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1. 发明申请

US20040259025A1 Novel polymers, processes for polymer synthesis and photoresist compositions 有权
标题翻译：新型聚合物，聚合物合成方法和光致抗蚀剂组合物
公开(公告)号：US20040259025A1
公开(公告)日：2004-12-23
申请号：US10819686
申请日：2004-04-05
申请人： Shipley Company, L.L.C.
发明人： George G. Barclay , Stefan J. Caporale , Robert J. Kavanagh , Nick Pugliano
IPC分类号： G03C001/76
CPC分类号： G03F7/0392 , G03F7/0382 , G03F7/0395 , G03F7/0397 , Y10S430/106
摘要： The invention includes new polymers and methods for providing such polymers and photoresists that comprises the polymers. Methods of the invention include those that comprise providing a reaction mixture and adding over the course of a polymerization reaction one or more polymerization reagents to the reaction mixture to provide the polymer. Photoresists containing a polymer of the invention can exhibit significantly improved lithographic properties.
摘要翻译：本发明包括用于提供包含聚合物的这种聚合物和光致抗蚀剂的新聚合物和方法。本发明的方法包括提供反应混合物并在聚合反应过程中向反应混合物中加入一种或多种聚合试剂以提供聚合物的方法。含有本发明聚合物的光致抗蚀剂可显示出显着改善的平版印刷性能。

2. 发明申请

US20040258847A1 Method of measuring component loss 审中-公开
标题翻译：测量元件损耗的方法
公开(公告)号：US20040258847A1
公开(公告)日：2004-12-23
申请号：US10723218
申请日：2003-11-26
申请人： Shipley Company, L.L.C.
发明人： Martin W. Bayes , Raymund W. M. Kwok
IPC分类号： C25D021/06 , C25D021/16 , C25D021/18
CPC分类号： C23C18/31 , C23C18/1617 , C23C18/1683 , C23C18/36 , C25D21/12
摘要： A method to determine and monitor concentrations of inert metal plating components in metal plating baths. An inert indictor is included in the bath composition and the concentration of the inert indictor is monitored during plating. The change in the concentration of the inert indicator is used to determine the change in the concentration of inert bath components.
摘要翻译：确定和监测金属电镀液中惰性金属电镀组分浓度的方法。在浴组合物中包括惰性指示剂，并且在电镀期间监测惰性指示剂的浓度。惰性指示剂浓度的变化用于确定惰性浴组分浓度的变化。

3. 发明申请

US20040253450A1 Formaldehyde-free electroless copper plating process and solution for use in the process 审中-公开
标题翻译：无甲醛无电解铜电镀工艺及解决方案
公开(公告)号：US20040253450A1
公开(公告)日：2004-12-16
申请号：US10696552
申请日：2003-10-29
申请人： Shipley Company, L.L.C.
发明人： Masaru Seita , Hideki Tsuchida , Masaaki Imanari , Yoshihiro Sugita , Andre Egli , William Brasch
IPC分类号： B32B009/04 , B05D001/18
CPC分类号： C23C18/30 , C23C18/40 , H05K3/181 , Y10T428/31504
摘要： This invention provides a process for electroless copper plating without using formaldehyde and an electroless copper plating solution which is used in the process. To this end, there is disclosed a process for electroless copper plating, which treatment comprises depositing a palladium or palladium-tin catalyst on a resin substrate, and then treating said resin substrate having the catalyst deposited thereon with a formaldehyde-free electroless copper plating solution that contains copper ions and a reducing agent, wherein the need for an accelerating treatment of a catalyst after said catalyst depositing treatment is obviated. The productivity of a copper-resin composite material is dramatically enhanced by the process of the present invention, because a copper thin layer can be formed on the resin substrate in a short time, even if an accelerating treatment for a catalyst is not performed in a separate process.
摘要翻译：本发明提供一种无需使用甲醛的化学镀铜方法和该方法中使用的化学镀铜溶液。为此，公开了一种无电镀铜方法，该方法包括在树脂基板上沉积钯或钯 - 锡催化剂，然后用不含甲醛的化学镀铜溶液处理其上沉积有催化剂的催化剂的树脂基材其含有铜离子和还原剂，其中消除了在所述催化剂沉积处理之后催化剂的加速处理的需要。通过本发明的方法，铜树脂复合材料的生产率显着提高，因为即使不在催化剂中进行催化剂的加速处理，也可以在短时间内在树脂基板上形成铜薄层单独的过程。

