专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20030008027A1 Mold cleaning apparatus 有权
标题翻译：模具清洗设备
公开(公告)号：US20030008027A1
公开(公告)日：2003-01-09
申请号：US09901256
申请日：2001-07-09
申请人： ASM Technology Singapore Pte Ltd.
发明人： Jie Liu , Zhen Rong Huang , Shu Chuen Ho , Chin Guan Ong , Teng Hock Kuah
IPC分类号： B29C033/72
CPC分类号： B29C33/72 , B29C45/1753
摘要： Mold cleaning apparatus (1) includes a manifold (5) adapted to be coupled to a suction device. A first conduit (6) extends from the manifold (5) and has a first opening (8) remote from the manifold. A second conduit (7) extends from the manifold (5) and has a second opening (11) remote from the manifold (5). The first and the second openings (8, 11) being directed in opposite directions, and the first conduit (6) having a section (10) with a cross-sectional area which is less than cross-sectional area at any point along the length of the second conduit (7).
摘要翻译：模具清洁装置（1）包括适于联接到抽吸装置的歧管（5）。第一导管（6）从歧管（5）延伸并且具有远离歧管的第一开口（8）。第二导管（7）从歧管（5）延伸并且具有远离歧管（5）的第二开口（11）。所述第一和第二开口（8,11）以相反方向被引导，并且所述第一导管（6）具有截面积小于所述长度的任何点处的横截面面积的截面积（10）的第二导管（7）。

2. 发明申请

US20020063353A1 Process to purge polymer or plastic melt guiding parts of film extrusion systems 有权
标题翻译：清洗膜挤出系统的聚合物或塑料熔体引导部件的方法
公开(公告)号：US20020063353A1
公开(公告)日：2002-05-30
申请号：US09954216
申请日：2001-09-18
发明人： Reinhard Paetzold , Ulrich Krause
IPC分类号： B29C033/72 , B29C047/92
CPC分类号： B29C47/0877 , B29B7/428 , B29B7/488 , B29B7/603 , B29B7/72 , B29B7/7485 , B29C47/0021 , B29C47/92 , B29C2947/92095 , B29C2947/92104 , B29C2947/9238 , B29C2947/9239 , B29C2947/92409 , B29C2947/92428
摘要： Presented is a process to purge film extrusion systems with at least one extruder (A, B, C, D) for the purpose of changing batches, wherein the speed is changed periodically in at least that part of the extruder, wherein the material is changed. By considering the mass flow rate of the film extrusion system, advantageous improvements of the process avoid the situation in which the film tears off. To this end, at least one selected guide extruder (A) is operated at a speed, which is increased as compared to the normal operation, and at least one selected downstream extruder (B, C, D) is operated at a speed that is decreased as compared to the normal operation. Furthermore, control and operating units (1) and extrusion systems to carry out the process, which include, among other things, means for an automated program run of the purging program and the optical display of the parameters of the same, are presented. The described purging processes result in the production of films having a specific cross section.
摘要翻译：提出了用至少一个挤出机（A，B，C，D）吹扫薄膜挤出系统以改变批次的方法，其中速度至少在挤出机的那部分周期性地改变，其中材料被改变。通过考虑膜挤出系统的质量流量，该方法的有利改进避免了膜撕裂的情况。为此，至少一个选定的导向挤出机（A）以与正常操作相比增加的速度运行，并且至少一个选定的下游挤出机（B，C，D）以与正常手术相比有所下降。此外，还提出了用于执行该过程的控制和操作单元（1）和挤出系统，其中包括清除程序的自动程序运行和其参数的光学显示的装置。所述的清洗过程导致制造具有特定横截面的膜。

