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1. 发明授权

US12084775B1 Passivation of copper-nickel alloy conduits for marine use 有权
公开(公告)号：US12084775B1
公开(公告)日：2024-09-10
申请号：US16898874
申请日：2020-06-11
申请人： The United States of America, as represented by the Secretary of the Navy
发明人： Elissa M. Trueman , Jacob R. Steiner , Peter K. Todoroff
IPC分类号： C23C22/73 , C23C22/63
CPC分类号： C23C22/73 , C23C22/63
摘要： According to exemplary practice of the present invention, a passivation solution is circulated in a closed loop so as to laminarly flow on a continual basis through the channels of copper-nickel alloy piping or tubing. The passivation solution consists essentially of seawater (natural and/or artificial) plus 0.5 mM nickel hydroxide additive. The cyclical flow of the passivation solution is administered to the piping/tubing for a selected period of time (e.g., seven days), resulting in growth of a corrosion-resistant film on the inside (channel) surfaces of the piping/tubing. The film thus formed consists essentially of nickel hydroxide, nickel oxide, and copper oxide, and represents a durable and effective anti-corrosive barrier when exposed to seawater.

2. 发明申请

US20180154608A1 METHOD FOR PRODUCING METAL CONTAINING COMPOSITE AND METAL CONTAINING COMPOSITE FORMED BY ADHESION 审中-公开
公开(公告)号：US20180154608A1
公开(公告)日：2018-06-07
申请号：US15883098
申请日：2018-01-30
申请人： ANDOH-Corporation limited partnership company
发明人： Naoki ANDOH
IPC分类号： B32B7/12 , C09J163/00 , B29C65/00 , C09J5/06
CPC分类号： B32B7/12 , B29C65/00 , B29C65/02 , B29C65/4835 , B29C65/526 , B29C65/8215 , B29C65/8253 , B29C66/0222 , B29C66/02245 , B29C66/0242 , B29C66/112 , B29C66/114 , B29C66/1142 , B29C66/30322 , B29C66/43 , B29C66/43421 , B29C66/43441 , B29C66/71 , B29C66/7212 , B29C66/72141 , B29C66/73161 , B29C66/73751 , B29C66/73755 , B29C66/7394 , B29C66/742 , B29C66/7422 , B29C66/7428 , B29C66/74281 , B29C66/74283 , B29C66/919 , C09J5/06 , C09J163/00 , C23C22/05 , C23C22/33 , C23C22/57 , C23C22/63 , C23C22/64 , C23F1/18 , C23F1/20 , C23F1/28 , C23F1/40 , C23G1/00 , C23G1/125 , C23G1/22 , B29K2307/04 , B29K2063/00
摘要： An adhesive (B) of solvent containing adhesive as a suspension of low viscosity is prepared by adding a solvent MIBK to a one-part epoxy adhesive of a dicyandiamide-curable type (A). Metal shaped articles (M1 to M5) as adherends are prepared each of which, through various surface treatment, has specific surface configuration of roughened face and/or ultrafine irregularities and the surface is entirely covered with a thin layer of ceramics such as a metal oxide or metal phosphate. The specified face of each metal shaped article (M1 to M5) is painted with the solvent containing adhesive (B). The faces painted with the adhesive of two metal shaped articles (M1 to M5) are caused to abut each other, the articles are heated to cure the one-epoxy adhesive to accomplish adhesion. With one of the adherends replaced by a CFRP shaped article (P2), a composite of a metal and CFRP can be formed.

