target. A conveyor continuously transports substrates at a constant speed past the sputtering target, such that at any given time, several substrates face the target between the leading edge and the trailing edge. The movable magnet arrangement slides at a speed that is at least several times faster than the constant speed of the conveyor. A rotating zone is defined behind the leading edge and trailing edge of the target, wherein the magnet arrangement decelerates when it enters the rotating zone and accelerates as it reverses direction of sliding within the rotating zone. Magnet power and/or speed varies as function of direction of magnet travel.
摘要翻译：一种溅射系统，具有具有入口和出口的处理室和位于处理室的壁上的溅射靶。可移动磁体布置位于溅射靶的后面并在目标之后往复滑动。输送机以恒定速度连续输送基板通过溅射靶，使得在任何给定时间，几个基板在前缘和后缘之间面对目标。可移动磁体装置以比传送带的恒定速度快至少几倍的速度滑动。旋转区域被限定在目标的前缘和后缘之后，其中磁体装置在其进入旋转区域时减速，并且当其在转动区域内反转滑动方向时加速。磁铁功率和/或速度随磁铁方向的变化而变化。

18. 发明申请

WO2013067201A3 SYSTEM ARCHITECTURE FOR PLASMA PROCESSING SOLAR WAFERS 审中-公开
标题翻译：等离子体处理太阳能波束的系统架构
公开(公告)号：WO2013067201A3
公开(公告)日：2014-12-04
申请号：PCT/US2012063090
申请日：2012-11-01
申请人： INTEVAC INC , CHO YOUNG KYU , JANAKIRAMAN KARTHIK , BLUCK TERRY , KEDLAYA DIWAKAR
发明人： CHO YOUNG KYU , JANAKIRAMAN KARTHIK , BLUCK TERRY , KEDLAYA DIWAKAR
IPC分类号： H01L21/687
CPC分类号： H01L31/18
摘要： A system for plasma processing of wafers at high throughput, particularly suitable for processing solar cells. A loading station has a loading conveyor, a loading transport mechanism, and a chuck loading station accepting transportable electrostatic chucks, wherein the loading transport mechanism is configured to remove wafers from the conveyor and place them on the transportable electrostatic chucks. The transportable chuck is delivered to at least one processing chamber to perform plasma processing of wafers. An unloading station has an unloading conveyor, an unloading transport mechanism, and a chuck unloading station accepting the transportable electrostatic chucks from the processing chamber, wherein the unloading transport mechanism is configured to remove wafers from the transportable electrostatic chucks and place them on the conveyor. A chuck return module configured for transporting the transportable electrostatic chucks from the chuck unloading station to the chuck loading station.
摘要翻译：一种用于在高通量下等离子体处理晶片的系统，特别适用于处理太阳能电池。装载站具有装载传送装置，装载传送机构和接收可移动静电卡盘的卡盘装载站，其中装载传送机构构造成从输送机移除晶片并将它们放置在可运送的静电卡盘上。可移动卡盘被输送到至少一个处理室以执行晶片的等离子体处理。卸载站具有卸载输送机，卸载输送机构和从处理室接收可移动静电卡盘的卡盘卸载站，其中卸载输送机构构造成从可移动静电卡盘移除晶片并将其放置在输送机上。卡盘返回模块，其构造成将可移动静电卡盘从卡盘卸载站运送到卡盘装载站。

19. 发明申请

WO2013109333A4 LINEAR SCANNING SPUTTERING SYSTEM AND METHOD 审中-公开
标题翻译：线性扫描溅射系统和方法
公开(公告)号：WO2013109333A4
公开(公告)日：2013-10-31
申请号：PCT/US2012063432
申请日：2012-11-02
申请人： INTEVAC INC , BROWN DAVID WARD , SHAH VINAY , PEDERSON TERRY , BLUCK TERRY
发明人： BROWN DAVID WARD , SHAH VINAY , PEDERSON TERRY , BLUCK TERRY
IPC分类号： C23C14/35
CPC分类号： H01J37/3455 , C23C14/35 , C23C14/56 , H01J37/32779 , H01J37/32899 , H01J37/3405 , H01J37/3417 , H01J37/3452
摘要： A sputtering system having a processing chamber with an inlet port and an outlet port, and a sputtering target positioned on a wall of the processing chamber. A movable magnet arrangement is positioned behind the sputtering target and reciprocally slides behinds the target. A conveyor continuously transports substrates at a constant speed past the sputtering target, such that at any given time, several substrates face the target between the leading edge and the trailing edge. The movable magnet arrangement slides at a speed that is at least several times faster than the constant speed of the conveyor. A rotating zone is defined behind the leading edge and trailing edge of the target, wherein the magnet arrangement decelerates when it enters the rotating zone and accelerates as it reverses direction of sliding within the rotating zone.
摘要翻译：一种溅射系统，其具有带有入口和出口的处理室，以及位于处理室的壁上的溅射靶。可移动的磁体布置被定位在溅射靶之后并且在靶之后往复滑动。输送机以恒定速度连续输送衬底经过溅射靶，使得在任何给定时间，多个衬底面对前缘和后缘之间的靶。可移动磁体装置的滑动速度至少比传送机的恒定速度快几倍。旋转区域被限定在目标的前缘和后缘后面，其中磁体装置在其进入旋转区域时减速并且随着其在旋转区域内反向滑动的方向而加速。

20. 发明申请

WO2011156625A4 FULL-ENCLOSURE, CONTROLLED-FLOW MINI-ENVIRONMENT FOR THIN FILM CHAMBERS 审中-公开
标题翻译：全封闭，薄膜冲击阀的控制流动微环境
公开(公告)号：WO2011156625A4
公开(公告)日：2012-05-10
申请号：PCT/US2011039838
申请日：2011-06-09
申请人： INTEVAC INC , XIE JUN , FAIRBAIRN KEVIN P , LIU CHARLES , LEAHEY PATRICK , RUCK ROBERT L , BLUCK TERRY
发明人： XIE JUN , FAIRBAIRN KEVIN P , LIU CHARLES , LEAHEY PATRICK , RUCK ROBERT L , BLUCK TERRY
IPC分类号： C23C16/513
CPC分类号： C23C16/4412 , C23C16/4409 , H01J37/32513 , H01J37/32798 , H01J37/32834 , H01J37/32871
摘要： An enclosure for generating a secondary environment within a processing chamber for coating a substrate. An enclosure wall forms a secondary environment encompassing the coating source, plasma, and the substrate, and separating them from interior of the processing chamber. The enclosure wall includes a plurality of pumping channels for diverting gaseous flow away from the substrate. The channels have an intake of larger diameter from the exhaust opening and are oriented at an angle with the intake opening pointing away from the deposition source. A movable seal enables transport of the substrate in open position and processing the substrate in closed position. The seal may be formed as a labyrinth seal to avoid particle generation from a standard contact seal.
摘要翻译：一种用于在用于涂覆基底的处理室内产生二次环境的外壳。外壳壁形成包围涂料源，等离子体和基材的二次环境，并将它们从处理室的内部分离。封闭壁包括多个泵送通道，用于将气流从衬底转向。通道具有来自排气口的较大直径的入口并且与进气开口指向远离沉积源成一定角度定向。可移动密封件使得能够将基板传送到打开位置并且将基板处于关闭位置。密封件可以形成为迷宫式密封件，以避免从标准接触密封件产生颗粒。

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