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1. 发明授权

US08123111B2 Production method of solder circuit board 有权
标题翻译：焊接电路板的生产方法
公开(公告)号：US08123111B2
公开(公告)日：2012-02-28
申请号：US11910256
申请日：2006-03-28
申请人： Takashi Shoji , Takekazu Sakai , Tetsuo Kubota
发明人： Takashi Shoji , Takekazu Sakai , Tetsuo Kubota
IPC分类号： B23K31/02 , C23C20/04
CPC分类号： H05K3/3484 , B23K1/0016 , B23K3/06 , B23K2101/42 , H05K2203/0292 , H05K2203/0425 , H05K2203/043 , H05K2203/1527
摘要： A method for producing a solder circuit board includes imparting tackiness to a surface of a conductive circuit electrode provided on a printed wiring board to form a tackiness-imparted area. depositing solder powder on the tackiness-imparted area and heating the printed wiring board so as to melt the solder to thereby form a solder circuit. The solder powder is placed in a vessel. The printed wiring board having the electrode whose surface has been imparted with tackiness is placed in the vessel. The vessel is tilted to thereby deposit the solder powder on the tackiness-imparted area.
摘要翻译：一种焊接电路板的制造方法，其特征在于，在设置在印刷电路板上的导电电路电极的表面赋予粘合性，形成赋予粘着性的区域。在赋予粘合性的区域上形成焊料粉末并加热印刷电路板，从而熔化焊料从而形成焊料电路。将焊料粉末放置在容器中。具有表面已经赋予粘性的电极的印刷线路板被放置在容器中。将容器倾斜，从而将焊料粉末沉积在赋予粘性的区域上。

2. 发明申请

US20090056977A1 PRODUCTION METHOD OF SOLDER CIRCUIT BOARD 有权
标题翻译：焊接电路板的生产方法
公开(公告)号：US20090056977A1
公开(公告)日：2009-03-05
申请号：US11910256
申请日：2006-03-28
申请人： Takashi Shoji , Takekazu Sakai , Tetsuo Kubota
发明人： Takashi Shoji , Takekazu Sakai , Tetsuo Kubota
IPC分类号： H05K1/00 , B23K1/20 , B23K37/00
CPC分类号： H05K3/3484 , B23K1/0016 , B23K3/06 , B23K2101/42 , H05K2203/0292 , H05K2203/0425 , H05K2203/043 , H05K2203/1527
摘要： A method for producing a solder circuit board includes imparting tackiness to a surface of a conductive circuit electrode provided on a printed wiring board to form a tackiness-imparted area. depositing solder powder on the tackiness-imparted area and heating the printed wiring board so as to melt the solder to thereby form a solder circuit. The solder powder is placed in a vessel. The printed wiring board having the electrode whose surface has been imparted with tackiness is placed in the vessel. The vessel is tilted to thereby deposit the solder powder on the tackiness-imparted area.
摘要翻译：一种焊接电路板的制造方法，其特征在于，在设置在印刷电路板上的导电电路电极的表面赋予粘合性，形成赋予粘着性的区域。在赋予粘合性的区域上形成焊料粉末并加热印刷电路板，从而熔化焊料从而形成焊料电路。将焊料粉末放置在容器中。具有表面已经赋予粘性的电极的印刷线路板被放置在容器中。将容器倾斜，从而将焊料粉末沉积在赋予粘性的区域上。

3. 发明授权

US08109432B2 Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board 有权
标题翻译：将焊料粉末附着到电子电路板和焊接电子电路板的方法
公开(公告)号：US08109432B2
公开(公告)日：2012-02-07
申请号：US12013246
申请日：2008-01-11
申请人： Takashi Shoji , Takekazu Sakai , Tetsuo Kubota
发明人： Takashi Shoji , Takekazu Sakai , Tetsuo Kubota
IPC分类号： B23K31/02
CPC分类号： H05K3/3478 , H05K3/282 , H05K2203/0285 , H05K2203/0425 , H05K2203/0786 , H05K2203/124
摘要： A method for the attachment of solder powder includes the steps of treating an exposed metallic surface of an electronic circuit board with a tackifier compound, thereby imparting tackiness thereto to form a tackified part, attaching solder powder by a dry or wet process to the tackified part, and then removing excessively adhering solder powder in a liquid that is water, deoxidized water or deoxidized water added with an antirust.
摘要翻译：用于焊接粉末的附着方法包括以下步骤：用增粘剂处理电子电路板的暴露的金属表面，由此赋予粘合性以形成增粘部分，通过干法或湿法将焊料粉末附着到增粘部分，然后除去添加有防锈剂的水，脱氧水或脱氧水的液体中过度粘附的焊料粉末。

