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1. 发明申请

US20010015424A1 Conductive adhesive and connection structure using the same 失效
标题翻译：导电胶和连接结构使用相同
公开(公告)号：US20010015424A1
公开(公告)日：2001-08-23
申请号：US09751621
申请日：2000-12-29
申请人： Matsushita Electric Industrial Co. Ltd.
发明人： Hiroaki Takezawa , Takashi Kitae , Yukihiro Ishimaru , Tsutomu Mitani
IPC分类号： H01B001/22 , H01C001/00 , H01B001/02
CPC分类号： H01B1/22 , C09J9/02 , H01R4/04 , H05K3/321 , H05K2201/0129 , H05K2203/121 , Y10T428/249985 , Y10T428/2804 , Y10T428/2852
摘要： A mounting technique with improved adhesive strength and higher reliability against bending stress is provided with the use of a conductive adhesive including a binder resin and a metal filler as main components, in which a functional group is introduced into the molecular chain of the binder resin to form a multidentate bonding with an electrode metal easily. As a thermoplastic resin, at least two kinds of functional groups selected from the group consisting of a carbonyl group, a carboxyl group, an amino group, an imino group, an iminoacetic acid group, an iminopropionic acid group, a hydroxyl group, a thiol group, a pyridinium group, an imido group, an azo group, a nitrilo group, an ammonium group and an imidazole group are introduced. Accordingly, a strong bond with the electrode metal can be achieved. The conductive adhesive is screen-printed to an electrode disposed on a substrate, and after an electrode of a component is mounted, the structure is heated so as to create a mounted structure.
摘要翻译：通过使用包含粘合剂树脂和金属填料作为主要成分的导电粘合剂，其中将官能团引入到粘合剂树脂的分子链中，提供了具有改进的粘合强度和对弯曲应力的更高可靠性的安装技术，与电极金属容易形成多齿结合。作为热塑性树脂，选自羰基，羧基，氨基，亚氨基，亚氨基乙酸基，亚氨基丙酸基，羟基，硫醇中的至少两种官能团基团，吡啶鎓基，亚氨基，偶氮基，次氮基，铵基和咪唑基。因此，可以实现与电极金属的牢固结合。将导电粘合剂丝网印刷到设置在基板上的电极，并且在部件的电极安装之后，将该结构加热以形成安装的结构。

2. 发明申请

US20040005459A1 Conductive adhesive agent, packaging structure, and method for manufacturing the same structure 失效
标题翻译：导电胶粘剂，包装结构及其制造方法
公开(公告)号：US20040005459A1
公开(公告)日：2004-01-08
申请号：US10613042
申请日：2003-07-07
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO.,LTD.
发明人： Hiroaki Takezawa , Yukihiro Ishimaru , Takashi Kitae , Tsutomu Mitani , Tousaku Nishiyama
IPC分类号： B32B031/00
CPC分类号： H01L24/83 , C09J9/02 , H01B1/22 , H01L23/49883 , H01L24/28 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/29439 , H01L2224/29444 , H01L2224/29499 , H01L2224/32225 , H01L2224/73204 , H01L2224/8319 , H01L2224/838 , H01L2924/00014 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/1579 , H01L2924/19041 , H01L2924/19043 , H01R4/04 , H05K3/321 , H05K13/0469 , H05K2201/0769 , H05K2201/10636 , H05K2201/10674 , H05K2203/121 , Y02P70/611 , Y10T428/2982 , Y10T428/2984 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/05599
摘要： A conductive adhesive agent of the invention contains an elution preventing film-forming agent 4, which becomes reactive after electric continuity through a conductive particle 3 appeared in the conductive adhesive agent when a binder resin 2 is being hardened, to thereby form an elution preventing film 5 on a surface of the conductive particle 3. By using this conductive adhesive agent, the packaging structure is made migration resistant and sulfurization resistant.
摘要翻译：本发明的导电性粘合剂含有防粘膜成膜剂4，当粘合剂树脂2硬化时，在导电性粘合剂中出现通过导电性粒子3的电连续性而变为反应性的成膜剂，从而形成洗脱防止膜通过使用该导电性粘合剂，使包装结构耐迁移，耐硫化。

