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91. 发明申请

WO2006045267A1 VERFAHREN ZUM HERSTELLEN EINES METALL-KERAMIK-SUBSTRATES BZW. KUPFER-KERAMIK-SUBSTRATES SOWIE TRÄGER ZUR VERWENDUNG BEI DIESEM VERFAHREN 审中-公开
标题翻译：一种用于生产金属陶瓷基片或铜陶瓷基板与载体，使用这个方法中
公开(公告)号：WO2006045267A1
公开(公告)日：2006-05-04
申请号：PCT/DE2005/001781
申请日：2005-10-05
申请人： CURAMIK ELECTRONICS GMBH , SCHULZ-HARDER, Jürgen , FRISCHMANN, Andreas Karl , ROGG, Alexander , EXEL, Karl
发明人： SCHULZ-HARDER, Jürgen , FRISCHMANN, Andreas Karl , ROGG, Alexander , EXEL, Karl
IPC分类号： H05K3/02 , H05K1/03 , H05K13/00 , H01L23/373 , C04B37/02
CPC分类号： C04B37/021 , B32B18/00 , B32B2311/12 , B32B2315/02 , C04B2235/6584 , C04B2235/9607 , C04B2237/341 , C04B2237/343 , C04B2237/365 , C04B2237/407 , C04B2237/54 , C04B2237/56 , C04B2237/562 , C04B2237/704 , H01L23/3735 , H01L2924/0002 , H05K1/0306 , H05K3/022 , H05K2201/0116 , H05K2201/0355 , H05K2203/016 , H01L2924/00
摘要： Bei einem Verfahren zum Herstellen von doppelseitig metallisierten Metall-Keramik-Substraten unter Verwendung des Direct-Bonding-Prozesses durch Erhitzen auf eine Direct-Bonding-Temperatur wird auf einer Trennschicht (2) eines Trägers (1) zumindest ein DCB-Paket (6) bestehend aus einer ersten und einer zweiten Metallschicht (3, 5) und einer zwischen den Metallschichten (3, 5) angeordneten Keramikschicht (4) gebildet wird, wobei wenigstens eine der Metallschichten (3, 5) während des Bondens gegen die Trennschicht (2) anfliegt, die von einer porösen Lage oder Beschichtung aus einem Trennschichtmaterial der Gruppe Mullit, Al 2 O 3 , TiΟ 3 , ZrO 2 , MgO, CaO, CaCO 2 oder aus einer Mischung wenigstens zweier dieser Materialien besteht.
摘要翻译：在用于通过加热，通过使用直接接合工艺制造的双面金属化金属陶瓷基片，以一个直接接温度被设定在载体的隔离层（2）（1）至少一种DCB分组的方法（6）由......组成布置在第一和第二金属层（3,5）和所述金属层之间的（3,5）的陶瓷层（4）形成，其中所述金属层中的至少一个（3,5）的键合到释放层中（2）飞行到该基团的莫来石的分离层材料的多孔层或涂层的，铝_{2 0 _{3 ，钛？_{3 ，的ZrO _{2 ，氧化镁，氧化钙，碳酸钙_{2 或由至少两个这些材料的混合物组成。}}}}}

92. 发明申请

WO2005034596A2 IMPROVED METHOD FOR MICRO-ROUGHENING TREATMENT OF COPPER AND MIXED-METAL CIRCUITRY 审中-公开
公开(公告)号：WO2005034596A2
公开(公告)日：2005-04-14
申请号：PCT/US2004031697
申请日：2004-09-27
申请人： ATOTECH DEUTSCHLAND GMBH , FUERHAUPTER HARRY , BARON DAVID THOMAS , JOHAL KULDIP SINGH , BROOKS PATRICK PAUL
发明人： FUERHAUPTER HARRY , BARON DAVID THOMAS , JOHAL KULDIP SINGH , BROOKS PATRICK PAUL
IPC分类号： C23F1/18 , H05K3/02 , H05K3/06 , H05K3/38 , H05K3/46 , H05K3/00
CPC分类号： C23F1/18 , H05K3/022 , H05K3/064 , H05K3/383 , H05K3/4641 , H05K2201/0338 , H05K2201/068 , H05K2203/124
摘要： Process to improve adhesion of dielectric materials to a metal layer, including providing an unpatterned metal layer having a first major surface; micro-roughening the first major surface to form a micro-roughened surface; and etching the metal layer to form a circuit pattern in the metal layer, in which the micro-roughening is carried out prior to the etching.