4. 发明申请

US20080173699A1 Method for Attachment of Solder Powder to Electronic Circuit Board and Solder-Attached Electronic Circuit Board 有权
标题翻译：将焊粉附着到电子电路板和焊接电子电路板上的方法
公开(公告)号：US20080173699A1
公开(公告)日：2008-07-24
申请号：US12013246
申请日：2008-01-11
申请人： Takashi Shoji , Takekazu Sakai , Tetsuo Kubota
发明人： Takashi Shoji , Takekazu Sakai , Tetsuo Kubota
IPC分类号： B23K1/20 , B23K31/00
CPC分类号： H05K3/3478 , H05K3/282 , H05K2203/0285 , H05K2203/0425 , H05K2203/0786 , H05K2203/124
摘要： A method for the attachment of solder powder includes the steps of treating an exposed metallic surface of an electronic circuit board with a tackifier compound, thereby imparting tackiness thereto to form a tackified part, attaching solder powder by a dry or wet process to the tackified part, and then removing excessively adhering solder powder in a liquid that is water, deoxidized water or deoxidized water added with an antirust.
摘要翻译：用于焊接粉末的附着方法包括以下步骤：用增粘剂处理电子电路板的暴露的金属表面，由此赋予粘合性以形成增粘部分，通过干法或湿法将焊料粉末附着到增粘部分，然后除去添加有防锈剂的水，脱氧水或脱氧水的液体中过度粘附的焊料粉末。

5. 发明申请

US20090041990A1 METHOD FOR ATTACHMENT OF SOLDER POWDER TO ELECTRONIC CIRCUIT BOARD AND SOLDERED ELECTRONIC CIRCUIT BOARD 审中-公开
标题翻译：焊接粉末焊接到电子电路板和焊接电子电路板的方法
公开(公告)号：US20090041990A1
公开(公告)日：2009-02-12
申请号：US12066369
申请日：2006-09-06
申请人： Takashi Shoji , Takekazu Sakai
发明人： Takashi Shoji , Takekazu Sakai
IPC分类号： H05K3/34 , H05K3/24 , B23K3/06
CPC分类号： H05K3/3484 , B23K1/20 , B23K3/0607 , B23K2101/42 , H05K2203/0126 , H05K2203/0292 , H05K2203/0425 , H05K2203/043 , H05K2203/124 , Y10T428/24802
摘要： A method for the attachment of solder powder includes the steps of treating an exposed metallic surface of an electronic circuit board with a tackifier compound, thereby imparting tackiness to the metallic surface to form a tacky part, and supplying the tacky part with a solder powder slurry suspended in a liquid, thereby inducing attachment of the solder powder. A method for the production of a soldered electronic circuit board, includes the steps of treating an exposed metallic surface of an electronic circuit board with a tackifier compound, thereby imparting tackiness to the metallic surface to form a tacky part; supplying the tacky part with a solder powder slurry suspended in a liquid, thereby inducing attachment of the solder powder, and thermally fusing the attached solder powder, thereby forming a circuit. A method for the attachment of solder powder includes the steps of treating an exposed metallic surface of an electronic circuit board with a tackifier compound, thereby imparting tackiness to the metallic surface to form a tacky part, supplying the tacky part with a solder powder slurry suspended in a liquid, thereby inducing attachment of the solder powder and, on the occurrence of a part devoid of attachment of solder powder in the consequently formed electronic circuit board, supplying the part with a solder powder slurry, thereby inducing attachment of solder powder thereto.
摘要翻译：用于焊接粉末的附着方法包括以下步骤：用增粘剂处理电子电路板的暴露的金属表面，从而赋予金属表面粘性以形成粘性部分，并向粘性部分供给焊料粉末浆料悬浮在液体中，从而引起焊料粉末的附着。制造焊接电子电路板的方法包括以下步骤：用增粘剂处理电子电路板的暴露的金属表面，从而赋予金属表面粘性以形成粘性部分; 向粘性部分提供悬浮在液体中的焊料粉末浆料，从而引起焊料粉末的附着，并热粘合附着的焊料粉末，从而形成电路。用于焊接粉末的附着方法包括以下步骤：用增粘剂处理电子电路板的暴露的金属表面，从而赋予金属表面粘性以形成粘性部分，向粘性部分供应悬浮的焊料粉末浆料在液体中，从而引起焊料粉末的附着，并且在发生焊接粉末附着在所形成的电子电路板上的部分时，向该部分供给焊料粉末浆料，从而引起焊料粉末附着。

