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    • 2. 发明授权
    • Alloy, in particular a solder alloy, for joining workpieces
    • 合金,特别是焊料合金,用于连接工件
    • US06231693B1
    • 2001-05-15
    • US08983472
    • 1998-04-23
    • Erich LugscheiderWolfgang TillmannHongshou Zhuang
    • Erich LugscheiderWolfgang TillmannHongshou Zhuang
    • B23K3526
    • B23K35/268B23K35/262
    • The invention, which enables wider use to be made of soft-soldering techniques, concerns an alloy, in particular a solder alloy, a method of joining workpieces by soldering using the solder alloy and the use of the alloy for soldering. The alloy proposed is characterized in that it contains at least 1% by wt. of an element or a mixture of elements from sub-group IVa and/or Va in the periodic table, at least 0.01% by wt. of an element or a mixture of elements from the lanthanide series; optionally at least 0.5% of silver or copper or indium or a mixture silver and/or copper and/or indium; and optionally at least 0.01% by wt. of gallium, the remainder consisting of tin or lead or a mixture of tin and lead plus, as applicable, the usual impurities. The alloy proposed can be used as solder in oxygen-containing atmospheres such as air, can be used at relatively low temperatures and efficiently wets normally difficult to wet surfaces such as ceramic surfaces. In a further embodiment of the invention, the solder alloy can be used without flux.
    • 能够更广泛地使用软钎焊技术的本发明涉及合金,特别是焊料合金,通过使用焊料合金进行焊接以及使用合金来焊接工件的方法。 提出的合金的特征在于其含有至少1重量%。 元素的元素或元素的混合物,元素周期表中Ⅳa族和/或Ⅴa族元素的混合物,至少为0.01%(重量)。 元素或来自镧系元素的元素的混合物; 任选至少0.5%的银或铜或铟或混合物银和/或铜和/或铟; 和任选地至少0.01重量%。 的镓,其余的由锡或铅组成,或者锡和铅的混合物加上通常的杂质。 所提出的合金可以用作含氧气氛如空气中的焊料,可以在相对低的温度下使用,并且通常难以湿润表面如陶瓷表面。 在本发明的另一个实施例中,可以使用焊剂合金而没有焊剂。