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1. 发明授权

US06797145B2 Current carrying structure using voltage switchable dielectric material 有权
标题翻译：使用可开关电介质材料的载流结构
公开(公告)号：US06797145B2
公开(公告)日：2004-09-28
申请号：US10315496
申请日：2002-12-09
申请人： Lex Kosowsky
发明人： Lex Kosowsky
IPC分类号： C25D548
CPC分类号： H05K1/0254 , C25D5/54 , H05K1/0373 , H05K1/167 , H05K3/188 , H05K3/423 , H05K3/426 , H05K2201/0215 , H05K2201/0738 , H05K2203/105 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155
摘要： An electrochemical processing method is provided for forming a current carrying device for semiconductor chip packaging and similar applications. The method comprises selecting sections of a substrate to carry current wherein a selected section is at least partly covered with a voltage switchable dielectric material, rendering the voltage switchable dielectric material conductive, and electrochemically forming a current carrying material directly on the voltage switchable dielectric material. The voltage switchable dielectric material can have a characteristic voltage, such that when a voltage having a magnitude exceeding the characteristic voltage is applied to the voltage switchable dielectric material, the voltage switchable dielectric material switches from a dielectric material to a conductive material. When conductive, the voltage switchable dielectric material is amenable to electrochemical processing such as electroplating.
摘要翻译：提供一种用于形成用于半导体芯片封装的载流装置和类似应用的电化学处理方法。该方法包括选择衬底的部分以承载电流，其中所选择的部分至少部分地被可开关电介质材料覆盖，使得电压可切换电介质材料导电，并且电化学地在可开关电介质材料上直接形成载流材料。电压可切换介电材料可以具有特征电压，使得当具有超过特征电压的电压的电压被施加到可开关电介质材料时，可切换电介质材料从电介质材料切换到导电材料。导电时，电压可切换介电材料适用于诸如电镀的电化学处理。

2. 发明授权

US06368484B1 Selective plating process 失效
标题翻译：选择电镀工艺
公开(公告)号：US06368484B1
公开(公告)日：2002-04-09
申请号：US09567468
申请日：2000-05-09
申请人： Richard P. Volant , Peter S. Locke , Kevin S. Petrarca , David M. Rockwell , Seshadri Subbanna
发明人： Richard P. Volant , Peter S. Locke , Kevin S. Petrarca , David M. Rockwell , Seshadri Subbanna
IPC分类号： C25D548
CPC分类号： H01L21/76865 , C25D5/02 , C25D5/48 , H01L21/76843 , H01L21/76874 , H01L21/76879
摘要： A method is described for electroplating a metal structure in a feature formed in a substrate. A seed layer of the metal is deposited on the top surface and on the bottom and sidewalls of the feature. The seed layer is then selectively removed from the top surface, so that only a portion of the seed layer remains in the feature on at least the bottom thereof. The metal is then electroplated using this portion of the seed layer, so that the metal fills the feature. The removal of the seed layer from the top surface causes no electroplating to occur on the top surface.
摘要翻译：描述了一种用于在形成在基底中的特征中电镀金属结构的方法。金属的种子层沉积在特征的顶表面和底部以及侧壁上。然后，从顶表面选择性地去除晶种层，使得至少其底部仅有部分种子层保留在特征中。然后使用种子层的这一部分电镀金属，使得金属填充该特征。从上表面去除种子层不会在顶表面上发生电镀。

3. 发明授权

US06267862B1 Apparatus and method for plating wafers, substrates and other articles 失效
标题翻译：用于电镀晶片，基板和其他物品的装置和方法
公开(公告)号：US06267862B1
公开(公告)日：2001-07-31
申请号：US09639029
申请日：2000-08-15
申请人： Robert Kaufman , Gary C. Downes
发明人： Robert Kaufman , Gary C. Downes
IPC分类号： C25D548
CPC分类号： H01L21/2885 , C25D7/123 , C25D17/001 , C25D17/008 , Y10S204/07
摘要： A plating apparatus and methodology is disclosed that is particularly useful in improving the plating rate, improving the plating of via holes, improving the uniformity of the plating deposition across the surface of the wafer, and minimizing damage to the wafer. With regard to improving the plating rate and the plating of via holes, the plating apparatus and method immerses a wafer in a plating fluid bath and continuously directs plating fluid towards the surface of the wafer. Immersing the wafer in a plating fluid bath reduces the occurrence of trapped gas pockets within via holes which makes it easier to plate them. The continuous directing of plating fluid towards the surface of the wafer increases the ion concentration gradient which is, in turn, increases the plating rate.
摘要翻译：公开了一种电镀装置和方法，其特别可用于改善电镀速率，改善通孔的电镀，改善跨晶片表面的电镀沉积的均匀性，并最小化对晶片的损伤。关于提高电镀速度和通孔的电镀，电镀装置和方法将晶片浸入电镀液浴中，并且将电镀液持续地引向晶片表面。将晶片浸入电镀液浴中可以减少通孔内捕获的气穴的发生，从而使其更容易固定。电镀流体朝向晶片表面的连续引导增加了离子浓度梯度，这又提高了电镀速率。