3. 发明授权

US09902132B2 Method for producing metal containing composite and metal containing composite formed by adhesion 有权
公开(公告)号：US09902132B2
公开(公告)日：2018-02-27
申请号：US15153670
申请日：2016-05-12
申请人： ANDOH—Corporation limited partnership company
发明人： Naoki Andoh
IPC分类号： C09J7/02 , B32B7/12 , C09J5/06 , C09J163/00 , B29C65/00
CPC分类号： B32B7/12 , B29C65/00 , B29C65/02 , B29C65/4835 , B29C65/526 , B29C65/8215 , B29C65/8253 , B29C66/0222 , B29C66/02245 , B29C66/0242 , B29C66/112 , B29C66/114 , B29C66/1142 , B29C66/30322 , B29C66/43 , B29C66/43421 , B29C66/43441 , B29C66/71 , B29C66/7212 , B29C66/72141 , B29C66/73161 , B29C66/73751 , B29C66/73755 , B29C66/7394 , B29C66/742 , B29C66/7422 , B29C66/7428 , B29C66/74281 , B29C66/74283 , B29C66/919 , C09J5/06 , C09J163/00 , C23C22/05 , C23C22/33 , C23C22/57 , C23C22/63 , C23C22/64 , C23F1/18 , C23F1/20 , C23F1/28 , C23F1/40 , C23G1/00 , C23G1/125 , C23G1/22 , B29K2307/04 , B29K2063/00
摘要： An adhesive (B) of solvent containing adhesive as a suspension of low viscosity is prepared by adding a solvent MIBK to a one-part epoxy adhesive of a dicyandiamide-curable type (A). Metal shaped articles (M1 to M5) as adherends are prepared each of which, through various surface treatment, has specific surface configuration of roughened face and/or ultrafine irregularities and the surface is entirely covered with a thin layer of ceramics such as a metal oxide or metal phosphate. The specified face of each metal shaped article (M1 to M5) is painted with the solvent containing adhesive (B). The faces painted with the adhesive of two metal shaped articles (M1 to M5) are caused to abut each other, the articles are heated to cure the one-epoxy adhesive to accomplish adhesion. With one of the adherends replaced by a CFRP shaped article (P2), a composite of a metal and CFRP can be formed.

4. 发明授权

US09338896B2 Adhesion promotion in printed circuit boards 有权
标题翻译：印刷电路板中的粘附促进
公开(公告)号：US09338896B2
公开(公告)日：2016-05-10
申请号：US13558019
申请日：2012-07-25
申请人： Abayomi I. Owei , Joseph A. Abys , Theodore Antonellis , Eric Walch
发明人： Abayomi I. Owei , Joseph A. Abys , Theodore Antonellis , Eric Walch
IPC分类号： B05D5/10 , H05K3/38 , C23C22/52 , C23C22/63 , C23C22/73 , C23C22/78 , B05D3/10 , C23F1/18 , C23G1/20
CPC分类号： H05K3/385 , B05D3/10 , B05D5/10 , C23C22/52 , C23C22/63 , C23C22/73 , C23C22/78 , C23F1/18 , C23G1/20 , H05K3/383
摘要： Compositions and methods for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. Conditioning compositions contain a functional organic compound and preferably a transition metal ion. The functional organic compound, e.g., a purine derivative, is capable of forming a self-assembled monolayer. Adhesion promoting compositions contain an acid, preferably an inorganic acid, and an oxidant. The latter compositions may also contain a corrosion inhibitor and/or a transition metal ion selected from among Zn, Ni, Co, Cu, Ag, Au, Pd or another Pt group metal. The corrosion inhibitor may comprise a nitrogen-containing aromatic heterocyclic compound.
摘要翻译：用于在制造印刷电路板期间增强铜导电层和电介质材料之间的粘附性的组合物和方法。调理组合物含有功能性有机化合物，优选过渡金属离子。功能性有机化合物，例如嘌呤衍生物，能够形成自组装单层。粘合促进组合物含有酸，优选无机酸和氧化剂。后一种组合物还可以含有选自Zn，Ni，Co，Cu，Ag，Au，Pd或其它Pt族金属中的腐蚀抑制剂和/或过渡金属离子。腐蚀抑制剂可以包含含氮芳族杂环化合物。

