专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06811892B2 Lead-based solder alloys containing copper 有权
公开(公告)号：US06811892B2
公开(公告)日：2004-11-02
申请号：US10226370
申请日：2002-08-22
申请人： Shing Yeh , Bradley H. Carter , Frank Stepniak , Scott D. Brandenburg
发明人： Shing Yeh , Bradley H. Carter , Frank Stepniak , Scott D. Brandenburg
IPC分类号： B23K3526
CPC分类号： B23K35/262 , B23K2101/36 , H01L24/81 , H01L2224/81801 , H01L2924/01087 , H01L2924/01322 , H01L2924/01327 , H01L2924/14 , H05K3/3436 , H05K3/3463 , Y10T428/12528 , Y10T428/12715 , Y10T428/12903 , Y10T428/24917 , H01L2924/00
摘要： A tin-lead solder alloy containing copper and optionally silver as its alloying constituents. The solder alloy consists essentially of, by weight, about 55% to about 75% tin, about 11% to about 44% lead, up to about 4% silver, nickel, palladium, platinum and/or gold, greater than 1% to about 10% copper, and incidental impurities. The solder alloys contain a small portion of CuSn intermetallic compounds, and exhibit a melting mechanism in which all but the intermetallic compounds melt within a narrow temperature range, though the actual liquidus temperature of the alloys may be considerably higher, such that the alloys can be treated as requiring peak reflow temperatures of about 250° C. or less. The intermetallic compounds precipitate out to form a diffusion barrier that increases the reliability of solder connections formed therewith.

2. 发明授权

US06619536B2 Solder process and solder alloy therefor 有权
公开(公告)号：US06619536B2
公开(公告)日：2003-09-16
申请号：US10379753
申请日：2003-03-05
申请人： Shing Yeh , Scott D. Brandenburg , Bradley H. Carter
发明人： Shing Yeh , Scott D. Brandenburg , Bradley H. Carter
IPC分类号： B23K3102
CPC分类号： H01L24/10 , B23K35/26 , B23K35/262 , B23K35/268 , H01L23/488 , H01L24/13 , H01L2224/05573 , H01L2224/13 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/00
摘要： A solder alloy containing indium, lead, silver and copper as its alloying constituents, and a soldering process employing the solder alloy. The solder alloy consists essentially of, by weight, about 50% to about 65% indium, about 0.5% to about 3.0% silver, up to about 3.0% copper, the balance lead and incidental impurities. The alloy preferably has a solidus temperature in a range of about 173° C. to about 178° C., and a liquidus temperature in a range of about 187° C. to about 196° C. As such, the alloy can be used in a reflow process with a peak reflow temperature of about 220° C. to about 240° C., and is therefore compatible with most circuit components and can be simultaneously reflowed with 63Sn-37Pb solder.

3. 发明授权

US06570260B1 Solder process and solder alloy therefor 有权
标题翻译：焊接工艺及焊锡合金
公开(公告)号：US06570260B1
公开(公告)日：2003-05-27
申请号：US10075979
申请日：2002-02-15
申请人： Shing Yeh , Scott D. Brandenburg , Bradley H. Carter
发明人： Shing Yeh , Scott D. Brandenburg , Bradley H. Carter
IPC分类号： H01L2348
CPC分类号： H01L24/10 , B23K35/26 , B23K35/262 , B23K35/268 , H01L23/488 , H01L24/13 , H01L2224/05573 , H01L2224/13 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/00
摘要： A solder alloy containing indium, lead, silver and copper as its alloying constituents, and a soldering process employing the solder alloy. The solder alloy consists essentially of, by weight, about 50% to about 65% indium, about 0.5% to about 3.0% silver, up to about 3.0% copper, the balance lead and incidental impurities. The alloy preferably has a solidus temperature in a range of about 173° C. to about 178° C., and a liquidus temperature in a range of about 187° C. to about 196° C. As such, the alloy can be used in a reflow process with a peak reflow temperature of about 220° C. to about 240° C., and is therefore compatible with most circuit components and can be simultaneously reflowed with 63Sn-37Pb solder.
摘要翻译：含有铟，铅，银和铜作为其合金成分的焊料合金以及采用焊料合金的焊接工艺。焊料合金基本上由重量计约50％至约65％的铟，约0.5％至约3.0％的银，至多约3.0％的铜，余量的铅和附带的杂质。合金优选固相线温度在约173℃至约178℃的范围内，液相线温度在约187℃至约196℃的范围内。因此，可以使用该合金在高回流温度为约220℃至约240℃的回流工艺中，因此与大多数电路部件兼容，并可与63Sn-37Pb焊料同时回流。

