专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08866237B2 Methods for embedding controlled-cavity MEMS package in integration board 有权
标题翻译：将控制腔MEMS封装嵌入集成板的方法
公开(公告)号：US08866237B2
公开(公告)日：2014-10-21
申请号：US13405513
申请日：2012-02-27
申请人： Christopher D. Manack , Frank Stepniak , Sreenivasan K. Koduri
发明人： Christopher D. Manack , Frank Stepniak , Sreenivasan K. Koduri
IPC分类号： H01L29/84 , H01L31/02 , H01L29/66 , H01L21/02
CPC分类号： B81C1/00246 , B81B7/0067 , B81B2201/0207 , B81C1/00269 , G01J5/045 , G01J5/12 , H01L24/24 , H01L24/82 , H01L24/97 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/24245 , H01L2224/32245 , H01L2224/82039 , H01L2224/92144 , H01L2224/97 , H01L2924/10253 , H01L2924/10271 , H01L2924/10329 , H01L2924/12042 , H01L2924/1433 , H01L2924/1434 , H01L2924/1461 , H01L2924/00 , H01L2224/83 , H01L2224/82
摘要： An embedded micro-electro-mechanical system (MEMS) (100) comprising a semiconductor chip (101) embedded in an insulating board (120), the chip having a cavity (102) including a radiation sensor MEMS (105), the opening (104) of the cavity at the chip surface covered by a plate (110) transmissive to the radiation (150) sensed by the MEMS. The plate surface remote from the cavity having a bare central area, to be exposed to the radiation sensed by the MEMS in the cavity, and a peripheral area covered by a metal film (111) touching the plate surface and a layer (112) of adhesive stacked on the metal film.
摘要翻译：一种嵌入式微电子机械系统（MEMS）（100），包括嵌入在绝缘板（120）中的半导体芯片（101），所述芯片具有包括辐射传感器MEMS（105）的空腔（102），所述开口在由芯片感测到的辐射（150）透射的板（110）覆盖的芯片表面处的腔的空腔（104）。离开空腔的板表面具有裸露的中心区域，以暴露于由空腔内的MEMS感测的辐射，以及由接触板表面的金属膜（111）覆盖的周边区域和覆盖板（112）的层粘合剂堆叠在金属膜上。

2. 发明申请

US20140054795A1 Electronic Assembly With Three Dimensional Inkjet Printed Traces 有权
标题翻译：具有三维喷墨打印痕迹的电子组件
公开(公告)号：US20140054795A1
公开(公告)日：2014-02-27
申请号：US13591719
申请日：2012-08-22
申请人： Matthew David Romig , Lance Cole Wright , Leslie Edward Stark , Frank Stepniak , Sreenivasan K. Koduri
发明人： Matthew David Romig , Lance Cole Wright , Leslie Edward Stark , Frank Stepniak , Sreenivasan K. Koduri
IPC分类号： H01L23/48 , H01L21/50
CPC分类号： H01L23/00 , B41M3/06 , H01L23/48 , H01L24/24 , H01L24/25 , H01L24/76 , H01L24/80 , H01L24/82 , H01L25/0657 , H01L2224/24145 , H01L2224/24227 , H01L2224/321 , H01L2224/32145 , H01L2224/32225 , H01L2224/76155 , H01L2224/82102 , H05K1/092 , H05K1/181 , H05K3/125 , H05K3/32 , H05K2201/09272 , H05K2201/10151 , H05K2201/10454 , Y02P70/611
摘要： One method of making an electronic assembly includes mounting one electrical substrate on another electrical substrate with a face surface on the one substrate oriented transversely of a face surface of the other substrate. The method also includes inkjet printing on the face surfaces a conductive trace that connects an electrical contact on the one substrate with an electrical connector on the other substrate. An electronic assembly may include a first substrate having a generally flat surface with a first plurality of electrical contacts thereon; a second substrate having a generally flat surface with a second plurality of electrical contacts thereon, the surface of the second substrate extending transversely of the surface of said first substrate; and at least one continuous conductive ink trace electrically connecting at least one of the first plurality of electrical contacts with at least one of the second plurality of electrical contacts.
摘要翻译：制造电子组件的一种方法包括将一个电气基板安装在另一个电气基板上，其中一个基板上的面表面横向于另一个基板的表面。该方法还包括在表面上喷墨印刷导电迹线，导电迹线将一个基底上的电接触与另一基底上的电连接器连接。电子组件可以包括具有大致平坦表面的第一基板，其上具有第一多个电触点; 第二基板，其具有大致平坦的表面，其上具有第二多个电触点，所述第二基板的表面横向于所述第一基板的表面延伸; 以及至少一个连续的导电油墨迹线将所述第一多个电触点中的至少一个与所述第二多个电触点中的至少一个电连接。