93. 发明申请

WO2004103042A1 PROCESS FOR PRODUCING PRINTED ELECTRONIC CIRCUITS, INCLUDING MULTILAYER, BY ENDOTHERMIC INDUCTION HEATING 审中-公开
标题翻译：通过内热诱导加热生产印刷电路的方法，包括多层膜
公开(公告)号：WO2004103042A1
公开(公告)日：2004-11-25
申请号：PCT/IT2003/000403
申请日：2003-06-27
申请人： CEDAL EQUIPMENT SRL , CERASO, Bruno
发明人： CERASO, Bruno
IPC分类号： H05K3/02
CPC分类号： H05K3/022 , B29C65/3656 , B29C65/368 , B29C66/1122 , B29C66/45 , B29C66/71 , B29C66/72321 , B29C66/8242 , B29C66/8322 , B32B37/06 , B32B2310/0812 , B32B2457/08 , H05K3/4611 , H05K2203/101 , H05K2203/1536 , B29K2061/04 , B29K2063/00 , B29K2067/00 , B29K2079/00
摘要： Process for producing plastic laminates with copper laminae for electronic circuits, including multilayer, with pressing in a cold press (10) and endothermic heating of a pile (88) of packages of the components obtained by generating voltage in the copper laminae by induction created by a ferromagnetic core (50) with a winding (60) through which the alternating current passes.
摘要翻译：用于生产用于电子电路的铜层的塑料层压板的方法，包括多层，在冷压机（10）中压制和通过在铜层中产生电压而获得的组件的堆（88）的吸收加热，具有交流电流通过的绕组（60）的铁磁芯（50）。

94. 发明申请

WO2004086202B1 A SECURITY HOUSING FOR A CIRCUIT 审中-公开
标题翻译：电路的安全外壳
公开(公告)号：WO2004086202B1
公开(公告)日：2004-11-25
申请号：PCT/IE2004000043
申请日：2004-03-25
申请人： BOURNS INC , BURKE RAY , QUEEN CARL
发明人： BURKE RAY , QUEEN CARL
IPC分类号： G06F21/87 , G08B13/12 , H01L23/58 , H05K1/00 , H05K1/02 , H05K1/14 , H05K3/02 , H05K3/10 , H05K3/18 , G06F1/00
CPC分类号： H01L23/57 , G06F21/87 , G08B13/128 , H01L2924/0002 , H05K1/0275 , H05K1/0284 , H05K1/144 , H05K3/027 , H05K3/105 , H05K3/185 , H05K2201/0999 , H05K2201/10151 , H05K2203/107 , H01L2924/00
摘要： The present invention relates to the field of enclosures for electronic circuits and in particular to applications, for example payment card systems, where it is necessary to provide some physical security to prevent unauthorised access to a circuit and more particularly to the data contained within memory devices in the circuit. The present invention provides an improved housing overcoming problems associated with prior art housing and in particular provides a housing that allows for replacement and/or repair of an underlying circuit at a relatively low cost. This is achieved by provision of a single piece construction security housing having conductive patterns integrally provided thereon. In particular, a first embodiment of the invention provides a security housing for mounting in use on a circuit board to protect an associated circuit, comprising: a plurality of electrical contacts for making electrical contact with the circuit board, a cover, a plurality of side walls, where the plurality of side walls and cover define a space for accommodating the associated circuit, and at least one pattern of conductive tracks electrically connected to the electrical contacts and integrally formed with the plurality of side walls and the cover in a single piece construction.
摘要翻译：本发明涉及用于电子电路的外壳领域，特别涉及应用，例如支付卡系统，其中需要提供一些物理安全性以防止对电路的未经授权的访问，更具体地涉及包含在存储器装置内的数据在电路中。本发明提供了一种改进的壳体，克服了与现有技术的壳体相关的问题，并且特别地提供了允许以相对较低成本替换和/或修理底层电路的壳体。这通过提供具有一体设置在其上的导电图案的单件结构安全壳体来实现。特别地，本发明的第一实施例提供一种安全壳体，用于在电路板上安装使用以保护相关联的电路，包括：多个用于与电路板电接触的电触头，盖子，多个侧面壁，其中多个侧壁和盖限定用于容纳相关电路的空间，以及电连接到电触点并与多个侧壁和盖一体形成为单件结构的导电轨道的至少一个图案。