6. 发明授权

US07775417B2 Method of producing conductive circuit board 有权
标题翻译：导电电路板的制造方法
公开(公告)号：US07775417B2
公开(公告)日：2010-08-17
申请号：US12517320
申请日：2007-12-17
申请人： Takashi Shoji , Takekazu Sakai
发明人： Takashi Shoji , Takekazu Sakai
IPC分类号： B23K31/02 , B05D5/12 , C23C30/00
CPC分类号： H05K3/3484 , H05K3/282 , H05K2203/0425 , H05K2203/043 , H05K2203/124
摘要： A method of producing a conductive circuit board including imparting tackiness through the use of a tackiness-imparting compound to the surface of the conductive circuit on a printed wiring board, attaching a solder powder to the tacky area and then heating the printed wiring board to melt the solder to form a solder circuit. The characteristic feature of this method is that the tackiness-imparted printed wiring board is kept in a liquid, etc at not more than 10° C. before attaching the solder powder.
摘要翻译：一种制造导电电路板的方法，包括通过使用赋予粘着性的化合物在印刷电路板上的导电电路的表面赋予粘性，将焊料粉末附着在粘性区域上，然后加热印刷线路板以熔化焊料形成焊锡电路。该方法的特征在于，在附着焊料粉末之前，将粘性赋予印刷线路板保持在不超过10℃的液体等中。

7. 发明申请

US20100009070A1 METHOD FOR FORMING SOLDER LAYER ON PRINTED-WIRING BOARD AND SLURRY DISCHARGE DEVICE 审中-公开
标题翻译：在印刷电路板和浆液放电装置上形成焊盘层的方法
公开(公告)号：US20100009070A1
公开(公告)日：2010-01-14
申请号：US12445379
申请日：2007-10-12
申请人： Takashi Shoji , Takekazu Sakai
发明人： Takashi Shoji , Takekazu Sakai
IPC分类号： H05K3/00
CPC分类号： H05K3/3484 , B23K3/0638 , B23K2101/42 , H05K2203/0126 , H05K2203/124
摘要： A method for forming a solder layer on the surface of a conductive circuit on a printed-wiring board includes discharging slurry containing solder powder onto the surface and heating the substrate. The slurry is discharged by dint of the pressure in a tank for the slurry. In a discharging device to be used in the method, the tank for storing the slurry is provided with a discharge pipe (2) for the slurry and a delivery pipe (1) for gas or solvent to be used for adjusting the pressure in the tank. In this device, one common pipe may be used both for discharging the slurry from the tank and delivering the slurry to the tank and one common pipe may be used for both delivering gas into the tank and sucking the gas from the tank.
摘要翻译：在印刷电路板上的导电电路的表面上形成焊料层的方法包括将含有焊料粉末的浆料排出到表面上并加热基板。浆料通过浆料中的压力排出。在该方法中使用的排出装置中，用于储存浆料的罐设置有用于浆料的排出管（2）和用于调节罐中的压力的用于气体或溶剂的输送管（1）。在该装置中，可以使用一根普通的管子来从罐中排出浆料并将浆料输送到罐中，并且可以使用一根普通的管道将两个气体输送到罐中并从罐中吸入气体。