5. 发明申请

US20140030425A1 ADHESION PROMOTION IN PRINTED CIRCUIT BOARDS 有权
标题翻译：印刷电路板中的粘合促进
公开(公告)号：US20140030425A1
公开(公告)日：2014-01-30
申请号：US13558019
申请日：2012-07-25
申请人： Abayomi I. OWEI , Joseph A. ABYS , Theodore ANTONELLIS , Eric WALCH
发明人： Abayomi I. OWEI , Joseph A. ABYS , Theodore ANTONELLIS , Eric WALCH
IPC分类号： B05D5/12 , C09K15/32
CPC分类号： H05K3/385 , B05D3/10 , B05D5/10 , C23C22/52 , C23C22/63 , C23C22/73 , C23C22/78 , C23F1/18 , C23G1/20 , H05K3/383
摘要： Compositions and methods for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. Conditioning compositions contain a functional organic compound and preferably a transition metal ion. The functional organic compound, e.g., a purine derivative, is capable of forming a self-assembled monolayer. Adhesion promoting compositions contain an acid, preferably an inorganic acid, and an oxidant. The latter compositions may also contain a corrosion inhibitor and/or a transition metal ion selected from among Zn, Ni, Co, Cu, Ag, Au, Pd or another Pt group metal. The corrosion inhibitor may comprise a nitrogen-containing aromatic heterocyclic compound.
摘要翻译：用于在制造印刷电路板期间增强铜导电层和电介质材料之间的粘附性的组合物和方法。调理组合物含有功能性有机化合物，优选过渡金属离子。功能性有机化合物，例如嘌呤衍生物，能够形成自组装单层。粘合促进组合物含有酸，优选无机酸和氧化剂。后一种组合物还可以含有选自Zn，Ni，Co，Cu，Ag，Au，Pd或其它Pt族金属中的腐蚀抑制剂和/或过渡金属离子。腐蚀抑制剂可以包含含氮芳族杂环化合物。

6. 发明授权

US08388768B2 Method for preparing patination materials and patination material 有权
标题翻译：制作人造材料和雕刻材料的方法
公开(公告)号：US08388768B2
公开(公告)日：2013-03-05
申请号：US10510568
申请日：2003-04-07
申请人： Tapio Korpinen
发明人： Tapio Korpinen
IPC分类号： C23C22/48
CPC分类号： C23C22/63 , C09D167/08 , C23C8/10 , C23C8/40 , C08L2666/54
摘要： The present invention relates to a method for preparing an artificial patination material to substrates, preferably made from copper or copper alloys and a patination material. The raw material is a copper salt, which reacts with an alkali metal hydroxide. The precipitate is dispersed with powerful mixing and an addition of a dispersing agent. An oxidative agent like manganese dioxide is used, and carbon is used as an agent for catalyzing natural patina forming. Metal compounds are used to achieving desired color and/or color tinge. The invention relates also to the corresponding patination material.
摘要翻译：本发明涉及一种制备人造修复材料的方法，该方法优选由铜或铜合金制成，并且可用于基片材料。原料是与碱金属氢氧化物反应的铜盐。沉淀物通过强力混合和分散剂的加入而分散。使用氧化剂如二氧化锰，碳用作催化天然蛋白形成剂。金属化合物用于实现期望的颜色和/或颜色色调。本发明还涉及相应的识别材料。

7. 发明申请

US20080096046A1 Method Of Treating The Surface Of Copper And Copper 有权
标题翻译：铜和铜表面处理方法
公开(公告)号：US20080096046A1
公开(公告)日：2008-04-24
申请号：US11908329
申请日：2006-03-10
申请人： Tomoaki Yamashita , Yasuo Inoue , Masaharu Matsuura , Toyoki Ito , Akira Shimizu , Fumio Inoue , Akishi Nakaso
发明人： Tomoaki Yamashita , Yasuo Inoue , Masaharu Matsuura , Toyoki Ito , Akira Shimizu , Fumio Inoue , Akishi Nakaso
IPC分类号： C23F1/00 , B32B15/20
CPC分类号： H05K3/385 , C23C8/02 , C23C8/40 , C23C22/63 , C23C28/00 , C23C28/321 , C23C28/322 , C23C28/345 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/73204 , H01L2224/73265 , H01L2924/15311 , H01L2924/181 , H05K3/384 , H05K3/389 , H05K3/4644 , H05K2201/0347 , H05K2201/0373 , H05K2203/0315 , H05K2203/1157 , Y10T428/12438 , Y10T428/12771 , Y10T428/12875 , Y10T428/12903 , Y10T428/12993 , Y10T428/24917 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A method of treating the surface of copper is provided to ensure adhesive strength between the surface of copper and an insulating layer without forming irregularities exceeding 1 μm on the surface of copper and to improve insulation reliability between wirings. A copper whose surface is treated by the above surface treating method is also provided. The method of treating the surface of copper comprises the surface of copper comprising the steps of: forming a metal nobler than copper discretely on the surface of copper; and subsequently oxidizing the surface of copper by using an alkaline solution containing an oxidant.
摘要翻译：提供一种处理铜表面的方法，以确保铜表面和绝缘层之间的粘合强度，而不会在铜表面上形成超过1um的凹凸，并提高布线之间的绝缘可靠性。还提供了通过上述表面处理方法处理其表面的铜。处理铜的表面的方法包括铜的表面，包括以下步骤：在铜的表面上离散地形成比铜更贵的金属; 然后通过使用含有氧化剂的碱性溶液氧化铜的表面。