95. 发明申请

WO2004039134A3 PRINTED CIRCUIT HEATERS WITH ULTRATHIN LOW RESISTIVITY MATERIALS 审中-公开
标题翻译：具有超低电阻材料的印刷电路加热器
公开(公告)号：WO2004039134A3
公开(公告)日：2004-07-01
申请号：PCT/US0332140
申请日：2003-10-10
申请人： OAK MITSUI INC
发明人： CARBIN DEREK C , GRAY JEFFREY T , ANDRESAKIS JOHN A
IPC分类号： H01C17/00 , H01C17/24 , H05B3/26 , H05K1/16 , H05K3/02 , H01C1/012
CPC分类号： H01C17/003 , H01C17/2412 , H01C17/2416 , H05B3/262 , H05B2203/003 , H05K1/167 , H05K3/025 , H05K2201/0355 , H05K2203/0361
摘要： A printed circuit heater and process for forming a printed circuit heater are described. The printed circuit heater is formed by depositing a thin metal layer onto a surface of a metal carrier foil, forming a composite. The thin metal layer has a thickness of about 0.1 µm to about 2 µm. The composite is attached to a substrate such that the thin metal layer is in contact with the substrate, forming a laminate. At least a portion of the metal carrier foil is selectively removed from portions of the laminate. The thin metal layer is patterned and etched such that the etched thin metal layer has a heat density of from about 0.5 wafts/in to about 20 watts/in at working voltages from about 3 volts to about 600 volts. The remaining portions of the metal carrier foil, if any, can be selectively removed to thereby provide low resistance busses within the circuit, thus eliminating the need for multiple external connections, and to facilitate evenness of heat distribution.
摘要翻译：描述印刷电路加热器和用于形成印刷电路加热器的工艺。印刷电路加热器通过在金属载体箔的表面上沉积薄金属层而形成复合材料。薄金属层的厚度为约0.1μm至约2μm。复合材料附着在基材上，使得薄金属层与基材接触，形成叠层。金属载体箔的至少一部分从层压体的部分选择性地去除。薄金属层被图案化和蚀刻，使得蚀刻的薄金属层在约3伏至约600伏的工作电压下具有约0.5瓦特/英寸2至约20瓦/英寸2的热密度。金属载体箔的剩余部分（如果有的话）可以被选择性地去除，从而在电路内提供低电阻总线，从而消除对多个外部连接的需要，并且便于热分布的均匀性。

96. 发明申请

WO2003081968A1 A METHOD FOR INTEGRATING MICROPARTICLES INTO MEMS 审中-公开
标题翻译：将微波集成到MEMS中的方法
公开(公告)号：WO2003081968A1
公开(公告)日：2003-10-02
申请号：PCT/US2003/008176
申请日：2003-03-18
申请人： CALIFORNIA INSTITUTE OF TECHNOLOGY , TAI, Yu-Chong , HE, Qing
发明人： TAI, Yu-Chong , HE, Qing
IPC分类号： H05K3/02
CPC分类号： B81C1/00333 , B01L3/502707 , B01L2200/0668 , B01L2200/12 , B01L2300/0896 , B81C1/00182 , B81C1/00476 , B81C2201/0108 , B82Y30/00 , G01N30/6095 , G01N2030/562 , G01N2030/6056
摘要： A method for integrally fabricated MEMs devices with include micro or nanoparticles by providing a mixture (16) of sacrificial material (12) and a multiplicity of particles (10), disposing the mixture (16) on a substrate (14), fabricating a MEMs structure on the substrate (14) including at least part of the mixture (16), so that at least some of the mixture (16) is enclosed in the MEMs structure, removing the sacrificial material (12), and leaving at least some of the multiplicity of particles (10) substantially free and enclosed in the MEMs structure. The step of fabricating a MEMs structure is quite general and is contemplated as including one or a multiplicity of additional steps for creating some type of structure in which the particles (10), which may be microbeads or nanobeads, are included.
摘要翻译：一种通过提供牺牲材料（12）的混合物（16）和多个颗粒（10），将混合物（16）设置在基底（14）上的，用于整体制造的MEM装置的方法，其包括微型或纳米颗粒，制造MEM 包括至少部分混合物（16）的衬底（14）上的结构，使得混合物（16）中的至少一些被封闭在MEM结构中，去除牺牲材料（12），并且留下至少一些基本上游离并包围在MEMs结构中的颗粒（10）的多样性。制造MEMs结构的步骤是相当普遍的，并且被设想为包括用于产生某些类型的结构的一个或多个附加步骤，其中可以包括可以是微珠或纳米珠的颗粒（10）。