4. 发明授权

US06756134B2 Zinc-diffused alloy coating for corrosion/heat protection 有权
标题翻译：锌扩散合金涂层，用于腐蚀/热保护
公开(公告)号：US06756134B2
公开(公告)日：2004-06-29
申请号：US10252867
申请日：2002-09-23
申请人： Henry M. Hodgens , Thomas R. Hanlon , Promila Bhatia
发明人： Henry M. Hodgens , Thomas R. Hanlon , Promila Bhatia
IPC分类号： C25D548
CPC分类号： C23C10/60 , C23C22/34 , C23C28/021 , C23C28/023 , C23C28/025 , C23C28/028 , C23C2222/10 , Y10S428/941 , Y10T428/12458 , Y10T428/12792 , Y10T428/12799 , Y10T428/12937
摘要： The present invention relates to a zinc-diffused nickel alloy coating for corrosion and heat protection and to a method for forming such a coating. The coating method broadly comprises the steps of forming a plain nickel or nickel alloy coating layer on a substrate, applying a layer of zinc over the nickel or nickel alloy coating layer, and thermally diffusing the zinc into the nickel alloy coating layer. The coating method may further comprise immersing the coated substrate in a phosphated trivalent chromium conversion solution either before or after the diffusing step. The substrate may be a component used in a gas turbine engine, which component is formed from a steel material.
摘要翻译：本发明涉及一种用于腐蚀和热保护的锌扩散镍合金涂层及其形成方法。涂覆方法广泛地包括在基材上形成普通镍或镍合金涂层的步骤，在镍或镍合金涂层上施加锌层，并将锌热扩散到镍合金涂层中。涂布方法可以进一步包括在扩散步骤之前或之后将涂覆的基材浸入磷酸化的三价铬转化溶液中。基板可以是用于燃气涡轮发动机中的部件，该部件由钢材料形成。

5. 发明授权

US06607650B1 Method of forming a plated layer to a predetermined thickness 失效
标题翻译：将镀层形成为预定厚度的方法
公开(公告)号：US06607650B1
公开(公告)日：2003-08-19
申请号：US09665576
申请日：2000-09-18
申请人： Takayuki Niuya , Michihiro Ono , Hideto Goto , Kyungho Park , Yoshinori Marumo , Katsusuke Shimizu
发明人： Takayuki Niuya , Michihiro Ono , Hideto Goto , Kyungho Park , Yoshinori Marumo , Katsusuke Shimizu
IPC分类号： C25D548
CPC分类号： H01L21/76877 , C25D5/18 , C25D7/123 , C25D17/001 , H01L21/2885 , H01L21/7684 , H01L2924/0002 , H01L2924/00
摘要： The object of the present invention is to provide a plating method capable of planarization process of high quality in comparison with the conventional plating method and also provide a plating device and a plating system adopting the plating method of the invention. In the plating method and device, an object 10 to be processed and an electrode plate 20 are dipped in a solution including objective metal ions and a forward current is supplied between the object and the electrode plate to educe a metal on the surface of the object. After forming a plating film on the object excessively, a backward current is supplied between the object 10 and the electrode 20 to uniformly remove at least part of superfluous plating film.
摘要翻译：本发明的目的是提供一种与传统的镀覆方法相比能够进行高质量平坦化处理的电镀方法，并且还提供了采用本发明的电镀方法的电镀装置和电镀系统。在电镀方法和装置中，将待处理物体10和电极板20浸入包含目标金属离子的溶液中，并且在物体和电极板之间提供正向电流以在物体的表面上还原金属。在物体上过度地形成镀膜之后，在物体10和电极20之间提供反向电流，以均匀地去除至少一部分多余的镀膜。