3. 发明申请

US20030034049A1 Cleaning substrate for cleaning and regenerating a mold 有权
标题翻译：用于清洁和再生模具的清洁基板
公开(公告)号：US20030034049A1
公开(公告)日：2003-02-20
申请号：US09928991
申请日：2001-08-15
申请人： ADVANCED SEMICONDUCTOR ENGINEERING, INC.
发明人： Kuang Chun Chou
IPC分类号： B29C033/40 , B29C033/72 , B29C045/14
CPC分类号： B29C33/72 , B29C45/14336 , Y10T428/24455 , Y10T428/24479 , Y10T428/24612 , Y10T428/31993
摘要： A cleaning substrate for cleaning and regenerating a mold is disclosed. The mold is contaminated after repeatedly packaging the semiconductor device by making use of thermosetting resin. At least a protrusion of the substrate can substantially match with and be contained within the edges of the mold cavity of the mold when the cleaning substrate is placed in the mold.
摘要翻译：公开了一种用于清洁和再生模具的清洁基板。通过使用热固性树脂反复包装半导体器件后，模具被污染。当将清洁基板放置在模具中时，至少基板的突起可以与模具的模具腔的边缘基本上匹配并且容纳在模具的模具的边缘内。

4. 发明申请

US20020185766A1 Method of removing extraneous matter from injection mold, and method of placing insert in mold 失效
标题翻译：从注射模具中除去外来物质的方法，以及将插入物置于模具中的方法
公开(公告)号：US20020185766A1
公开(公告)日：2002-12-12
申请号：US10157967
申请日：2002-05-31
申请人： FUJI PHOTO FILM CO., LTD.
发明人： Takuji Daihisa , Mitsugu Konno
IPC分类号： B29C033/72 , B29C033/32
CPC分类号： B29C45/14065 , B29C33/16 , B29C45/14008 , B29C45/1753 , B29C2043/566
摘要： When resins are injected into a cavity 104 of an injection mold 101 separably formed of a movable mold 102 and an immovable mold 103 to form a casting, a high-pressure gas is supplied into the cavity 104 during a time period after completion of forming the casting till the injection mold 101 opens partway, and the high-pressure gas is allowed to jet out through a clearance formed between joint surfaces of the movable and immovable molds 102, 103 while the injection mold is opening. More than one attraction gripper is used to hold, move and place an insert at a predetermined position in the injection mold. Magnetic shielding is provided between the injection mold and a magnet embedded at the predetermined position in the injection mold to restrict a leakage of a magnetic flux into the injection mold.
摘要翻译：当将树脂注入到由可移动模具102和不动模103可分离地形成的注射模具101的空腔104中以形成铸件时，在形成完成后的时间段内将高压气体供应到空腔104中铸造直到注塑模具101中断，并且高压气体在喷射模具打开时通过形成在可移动模具102和不可移动模具103的接合表面之间的间隙而喷出。使用多于一个吸引夹持器来将注入件保持，移动和放置在注射模具中的预定位置。在注射模具和嵌入在注射模具中的预定位置处的磁体之间设置磁屏蔽，以限制磁通量进入注射模具的泄漏。