97. 发明申请

WO2003026368A1 回路基板を含む物体表面への画像形成方法审中-公开
标题翻译：用于在包含电路基板的物体表面上形成图像的方法
公开(公告)号：WO2003026368A1
公开(公告)日：2003-03-27
申请号：PCT/JP2002/007291
申请日：2002-07-18
申请人：大研化学工業株式会社 , 加藤正利 , 原田昭雄
发明人：加藤正利 , 原田昭雄
IPC分类号： H05K3/02
CPC分类号： H05K3/02 , H05K1/092 , H05K3/4611 , H05K2203/0514 , H05K2203/107 , Y10S430/146
摘要： By using a novel method, the exposure time of the photosensitive paste layer is reduced and the exposure accuracy of the layer is improved, thereby developing a highly fine circuit substrate of high density having a thermal resistance at a reasonable cost. A circuit substrate is manufactured as follows. A photosensitive paste containing photoresist and a circuit material is applied onto a substrate surface so as to form a photosensitive paste layer (4). This photosensitive paste layer (4) is plotted by a laser beam (8) so as to form a plotted area (7). The photosensitive paste layer (4) is developed and an exposed area (4a) or an unexposed area (4b) is removed so as to form a circuit pattern (17). This circuit pattern (17) is sintered to form a circuit pattern (20) composed of the circuit material. It is possible to form a highly fine circuit pattern of high density by laser beam plotting. Moreover, when a green sheet (2) is used as the substrate, it is possible to form a ceramic substrate (18) having a thermal resistance by sintering. Furthermore, by using this method, it is possible to form an arbitrary image on an arbitrary object.
摘要翻译：通过使用新颖的方法，降低了感光性糊剂层的曝光时间，提高了层的曝光精度，从而以合理的成本开发了具有耐热性的高密度高精度电路基板。电路基板如下制造。将含有光致抗蚀剂和电路材料的感光性浆料涂布在基材表面上，形成感光性浆料层（4）。通过激光束（8）绘制感光性浆料层（4），形成绘图面积（7）。显影感光性浆料层（4），除去曝光区域（4a）或未曝光区域（4b），形成电路图案（17）。该电路图形（17）被烧结以形成由电路材料构成的电路图案（20）。可以通过激光束绘图形成高密度的高精度电路图案。此外，当使用生片（2）作为衬底时，可以通过烧结形成具有耐热性的陶瓷衬底（18）。此外，通过使用该方法，可以在任意对象上形成任意图像。

98. 发明申请

WO2002078781A3 METHOD AND APPARATUS FOR PROVIDING HERMETIC ELECTRICAL FEEDTHROUGH 审中-公开
公开(公告)号：WO2002078781A3
公开(公告)日：2002-10-10
申请号：PCT/US2002/008742
申请日：2002-03-22
申请人： SECOND SIGHT, LLC
发明人： OK, Jerry , GREENBERG, Robert, J.
IPC分类号： H05K3/00 , H05K3/02 , H05K3/10 , H05K3/30 , H01R9/00 , H01R43/00 , H01B17/26 , H01B17/30 , H01J5/32
摘要： A method and apparatus suitable for forming hermetic electrical feedthroughs in a ceramic sheet having a thickness of ≤ 40 mils. More particularly, the method yields an apparatus including a hermetic electrical feedthrough which is both biocompatible and electrochemically stable and suitable for implantation in a patient's body. The method involves: (a) providing an unfired, ceramic sheet having a thickness of ≤ 40 mils and preferably comprising ≥ 99 % aluminium oxide; (b) forming multiple blind holes in said sheet; (c) inserting solid wires, preferably of platinum, in said holes; (d) firing the assembly of sheet and wires to a temperature sufficient to sinter the sheet material but insufficient to melt the wires; and (e) removing sufficient material from the sheet lower surface so that the lower ends of said wires are flush with the finished sheet lower surface.