6. 发明授权

US06284122B1 Production of a zinc-aluminum alloy coating by immersion into molten metal baths 失效
标题翻译：通过浸入熔融金属浴中生产锌 - 铝合金涂层
公开(公告)号：US06284122B1
公开(公告)日：2001-09-04
申请号：US09615515
申请日：2000-07-12
申请人： Massimo Memmi , Bruno Brevaglieri , Stefano Natali , Michele Cecchini
发明人： Massimo Memmi , Bruno Brevaglieri , Stefano Natali , Michele Cecchini
IPC分类号： C25D548
CPC分类号： C23C2/02
摘要： A process for non-continuous galvanization of a metal object with a Zn—Al alloy including the steps of pre-coating the object with a metallic layer of sufficient thickness to protect the object from oxidation and yet sufficiently thin to permit the pre-coating to substantially completely react with or dissolve in the molten Zn—Al bath, subjecting the precoated object to a surface activation treatment by immersing it in hydrochloric acid and thereafter allowing the surface to dry with a protective coating of a chloride salt, and thereafter immersing the object in the Zn—Al bath.
摘要翻译：一种用Zn-Al合金对金属物体进行非连续镀锌的方法，包括以下步骤：用足够厚度的金属层预涂物体，以保护物体不被氧化，然后足够薄以允许预涂基本上完全与熔融的Zn-Al浴反应或溶解，使预涂物进行表面活化处理，将其浸入盐酸中，然后使表面用氯化物盐的保护涂层干燥，然后浸渍物体在Zn-Al浴中。

7. 发明授权

US06790336B2 Method of fabricating damascene structures in mechanically weak interlayer dielectrics 失效
标题翻译：在机械弱层间电介质中制造镶嵌结构的方法
公开(公告)号：US06790336B2
公开(公告)日：2004-09-14
申请号：US10175671
申请日：2002-06-19
申请人： Tatyana Andryushchenko
发明人： Tatyana Andryushchenko
IPC分类号： C25D548
CPC分类号： H01L21/7684 , C25D7/123 , H01L21/7688 , Y10S205/917
摘要： A copper damascene process for a mechanically weak low k dielectric layer is described. Electropolishing is used to etch back the copper. A sacrificial conductive layer beneath the barrier layer assures complete planarization of the copper.
摘要翻译：描述了用于机械弱低k电介质层的铜镶嵌工艺。电抛光用于回蚀铜。阻挡层下方的牺牲导电层确保了铜的完全平坦化。

8. 发明授权

US06521114B1 Prevention of marine encrustation on bronze propellers 失效
标题翻译：防止海洋结垢在青铜螺旋桨上
公开(公告)号：US06521114B1
公开(公告)日：2003-02-18
申请号：US09242534
申请日：1999-05-11
申请人： Ronald Kempin
发明人： Ronald Kempin
IPC分类号： C25D548
CPC分类号： C23C28/322 , B63H1/28 , C23C22/63 , C23C28/345
摘要： From the time that they are immersed into a marine environment, bronze propellers are prone to attack by marine organisms, such as barnacles, coral and algae, which attach themselves to the bronze metallic surface, creating lumps on the propeller, which adversely affect its balance and cause impedance and vibration of the propeller and its boat in the water. Anti-fouling paints are either too toxic for the marine environment or lack smoothness on the surface. These problems have been overcome by polishing the propeller to prepare it for electroplating, cleansing to remove dirt and grease, electroplating with copper, followed by spraying with a standard solution (5%) of sodium hypochlorite and sodium chloride and allowing sufficient time for a reaction of the hypochlorite solution with the copper to form a firmly adhering conversion coating of basic cupric chloride. The coating is blue-green in color.
摘要翻译：从浸入海洋环境的时候，青铜螺旋桨容易受海洋生物侵袭，例如藤壶，珊瑚和藻类，它们附着在青铜金属表面，在螺旋桨上产生不利影响其平衡的块状物并引起螺旋桨及其船在水中的阻抗和振动。防污涂料对海洋环境毒性太大或表面光滑度不高。通过抛光螺旋桨来准备电镀，清洁以除去污垢和油脂，用铜电镀，然后用标准溶液（5％）次氯酸钠和氯化钠喷雾并允许足够的反应时间来克服这些问题。的次氯酸盐溶液与铜形成基本氯化铜的牢固粘附转化涂层。涂层是蓝绿色的。

