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1. 发明授权

US11856688B2 Adhesive film for printed wiring board 有权
公开(公告)号：US11856688B2
公开(公告)日：2023-12-26
申请号：US17055732
申请日：2019-07-05
申请人： Tatsuta Electric Wire & Cable Co., Ltd.
发明人： Masahiro Watanabe
IPC分类号： H05K1/02 , C09J7/29 , C09J7/38 , B32B7/12 , B32B27/06 , B32B27/28 , C09J9/02 , H05K3/46
CPC分类号： H05K1/0218 , B32B7/12 , B32B27/06 , B32B27/281 , C09J7/29 , C09J7/38 , C09J9/02 , H05K3/4644 , B32B2255/10 , B32B2307/206 , B32B2457/08 , C09J2301/162 , C09J2463/00 , C09J2463/006 , C09J2467/006
摘要： An adhesive film for a printed wiring board includes an adhesive layer 111 and an insulating protective layer 112. The insulating protective layer has an areal material ratio (Smr2) of 91% or less, the areal material ratio (Smr2) dividing reduced valleys from a core.

2. 发明授权

US09905450B2 Wafer processing base 有权
公开(公告)号：US09905450B2
公开(公告)日：2018-02-27
申请号：US13316264
申请日：2011-12-09
申请人： Se Ra Kim , Hyo Sook Joo , Suk Ky Chang , Jung Sup Shim
发明人： Se Ra Kim , Hyo Sook Joo , Suk Ky Chang , Jung Sup Shim
IPC分类号： C08L33/08 , B29C35/08 , H01L21/683 , C09J7/02 , C08G18/62 , C08G18/81 , C09J175/16
CPC分类号： H01L21/6836 , C08G18/6229 , C08G18/8116 , C08G2170/40 , C08L33/08 , C09J7/24 , C09J175/16 , C09J2201/128 , C09J2201/606 , C09J2203/326 , C09J2205/31 , C09J2433/006 , C09J2463/006 , C09J2467/006 , C09J2471/006 , C09J2475/006 , H01L2221/68327 , H01L2221/6834 , C08F2220/1858 , C08F2220/1875 , C08F220/06 , C08F220/20
摘要： Provided is a substrate for processing a wafer. The present invention can provide a substrate having excellent heat resistance and dimensional stability. The present invention can provide a substrate that has excellent stress relaxation properties, and therefore can prevent a wafer from being destroyed due to residual stress. Also, the present invention can provide a substrate that can prevent a wafer from being damaged or fried off due to a non-uniformly applied pressure during the wafer processing process, and that exhibits excellent cuttability. For these reasons, the substrate can be useful as a sheet for processing a wafer in various wafer preparation processes such as dicing, back-grinding, and picking-up.

3. 发明申请

US20180001572A1 BONDING OF COMPOSITE MATERIALS 审中-公开
公开(公告)号：US20180001572A1
公开(公告)日：2018-01-04
申请号：US15707160
申请日：2017-09-18
申请人： CYTEC INDUSTRIES INC.
发明人： Leonard MacAdams , Dalip Kohli
IPC分类号： B29C65/00 , C08J5/24 , B05D3/00 , C09J5/02 , B32B37/12 , B32B37/14
CPC分类号： B29C66/0224 , B05D3/007 , B29C65/4835 , B29C65/5042 , B29C65/5057 , B29C66/02245 , B29C66/1122 , B29C66/45 , B29C66/721 , B29C66/73753 , B32B37/12 , B32B37/14 , B32B2260/046 , B32B2305/72 , C08G59/40 , C08J5/124 , C08J5/24 , C08J2363/00 , C08J2463/00 , C09J5/02 , C09J2463/00 , C09J2463/006 , C09J2463/008
摘要： A method for surface preparation of composite substrates prior to adhesive bonding. A curable surface treatment layer is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the surface treatment layer remains partially cured. The surface treatment layer may be a resin film or a removal peel ply composed of resin-impregnated fabric. After surface preparation, the composite substrate is provided with a chemically-active, bondable surface that can be adhesively bonded to another composite substrate to form a covalently-bonded structure.

