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1. 发明授权

US06811892B2 Lead-based solder alloys containing copper 有权
公开(公告)号：US06811892B2
公开(公告)日：2004-11-02
申请号：US10226370
申请日：2002-08-22
申请人： Shing Yeh , Bradley H. Carter , Frank Stepniak , Scott D. Brandenburg
发明人： Shing Yeh , Bradley H. Carter , Frank Stepniak , Scott D. Brandenburg
IPC分类号： B23K3526
CPC分类号： B23K35/262 , B23K2101/36 , H01L24/81 , H01L2224/81801 , H01L2924/01087 , H01L2924/01322 , H01L2924/01327 , H01L2924/14 , H05K3/3436 , H05K3/3463 , Y10T428/12528 , Y10T428/12715 , Y10T428/12903 , Y10T428/24917 , H01L2924/00
摘要： A tin-lead solder alloy containing copper and optionally silver as its alloying constituents. The solder alloy consists essentially of, by weight, about 55% to about 75% tin, about 11% to about 44% lead, up to about 4% silver, nickel, palladium, platinum and/or gold, greater than 1% to about 10% copper, and incidental impurities. The solder alloys contain a small portion of CuSn intermetallic compounds, and exhibit a melting mechanism in which all but the intermetallic compounds melt within a narrow temperature range, though the actual liquidus temperature of the alloys may be considerably higher, such that the alloys can be treated as requiring peak reflow temperatures of about 250° C. or less. The intermetallic compounds precipitate out to form a diffusion barrier that increases the reliability of solder connections formed therewith.

2. 发明授权

US06231693B1 Alloy, in particular a solder alloy, for joining workpieces 失效
标题翻译：合金，特别是焊料合金，用于连接工件
公开(公告)号：US06231693B1
公开(公告)日：2001-05-15
申请号：US08983472
申请日：1998-04-23
申请人： Erich Lugscheider , Wolfgang Tillmann , Hongshou Zhuang
发明人： Erich Lugscheider , Wolfgang Tillmann , Hongshou Zhuang
IPC分类号： B23K3526
CPC分类号： B23K35/268 , B23K35/262
摘要： The invention, which enables wider use to be made of soft-soldering techniques, concerns an alloy, in particular a solder alloy, a method of joining workpieces by soldering using the solder alloy and the use of the alloy for soldering. The alloy proposed is characterized in that it contains at least 1% by wt. of an element or a mixture of elements from sub-group IVa and/or Va in the periodic table, at least 0.01% by wt. of an element or a mixture of elements from the lanthanide series; optionally at least 0.5% of silver or copper or indium or a mixture silver and/or copper and/or indium; and optionally at least 0.01% by wt. of gallium, the remainder consisting of tin or lead or a mixture of tin and lead plus, as applicable, the usual impurities. The alloy proposed can be used as solder in oxygen-containing atmospheres such as air, can be used at relatively low temperatures and efficiently wets normally difficult to wet surfaces such as ceramic surfaces. In a further embodiment of the invention, the solder alloy can be used without flux.
摘要翻译：能够更广泛地使用软钎焊技术的本发明涉及合金，特别是焊料合金，通过使用焊料合金进行焊接以及使用合金来焊接工件的方法。提出的合金的特征在于其含有至少1重量％。元素的元素或元素的混合物，元素周期表中Ⅳa族和/或Ⅴa族元素的混合物，至少为0.01％（重量）。元素或来自镧系元素的元素的混合物; 任选至少0.5％的银或铜或铟或混合物银和/或铜和/或铟; 和任选地至少0.01重量％。的镓，其余的由锡或铅组成，或者锡和铅的混合物加上通常的杂质。所提出的合金可以用作含氧气氛如空气中的焊料，可以在相对低的温度下使用，并且通常难以湿润表面如陶瓷表面。在本发明的另一个实施例中，可以使用焊剂合金而没有焊剂。

3. 发明授权

US06669079B2 Conductive paste and semiconductor component having conductive bumps made from the conductive paste 有权
公开(公告)号：US06669079B2
公开(公告)日：2003-12-30
申请号：US10211631
申请日：2002-08-02
申请人： Li Li , Treliant Fang
发明人： Li Li , Treliant Fang
IPC分类号： B23K3526
CPC分类号： H01L24/12 , B23K35/025 , B23K35/262 , B23K35/3613 , B23K35/3618 , H01L23/49883 , H01L24/11 , H01L2224/05001 , H01L2224/05022 , H01L2224/05572 , H01L2224/056 , H01L2224/13099 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01047 , H01L2924/01051 , H01L2924/01067 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H05K3/3484 , H01L2224/05099
摘要： A conductive paste (16) for use in making conductive bumps (18) and a method for using the conductive paste to make conductive bumps (18) on a substrate (10). The conductive paste (16) is formed by combining a tin alloy with a flux composition containing an aromatic carboxylic acid fluxing agent and a solvent. The conductive paste (16) is disposed on underbump metallization layers (15) and reflowed to form the conductive bumps (18).

