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    • 6. 发明申请
    • Clathrate compounds, manufacture thereof, and thermoelectric materials, thermoelectric modules, semiconductor materials and hard materials based thereon
    • 包覆化合物,其制造方法,热电材料,热电模块,半导体材料和基于其的硬质材料
    • US20030197156A1
    • 2003-10-23
    • US10214857
    • 2002-08-08
    • Haruki EguchiAkihiko SuzukiSatoshi TakahashiKaoru MiyaharaTohru TanakaShigemitsu KiharaKazuo Tsumuraya
    • H01C001/00
    • H01L35/14C01B33/06Y02P20/129Y02P20/13
    • In high-tech fields such as electronics, the development of new high performance materials which differ from conventional materials has received much attention. An object of the present invention is to provide a clathrate compound which can be used as a thermoelectric material, a hard material, or a semiconductor material. Atoms of an element from group 4B of the periodic table are formed into a clathrate lattice, and a clathrate compound is then formed in which specified doping atoms are encapsulated within the clathrate lattice, and a portion of the atoms of the clathrate lattice are substituted with specified substitution atoms. Suitable doping atoms are atoms from group 1A, group 2A, group 3A, group 1B, group 2B, group 3B, group 4A, group 5A, group 6A, and group 8, and suitable substitution atoms are atoms from group 1A, group 2A, group 3A, group 1B, group 2B, group 3B, group 5A, group 6A, group 7A, group 5B, group 6B, group 7B, and group 8 of the periodic table. Suitable manufacturing methods include melt methods and sintering methods, and moreover intercalant intercalation compounds or the like may also be used as raw materials.
    • 在电子等高科技领域,与传统材料不同的新型高性能材料的开发受到重视。 本发明的目的是提供一种可用作热电材料,硬质材料或半导体材料的包合化合物。 元素周期表4B的元素的原子形成包合物晶格,然后形成包合物化合物,其中特定的掺杂原子被包封在包合物晶格内,并且包合物晶格的一部分原子被 指定的取代原子。 合适的掺杂原子是1A组,2A组,3A组,1B组,2B组,3B组,4A组,5A组,6A组和8组的原子,合适的取代原子是来自1A组,2A组, 3A组,1B组,2B组,3B组,5A组,6A组,7A组,5B组,6B组,7B组和8周期。 合适的制造方法包括熔融法和烧结方法,而且插入剂插层化合物等也可以用作原料。