4. 发明申请

US20040231757A1 Resistive materials 失效
标题翻译：电阻材料
公开(公告)号：US20040231757A1
公开(公告)日：2004-11-25
申请号：US10873523
申请日：2004-06-21
申请人： Shipley Company, L.L.C.
发明人： Craig S. Allen , John Schemenaur , David D. Senk , Marc Langlois , Xiaodong Hu , Jan Tzyy-Jiuan Hwang , Jud Ready , Trifon Tomov
IPC分类号： C22C005/04
CPC分类号： H05K1/167 , H01C7/006 , H01C7/06 , H01C17/08 , H05K2201/0317 , H05K2201/0355 , H05K2203/0361 , Y10T428/261 , Y10T428/31678
摘要： Electrically resistive material including platinum and from about 5 and about 70 molar percent of iridium, ruthenium or mixtures thereof, calculated based on platinum as 100%, are disclosed.
摘要翻译：公开了包含铂和约5至约70摩尔％的铱，钌或其混合物的电阻材料，其基于铂为100％计算。

5. 发明申请

US20040224528A1 Electronic device manufacture 失效
标题翻译：电子设备制造
公开(公告)号：US20040224528A1
公开(公告)日：2004-11-11
申请号：US10742424
申请日：2003-12-19
申请人： Shipley Company, L.L.C.
发明人： George P. Mirth
IPC分类号： H01L021/31 , H01L021/469 , H01L021/4763
CPC分类号： G03F7/094 , G03F7/11 , H01L21/0271 , H01L21/0273 , H01L21/0337 , H01L21/31144 , H01L21/312 , H01L21/32139
摘要： A method of manufacturing electronic devices containing one or more layers of materials that are sensitive to the strong chemicals used to remove cross-linked polymeric layers such as photoresists and antireflective coatings is provided. The cross-linked polymeric layers can be easily removed following etching through the use of certain removable layers disposed between the substrate and the cross-linked polymeric layers.
摘要翻译：提供一种制造电子器件的方法，其包含对用于除去交联聚合物层（例如光致抗蚀剂和抗反射涂层）的强化学品敏感的一层或多层材料。在通过使用设置在基底和交联聚合物层之间的某些可移除层的蚀刻之后，可以容易地除去交联的聚合物层。

6. 发明申请

US20040218889A1 Methods of forming waveguides and waveguides formed therefrom 有权
标题翻译：形成波导和波导的方法
公开(公告)号：US20040218889A1
公开(公告)日：2004-11-04
申请号：US10726052
申请日：2003-12-02
申请人： Shipley Company, L.L.C.
发明人： James G. Shelnut , Matthew L. Moynihan , Omari Patterson
IPC分类号： G02B006/00
CPC分类号： G02B6/138
摘要： Provided are methods of forming optical waveguides. The methods involve: (a) forming over a substrate a layer of a photodefinable composition; (b) exposing a portion of the layer to actinic radiation; (c) developing the exposed layer to form a waveguide core structure; and (d) heating the waveguide core structure to a temperature and for a time effective to reflow the structure such that it becomes at least partially rounded in cross-section. Also provided are optical waveguides formed from the described methods and electronic devices including one or more of the optical waveguides.
摘要翻译：提供了形成光波导的方法。所述方法包括：（a）在基底上形成可光分解组合物的层; （b）将该层的一部分暴露于光化辐射; （c）显影曝光层以形成波导芯结构; 和（d）将波导芯结构加热到有效地回流结构的温度和时间，使得其在横截面中变得至少部分为圆形。还提供了由所述方法形成的光波导和包括一个或多个光波导的电子器件。

7. 发明申请

US20040217008A1 Method for electrolytic copper plating 失效
标题翻译：电解镀铜方法
公开(公告)号：US20040217008A1
公开(公告)日：2004-11-04
申请号：US10723219
申请日：2003-11-26
申请人： Shipley Company, L.L.C.
发明人： Hideki Tsuchida , Masaru Kusaka , Shinjiro Hayashi
IPC分类号： C25D003/38
CPC分类号： C25D21/18 , C25D3/38 , H01L21/2885 , H01L21/76877 , H05K3/423
摘要： A method for electrolytic copper plating using an electrolytic copper plating solution including a compound containing a structure of nullXnullSnullYnull, wherein X and Y are independently chosen from hydrogen atom, carbon atom, sulfur atom, nitrogen atom, and oxygen atom, and X and Y may be the same only when they are a carbon atom, and by contacting the electrolytic copper plating solution with ozone is disclosed.
摘要翻译：一种电解镀铜方法，其特征在于，使用包含含有-XSY-结构的化合物的电解镀铜溶液，其中X和Y独立地选自氢原子，碳原子，硫原子，氮原子和氧原子，X和 Y可以相同，只要它们是碳原子，并且通过使电解铜电镀溶液与臭氧接触。