4. 发明授权

US09567500B2 Hydrophobic polyurethane adhesive 有权
标题翻译：疏水性聚氨酯胶粘剂
公开(公告)号：US09567500B2
公开(公告)日：2017-02-14
申请号：US14901138
申请日：2014-06-16
申请人： BASF SE
发明人： Berend Eling , Hans-Juergen Reese , Christian Koenig , Patrick Bolze
IPC分类号： C09J175/08 , C09J5/00 , C09J7/02 , C08G18/32 , C09J175/06 , C09J175/04 , C08G18/48 , C08G18/36
CPC分类号： C09J175/08 , C08G18/3206 , C08G18/3215 , C08G18/36 , C08G18/4891 , C09J5/00 , C09J7/25 , C09J175/04 , C09J175/06 , C09J2463/006 , C09J2475/00
摘要： The present invention relates to a polyurethane adhesive comprising an isocyanate component A and a polyol component B where the isocyanate component A comprises at least one diisocyanate or polyisocyanate and the polyol component B comprises the alkoxylation product of a mixture of castor oil or ricinoleic acid (i), of an aromatic di- or polyol (ii), and of an OH-functional compound having aliphatically bonded OH groups and OH-functionality of from 1 to 8 (iii), and also optionally of a compound (iv), selected from the group consisting of cyclic anhydrides of dicarboxylic acids, and optionally of a compound (v) selected from the group consisting of cyclic mono- or diesters. The present invention further relates to a process for adhesive bonding with use of the polyurethane adhesive of the invention, to an item adhesive-bonded with the use of the polyurethane adhesive, and to the use of said item in the construction of wind turbines.
摘要翻译：本发明涉及包含异氰酸酯组分A和多元醇组分B的聚氨酯粘合剂，其中异氰酸酯组分A包含至少一种二异氰酸酯或多异氰酸酯，多元醇组分B包含蓖麻油或蓖麻油酸的混合物的烷氧基化产物）和芳族二元或多元醇（ii）的OH官能化合物和具有1至8个（iii）的脂族键合的OH基团和OH官能团的OH-官能化合物，以及任选的化合物（iv），选自由二羧酸的环酸酐和任选的选自环状单或二酯的化合物（v）组成的组。本发明还涉及使用本发明的聚氨酯粘合剂与使用聚氨酯粘合剂粘合的物品以及所述物品在风力涡轮机结构中的用途的粘合方法。

5. 发明申请

US20160229965A1 STRUCTURAL HANDLING FILM 审中-公开
标题翻译：结构处理电影
公开(公告)号：US20160229965A1
公开(公告)日：2016-08-11
申请号：US14872249
申请日：2015-10-01
申请人： Zephyros, Inc.
发明人： Craig Chmielewski , Brandon Madaus , Dawn Dombrowski
IPC分类号： C08J5/18 , C09J7/02
CPC分类号： C08J5/18 , C08G2650/56 , C08J2363/00 , C08J2409/02 , C08J2433/10 , C08J2463/00 , C08L71/00 , C09D171/00 , C09J7/10 , C09J7/25 , C09J2201/134 , C09J2201/36 , C09J2201/606 , C09J2201/61 , C09J2413/00 , C09J2413/006 , C09J2463/00 , C09J2463/006 , C09J2479/02 , C09J2479/026 , C08L9/02 , C08L63/00
摘要： A handling film to be applied to an adhesive, wherein the handling film comprises a polyhydroxyamino ether thermoplastic, a monofunctional epoxy, and a carboxylated nitrile butadiene elastomer.
摘要翻译：一种应用于粘合剂的处理膜，其中处理膜包括多羟基氨基醚热塑性塑料，单官能环氧树脂和羧化腈丁二烯弹性体。