4. 发明申请

US20080212296A1 Compression connection for vertical IC packages 有权
公开(公告)号：US20080212296A1
公开(公告)日：2008-09-04
申请号：US11712718
申请日：2007-03-01
申请人： Scott D. Brandenburg , Thomas A. Degenkolb , Shing Yeh
发明人： Scott D. Brandenburg , Thomas A. Degenkolb , Shing Yeh
IPC分类号： H05K7/00
CPC分类号： H05K7/2049 , H01L24/05 , H01L24/06 , H01L24/72 , H01L25/072 , H01L2224/05644 , H01L2224/06181 , H01L2924/01029 , H01L2924/10253 , H01L2924/1203 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19043 , H01L2924/00
摘要： An improved vertical integrated circuit device package that eliminates or reduces the need for wire bond connections and/or solder connections is provided. The package includes a vertical device having electrodes on opposite surfaces, and a compressed spring member that is used to establish compression electrical connections between the electrodes and corresponding electrically conductive elements.

5. 发明授权

US5491364A Reduced stress terminal pattern for integrated circuit devices and packages 失效
标题翻译：用于集成电路器件和封装的减少应力端子图案
公开(公告)号：US5491364A
公开(公告)日：1996-02-13
申请号：US299924
申请日：1994-08-31
申请人： Scott D. Brandenburg , William S. Murphy , Ahmer R. Syed , David A. King , Shing Yeh
发明人： Scott D. Brandenburg , William S. Murphy , Ahmer R. Syed , David A. King , Shing Yeh
IPC分类号： H01L23/498 , H05K1/11 , H05K3/34 , H01L23/50
CPC分类号： H05K1/111 , H01L23/49838 , H01L2224/48227 , H01L24/48 , H01L2924/00014 , H01L2924/01078 , H01L2924/14 , H01L2924/181 , H05K2201/09418 , H05K2201/10719 , H05K2201/10734 , H05K3/3436 , Y02P70/611
摘要： A terminal pattern is provided for an integrated circuit device, such as a ball grid array package or an integrated circuit flip chip. The terminal pattern is composed of a number of terminals arranged in concentric arrays, each array having a substantially circular shape and being composed of a number of terminals. The terminal pattern is composed of at least two arrays, and more typically three or more arrays. When the integrated circuit device is mounted to its intended substrate, the individual terminals of the terminal pattern each register with and are soldered to a corresponding conductor of a conductor pattern formed on the substrate. A significant advantage is that, due to the terminals of the terminal pattern being arranged in concentric arrays, a smaller maximum width for the terminal pattern is achieved than possible with a conventional rectangular terminal pattern having the same number of terminals. As such, the terminal pattern and the resulting solder joints between the terminal pattern and its corresponding conductor pattern exhibit improved fatigue life as compared to the conventional rectangular terminal pattern.
摘要翻译：为诸如球栅阵列封装或集成电路倒装芯片的集成电路器件提供端子图案。端子图案由排列成同心排列的多个端子组成，每个阵列具有大致圆形形状并且由多个端子构成。终端图案由至少两个阵列组成，更典型地由三个或更多个阵列组成。当集成电路器件被安装到其预定的衬底上时，端子图案的各个端子每个寄存并被焊接到形成在衬底上的导体图案的相应导体。显着的优点在于，由于端子图案的端子被排列成同心的阵列，所以对于具有相同数量的端子的常规矩形端子图案，可以实现端子图案的较小的最大宽度。因此，与传统的矩形端子图案相比，端子图案和端子图案及其相应的导体图案之间产生的焊接接头显示出改善的疲劳寿命。