4. 发明授权

US06203929B1 Gold plated solder material and method of fluxless soldering using solder 失效
标题翻译：镀金焊料材料及无焊剂焊接方法
公开(公告)号：US06203929B1
公开(公告)日：2001-03-20
申请号：US09294264
申请日：1999-04-19
申请人： Heinrich G. Muller
发明人： Heinrich G. Muller
IPC分类号： B23K3526
CPC分类号： B23K35/0238 , B23K35/26 , B23K35/262 , B23K35/268 , B23K35/3013 , H01L2224/325 , H01L2924/01079 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , Y10T428/12687 , Y10T428/12715 , Y10T428/12889 , H01L2924/01014 , H01L2924/0105 , H01L2924/01032 , H01L2924/00
摘要： A solder material 10 suitable for fluxless soldering attachment of a component 12 to a substrate 14 in a microelectronic assembly 16 such as a hybrid package comprises a core 18 and a gold layer 20 on the core. The core can comprise an alloy of tin and lead. The core preferably consists essentially of at least about 30 wt. % tin and the balance lead, so that it melts at temperatures of less than about 250° C. The gold layer is preferably applied to the core using an electroless plating process that forms a highly uniform gold layer. The solder material provides a joint between the component and the substrate comprising less than about 3 wt. % gold.
摘要翻译：适合于在诸如混合封装的微电子组件16中的组件12到基板14的无助焊剂附接的焊料10包括芯18和芯上的金层20。芯可以包括锡和铅的合金。核心优选基本上由至少约30wt。％锡和余量铅，使其在小于约250℃的温度下熔化。金层优选通过形成高度均匀金层的无电镀方法施加到芯上。焊料材料提供组件和基材之间的接头，其包含小于约3wt。％黄金。

5. 发明授权

US06319461B1 Lead-free solder alloy 失效
标题翻译：无铅焊料合金
公开(公告)号：US06319461B1
公开(公告)日：2001-11-20
申请号：US09771939
申请日：2001-01-30
申请人： Shinjiro Domi , Koichi Sakaguchi , Shigeki Nakagaki , Katsuaki Suganuma
发明人： Shinjiro Domi , Koichi Sakaguchi , Shigeki Nakagaki , Katsuaki Suganuma
IPC分类号： B23K3526
CPC分类号： B23K35/262 , C22C13/00 , C22C13/02
摘要： A lead-free solder alloy substantially contains Sn and Ti, and has a temperature of a liquidus line of not greater than 400° C. The lead-free solder alloy contains no toxic lead and has sufficient bonding strength to oxide materials such as glass and ceramics.
摘要翻译：无铅焊料合金基本上含有Sn和Ti，液相线的温度不高于400℃。无铅焊料合金不含有毒铅，对氧化物质如玻璃和陶瓷。

6. 发明授权

US06267823B1 Solder, solder paste and soldering method 失效
标题翻译：焊锡，焊膏和焊接方法
公开(公告)号：US06267823B1
公开(公告)日：2001-07-31
申请号：US09125013
申请日：1998-11-12
申请人： Atsushi Yamaguchi , Tetsuo Fukushima , Kenichiro Suetsugu , Akio Furusawa
发明人： Atsushi Yamaguchi , Tetsuo Fukushima , Kenichiro Suetsugu , Akio Furusawa
IPC分类号： B23K3526
CPC分类号： B23K35/262 , B23K35/025
摘要： Disclosed are a solder and a solder paste used for soldering an electronic part to a circuit board. This solder comprises 2.0 to 3.5 wt % of Ag, 5 to 18 wt % of Bi and Sn for the rest. Alternatively, it further contains at least one element selected from the group consisting of 0.1 to 1.5 wt % of In, 0.1 to 0.7 wt % of Cu and 0.1 to 10 wt % of Zn.
摘要翻译：公开了用于将电子部件焊接到电路板的焊料和焊膏。该焊料包含2.0〜3.5重量％的Ag，5〜18重量％的Bi和Sn用于其余部分。或者，其还含有选自由0.1至1.5重量％的In，0.1至0.7重量％的Cu和0.1至10重量％的Zn中的至少一种元素。