6. 发明授权

US09233495B2 Sheet for forming hard coating 有权
标题翻译：用于形成硬涂层的板
公开(公告)号：US09233495B2
公开(公告)日：2016-01-12
申请号：US13496074
申请日：2011-02-09
申请人： Yun-Bong Kim , Won-Kook Kim , Dong-Joo Gwon , Yang-Gu Kang , Jin-Woo Kim , Mu-Seon Ryu
发明人： Yun-Bong Kim , Won-Kook Kim , Dong-Joo Gwon , Yang-Gu Kang , Jin-Woo Kim , Mu-Seon Ryu
IPC分类号： B32B9/04 , B32B27/38 , B29C65/54 , B29C45/14 , C08J7/04 , C09J7/02 , C09D133/06
CPC分类号： B29C45/14811 , B29K2995/0058 , B29K2995/0087 , C08G59/3209 , C08G59/4261 , C08G59/66 , C08J7/047 , C08J2300/24 , C09D133/06 , C09D163/10 , C09J7/29 , C09J2201/122 , C09J2463/006
摘要： The present invention relates to a sheet for forming a hard coating and a method of formation. The present invention can provide a transfer material or a surface protection sheet having a high index of refraction and superior physical properties, such as hardness, friction resistance, abrasion resistance, chemical resistance, transparency, luster, and the like, for forming a hard coating on the surface of various molded products, including resin molded products or wood products, and a method for forming a hard coating from such transfer material or surface protection sheets.
摘要翻译：本发明涉及用于形成硬涂层的片材和形成方法。本发明可以提供一种转印材料或表面保护片，其具有高的折射率和优异的物理性质，例如硬度，摩擦阻力，耐磨性，耐化学性，透明性，光泽等，用于形成硬涂层在各种模制产品的表面上，包括树脂模制产品或木制品，以及从这种转印材料或表面保护片形成硬涂层的方法。

7. 发明申请

US20140370265A1 COMPOSITION FOR PREPARING A BONDING MATERIAL AND USES THEREOF 审中-公开
标题翻译：用于制备粘合材料的组合物及其用途
公开(公告)号：US20140370265A1
公开(公告)日：2014-12-18
申请号：US14345100
申请日：2012-09-12
申请人： 3M INNOVATIVE PROPERTIES COMPANY
发明人： Justina S. Lee , Hyung-Jin Song , Andrew J. Ouderkirk , David J. Plaut
IPC分类号： C09J7/02 , C09J163/00 , C09J133/14 , B32B7/12 , B32B33/00
CPC分类号： B32B33/00 , B32B7/12 , B32B2250/02 , B32B2255/26 , B32B2405/00 , B32B2457/08 , C08F2220/1841 , C09J4/06 , C09J5/06 , C09J7/22 , C09J7/28 , C09J7/35 , C09J133/04 , C09J133/14 , C09J163/00 , C09J2201/122 , C09J2203/326 , C09J2433/00 , C09J2433/006 , C09J2463/00 , C09J2463/006 , H05K3/386 , H05K2201/0209 , Y10T428/2804 , Y10T428/287 , Y10T428/31515
摘要： The present invention discloses a composition for preparing a bonding material for use in a circuit board comprising a polymerizable acrylate system and a curable epoxy resin system, the composition being photocurable. The present invention also provides a circuit board comprising the bonding material.
摘要翻译：本发明公开了一种用于制备用于包含可聚合丙烯酸酯体系和可固化环氧树脂体系的电路板的接合材料的组合物，该组合物是可光固化的。本发明还提供一种包括接合材料的电路板。

