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1. 发明申请

US20010009273A1 Printed wiring board conductive via hole filler having metal oxide reducing capability 有权
标题翻译：具有金属氧化物还原能力的印刷电路板导电通孔填料
公开(公告)号：US20010009273A1
公开(公告)日：2001-07-26
申请号：US09792722
申请日：2001-02-26
申请人： Methode Electronics, Inc.
发明人： Frank St. John
IPC分类号： H01B001/22
CPC分类号： H01B1/22 , H05K1/095 , H05K3/4069 , H05K3/4614 , H05K2201/0245 , H05K2201/0959 , H05K2203/1453
摘要： A conductive via filler for printed wiring boards capable of reducing copper oxides and thereby eliminating a cleaning step in printed wiring board construction, the conductive via filler consisting essentially of silver flake, a resin, a hardener, and a titanate coupling compound. The filler or paste may further include one or more of a flexibilizer, a solvent, and/or an accelerator. It is a feature of the invention that extensive pre-cleaning of copper substrates is obviated.
摘要翻译：一种能够减少铜氧化物并因此消除印刷电路板结构中的清洁步骤的印刷线路板的导电通孔填料，基本上由银薄片，树脂，硬化剂和钛酸酯偶联化合物组成的导电通孔填料。填料或糊剂可进一步包括增韧剂，溶剂和/或促进剂中的一种或多种。本发明的一个特征是可以消除铜基板的大量预清洗。

2. 发明申请

US20030102466A1 ANISOTROPIC CONDUCTIVE ADHESIVE FILM 有权
标题翻译：各向异性导电胶片
公开(公告)号：US20030102466A1
公开(公告)日：2003-06-05
申请号：US09779480
申请日：2001-02-09
申请人： SONY CHEMICALS CORP.
发明人： Hiroyuki Kumakura , Satoshi Yamamoto
IPC分类号： H01B001/22
CPC分类号： H01L24/83 , C08L63/00 , C09J7/10 , C09J9/02 , C09J2201/36 , C09J2201/602 , C09J2433/00 , C09J2463/00 , H01B1/22 , H01B3/18 , H01L24/29 , H01L2224/16225 , H01L2224/2919 , H01L2224/73204 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01055 , H01L2924/0132 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H01R4/04 , H05K3/323 , H05K2201/0133 , H05K2201/0379 , H05K2201/10674 , H05K2203/1189 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/49211 , Y10T156/1052 , Y10T428/254 , Y10T428/269 , Y10T428/2857 , Y10T428/2991 , Y10T428/2998 , H01L2924/00 , H01L2924/01028
摘要： An anisotropic conductive adhesive film contains a first insulating adhesive layer, a second insulating adhesive layer whose modulus of elasticity after curing is less than the modulus of elasticity of the cured first insulating adhesive layer, and electrically conductive particles which are dispersed in at least either the first insulating adhesive layer or the second insulating adhesive layer.
摘要翻译：各向异性导电粘合剂膜包含第一绝缘粘合剂层，固化后的弹性模量小于固化的第一绝缘粘合剂层的弹性模量的第二绝缘粘合剂层和分散在至少第一绝缘粘合剂层或第二绝缘粘合剂层。