3. 发明授权

US07754992B2 High current switch and method of operation 有权
标题翻译：大电流开关及操作方法
公开(公告)号：US07754992B2
公开(公告)日：2010-07-13
申请号：US12462065
申请日：2009-07-29
申请人： Frank Stepniak , Larry Siebens , Charles Bindics , Anthony Reed
发明人： Frank Stepniak , Larry Siebens , Charles Bindics , Anthony Reed
IPC分类号： H01H33/02
CPC分类号： H01H33/02 , H01H1/385 , H01H31/32 , H01H33/025 , H01H33/565 , H01H2003/0273 , H01H2009/0292
摘要： An electrical switch which includes an insulative housing having a wall defining an axial bore therein, a first electrical contact disposed in the housing bore and a second electrical contact movably disposed in the housing bore between an open position and a closed position. When the contacts are in their open position, the second electrical contact is spaced apart from the first electrical contact and when the contacts are in their closed position, the second electrical contact is in electrical contact with the first electrical contact. The switch includes features to enhance safety and operation by reducing the possibility of arcing or flashover before and during the switching operation and to provide of visual indication of the state of the switch.
摘要翻译：一种电气开关，其包括具有在其中限定轴向孔的壁的绝缘壳体，设置在所述壳体孔中的第一电触点和在打开位置和闭合位置之间可移动地设置在所述壳体孔中的第二电触点。当触点处于其打开位置时，第二电触头与第一电触头间隔开，并且当触头处于其闭合位置时，第二电触点与第一电触点电接触。该开关包括通过减少切换操作之前和期间的电弧或闪络的可能性来增强安全性和操作的特征，并提供开关状态的可视指示。

4. 发明申请

US20070029669A1 Integrated circuit with low-stress under-bump metallurgy 审中-公开
标题翻译：低应力欠凸下冶金的集成电路
公开(公告)号：US20070029669A1
公开(公告)日：2007-02-08
申请号：US11198419
申请日：2005-08-05
申请人： Frank Stepniak , William Higdon
发明人： Frank Stepniak , William Higdon
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/10 , H01L24/05 , H01L24/13 , H01L24/81 , H01L2224/0401 , H01L2224/05022 , H01L2224/05027 , H01L2224/05572 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2224/81011 , H01L2224/8121 , H01L2224/81815 , H01L2224/83102 , H01L2224/83191 , H01L2224/92125 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/05042 , H01L2924/14 , H01L2924/30105 , H01L2924/00014 , H01L2224/05552 , H01L2924/00
摘要： An integrated circuit (IC) includes a semiconductor material, electronic circuitry formed on the semiconductor material, a contact layer formed on the electronic circuitry, a final passivation layer formed on the contact layer and an under-bump metallurgy (UBM) formed on at least a portion of the final passivation layer. The contact layer includes a plurality of contacts pads for providing external access to the electronic circuitry. The final passivation layer includes a plurality of windows that extend through the final passivation layer to the contact pads. The UBM includes an aluminum layer having a thickness of about 800 angstroms to about 1200 angstroms, a nickel/vanadium (Ni/V) layer having a thickness of about 800 angstroms to about 1200 angstroms and a copper (Cu) layer having a thickness of about 800 angstroms to about 1200 angstroms.
摘要翻译：集成电路（IC）包括半导体材料，形成在半导体材料上的电子电路，形成在电子电路上的接触层，形成在接触层上的最终钝化层和至少形成的凸块下冶金（UBM）最终钝化层的一部分。接触层包括用于提供对电子电路的外部访问的多个接触焊盘。最终钝化层包括多个窗口，其延伸穿过最终钝化层到接触垫。 UBM包括厚度约800埃至约1200埃的铝层，厚度约800埃至约1200埃的镍/钒（Ni / V）层和厚度为约800埃至约1200埃。