99. 发明申请

WO02034509A1 LAMINATE 审中-公开
标题翻译：层压板
公开(公告)号：WO02034509A1
公开(公告)日：2002-05-02
申请号：PCT/JP2001/009427
申请日：2001-10-26
IPC分类号： B32B15/08 , B32B27/34 , H05K1/03 , H05K3/02 , H05K3/14 , H05K3/18 , H05K3/38 , H05K3/46
CPC分类号： B32B15/08 , B32B27/34 , H05K1/0346 , H05K3/025 , H05K3/146 , H05K3/181 , H05K3/386 , H05K3/4626 , H05K2201/0154 , H05K2201/0195 , Y10T428/24917 , Y10T428/26 , Y10T428/266 , Y10T428/2804 , Y10T428/31678 , Y10T428/31681
摘要： A metal laminate having a synthetic resin film and, formed on one or both sides thereof, a metal layer, wherein the metal layer is a metal foil having a thickness of 5 microns or less; and a metal laminate having a synthetic resin film and, formed on one or both sides thereof, a metal layer, wherein the synthetic resin film is a polyimide film containing at least one element selected from the group consisting of aluminum, silicon, titanium, manganese, iron, cobalt, copper, zinc, tin, antimony, lead, bismuth and palladium which is obtained by immersing a polyamide acid film being partially converted to an imide or partially dried in a solution of a compound containing the above at least one element or applying the solution to the film, and then completely drying the polyamide acid film and converting it to an imide. The metal laminate can be used for producing a printed wiring substrate and a multi-layered printed wiring board which have a narrow-pitched wiring pattern and a small diameter via hole and exhibit homogeneous thickness of an insulating layer, high thermal resistance and high stability of adhesion between a metal layer and a synthetic resin film, and thus contributes to the production of electronic devices having a small size and exhibiting high performance and excellent function.
摘要翻译：一种具有合成树脂薄膜并在其一面或两面上形成金属层的金属层压板，其中金属层是厚度为5微米或更小的金属箔; 和具有合成树脂膜的金属层压体，并且在其一侧或两侧上形成金属层，其中所述合成树脂膜是含有选自铝，硅，钛，锰中的至少一种元素的聚酰亚胺膜，铁，钴，铜，锌，锡，锑，铅，铋和钯，其通过将部分转化为酰亚胺的聚酰胺酸膜或部分干燥在含有上述至少一种元素的化合物的溶液中而获得，或将溶液施加到膜上，然后完全干燥聚酰胺酸膜并将其转化为酰亚胺。金属层叠体可以用于制造具有狭窄布线图案和小直径通孔的印刷布线基板和多层印刷布线板，并且具有均匀的绝缘层厚度，高耐热性和高稳定性金属层与合成树脂膜之间的粘合，有助于制造尺寸小，显示出高性能和优异功能的电子器件。

100. 发明申请

WO02032660A1 MULTILAYERED METAL LAMINATE AND PROCESS FOR PRODUCING THE SAME 审中-公开
标题翻译：多层金属层压板及其制造方法
公开(公告)号：WO02032660A1
公开(公告)日：2002-04-25
申请号：PCT/JP2001/008756
申请日：2001-10-04
IPC分类号： B23K20/00 , B23K20/04 , B23K20/14 , B32B15/01 , H05K3/02 , H05K3/06 , B23K20/16 , H05K1/03 , H05K3/46
CPC分类号： H05K3/025 , B23K20/04 , B32B15/01 , H05K3/062 , H05K2201/0355 , H05K2201/0361 , H05K2203/0384 , H05K2203/068 , Y10T428/12 , Y10T428/12438 , Y10T428/12896 , Y10T428/12979
摘要： An adhesive-free multilayered metal laminate having a given thickness which is obtained by bonding a metal sheet having a thin metal film on a surface thereof to a metal foil without using an adhesive; and a process for continuously producing the laminate. The process comprises the steps of: setting a metal sheet on a reel for metal sheet unwinding; setting a metal foil on a reel for metal foil unwinding; unwinding the metal sheet from the metal sheet-unwinding reel and activating a surface of the metal sheet to thereby form a first thin metal film on the metal sheet surface; unwinding the metal foil from the metal foil-unwinding reel and activating a surface of the metal foil to thereby form a second thin metal film on the metal foil surface; and press-bonding the activated surface of the first thin metal film to that of the second thin metal film so that the first thin metal film formed on the metal sheet is in contact with the second thin metal film formed on the metal foil.
摘要翻译：具有给定厚度的无粘合剂的多层金属层压体，其通过在其表面上将不具有金属薄膜的金属薄片接合而不使用粘合剂而获得; 以及连续制造层压体的方法。该方法包括以下步骤：将金属片设置在用于金属板退绕的卷轴上; 在金属箔退绕卷轴上设置金属箔; 从金属板退绕卷轴退绕金属片并激活金属片的表面，从而在金属片表面上形成第一薄金属膜; 从金属箔退绕卷轴退绕金属箔并激活金属箔的表面，从而在金属箔表面上形成第二薄金属膜; 并且将第一薄金属膜的活化表面压接到第二薄金属膜的活化表面，使得形成在金属片上的第一薄金属膜与形成在金属箔上的第二薄金属膜接触。

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