6. 发明授权

US07726972B1 Liquid metal rotary connector apparatus for a vehicle steering wheel and column 有权
标题翻译：用于车辆方向盘和立柱的液体金属旋转连接器装置
公开(公告)号：US07726972B1
公开(公告)日：2010-06-01
申请号：US12505088
申请日：2009-07-17
申请人： Scott D. Brandenburg , Shing Yeh , Mark W. Gose
发明人： Scott D. Brandenburg , Shing Yeh , Mark W. Gose
IPC分类号： H01R39/00
CPC分类号： H01R39/646 , B60R16/027 , C22C28/00 , H01R2201/26
摘要： A liquid metal rotary connector for a vehicle steering mechanism utilizes a conductive alloy comprising Gallium, Indium, Tin and Zinc to electrically couple stationary and rotary terminals of the connector. The alloy is a liquid at ambient temperatures, and has a melting point of −36° C., though testing has shown that it operates satisfactorily at temperatures as low as −40° C. In a preferred arrangement, the rotary connector provides a two-wire connection through which power is supplied from the steering column to the steering wheel, and electronic modules located in the steering column and the steering wheel support bi-directional data communication through voltage and current modulation of the supplied power.
摘要翻译：用于车辆转向机构的液体金属旋转连接器利用包括镓，铟，锡和锌的导电合金来电连接连接器的固定和旋转端子。该合金在环境温度下为液体，熔点为-36℃，尽管测试表明它在低至-40℃的温度下令人满意地工作。在优选的布置中，旋转连接器提供两个 - 通过其从转向柱向方向盘供电的电线，并且位于转向柱和方向盘中的电子模块通过对所供电的电压和电流调制来支持双向数据通信。

7. 发明授权

US07447041B2 Compression connection for vertical IC packages 有权
标题翻译：垂直IC封装的压缩连接
公开(公告)号：US07447041B2
公开(公告)日：2008-11-04
申请号：US11712718
申请日：2007-03-01
申请人： Scott D. Brandenburg , Thomas A. Degenkolb , Shing Yeh
发明人： Scott D. Brandenburg , Thomas A. Degenkolb , Shing Yeh
IPC分类号： H05K7/00
CPC分类号： H05K7/2049 , H01L24/05 , H01L24/06 , H01L24/72 , H01L25/072 , H01L2224/05644 , H01L2224/06181 , H01L2924/01029 , H01L2924/10253 , H01L2924/1203 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19043 , H01L2924/00
摘要： An improved vertical integrated circuit device package that eliminates or reduces the need for wire bond connections and/or solder connections is provided. The package includes a vertical device having electrodes on opposite surfaces, and a compressed spring member that is used to establish compression electrical connections between the electrodes and corresponding electrically conductive elements.
摘要翻译：提供了改进的垂直集成电路器件封装，其消除或减少了对引线接合和/或焊接连接的需要。封装包括在相对表面上具有电极的垂直装置，以及用于在电极和对应的导电元件之间建立压缩电连接的压缩弹簧构件。

8. 发明授权

US06767411B2 Lead-free solder alloy and solder reflow process 有权
标题翻译：无铅焊料合金和回流焊工艺
公开(公告)号：US06767411B2
公开(公告)日：2004-07-27
申请号：US10099861
申请日：2002-03-15
申请人： Shing Yeh , Bradley H. Carter , Curtis W. Melcher
发明人： Shing Yeh , Bradley H. Carter , Curtis W. Melcher
IPC分类号： B23K35363
CPC分类号： B23K35/262
摘要： A lead-free solder alloy consisting essentially of, by weight, 3.0% to 3.5% silver, greater than 1% to about 15% copper, the balance tin and incidental impurities, and having an effective melting range of about 215° C. to about 222° C. The solder alloy is noneutectic, and therefore characterized by solidus and liquidus temperatures, the former being in a range of about 215° C. to about 218° C., while the latter is about 290° C. or more. However, the melting mechanism exhibited by the alloy is such that the alloy is substantially all melted and does not exhibit a “mushy zone” above the effective melting range, enabling the alloy to behave similarly to the SnAgCu eutectic alloy.
摘要翻译：一种无铅焊料合金，其基本上由重量比为3.0％至3.5％的银，大于1％至约15％的铜，余量为锡和附带杂质，并且具有约215℃的有效熔融范围，约222℃。焊料合金是共晶的，因此以固相和液相线温度为特征，前者在约215℃至约218℃的范围内，而后者为约290℃或更高。然而，合金显示的熔融机理使得合金基本上全部熔化，并且在有效熔融范围之上不显示“糊状区域”，使合金的性能与SnAgCu共晶合金类似。