5. 发明授权

US5903209A Encapsulated fuse with corona shield 有权
标题翻译：封装保险丝与电晕屏蔽
公开(公告)号：US5903209A
公开(公告)日：1999-05-11
申请号：US130860
申请日：1998-08-07
申请人： Frank Stepniak
发明人： Frank Stepniak
IPC分类号： H01H69/02 , H01H85/02 , H01H85/04 , H01H85/042 , H01H85/165 , H01H85/175
CPC分类号： H01H85/042 , H01H2085/0225 , H01H2085/2065 , H01H85/165
摘要： An encapsulated fuse assembly with a corona shield for use in high voltage underground power distribution systems. The fuse assembly includes a fuse encapsulated within an insulative outer housing. The outer surface of the fuse is coated with an electrically conductive material which is in electrical connection with one of the fuse terminals and extends along the outer surface of the fuse body to a point intermediate the other terminal leaving a portion of the fuse body not coated with the conductive material. Preferably, at least the terminal of the fuse not in contact with the conductive material is enveloped by an electrically conductive insert disposed within the insulative outer housing which along with the conductive coating establish an effective corona shield around the fuse without providing an alternate electrical circuit between the fuse terminals. The fuse assembly may include a fuse spacer which provides an electrical extension to the fuse so that different size fuses may be utilized within a standard size housing.
摘要翻译：一种具有电晕屏蔽的封装保险丝组件，用于高压地下配电系统。保险丝组件包括封装在绝缘外壳内的保险丝。保险丝的外表面涂覆有导电材料，该导电材料与熔断器端子中的一个电连接并且沿着保险丝体的外表面延伸到另一个端子的中间点，留下未涂覆的熔丝体的一部分与导电材料。优选地，至少不与导电材料接触的保险丝的端子被设置在绝缘外壳内的导电插入件包围，该导电插入件与导电涂层一起在熔丝周围建立有效的电晕屏蔽，而不会在熔断器之间提供交替的电路保险丝端子。保险丝组件可以包括保险丝间隔件，其提供到保险丝的电延伸，使得可以在标准尺寸的壳体内使用不同尺寸的保险丝。

6. 发明授权

US07579572B2 High current switch and method of operation 有权
标题翻译：大电流开关及操作方法
公开(公告)号：US07579572B2
公开(公告)日：2009-08-25
申请号：US12214026
申请日：2008-06-16
申请人： Frank Stepniak , Larry Siebens , Charles Bindics , Anthony Reed
发明人： Frank Stepniak , Larry Siebens , Charles Bindics , Anthony Reed
IPC分类号： H01H33/08
CPC分类号： H01H33/02 , H01H1/385 , H01H31/32 , H01H33/025 , H01H33/565 , H01H2003/0273 , H01H2009/0292
摘要： An electrical switch which includes an insulative housing having a wall defining an axial bore therein, a first electrical contact disposed in the housing bore and a second electrical contact movably disposed in the housing bore between an open position and a closed position. When the contacts are in their open position, the second electrical contact is spaced apart from the first electrical contact and when the contacts are in their closed position, the second electrical contact is in electrical contact with the first electrical contact. The switch includes features to enhance safety and operation by reducing the possibility of arcing or flashover before and during the switching operation and to provide of visual indication of the state of the switch.
摘要翻译：一种电气开关，其包括具有在其中限定轴向孔的壁的绝缘壳体，设置在所述壳体孔中的第一电触点和在打开位置和闭合位置之间可移动地设置在所述壳体孔中的第二电触点。当触点处于其打开位置时，第二电触头与第一电触头间隔开，并且当触头处于其闭合位置时，第二电触点与第一电触点电接触。该开关包括通过减少切换操作之前和期间的电弧或闪络的可能性来增强安全性和操作的特征，并提供开关状态的可视指示。

7. 发明申请

US20060266630A1 High current switch and method of operation 有权
公开(公告)号：US20060266630A1
公开(公告)日：2006-11-30
申请号：US11141571
申请日：2005-05-31
申请人： Frank Stepniak , Larry Siebens , Charles Bindics , Anthony Reed
发明人： Frank Stepniak , Larry Siebens , Charles Bindics , Anthony Reed
IPC分类号： H01H15/00
CPC分类号： H01H33/02 , H01H1/385 , H01H31/32 , H01H33/025 , H01H33/565 , H01H2003/0273 , H01H2009/0292
摘要： An electrical switch which includes an insulative housing having a wall defining an axial bore therein, a first electrical contact disposed in the housing bore and a second electrical contact movably disposed in the housing bore between an open position and a closed position. When the contacts are in their open position, the second electrical contact is spaced apart from the first electrical contact and when the contacts are in their closed position, the second electrical contact is in electrical contact with the first electrical contact. The switch includes features to enhance safety and operation by reducing the possibility of arcing or flashover before and during the switching operation and to provide of visual indication of the state of the switch.