3. 发明申请

US20010015424A1 Conductive adhesive and connection structure using the same 失效
标题翻译：导电胶和连接结构使用相同
公开(公告)号：US20010015424A1
公开(公告)日：2001-08-23
申请号：US09751621
申请日：2000-12-29
申请人： Matsushita Electric Industrial Co. Ltd.
发明人： Hiroaki Takezawa , Takashi Kitae , Yukihiro Ishimaru , Tsutomu Mitani
IPC分类号： H01B001/22 , H01C001/00 , H01B001/02
CPC分类号： H01B1/22 , C09J9/02 , H01R4/04 , H05K3/321 , H05K2201/0129 , H05K2203/121 , Y10T428/249985 , Y10T428/2804 , Y10T428/2852
摘要： A mounting technique with improved adhesive strength and higher reliability against bending stress is provided with the use of a conductive adhesive including a binder resin and a metal filler as main components, in which a functional group is introduced into the molecular chain of the binder resin to form a multidentate bonding with an electrode metal easily. As a thermoplastic resin, at least two kinds of functional groups selected from the group consisting of a carbonyl group, a carboxyl group, an amino group, an imino group, an iminoacetic acid group, an iminopropionic acid group, a hydroxyl group, a thiol group, a pyridinium group, an imido group, an azo group, a nitrilo group, an ammonium group and an imidazole group are introduced. Accordingly, a strong bond with the electrode metal can be achieved. The conductive adhesive is screen-printed to an electrode disposed on a substrate, and after an electrode of a component is mounted, the structure is heated so as to create a mounted structure.
摘要翻译：通过使用包含粘合剂树脂和金属填料作为主要成分的导电粘合剂，其中将官能团引入到粘合剂树脂的分子链中，提供了具有改进的粘合强度和对弯曲应力的更高可靠性的安装技术，与电极金属容易形成多齿结合。作为热塑性树脂，选自羰基，羧基，氨基，亚氨基，亚氨基乙酸基，亚氨基丙酸基，羟基，硫醇中的至少两种官能团基团，吡啶鎓基，亚氨基，偶氮基，次氮基，铵基和咪唑基。因此，可以实现与电极金属的牢固结合。将导电粘合剂丝网印刷到设置在基板上的电极，并且在部件的电极安装之后，将该结构加热以形成安装的结构。

4. 发明申请

US20040121237A1 Composite material and current collector for battery 失效
标题翻译：电池复合材料和集电器
公开(公告)号：US20040121237A1
公开(公告)日：2004-06-24
申请号：US10324068
申请日：2002-12-20
发明人： Kurtis C. Kelley , Charles F. Ostermeier , Matthew J. Maroon
IPC分类号： H01M004/66 , H01M004/68 , H01M004/62 , H01B001/22 , H01B001/24
CPC分类号： H01M4/667 , H01M4/663 , Y10T29/10
摘要： A composite material including a first carbon foam structure including a network of pores and a second carbon foam structure including a network of pores. An intermediate bonding structure is disposed at least in part between the first and second carbon foam structures.
摘要翻译：一种复合材料，其包括包括孔网的第一碳泡沫结构和包括孔网的第二碳泡沫结构。中间粘合结构至少部分地设置在第一和第二碳泡沫结构之间。

5. 发明申请

US20010016252A1 Conductive paste and ceramic electronic device using the same 审中-公开
标题翻译：导电糊和陶瓷电子器件使用相同
公开(公告)号：US20010016252A1
公开(公告)日：2001-08-23
申请号：US09777464
申请日：2001-02-06
申请人： Murata Manufacturing Co., Ltd.
发明人： Toshiki Nagamoto , Kunihiko Hamada
IPC分类号： H01B001/22 , H01G004/12
CPC分类号： H01G4/232 , H01B1/16 , Y10T428/24917
摘要： A conductive paste is provided which can ensure plating adhesion and joint strength between an external electrode and a ceramic body, and which can prevent sticking between electronic devices. The conductive paste, which contains substantially no alkaline earth metal and no lead, comprises powdered silver; a powdered glass containing an alkali metal oxide, boron oxide, silicon oxide, zinc oxide, and aluminum oxide; and an organic vehicle; wherein the powdered glass is composed of about 5 to 12 percent by weight of alkali metal oxide as M2O, M being at least one element selected from the group consisting of Li, Na, K, Rb, Cs and Fr, about 35 to 45 percent by weight of boron oxide as B2O3, about 10 to 20 percent by weight of silicon oxide as SiO2, about 35 to 45 percent by weight of zinc oxide as ZnO, and about 1 to 5 percent by weight of aluminum oxide as Al2O3.
摘要翻译：提供了可以确保外部电极和陶瓷体之间的电镀附着力和接合强度，并且可以防止电子器件之间粘附的导电膏。基本上不含碱土金属而不含铅的导电糊包含粉状银; 含有碱金属氧化物，氧化硼，氧化硅，氧化锌，氧化铝的玻璃粉末; 和有机车辆; 其中，所述粉末状玻璃由约5〜12重量％的碱金属氧化物作为M 2 O组成，M为选自Li，Na，K，Rb，Cs和Fr中的至少一种元素，约35〜45重量％的氧化硼作为B 2 O 3，约10〜20重量％的作为SiO 2的氧化硅，约35〜45重量％的氧化锌作为ZnO，约1〜5重量％的氧化铝作为Al 2 O 3。

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