9. 发明授权

US06630251B1 Leach-resistant solder alloys for silver-based thick-film conductors 有权
标题翻译：用于银基厚膜导体的防漏焊料合金
公开(公告)号：US06630251B1
公开(公告)日：2003-10-07
申请号：US10252502
申请日：2002-09-23
申请人： Bradley H. Carter , Shing Yeh
发明人： Bradley H. Carter , Shing Yeh
IPC分类号： B32B1501
CPC分类号： C22C13/00 , B23K35/007 , B23K35/262 , B23K35/268 , B23K2101/36 , C22C11/00 , H05K1/092 , H05K3/3463 , Y10T428/12701 , Y10T428/12708 , Y10T428/12715 , Y10T428/12722 , Y10T428/12896
摘要： A tin-lead solder alloy containing copper and/or nickel and optionally silver, palladium, platinum and/or gold as its alloying constituents. The solder alloy consists essentially of, by weight, about 5% to about 70% tin, up to about 4% silver palladium, platinum and/or gold, about 0.5% to about 10% copper and/or nickel, the balance lead and incidental impurities. The presence of copper and/or nickel in the alloy has the beneficial effect of inhibiting the dissolution and leaching of silver from a silver-containing thick-film, such as a conductor or solder pad, into the molten solder alloy during reflow. In addition, solder joints formed of the solder alloy form a diffusion barrier layer of intermetallic compounds that inhibit solid-state interdiffusion between silver from a silver-containing thick-film and tin from the solder joint.
摘要翻译：含有铜和/或镍的锡铅焊料合金和任选的银，钯，铂和/或金作为其合金成分。焊料合金基本上由重量计约5％至约70％的锡，至多约4％的银钯，铂和/或金，约0.5％至约10％的铜和/或镍，余量铅和附带杂质。合金中铜和/或镍的存在有利于在回流期间将银从含银厚膜（例如导体或焊盘）中溶解并浸出到熔融焊料合金中。此外，由焊料合金形成的焊点形成金属间化合物的扩散阻挡层，其阻止来自含银厚膜的银与来自焊料接头的锡之间的固态相互扩散。

10. 发明授权

US06281106B1 Method of solder bumping a circuit component 有权
标题翻译：焊接凸起电路部件的方法
公开(公告)号：US06281106B1
公开(公告)日：2001-08-28
申请号：US09449820
申请日：1999-11-25
申请人： William David Higdon , Frank Stepniak , Shing Yeh
发明人： William David Higdon , Frank Stepniak , Shing Yeh
IPC分类号： H01L2144
CPC分类号： H05K3/3436 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/05001 , H01L2224/05022 , H01L2224/05559 , H01L2224/05572 , H01L2224/11462 , H01L2224/1147 , H01L2224/11502 , H01L2224/11849 , H01L2224/11901 , H01L2224/13006 , H01L2224/13023 , H01L2224/1308 , H01L2224/131 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/81801 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H05K3/3463 , H05K3/3473 , Y02P70/613 , H01L2924/00014 , H01L2224/13099 , H01L2924/00 , H01L2224/05541 , H01L2224/05005 , H01L2224/1146
摘要： A method for solder bumping a surface-mount circuit component, as well as electrically and mechanically connecting the component to a conductor on a substrate, and the components and assemblies formed thereby. The method generally entails forming a multilayer metal bump containing discrete layers, including at least one layer of a solder alloy, a first metallic layer having a sufficiently high melting point so as not to melt or deform at the reflow temperature of the solder alloy, and a second metallic layer containing at least one metal that is soluble in the solder alloy. During reflow, the first metallic layer does not collapse, while the solder layer and the second metallic layer readily flow and subsequently bond the first metallic layer to suitable structures on the component and substrate. As a result of the reflow operation, the multilayer metal bump of this invention forms a solder connection with a graded composition, namely, an intermediate region formed primarily by the first metallic layer, and at least one end region that contains a solid solution formed of the solder layer and the first and second metallic layers.
摘要翻译：用于焊接凸起表面安装电路部件的方法，以及将部件电连接和机械地连接到基板上的导体以及由此形成的部件和组件。该方法通常需要形成包含离散层的多层金属凸块，包括至少一层焊料合金，具有足够高熔点的第一金属层，以便在焊料合金的回流温度下不熔化或变形，以及含有至少一种可溶于焊料合金的金属的第二金属层。在回流期间，第一金属层不会塌陷，而焊料层和第二金属层容易流动，并且随后将第一金属层结合到组件和基板上的合适结构。作为回流操作的结果，本发明的多层金属凸块形成了具有渐层组成的焊料连接，即主要由第一金属层形成的中间区，以及至少一个包含由焊料层和第一和第二金属层。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式