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    • 1. 发明授权
    • Method for a patterned etch with electrolytically grown mask
    • 具有电解生长掩模的图案化蚀刻的方法
    • US06224738B1
    • 2001-05-01
    • US09437737
    • 1999-11-09
    • Katherine Crawford SudduthThomas Flavian Strange
    • Katherine Crawford SudduthThomas Flavian Strange
    • C25D548
    • H01G9/0032C25D11/06C25D11/18C25F3/14H01G9/055
    • This present invention is directed to a method of etching anodic foil for electrolytic capacitors and provides a method of electrolytically growing a porous oxide mask on a surface of a high purity etchable strip of anodic foil for forming etch tunnels at strategic locations on the foil. Unetched high purity aluminum foil is placed in a prepared electrolyte doped with chloride. By passing current through the foil, a porous oxide mask is formed on the surface of the anode foil, with an optimized pore spacing. This oxide mask is then partially removed with a stripping agent in order to expose the underlying anode foil at the bottom of the mask pores to the etch solution. The mask is not removed completely, and the anode foil is exposed only at the pore sites. The foil can then be etched using a conventional etch solution. Etch pits and tunnels form only at the pore sites. The tunnel density is increased by 100%-200% over conventional etching using the described process, thereby increasing the foil capacitance by 100 to 200%.
    • 本发明涉及蚀刻用于电解电容器的阳极箔的方法,并且提供了在高纯度可蚀刻的阳极箔的表面上电解生长多孔氧化物掩膜的方法,用于在箔上的战略位置形成蚀刻隧道。 将未蚀刻的高纯度铝箔放置在掺有氯化物的制备的电解质中。 通过使电流通过箔,在阳极箔的表面上形成多孔氧化物掩模,并具有优化的孔隙。 然后用剥离剂部分地除去该氧化物掩模,以将掩模孔底部的底层阳极箔暴露于蚀刻溶液。 掩模不能完全去除,阳极箔仅在孔部位露出。 然后可以使用常规蚀刻溶液蚀刻箔。 蚀刻坑和隧道仅在孔隙位置形成。 使用所述方法,隧道密度比常规蚀刻增加100%-200%,从而将箔电容增加100%至200%。
    • 2. 发明授权
    • High capacitance anode and system and method for making same
    • 高电容阳极及其制造方法
    • US06858126B1
    • 2005-02-22
    • US10289580
    • 2002-11-06
    • Ralph Jason HemphillThomas Flavian Strange
    • Ralph Jason HemphillThomas Flavian Strange
    • H01G9/04H01G9/055B23H11/00B23H3/00
    • H01G9/055C25F3/02C25F3/04
    • A method of producing electrodes for electrolytic capacitors by etching metal foil in a low pH etching electrolyte is disclosed. The low pH electrolyte is an aqueous solution, which comprises hydrochloric acid, glycerol, sodium perchlorate or perchloric acid, sodium persulfate and titanium (111) chloride. Anode foils etched according to the method of the invention maintain high capacitance gains, electrical porosity and strength. The electrical porosity of the etched foils is sufficiently high such that the overall Equivalent Series Resistance (ESR) is not increased in multilayer anodes configurations. Also described is a low pH electrolyte bath composition. Anode foils etched according to the present invention and electrolytic capacitors incorporating the etched anode foils are also disclosed.
    • 公开了一种通过在低pH腐蚀电解质中蚀刻金属箔来生产电解电容器用电极的方法。 低pH电解质是水溶液,其包括盐酸,甘油,高氯酸钠或高氯酸,过硫酸钠和氯化钛(111)。 根据本发明的方法蚀刻的阳极箔保持高电容增益,电孔隙率和强度。 蚀刻箔的电气孔隙度足够高,使得多层阳极配置中的整体等效串联电阻(ESR)不增加。 还描述了低pH电解质浴组合物。 还公开了根据本发明蚀刻的阳极箔和结合有蚀刻的阳极箔的电解电容器。
    • 5. 发明授权
    • Method of producing high quality oxide for electrolytic capacitors
    • 电解电容器生产高品质氧化物的方法
    • US06197184B1
    • 2001-03-06
    • US09183442
    • 1998-10-29
    • Ralph Jason HemphillThomas Flavian Strange
    • Ralph Jason HemphillThomas Flavian Strange
    • C25D900
    • H01G9/0032C25D11/02
    • An oxide dissolving acid dip is integrated into an anodic foil formation process. After a foil, either etched or un-etched, is hydrated in a bath of deionized water at an elevated temperature, the foil is then dipped in an organic acid mixture. Next, an oxide layer formation step is utilized to form a barrier oxide layer on a surface of the foil. Next, an oxide dissolving acid dip is utilized to selectively remove a diffuse hydrate layer formed in the formation process. The diffuse hydrate layer is responsible for the reduction of capacitance of the anodic foil. By the use of this oxide dissolving acid dip in conjunction with an organic acid dip, the foil exhibits reduced leakage current properties, while maintaining its capacitance. The treated foil can then be incorporated into a high voltage electrolytic capacitor suitable for use in an implantable cardioverter defibrillator.