8. 发明申请

US20040209200A1 Coating compositions for use with an overcoated photoresist 有权
标题翻译：用于外涂光致抗蚀剂的涂料组合物
公开(公告)号：US20040209200A1
公开(公告)日：2004-10-21
申请号：US10844125
申请日：2004-05-12
申请人： Shipley Company, L.L.C.
发明人： Gerald B. Wayton , Peter Trefonas III , Suzanne Coley , Tomoki Kurihara
IPC分类号： G03C001/76
CPC分类号： C09D167/00 , G03F7/091 , Y10T428/31786
摘要： In a first aspect, organic coating compositions are provided, particularly spin-on antireflective coating compositions, that contain a polyester resin component. In a further aspect, coating compositions are provided that contain a resin component obtained by polymerization of a multi-hydroxy compound. Coating compositions of the invention are particularly useful employed in combination with an overcoated photoresist layer to manufacture integrated circuits.
摘要翻译：在第一方面，提供了含有聚酯树脂组分的有机涂料组合物，特别是旋涂抗反射涂料组合物。在另一方面，提供含有通过聚合多羟基化合物获得的树脂组分的涂料组合物。本发明的涂料组合物特别可用于与外涂光致抗蚀剂层组合以制造集成电路。

9. 发明申请

US20040209188A1 Solvents and photoresists compositions for short wavelength imaging 审中-公开
标题翻译：用于短波长成像的溶剂和光致抗蚀剂组合物
公开(公告)号：US20040209188A1
公开(公告)日：2004-10-21
申请号：US10847679
申请日：2004-05-17
申请人： Shipley Company, L.L.C.
发明人： Charles R. Szmanda , Anthony Zampini
IPC分类号： G03C001/76
CPC分类号： H05K3/381 , C08J7/02 , C23C18/2006 , C23C18/24 , G03F7/0046 , G03F7/0048 , G03F7/0392 , G03F7/0395 , G03F7/0397 , H05K3/0055 , Y10S430/113
摘要： New photoresists are provides that are suitable for short wavelength imaging, particularly sub-170 nm such as 157 nm. Resists of the invention comprise a fluorine-containing polymer, a photoactive component, and a solvent component. Preferred solvents for use on the resists of the invention can maintain the resist components in solution and include one or more preferably two or more (i.e. blends) of solvents. In particularly preferred solvent blends of the invention, each blend member evaporates at substantially equal rates, whereby the resist composition maintains a substantially constant concentration of each blend member.
摘要翻译：提供适用于短波长成像的新型光致抗蚀剂，特别是亚170nm，例如157nm。本发明的抗菌剂包括含氟聚合物，光敏组分和溶剂组分。用于本发明抗蚀剂的优选溶剂可以将抗蚀剂组分保持在溶液中，并且包括溶剂的一种或多种（即共混物）。在本发明的特别优选的溶剂共混物中，每个共混构件以基本上相等的速率蒸发，由此抗蚀剂组合物保持每个共混构件的基本恒定的浓度。

10. 发明申请

US20040161699A1 Radiation sensitive compositions and methods 有权
标题翻译：辐射敏感组合物和方法
公开(公告)号：US20040161699A1
公开(公告)日：2004-08-19
申请号：US10783631
申请日：2004-02-20
申请人： Shipley Company, L.L.C.
发明人： James W. Thackeray , Angelo A. Lamola
IPC分类号： G03F007/20 , G03F007/40 , G03F007/038
CPC分类号： G03F7/0382 , G03F7/004 , G03F7/0045 , G03F7/0226 , G03F7/038 , G03F7/039 , G03F7/0392 , G03F7/40
摘要： The present invention provides radiation sensitive compositions and methods that comprise novel means for providing relief images of enhanced resolution. In one aspect the invention provides a method for controlling diffusion of photogenerated acid comprising adding a polar compound to a radiation sensitive composition and applying a layer of the composition to a substrate; exposing the composition layer to activating radiation whereby a latent image is generated comprising a distribution of acid moieties complexed with the polar compound; and treating the exposed composition layer to provide an activating amount of acid.
摘要翻译：本发明提供了辐射敏感组合物和方法，其包括用于提供增强分辨率的浮雕图像的新型装置。在一个方面，本发明提供了一种控制光生酸扩散的方法，包括将极性化合物加入到辐射敏感组合物中，并将该组合物的一层施加到基底上; 将组合物层暴露于激活辐射，由此产生包含与极性化合物络合的酸部分的分布的潜像; 并处理暴露的组合物层以提供活化量的酸。

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