8. 发明授权

US06818556B2 Method of plating a metal or metal compound on a semiconductor substrate that includes using the same main component in both plating and etching solutions 失效
标题翻译：在半导体基板上镀覆金属或金属化合物的方法，包括在电镀和蚀刻溶液中使用相同的主要成分
公开(公告)号：US06818556B2
公开(公告)日：2004-11-16
申请号：US10233582
申请日：2002-09-04
申请人： Yoshihiro Uozumi
发明人： Yoshihiro Uozumi
IPC分类号： H01L21445
CPC分类号： H01L21/76849 , C23C22/63 , H01L21/02074 , H01L21/02087 , H01L21/0209 , H01L21/3212 , H01L21/32134 , H01L21/76865 , H01L21/76883 , H01L21/76885 , H01L21/76888
摘要： A method of forming a copper oxide film includes forming a copper oxide film including an ammonia complex by causing a mixed solution of aqueous ammonia and aqueous hydrogen peroxide, which has been adjusted to have pH of 8 to 10 or pH of 9 to 10, to contact a surface of a copper film. A method of fabricating a semiconductor device includes burying a copper film to be a wiring or a contact wiring in a wiring groove or a contact hole formed in a surface of an insulating film formed on a semiconductor substrate, or in both the wiring groove and the contact hole, forming a copper oxide film including an ammonia complex on a surface of the copper film by using the copper oxide film forming method, and removing the copper oxide film from the copper film using acid or alkali.
摘要翻译：形成氧化铜膜的方法包括通过将已调节为pH8至10或pH为9至10的氨水和过氧化氢水溶液的混合溶液形成包括氨络合物的氧化铜膜至接触铜膜的表面。一种制造半导体器件的方法包括：在形成于半导体衬底上的绝缘膜表面上形成的布线槽或接触孔中，或在布线槽和布线槽中形成布线或接触布线的铜膜接触孔，通过使用氧化铜膜形成方法在铜膜的表面上形成包含氨络合物的氧化铜膜，并使用酸或碱从铜膜除去氧化铜膜。