7. 发明授权

US06214131B1 Mixed solder pastes for low-temperature soldering process 失效
标题翻译：混合焊膏用于低温焊接工艺
公开(公告)号：US06214131B1
公开(公告)日：2001-04-10
申请号：US09182938
申请日：1998-10-29
申请人： Fay Hua
发明人： Fay Hua
IPC分类号： B23K3526
CPC分类号： H05K3/3484 , B23K35/0244 , B23K35/025 , B23K35/262 , B23K35/268 , H05K3/3463 , H05K2201/0272
摘要： A mixed solder paste that reflows below 158° C., and, once reflowed, forms a solder alloy with a melting temperature at least 10° C. higher than the reflow temperature of the mixed solder paste, without ternary eutectic structures occurring at approximately 96° C., and with a uniform microstructure. The mixed solder paste according to the invention includes an eutectic or near eutectic tin-lead (Sn—Pb) solder powder, an eutectic or near eutectic lead-bismuth (Pb—Bi) solder powder, and a flux vehicle. The Sn—Pb solder powder and the Pb—Bi solder powder are mixed in a ratio between about 51:49 and about 77:23, but preferably between 55:45 and 65:35. These ratio result in a solder alloy with a mass consisting of 14% and about 25% Bi and between about 35% and about 45% Pb. The invention further provides a method for forming a mixed solder paste for low temperature soldering. The steps of the method include providing a flux vehicle, providing first solder powder, providing a second solder powder, and mixing the flux vehicle, the first solder powder, and the second powder together to form the mixed solder paste. The first solder powder includes a first solder alloy including Sn and Pb. The second solder powder includes a second solder alloy including Pb and Bi. The method may also include mixing the flux vehicle and the tin-lead solder powder to form a first solder paste and mixing the flux vehicle and the lead-bismuth solder powder to form a second solder paste. The first solder paste and the second solder paste may then be mixed together to form the mixed solder paste.
摘要翻译：一种在158℃以下回流的混合焊膏，一旦回流，就形成熔融温度高于混合焊膏的回流温度至少10℃的焊料合金，没有在大约96℃发生三元共晶结构。，并具有均匀的微观结构。根据本发明的混合焊膏包括共晶或近共晶锡铅（Sn-Pb）焊料粉末，共晶或近共晶铅铋（Pb-Bi）焊料粉末和焊剂载体。 Sn-Pb焊料粉末和Pb-Bi焊料粉末以约51:49至约77:23之间的比例混合，但优选在55:45至65:35之间。这些比例导致焊料合金质量由14％和25％的Bi和约35％至约45％的Pb组成。本发明还提供一种用于形成用于低温焊接的混合焊膏的方法。所述方法的步骤包括提供助焊剂载体，提供第一焊料粉末，提供第二焊料粉末，并将焊剂载体，第一焊料粉末和第二粉末混合在一起以形成混合焊膏。第一焊料粉末包括包含Sn和Pb的第一焊料合金。第二焊料粉末包括包含Pb和Bi的第二焊料合金。该方法还可以包括混合助焊剂载体和锡铅焊料粉末以形成第一焊膏并混合焊剂载体和铅 - 铋焊料粉末以形成第二焊膏。然后可以将第一焊膏和第二焊膏混合在一起以形成混合焊膏