5. 发明申请

US20040211217A1 Method of regenerating pressing molds and method of manufacturing optical elements 审中-公开
标题翻译：再生压模的方法及制造光学元件的方法
公开(公告)号：US20040211217A1
公开(公告)日：2004-10-28
申请号：US10658467
申请日：2003-09-10
申请人： HOYA CORPORATION
发明人： Shigeaki Ohmi
IPC分类号： B29C033/60 , B29C033/72 , C03B040/02
CPC分类号： B29C33/56 , B29C33/70 , B29L2011/00 , C03B11/086 , C03B2215/03 , C03B2215/24
摘要： Disclosed is a method of regenerating a pressing mold comprising removal of a carbon-based film from a pressing mold having the film on a molding surface thereof. The removal of the film is performed by etching with plasma of a hydrogen-based gas or treatment with UV ozone. Disclosed is a method of manufacturing an optical glass element comprising press molding of a heat-softened glass material in a pressing mold having a carbon-based film on a molding surface thereof. The pressing mold is that has been regenerated by removing a carbon-based film on the pressing mold having the film on the molding surface thereof by hydrogen gas plasma etching or UV ozone treatment, after which a carbon-based film has been formed on the molding surfaces from which the film has been removed. Provide is a method of regeneration that removes the carbon-based film on the molding surface of the base material of a pressing mold without damaging the surface of the base material of the pressing mold and that can reliably remove carbon-based films at reduced cost and in less time. Provide is a method of manufacturing optical glass elements employing a pressing mold that has been regenerated by this method.
摘要翻译：公开了一种再生压模的方法，包括在其成型表面上从具有该膜的压模中除去碳基膜。通过用氢基气体的等离子体蚀刻或用UV臭氧处理来进行膜的去除。公开了一种制造光学玻璃元件的方法，包括在其成型表面上具有碳基膜的压模中对热软化玻璃材料进行加压成型。压模通过氢气等离子体蚀刻或UV臭氧处理除去其成型面上的膜的压模上的碳基膜而再生，然后在成型体上形成碳系膜已经从中除去膜的表面。提供一种再生方法，其除去压模的基材的成型面上的碳基膜，而不会损坏压模的基材的表面，并且可以以降低的成本可靠地除去碳系膜; 在更短的时间内。提供一种使用已经通过该方法再生的压模的制造光学玻璃元件的方法。

6. 发明申请

US20030062642A1 Leadframe and method for removing cleaning compound flash from mold vents 失效
公开(公告)号：US20030062642A1
公开(公告)日：2003-04-03
申请号：US10253047
申请日：2002-09-23
发明人： Vernon M. Williams , Michael D. Gifford
IPC分类号： B29C033/72
CPC分类号： B29C45/1753 , B08B7/0014 , B29C33/10 , B29C33/72 , B29C37/02 , B29C45/14655 , B29C45/34 , H01L21/565 , H01L23/49565 , H01L2924/0002 , Y10S425/812 , Y10T428/24355 , H01L2924/00
摘要： An integrated circuit leadframe is specially adapted to adhere to injection mold cleaning compounds in the area of vents for an injection mold. An area of a leadframe rail that is normally positioned adjacent a mold vent is provided with apertures, surface roughness or a surface coating to cause the cleaning compound to more tightly adhere to the leadframe rail. As a result, cleaning compound flash is removed from the vents when the leadframe is removed from the mold.

7. 发明申请

US20040021239A1 Process for the functional regeneration of the porosity of moulds used for moulding ceramic objects 有权
标题翻译：用于模制陶瓷物体的模具的孔隙度的功能再生的方法
公开(公告)号：US20040021239A1
公开(公告)日：2004-02-05
申请号：US10333412
申请日：2003-01-21
发明人： Vasco Mazzanti
IPC分类号： B29C033/72
CPC分类号： B08B3/00 , B28B1/26 , B28B7/386
摘要： A process for the functional regeneration of the porosity of the materials used to make moulds (2) for moulding ceramic objects, when the pores have been damaged by use of the mould (2), comprises the sequential execution of at least two successive steps of an ordered sequence which includes the steps of: eliminating contamination caused by organic substances form the mould (2); eliminating contamination of biological origin from the mould (2); attacking inorganic encrustations and eliminating inorganic substances which have infiltrated the pores of the mould (2), the initial step of the process being preset according to the nature of a predetermined contaminating agent. A station implementing the process is also an integral part of the present invention.
摘要翻译：用于制造用于模制陶瓷物体的模具（2）的材料的孔隙率的功能再生的方法，当孔已经通过使用模具（2）损坏时，包括连续执行至少两个连续步骤有序序列包括以下步骤：消除由有机物质引起的污染物形成模具（2）; 消除模具中生物来源的污染（2）; 攻击无机结垢并消除渗透模具孔（2）的无机物质，该过程的初始步骤根据预定污染剂的性质预先设定。实施该方法的站也是本发明的组成部分。