3. 发明申请

US20020034620A1 Mounting structure for an electronic component and method for producing the same 失效
标题翻译：电子部件的安装结构及其制造方法
公开(公告)号：US20020034620A1
公开(公告)日：2002-03-21
申请号：US09965768
申请日：2001-09-27
申请人： Matsushita Electric Industrial Co., Ltd.
发明人： Hiroaki Takezawa , Tsutomu Mitani , Minehiro Itagaki , Yoshihiro Bessho , Kazuo Eda
IPC分类号： B32B003/00
CPC分类号： H05K3/321 , B32B7/02 , B32B7/12 , H05K2201/09909 , H05K2201/10636 , H05K2201/10984 , H05K2203/0783 , H05K2203/121 , Y02P70/611 , Y10S428/901 , Y10T29/4913 , Y10T29/49147 , Y10T428/24066 , Y10T428/24917 , Y10T428/2495 , Y10T428/24975 , Y10T428/269 , Y10T428/31678 , Y10T428/31681
摘要： In a mounting structure including a first electrode and a second electrode electrically connected to each other via a conductive adhesive, the periphery of an adhesion portion between at least one of the electrodes and the conductive adhesive is covered with an electrical insulating layer, whereby the adhesion portion is reinforced from the periphery. The electrical insulating layer may be formed by dissolving a binder resin component of the conductive adhesive in a solvent. This increases the concentration of a conductive filler in the conductive adhesive, so that the conductivity of the adhesion portion is also enhanced.
摘要翻译：在包括通过导电粘合剂彼此电连接的第一电极和第二电极的安装结构中，至少一个电极和导电粘合剂之间的粘合部分的周边被电绝缘层覆盖，由此附着部分从外围加强。电绝缘层可以通过将导电粘合剂的粘合剂树脂组分溶解在溶剂中而形成。这增加了导电粘合剂中的导电填料的浓度，从而也增强了粘合部分的导电性。

4. 发明申请

US20030207073A1 Mounting structure for an electronic component and method for producing the same 失效
公开(公告)号：US20030207073A1
公开(公告)日：2003-11-06
申请号：US10409400
申请日：2003-04-07
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： Hiroaki Takezawa , Tsutomu Mitani , Minehiro Itagaki , Yoshihiro Bessho , Kazuo Eda
IPC分类号： B32B005/12 , B32B009/00 , B05D005/10 , B05D001/36
CPC分类号： H05K3/321 , B32B7/02 , B32B7/12 , H05K2201/09909 , H05K2201/10636 , H05K2201/10984 , H05K2203/0783 , H05K2203/121 , Y02P70/611 , Y10S428/901 , Y10T29/4913 , Y10T29/49147 , Y10T428/24066 , Y10T428/24917 , Y10T428/2495 , Y10T428/24975 , Y10T428/269 , Y10T428/31678 , Y10T428/31681
摘要： In a mounting structure including a first electrode and a second electrode electrically connected to each other via a conductive adhesive, the periphery of an adhesion portion between at least one of the electrodes and the conductive adhesive is covered with an electrical insulating layer, whereby the adhesion portion is reinforced from the periphery. The electrical insulating layer may be formed by dissolving a binder resin component of the conductive adhesive in a solvent. This increases the concentration of a conductive filler in the conductive adhesive, so that the conductivity of the adhesion portion is also enhanced.