8. 发明申请

US20090261148A1 PRODUCTION METHOD OF SOLDER CIRCUIT BOARD 审中-公开
标题翻译：焊接电路板的生产方法
公开(公告)号：US20090261148A1
公开(公告)日：2009-10-22
申请号：US12375341
申请日：2007-07-27
申请人： Takashi Shoji , Takekazu Sakai
发明人： Takashi Shoji , Takekazu Sakai
IPC分类号： B23K1/20
CPC分类号： H05K3/3478 , H01L21/4853 , H05K3/3452 , H05K2203/033 , H05K2203/041 , H05K2203/0415 , H05K2203/043 , H05K2203/0485 , H05K2203/0776
摘要： A method for producing a solder circuit board includes the steps of imparting tackiness to a surface of an electrically conductive circuit electrode on a printed-wiring board to form a tacky part, causing only one solder particle to adhere to the tacky part, and heating the printed-wiring board, thereby melting the solder particle to form a bump part which corresponds to the tacky part and to which an electronic part is to be connected and forming a solder circuit.
摘要翻译：一种焊接电路板的制造方法，其特征在于，在印刷布线基板上的导电性电路电极的表面赋予粘合性，形成粘着部，仅使一个焊料粒子附着在粘着部上，从而熔化焊料颗粒以形成与粘性部分相对应的凸起部分，并且电子部件将被连接并形成焊接电路。

9. 发明申请

US20070284136A1 Method for Production of Electronic Circuit Board 有权
标题翻译：电子电路板生产方法
公开(公告)号：US20070284136A1
公开(公告)日：2007-12-13
申请号：US11579879
申请日：2005-05-10
申请人： Takekazu Sakai , Takashi Shoji
发明人： Takekazu Sakai , Takashi Shoji
IPC分类号： H05K1/02 , H05K3/00
CPC分类号： H05K3/3484 , H05K2203/0292 , H05K2203/0425 , H05K2203/0485 , Y10T29/49144
摘要： A method for the deposition of a soldering powder to an electronic circuit board includes the steps of imparting stickiness to an exposed metal surface of a substrate and depositing a soldering powder to the resultant sticking part in a liquid body. The method can further include the steps of heating the substrate, thereby fusing the soldering powder, and forming a solder circuit.
摘要翻译：一种用于将焊接粉末沉积到电子电路板的方法包括以下步骤：向基底的暴露的金属表面施加粘性并将焊接粉末沉积在液体中的所得粘着部分上。该方法还可以包括加热基板，从而熔化焊接粉末并形成焊接电路的步骤。

10. 发明授权

US5750271A Method of forming solder film 失效
公开(公告)号：US5750271A
公开(公告)日：1998-05-12
申请号：US513549
申请日：1995-08-10
申请人： Takeo Kuramoto , Masataka Watabe , Satoshi Noda , Takashi Shoji , Takekazu Sakai
发明人： Takeo Kuramoto , Masataka Watabe , Satoshi Noda , Takashi Shoji , Takekazu Sakai
IPC分类号： B23K3/06 , B23K35/02 , B23K35/36 , H01L23/495 , H05K3/28 , H05K3/34 , H05K3/24
CPC分类号： H05K3/282 , B23K3/0607 , B23K3/0623 , B23K35/0244 , B23K35/3613 , B23K35/3615 , H01L23/49582 , H05K3/3484 , B23K2201/40 , B23K2201/42 , H01L2924/0002 , H05K2201/10984 , H05K2203/0425 , H05K2203/043 , H05K2203/0522 , H05K2203/0557 , H05K2203/0591 , H05K2203/124 , Y10T428/12556
摘要： A method of forming a solder film on a metallic surface such as a pad of a metallic circuit of a printed circuit board and a lead frame of electronic parts, which is capable of forming a precise and fine pattern and which comprises selectively imparting tackiness to only a predetermined part of the metallic surface by means of a tacky layer-forming solution, adhering a powdered solder to the resulting tacky part, and then melting the solder by heating to thereby form a solder film.

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