    • 将氧化物溶解酸浸液整合到阳极箔形成工艺中。 在蚀刻或未蚀刻的箔之后,在升高的温度下在去离子水浴中水合,然后将箔浸入有机酸混合物中。 接下来,利用氧化物层形成步骤在箔的表面上形成阻挡氧化物层。 接下来,使用溶解酸浸的氧化物来选择性地去除在形成过程中形成的扩散水合物层。 扩散水合物层负责减少阳极箔的电容。 通过使用这种氧化物溶解酸浸渍与有机酸浸渍结合,箔保持其电容,显示出降低的漏电流特性。 然后将经处理的箔并入适用于可植入心律转复除颤器的高压电解电容器中。
    • 7. 发明授权
    • Non-uniform etching of anode foil to produce higher capacitance gain without sacrificing foil strength
    • 阳极箔的不均匀蚀刻产生较高的电容增益而不牺牲箔强度
    • US06736956B1
    • 2004-05-18
    • US09851298
    • 2001-05-07
    • Ralph Jason HemphillThomas V. GrahamThomas Flavian Strange
    • Ralph Jason HemphillThomas V. GrahamThomas Flavian Strange
    • B23H1100
    • H01G9/055B23H9/00C25D3/04C25D3/08
    • The present invention is directed to a method of etching anode foil in a non-uniform manner which increases the overall capacitance gain of the foil while retaining foil strength. In particular, by using a mask to protect a mesh grid of the foil from further etching, a previously etched foil can be further etched, prior to the widening step. Alternatively, the mask may be used in the initial etch, eliminating the need for the second process. In effect the foil may be etched to a higher degree in select regions, leaving a web of more lightly etched foil defined by the mask to retain strength. According to the present invention, the foil is placed between two masks with a grid of openings which expose the foil in these areas to the etching solution. The exposed area can be as little as 10% of the total foil to as much as 95% of the total foil, preferably 30% to 70% of the total foil area. The pattern is configured in such a way that the enhanced area does not create large scale strength defects such as perforation holes and is held in a pattern such as a hexagonal array, random array or radial burst array, such that the exposed area perimeter can be round, square, hexagonal, or triangular. The higher surface area in the exposed areas does not significantly decrease the strength of the foil as a whole, such that the method according to the present invention increases capacitance of the anode foil without significantly decreasing the strength of the foil.
    • 本发明涉及一种以不均匀的方式蚀刻阳极箔的方法,其增加箔的整体电容增益同时保持箔强度。 特别地,通过使用掩模来保护箔的网格网进一步蚀刻,可以在加宽步骤之前进一步蚀刻预蚀刻的箔。 或者,可以在初始蚀刻中使用掩模,消除对第二工艺的需要。 实际上,箔可以在选择区域中被蚀刻到较高程度,留下由掩模限定的更轻微蚀刻的箔的网以保持强度。 根据本发明,箔被放置在具有开口格栅的两个掩模之间,这些开口将这些区域中的箔暴露于蚀刻溶液。 曝光面积可以少于总箔的10%,高达总箔的95%,优选总箔面积的30%至70%。 该图案被配置成使得增强区域不产生诸如穿孔的大规模强度缺陷,并且被保持在诸如六边形阵列,随机阵列或径向突发阵列的图案中,使得暴露的区域周长可以是 圆形,正方形,六边形或三角形。 暴露区域中较高的表面积并不会显着降低箔的整体强度,使得根据本发明的方法增加了阳极箔的电容而不显着降低箔的强度。