5. 发明申请

US20030116756A1 Conductive adhesive and packaging structure using the same 有权
公开(公告)号：US20030116756A1
公开(公告)日：2003-06-26
申请号：US10309426
申请日：2002-12-03
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： Hiroaki Takezawa , Takashi Kitae , Yukihiro Ishimaru , Tsutomu Mitani , Tousaku Nishiyama
IPC分类号： B32B005/16 , H01C001/00
CPC分类号： H01B1/22 , C09J9/02 , H01L2924/181 , H05K3/321 , H05K3/323 , H05K2201/0272 , H05K2201/0769 , Y10T428/12069 , Y10T428/1209 , Y10T428/12111 , Y10T428/12139 , Y10T428/12528 , Y10T428/25 , H01L2924/00012
摘要： The present invention provides a conductive adhesive and a packaging structure that can keep moisture-proof reliability even when a multipurpose base metal electrode is used. A conductive adhesive according to the present invention includes first particles having a standard electrode potential that is equal to or higher than a standard electrode potential of silver, and second particles having a standard electrode potential lower than a standard electrode potential of silver. A metal compound coating having a potential higher than that of metal particles as the first particles can be formed on a surface of an electrode having a potential lower than that of the metal particles.

6. 发明申请

US20020062988A1 Electronic component mounted member and repair method thereof 失效
标题翻译：电子元件安装件及其修理方法
公开(公告)号：US20020062988A1
公开(公告)日：2002-05-30
申请号：US09893106
申请日：2001-06-27
申请人： Matsushita Electric Industrial Co., Ltd.
发明人： Tsutomu Mitani , Hiroaki Takezawa , Yukihiro Ishimaru , Takashi Kitae , Yasuhiro Suzuki
IPC分类号： H05K001/09
CPC分类号： H05K3/321 , H05K2201/0129 , H05K2201/10992 , H05K2203/176 , H05K2203/306 , Y10T29/49172
摘要： An electronic component mounted member includes a circuit board, an electronic component connected to the circuit board and an electrically conductive adhesive interposed between the electronic component and the circuit board. In a joining interface of the electrically conductive adhesive and an electrode of the circuit board, an intermediate layer that is formed of a thermoplastic insulating adhesive with a softening temperature of 100null C. to 300null C. is interposed between the electrically conductive adhesive and the electrode. An electrically conductive filler contained in the electrically conductive adhesive is present partially in the intermediate layer, thus allowing an electrical conduction between the electrically conductive adhesive and the electrode of the circuit board. This electronic component mounted member is used, and when a repair is necessary, a portion of the intermediate layer corresponding to the electronic component to be repaired is heated so as to raise a temperature of this portion to at least a melting point of the thermoplastic insulating adhesive, thereby melting the thermoplastic insulating adhesive. Then, the electronic component is removed with this state maintained.
摘要翻译：电子部件安装部件包括电路板，连接到电路板的电子部件和插入在电子部件和电路板之间的导电粘合剂。在导电粘合剂和电路板的电极的接合界面中，由软化温度为100℃至300℃的热塑性绝缘粘合剂形成的中间层介于导电粘合剂和电极。包含在导电粘合剂中的导电填料部分地存在于中间层中，从而允许导电粘合剂和电路板的电极之间的导电。使用该电子部件安装部件，当需要修理时，对应于要修复的电子部件的中间层的一部分被加热，以将该部分的温度升高至热塑性绝缘体的至少熔点粘合剂，从而熔化热塑性绝缘粘合剂。然后，保持该状态，去除电子部件。