9. 发明授权

US06428674B1 Process for the removal of galvanic electrolytic residues from electrode frames or electrode frame webs with fiber structure 有权
标题翻译：从具有纤维结构的电极框架或电极框架网中去除电镀电解残渣的工艺
公开(公告)号：US06428674B1
公开(公告)日：2002-08-06
申请号：US09698288
申请日：2000-10-30
申请人： Otwin Imhof , Holger Kistrup , Karl-Ernst Noreikat
发明人： Otwin Imhof , Holger Kistrup , Karl-Ernst Noreikat
IPC分类号： C25D548
CPC分类号： H01M4/806 , C25D5/48 , H01M4/80
摘要： A process for the removal of galvanic electrolytic residues from galvanically reinforced fiber structure frames, where the fiber structure frame is produced through chemical metallization of a textile substrate based on fleeces or felts made of synthetic fibers and then through galvanic reinforcement of the metallized textile substrate in a galvanic bath containing a galvanic electrolyte. The invention provides that the galvanic electrolytic residues are removed by suction from the fiber structure frame. The fiber structure frame then makes contact at least once under high pressure with the wash liquid in a wash station, and subsequently the wash liquid is removed by suction from the fiber structure frame. In order to remove by suction, the galvanic electrolytic residues or the wash liquid, a belt-shaped porous supporting device is inserted between the suction port and a main area of the fiber structure frame.
摘要翻译：一种用于从电加强纤维结构框架去除电解电解残余物的方法，其中纤维结构框架是通过基于由合成纤维制成的绒毛或毡制成的织物基材的化学金属化制造的，然后通过金属化织物基材的电加强含有电解电解质的电镀浴。本发明提供通过从纤维结构框架抽吸除去电解电解残余物。然后纤维结构框架在高压下与洗涤站中的洗涤液体接触至少一次，随后通过抽吸从纤维结构框架去除洗涤液体。为了通过抽吸除去电解电解残余物或洗涤液，带状多孔支撑装置插入在吸入口和纤维结构框架的主区域之间。

10. 发明授权

US06224738B1 Method for a patterned etch with electrolytically grown mask 有权
标题翻译：具有电解生长掩模的图案化蚀刻的方法
公开(公告)号：US06224738B1
公开(公告)日：2001-05-01
申请号：US09437737
申请日：1999-11-09
申请人： Katherine Crawford Sudduth , Thomas Flavian Strange
发明人： Katherine Crawford Sudduth , Thomas Flavian Strange
IPC分类号： C25D548
CPC分类号： H01G9/0032 , C25D11/06 , C25D11/18 , C25F3/14 , H01G9/055
摘要： This present invention is directed to a method of etching anodic foil for electrolytic capacitors and provides a method of electrolytically growing a porous oxide mask on a surface of a high purity etchable strip of anodic foil for forming etch tunnels at strategic locations on the foil. Unetched high purity aluminum foil is placed in a prepared electrolyte doped with chloride. By passing current through the foil, a porous oxide mask is formed on the surface of the anode foil, with an optimized pore spacing. This oxide mask is then partially removed with a stripping agent in order to expose the underlying anode foil at the bottom of the mask pores to the etch solution. The mask is not removed completely, and the anode foil is exposed only at the pore sites. The foil can then be etched using a conventional etch solution. Etch pits and tunnels form only at the pore sites. The tunnel density is increased by 100%-200% over conventional etching using the described process, thereby increasing the foil capacitance by 100 to 200%.
摘要翻译：本发明涉及蚀刻用于电解电容器的阳极箔的方法，并且提供了在高纯度可蚀刻的阳极箔的表面上电解生长多孔氧化物掩膜的方法，用于在箔上的战略位置形成蚀刻隧道。将未蚀刻的高纯度铝箔放置在掺有氯化物的制备的电解质中。通过使电流通过箔，在阳极箔的表面上形成多孔氧化物掩模，并具有优化的孔隙。然后用剥离剂部分地除去该氧化物掩模，以将掩模孔底部的底层阳极箔暴露于蚀刻溶液。掩模不能完全去除，阳极箔仅在孔部位露出。然后可以使用常规蚀刻溶液蚀刻箔。蚀刻坑和隧道仅在孔隙位置形成。使用所述方法，隧道密度比常规蚀刻增加100％-200％，从而将箔电容增加100％至200％。

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