8. 发明申请

US20020125593A1 Apparatus and method for molding blocks 失效
标题翻译：用于模制块的装置和方法
公开(公告)号：US20020125593A1
公开(公告)日：2002-09-12
申请号：US10146167
申请日：2002-05-15
发明人： Rene Bergeron , Stanley Nelson , Denelle Shultz
IPC分类号： B29C033/72
CPC分类号： B28B7/386 , B28B3/022 , B28B7/0041 , B28B7/0097 , B28B7/20
摘要： Apparatus for molding blocks with laterally projecting, undercut side features includes a mold box having split mold parts defining a mold cavity open at the top and bottom. A top plate overlies the mold parts and is formed with an opening aligned with a cavity. Moldable block material is charged into the cavity from a feed box, and the material is compacted and shaped between a lower pallet and upper stripper head which are moved to close the bottom and top of the cavity during vibration of the mold. The mold parts are retractable beneath the top plate to release the block for stripping through the bottom of a mold. A plurality of fluid outlets in the top plate communicate with problem areas of the recessed mold parts which are prone to accumulate residual block material. Pressurized clean-out fluid, such as air is directed through the outlets onto such problem areas to cleanse the mold surfaces of the block material between mold cycles. An air knife is carried by the feed box and directs a high pressure curtain of air against the underside of the stripper head to remove any accumulated block material therefrom during movement of the feed box into and out of position over the mold.
摘要翻译：用于模制具有侧向突出的切削侧部特征的块的装置包括具有限定在顶部和底部开口的模腔的分开的模具部分的模具箱。顶板覆盖在模具部件上并形成有与空腔对准的开口。可模塑块材料从进料箱装入空腔中，并且材料被压实并成形在下部托盘和上部剥离器头之间，在下部托盘和上部剥离头之间移动以在模具振动期间关闭空腔的底部和顶部。模具部件在顶板下方可收缩以释放块以通过模具的底部剥离。顶板中的多个流体出口与凹陷的模具部件的易于积聚残留块材料的问题区域相通。诸如空气的加压清洁流体通过出口引导到这样的问题区域上，以在模具循环之间清洁块材料的模具表面。气动刀由进给箱承载，并将高压的空气帘子引导到汽提头的下侧，以在进给箱进入和离开模具的位置移动期间从其中去除任何积聚的块材料。

9. 发明申请

US20020038918A1 Method of manufacturing a semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US20020038918A1
公开(公告)日：2002-04-04
申请号：US09965221
申请日：2001-09-28
发明人： Masakatsu Gotou , Norihiko Kasai
IPC分类号： B29C033/72 , B29C070/70 , B29C070/88 , H05H001/24
CPC分类号： H01L24/85 , B29C45/14655 , H01L21/561 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L25/0657 , H01L2224/05554 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48471 , H01L2224/49171 , H01L2224/4945 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/85013 , H01L2224/85191 , H01L2224/85203 , H01L2224/85205 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2225/06558 , H01L2225/06568 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/85 , H01L2224/83 , H01L2224/78 , H01L2924/00 , H01L2924/00012 , H01L2224/81 , H01L2224/05599 , H01L2224/4554
摘要： The improvement of the yields of semiconductor devices is intended. In a method for manufacturing a semiconductor device, it has forming a resin enclosure for block-molding a plurality of semiconductor chips by placing a plurality of semiconductor chips inside a cavity of a molding die along with a substrate and then injecting a resin from a first side to a second side of a main surface of the substrate, the plurality of semiconductor chips being mounted on the main surface of the substrate from the first side to the second side of the main surface with a predetermined space, the second side facing to the first side, the method further has applying cleaning treatment to the main surface of the substrate before forming the resin enclosure.
摘要翻译：旨在提高半导体器件的产量。在制造半导体器件的方法中，通过将多个半导体芯片与基板一起放置在成型模具的空腔内，然后从第一个模具中注入树脂，形成用于块状模制多个半导体芯片的树脂外壳一侧到基板的主表面的第二侧，多个半导体芯片以预定的空间从主表面的第一侧安装到基板的主表面上，第二面朝向在形成树脂封壳之前，该方法还对基板的主表面进行清洁处理。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式