7. 发明申请

US20030127632A1 Conductive adhesive and connection structure using the same 失效
标题翻译：导电胶和连接结构使用相同
公开(公告)号：US20030127632A1
公开(公告)日：2003-07-10
申请号：US10309596
申请日：2002-12-03
申请人： Matsushita Electric Industrial Co., Ltd.
发明人： Hiroaki Takezawa , Takashi Kitae , Yukihiro Ishimaru , Tsutomu Mitani
IPC分类号： H01B001/00
CPC分类号： H01B1/22 , C09J9/02 , H01R4/04 , H05K3/321 , H05K2201/0129 , H05K2203/121 , Y10T428/249985 , Y10T428/2804 , Y10T428/2852
摘要： A mounting technique with improved adhesive strength and higher reliability against bending stress is provided with the use of a conductive adhesive including a binder resin and a metal filler as main components, in which a functional group is introduced into the molecular chain of the binder resin to form a multidentate bonding with an electrode metal easily. As a thermoplastic resin, at least two kinds of functional groups selected from the group consisting of a carbonyl group, a carboxyl group, an amino group, an imino group, an iminoacetic acid group, an iminopropionic acid group, a hydroxyl group, a thiol group, a pyridinium group, an imido group, an azo group, a nitrilo group, an ammonium group and an imidazole group are introduced. Accordingly, a strong bond with the electrode metal can be achieved. The conductive adhesive is screen-printed to an electrode disposed on a substrate, and after an electrode of a component is mounted, the structure is heated so as to create a mounted structure.
摘要翻译：通过使用包含粘合剂树脂和金属填料作为主要成分的导电粘合剂，其中将官能团引入到粘合剂树脂的分子链中，提供了具有改进的粘合强度和对弯曲应力的更高可靠性的安装技术，与电极金属容易形成多齿结合。作为热塑性树脂，选自羰基，羧基，氨基，亚氨基，亚氨基乙酸基，亚氨基丙酸基，羟基，硫醇中的至少两种官能团基团，吡啶鎓基，亚氨基，偶氮基，次氮基，铵基和咪唑基。因此，可以实现与电极金属的牢固结合。将导电粘合剂丝网印刷到设置在基板上的电极，并且在部件的电极安装之后，将该结构加热以形成安装的结构。

8. 发明申请

US20020050643A1 Conductive adhesive agent, packaging structrue, and method for manufacturing the same structure 失效
标题翻译：导电粘合剂，包装结构和制造相同结构的方法
公开(公告)号：US20020050643A1
公开(公告)日：2002-05-02
申请号：US09947353
申请日：2001-09-07
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： Hiroaki Takezawa , Yukihiro Ishimaru , Takashi Kitae , Tsutomu Mitani , Tousaku Nishiyama
IPC分类号： H01L021/44 , H01L023/48
CPC分类号： H01L24/83 , C09J9/02 , H01B1/22 , H01L23/49883 , H01L24/28 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/29439 , H01L2224/29444 , H01L2224/29499 , H01L2224/32225 , H01L2224/73204 , H01L2224/8319 , H01L2224/838 , H01L2924/00014 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/1579 , H01L2924/19041 , H01L2924/19043 , H01R4/04 , H05K3/321 , H05K13/0469 , H05K2201/0769 , H05K2201/10636 , H05K2201/10674 , H05K2203/121 , Y02P70/611 , Y10T428/2982 , Y10T428/2984 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/05599
摘要： A conductive adhesive agent of the invention contains an elution preventing film-forming agent 4, which becomes reactive after electric continuity through a conductive particle 3 appeared in the conductive adhesive agent when a binder resin 2 is being hardened, to thereby form an elution preventing film 5 on a surface of the conductive particle 3. By using this conductive adhesive agent, the packaging structure is made migration resistant and sulfurization resistant.
摘要翻译：本发明的导电性粘合剂含有防粘膜成膜剂4，当粘合剂树脂2硬化时，在导电性粘合剂中出现通过导电性粒子3的电连续性而变为反应性的成膜剂，从而形成洗脱防止膜通过使用该导电性粘合剂，使包装结构耐迁移，耐硫化。