9. 发明授权

US06746547B2 Methods and compositions for oxide production on copper 失效
标题翻译：铜上氧化物生产的方法和组成
公开(公告)号：US06746547B2
公开(公告)日：2004-06-08
申请号：US10093097
申请日：2002-03-05
申请人： Joseph Cole , Rudolf P. Sedlak
发明人： Joseph Cole , Rudolf P. Sedlak
IPC分类号： C23C2200
CPC分类号： C23C22/63 , C23C22/52 , H05K3/385
摘要： The invention features and methods and compositions for oxide production on a Copper substrate, e.g., a Copper or Copper alloy substrate, to provide for improved adhesion of Copper substrate to polymeric material, e.g., such as used in manufacture of printed circuit boards. The oxide-producing compositions of the invention, which may be either acidic or ammoniacal, comprise 1) a source of Cu++ (Cupric) ions; 2) a source of a primary electrolyte that is non-interactive with Copper ions; 3) a Cuprous ligand, e.g., a halide ion, preferably chloride, which also serves as a secondary electrolyte; and 4) an optional organic. Acidic oxide-producing compositions comprise a strong acid as the primary electrolyte. The primary electrolyte of ammoniacal oxide-producing compositions is a non-interactive, ammonium salt of acid, which provides a highly soluble Cupric ammonium salt. The secondary electrolyte of the oxide-producing compositions is selected so as to be compatible with the primary electrolyte.
摘要翻译：本发明的特征和用于铜基底（例如铜或铜合金基底）上的氧化物生产的方法和组合物，以提供铜基底与聚合物材料（例如用于制造印刷电路板的聚合材料）的改善的粘合性。可以是酸性或氨性的本发明的产生氧化物的组合物包含1）Cu ++（二价）离子源; 2）与铜离子不相互作用的初级电解质源; 3）还可用作二次电解质的亚铜配体，例如卤离子，优选氯化物; 和4）任选的有机物。酸性氧化物生成组合物包含强酸作为主要电解质。产生氨氧化物的组合物的主要电解质是非交互的酸性铵盐，其提供高度可溶的铜铵盐。选择氧化物生成组合物的二次电解质以与初级电解质相容。

10. 发明申请

US20030116441A1 Prevention of marine encrustation on bronze propellers 审中-公开
标题翻译：防止海洋结垢在青铜螺旋桨上
公开(公告)号：US20030116441A1
公开(公告)日：2003-06-26
申请号：US10354107
申请日：2003-01-30
发明人： Ronald Kempin
IPC分类号： C25D005/34
CPC分类号： C23C28/322 , B63H1/28 , C23C22/63 , C23C28/345
摘要： From the time that they are immersed into a marine environment, bronze propellers are prone to attack by marine organisms, such as barnacles, coral and algae, which attach themselves to the bronze metallic surface, creating lumps on the propeller, which adversely affect its balance and cause impedance and vibration of the propeller and its boat in the water. Ant-fouling paints are either too toxic for the marine environment of lack smoothness on the surface. These problems have been overcome by a combination of known steps, namely, polishing the propeller to prepare it for electroplating, cleansing to remove all traces of dirt and grease, electroplating with copper to a depth of at least 0.005null or 0.15 mm, followed by spraying with a standard solution (5%) of sodium hypochlorite and sodium chloride in a suitable container to form a firmly adhering conversion coating of basic cupric chloride and then sealing for at least twenty-four hours. The preferred procedure for polishing is 60null grit size at 3500 sfm for roughing, followed by 180null grit size at 5500 sfm for finishing using grease as a polishing aid. Electroplating with copper to the minimum depth provides a smoothing effect ranging from 70 to 90 per cent. The container in which the hypochlorite spraying is carried out is preferably kept sealed until just before fitting and launching. A life expectancy of five (5) years can be anticipated with minimal maintenance every time the vessel is slipped.
摘要翻译：从浸入海洋环境的时候，青铜螺旋桨容易受海洋生物侵袭，例如藤壶，珊瑚和藻类，它们附着在青铜金属表面，在螺旋桨上产生不利影响其平衡的块状物并引起螺旋桨及其船在水中的阻抗和振动。防污涂料对于表面缺乏平滑度的海洋环境来说太毒了。这些问题已经通过已知步骤的组合来克服，即抛光螺旋桨以准备其用于电镀，清洁以除去所有痕迹的污垢和油脂，用铜电镀至至少0.005“或0.15mm的深度，随后通过在合适的容器中喷洒次氯酸钠和氯化钠的标准溶液（5％）以形成基本氯化铜的牢固粘附的转化涂层，然后密封至少24小时。抛光的优选步骤是3500＃s的毛坯尺寸为60＃，用于粗加工，其次是180＃砂砾尺寸，5500 sfm，用于润滑脂作抛光助剂。用最小深度的铜电镀提供70％至90％的平滑效果。进行次氯酸盐喷雾的容器优选保持密封直到安装和发射之前。预计在五（5）年的预期寿命，每次船只滑倒时，维护量最少。

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