8. 发明授权

US06822327B1 Flip-chip interconnected with increased current-carrying capability 有权
标题翻译：倒装芯片与增加的载流能力相互连接
公开(公告)号：US06822327B1
公开(公告)日：2004-11-23
申请号：US10461318
申请日：2003-06-13
申请人： Pankaj Mithal , William D. Higdon , Mark W. Gose , John M. Dikeman , Frank Stepniak
发明人： Pankaj Mithal , William D. Higdon , Mark W. Gose , John M. Dikeman , Frank Stepniak
IPC分类号： H01L2940
CPC分类号： H01L24/02 , H01L23/528 , H01L24/10 , H01L2224/0401 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14
摘要： A metal runner that improves the current-carrying capability of solder bumps used to electrically connect a surface-mount circuit device to a substrate. The runner comprises at least one leg portion and a pad portion, with the pad portion having a continuous region and a plurality of separate electrical paths leading to and from the continuous region. The electrical paths are delineated in the pad portion by nonconductive regions defined in the pad portion, with at least some of the nonconductive regions extending into the leg portion. The multiple electrical paths split the current flow to and from the solder bump, distributing the current around the perimeter of the solder bump in a manner that reduces current density in regions of the solder bump where electromigration is most likely.
摘要翻译：金属流道，其提高用于将表面贴装电路器件电连接到衬底的焊料凸块的载流能力。流道包括至少一个支腿部分和垫部分，其中该焊盘部分具有连续区域和连续区域的多个分开的电路径。在焊盘部分中通过限定在焊盘部分中的非导电区域描绘电路径，其中至少一些非导电区域延伸到腿部。多个电路径将电流流向和从焊料凸块分开，以在减少电子迁移最有可能的焊料凸块区域中的电流密度的方式将电流分布在焊料凸块的周边周围。

9. 发明授权

US07397012B2 High current switch and method of operation 有权
公开(公告)号：US07397012B2
公开(公告)日：2008-07-08
申请号：US11141571
申请日：2005-05-31
申请人： Frank Stepniak , Larry Siebens , Charles Bindics , Anthony Reed
发明人： Frank Stepniak , Larry Siebens , Charles Bindics , Anthony Reed
IPC分类号： H01H33/00
CPC分类号： H01H33/02 , H01H1/385 , H01H31/32 , H01H33/025 , H01H33/565 , H01H2003/0273 , H01H2009/0292
摘要： An electrical switch which includes an insulative housing having a wall defining an axial bore therein, a first electrical contact disposed in the housing bore and a second electrical contact movably disposed in the housing bore between an open position and a closed position. When the contacts are in their open position, the second electrical contact is spaced apart from the first electrical contact and when the contacts are in their closed position, the second electrical contact is in electrical contact with the first electrical contact. The switch includes features to enhance safety and operation by reducing the possibility of arcing or flashover before and during the switching operation and to provide of visual indication of the state of the switch.

10. 发明申请

US20080157320A1 Laterally Interconnected IC Packages and Methods 审中-公开
标题翻译：双向互连IC封装和方法
公开(公告)号：US20080157320A1
公开(公告)日：2008-07-03
申请号：US11617906
申请日：2006-12-29
申请人： Ray D. Harrison , Jianbai Zhu , Jeffrey J. Wolfe , Frank Stepniak
发明人： Ray D. Harrison , Jianbai Zhu , Jeffrey J. Wolfe , Frank Stepniak
IPC分类号： H01L23/48 , H01L21/58
CPC分类号： H01L23/3128 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/105 , H01L2224/32225 , H01L2224/4809 , H01L2224/48091 , H01L2224/48175 , H01L2224/48227 , H01L2224/48472 , H01L2224/49 , H01L2224/73265 , H01L2225/1005 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01033 , H01L2924/014 , H01L2924/14 , H01L2924/15192 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H05K1/112 , H05K1/181 , H05K2201/09227 , H05K2201/09627 , H05K2201/1053 , H05K2201/10734 , Y02P70/611 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： Semiconductor devices and methods for their assembly are described in which IC packages may be combined in novel configurations. A multi-package semiconductor device system and associated methods for its construction include a plurality of packaged semiconductor devices, each provided with at least one lateral electrical contact. The plurality of packaged semiconductor devices so provided are fixed in a coplanar configuration and have the adjacent lateral contacts coupled for operation in concert.
摘要翻译：描述了用于组装的半导体器件和方法，其中IC封装可以以新颖的结构组合。多封装半导体器件系统及其结构的相关方法包括多个封装的半导体器件，每个封装的半导体器件均设置有至少一个横向电接触。如此设置的多个封装半导体器件被固定为共面构造，并且具有相互连接的相邻的侧向触点以一起操作。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式