8. 发明授权

US06805974B2 Lead-free tin-silver-copper alloy solder composition 有权
标题翻译：无铅锡银铜合金焊料组成
公开(公告)号：US06805974B2
公开(公告)日：2004-10-19
申请号：US10078020
申请日：2002-02-15
申请人： Won K. Choi , Charles C. Goldsmith , Timothy A. Gosselin , Donald W. Henderson , Sung K. Kang , Karl J. Puttlitz, Sr. , Da-Yuan Shih
发明人： Won K. Choi , Charles C. Goldsmith , Timothy A. Gosselin , Donald W. Henderson , Sung K. Kang , Karl J. Puttlitz, Sr. , Da-Yuan Shih
IPC分类号： B23K3526
CPC分类号： C22C13/00 , B23K35/262 , B23K2101/36 , H01L24/11 , H01L24/16 , H01L2224/05568 , H01L2224/05573 , H01L2924/01322 , H01L2924/14 , H05K3/3436 , H05K3/3463 , Y10T428/12708 , Y10T428/12715 , Y10T428/12722 , H01L2924/00
摘要： A solder composition and associated method of formation. The solder composition comprises a substantially lead-free alloy that includes tin (Sn), silver (Ag), and copper. The tin has a weight percent concentration in the alloy of at least about 90%. The silver has a weight percent concentration X in the alloy. X is sufficiently small that formation of Ag3Sn plates is substantially suppressed when the alloy in a liquefied state is being solidified by being cooled to a lower temperature at which the solid Sn phase is nucleated. This lower temperature corresponds to an undercooling &dgr;T relative to the eutectic melting temperature of the alloy. Alternatively, X may be about 4.0% or less, wherein the liquefied alloy is cooled at a cooling rate that is high enough to substantially suppress Ag3Sn plate formation in the alloy. The copper has a weight percent concentration in the alloy not exceeding about 1.5%.
摘要翻译：焊料组成及相关的形成方法。焊料组合物包括基本上无铅的合金，其包括锡（Sn），银（Ag）和铜。锡在合金中的重量百分比浓度至少为约90％。银在合金中具有重量百分比浓度X. X足够小，当液态的合金通过冷却至固相Sn相成核的较低温度而固化时，基本上抑制了Ag 3 Sn板的形成。该较低温度对应于相对于合金的共晶熔融温度的过冷度差ΔT。或者，X可以为约4.0％以下，其中液化合金以足够高的冷却速度被冷却，以基本上抑制合金中的Ag 3 Sn板的形成。铜在合金中的重量百分比浓度不超过约1.5％。

9. 发明授权

US06440360B1 Pb-free soldering alloy 有权
标题翻译：无铅焊接合金
公开(公告)号：US06440360B1
公开(公告)日：2002-08-27
申请号：US09786548
申请日：2001-03-02
申请人： Tadashi Sawamura , Hisashi Komiya
发明人： Tadashi Sawamura , Hisashi Komiya
IPC分类号： B23K3526
CPC分类号： B23K35/262
摘要： The present invention proposes Pb-free soldering alloy which does not contain Pb to prevent the environment from being contaminated by Pb when the soldered product is put on a wasteyard and to enhance the mechanical strength at the soldered joint by the soldering alloy. The Pb-free soldering alloy is characterized in that it contains Cu in 0.05 to 2.0 wt. %, Ni in 0.001 to 2.0 wt. % and Sn in the balance.
摘要翻译：本发明提出了当钎焊产品放在废料上时不含Pb的无铅焊接合金，以防止环境被Pb污染，并且通过焊接合金提高焊接接头处的机械强度。无铅焊接合金的特征在于，其含有0.05〜2.0重量％的Cu。％，Ni为0.001〜2.0wt。％和Sn在余额中。

10. 发明授权

US06391123B1 Solder paste 有权
标题翻译：焊膏
公开(公告)号：US06391123B1
公开(公告)日：2002-05-21
申请号：US09970036
申请日：2001-10-04
申请人： Sinzo Nakamura , Ryoichi Kurata , Hiroshi Takahashi
发明人： Sinzo Nakamura , Ryoichi Kurata , Hiroshi Takahashi
IPC分类号： B23K3526
CPC分类号： H05K3/3484 , B22F2998/00 , B23K35/0244 , B23K35/025 , B23K35/262 , B23K35/3613 , C22C13/00 , C22C13/02 , H05K3/3463 , H05K2201/0272 , C22C1/04
摘要： A solder paste comprises a lead-free solder alloy powder and a flux and is suitable for use in reflow soldering of electronic parts at a soldering temperature of 230° C. or below with minimized damage to the electronic parts to form soldered joints of good bond strength. The solder alloy powder is a mixture of from 10 to 30 vol % of a first powder of an Sn—Bi alloy consisting essentially of 10-45 wt % of Bi and a balance of Sn and from 70 to 90 vol % of a second powder of an Sn—Zn alloy consisting essentially of 9-15 wt % of Zn and a balance of Sn. The mixture gives an alloy having a composition upon melting which consists essentially of 7-11 wt % of Zn, 1-5 wt % of Bi, and a balance of Sn.
摘要翻译：焊膏包括无铅焊料合金粉末和焊剂，适用于在230℃或更低的焊接温度下回流焊接电子部件，同时对电子部件的损伤最小化，形成良好焊接的焊接接头强度。焊料合金粉末为10〜30体积％的Sn-Bi合金的第一粉末的混合物，其主要由Bi的10-45重量％和余量的Sn和70〜90体积％的第二粉末组成的基本上由9-15重量％的Zn和余量的Sn组成的Sn-Zn合金。混合物得到熔融组成的合金，其基本上由7-11重量％的Zn，1-5重量％的Bi和余量的Sn组成。

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