9. 发明申请

US20020043652A1 Conductive adhesive and packaging structure using the same 有权
标题翻译：导电胶和包装结构使用相同
公开(公告)号：US20020043652A1
公开(公告)日：2002-04-18
申请号：US09898721
申请日：2001-07-03
申请人： Matsushita Electric Industrial Co., Ltd.
发明人： Hiroaki Takezawa , Takashi Kitae , Yukihiro Ishimaru , Tsutomu Mitani , Tousaku Nishiyama
IPC分类号： H01B001/00 , H01B001/02
CPC分类号： H01B1/22 , C09J9/02 , H01L2924/181 , H05K3/321 , H05K3/323 , H05K2201/0272 , H05K2201/0769 , Y10T428/12069 , Y10T428/1209 , Y10T428/12111 , Y10T428/12139 , Y10T428/12528 , Y10T428/25 , H01L2924/00012
摘要： The present invention provides a conductive adhesive and a packaging structure that can keep moisture-proof reliability even when a multipurpose base metal electrode is used. A conductive adhesive according to the present invention includes first particles having a standard electrode potential that is equal to or higher than a standard electrode potential of silver, and second particles having a standard electrode potential lower than a standard electrode potential of silver. A metal compound coating having a potential higher than that of metal particles as the first particles can be formed on a surface of an electrode having a potential lower than that of the metal particles.
摘要翻译：本发明提供即使在使用多功能贱金属电极的情况下也能够保持防潮可靠性的导电性粘合剂和包装结构。根据本发明的导电粘合剂包括具有等于或高于银的标准电极电位的标准电极电位的第一颗粒和具有低于银的标准电极电位的标准电极电位的第二颗粒。可以在具有比金属颗粒的电位低的电极的表面上形成具有比作为第一颗粒的金属颗粒高的电位的金属化合物涂层。

10. 发明申请

US20010005053A1 Electronic part, an electronic part mounting element and an process for manufacturing such the articles 失效
标题翻译：电子部件，电子部件安装元件和制造这些物品的方法
公开(公告)号：US20010005053A1
公开(公告)日：2001-06-28
申请号：US09747976
申请日：2000-12-27
申请人： Matsushita Electric Industrial Co., Ltd.
发明人： Takashi Kitae , Tsutomu Mitani , Yukihiro Ishimaru , Hiroaki Takezawa
IPC分类号： H01L023/48 , H01L023/52 , H01L029/40
CPC分类号： H01L24/10 , H01L24/13 , H01L24/29 , H01L24/83 , H01L2224/13 , H01L2224/13099 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29318 , H01L2224/29339 , H01L2224/29344 , H01L2224/29355 , H01L2224/29364 , H01L2224/29369 , H01L2224/8319 , H01L2224/838 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/19041 , H05K3/321 , H05K2201/10636 , H05K2201/10689 , H05K2201/10909 , H05K2203/0307 , H05K2203/1446 , Y02P70/611 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： A surface of an external electrode 3 of an electronic part 4 is formed with a coating containing resin ingredient. Thereby, adhesion strength and reliability may be significantly improved in mounting an electronic part onto a circuit board 1 through the medium of a conductive adhesive. Further, it will be able to mount an electronic part to an element to be mounted by utilizing a conductive adhesive forming an external electrode 3 as a connecting element. Further, surface roughness (Ra) of an external electrode 3 of an electronic part is set to 0.1 nullm or more and to 10.0 nullm or less and preferably to 1.0 nullm or more and to 5.0 nullm or less. Thereby, adhesion strength with a conductive adhesive may be significantly enhanced in comparison with a conventional electronic part presented.
摘要翻译：电子部件4的外部电极3的表面形成有含有树脂成分的涂层。因此，通过导电粘合剂的介质将电子部件安装到电路板1上可以显着改善粘附强度和可靠性。此外，通过利用形成作为连接元件的外部电极3的导电粘合剂，能够将电子部件安装到要安装的元件上。此外，电子部件的外部电极3的表面粗糙度（Ra）设定为0.1μm以上且10.0μm以下，优选为1.0μm以上且5.0μm以下。因此，与传统的电子部件相比，与导电粘合剂的粘附强度可以显着提高。

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