8. 发明申请

US20140248488A1 4-METHYL-1-PENTENE POLYMER, RESIN COMPOSITION CONTAINING 4-METHYL-1-PENTENE POLYMER, MASTERBATCH THEREOF, AND FORMED PRODUCT THEREOF 审中-公开
标题翻译： 4-甲基-1-丁烯聚合物，含有4-甲基-1-丁烯聚合物的树脂组合物，其主要成分及其形成的产品
公开(公告)号：US20140248488A1
公开(公告)日：2014-09-04
申请号：US14274581
申请日：2014-05-09
申请人： Mitsui Chemicals, Inc.
发明人： Kuniaki KAWABE , Masayoshi Sutou , Toshiyuki Itou , Mai Kurihara , Akinori Etoh , Shinichirou Asao , Kenji Sugimura , Hiroshi Hoya , Koji Matsunaga , Yoji Hayakawa , Kunihiko Mizumoto
IPC分类号： C08F10/14 , C08J5/18 , C08L23/06 , C08L23/12 , C08L77/02
CPC分类号： C08F10/14 , C08F210/14 , C08J3/226 , C08J5/18 , C08J2323/02 , C08J2323/06 , C08J2323/12 , C08J2367/00 , C08J2369/00 , C08J2377/00 , C08J2377/02 , C08J2423/20 , C08L23/00 , C08L23/06 , C08L23/12 , C08L23/20 , C08L23/22 , C08L63/00 , C08L67/00 , C08L69/00 , C08L77/00 , C08L77/02 , C08L2310/00 , C08L2666/06 , C09J7/22 , C09J2423/006 , C09J2463/006 , C09J2467/006 , C09J2469/006 , C09J2477/006 , Y10T428/28 , C08F210/06 , C08F2500/12
摘要： [Object] To provide a resin composition with excellent mold releasability and blocking resistance.[Solution] A resin composition containing a 4-methyl-1-pentene polymer includes 0.01 to 10 parts by mass of a 4-methyl-1-pentene polymer (B) per 100 parts by mass of at least one resin (A) selected from the group consisting of thermoplastic resins and thermosetting resins, wherein the 4-methyl-1-pentene polymer (B) has (B1) an intrinsic viscosity [η] of 0.01 or more but less than 0.50 dl/g measured at 135° C. in a decalin solvent.
摘要翻译：提供具有优异的脱模性和抗粘连性的树脂组合物。 [解决方案]含有4-甲基-1-戊烯聚合物的树脂组合物，相对于所选择的至少一种树脂（A），相对于每100质量份的所述4-甲基-1-戊烯类聚合物（B），含有0.01〜10质量份的4-甲基-1-戊烯类聚合物由热塑性树脂和热固性树脂组成的组合物，其中4-甲基-1-戊烯聚合物（B）的特性粘度[ηe]为135°时测得的0.01或更大但小于0.50dl / g C.在十氢化萘溶剂中。

9. 发明申请

US20130306221A1 SWELLING TAPE FOR FILLING GAP 有权
公开(公告)号：US20130306221A1
公开(公告)日：2013-11-21
申请号：US13949955
申请日：2013-07-24
申请人： Se Ra Kim , Suk Ky CHANG , Byung Kyu JUNG , Yoon Tae HWANG , Cha Hun KU , Sung Jong KIM , Se Woo YANG , Hyo Sook JOO , Min Soo PARK
发明人： Se Ra Kim , Suk Ky CHANG , Byung Kyu JUNG , Yoon Tae HWANG , Cha Hun KU , Sung Jong KIM , Se Woo YANG , Hyo Sook JOO , Min Soo PARK
IPC分类号： C09J7/02 , B32B37/02
CPC分类号： C09J7/241 , B32B27/285 , B32B27/308 , B32B27/36 , B32B27/38 , B32B27/40 , B32B37/02 , C09J7/22 , C09J7/245 , C09J7/25 , C09J7/26 , C09J7/29 , C09J133/08 , C09J2203/33 , C09J2401/006 , C09J2433/00 , C09J2433/006 , C09J2463/00 , C09J2463/006 , C09J2475/00 , C09J2475/006 , H01M2/10 , H01M4/04 , H01M6/005 , H01M10/02 , H01M10/04 , H01M10/0431 , H01M10/049 , Y10T29/49114 , Y10T428/24521 , Y10T428/28 , Y10T428/2852 , Y10T428/287 , Y10T428/2891
摘要： A swelling tape for filling a gap and a method of filling a gap are provided. The swelling tape can be applied within the gap having a fluid to realize a 3D shape thereby filling the gap, and be used to fix a subject forming the gap as necessary.

10. 发明申请

US20130078452A1 QUICK DRYING SEMI-SOLID GLUES 审中-公开
标题翻译：快速干燥半固体玻璃
公开(公告)号：US20130078452A1
公开(公告)日：2013-03-28
申请号：US13242733
申请日：2011-09-23
申请人： Tao Xie
发明人： Tao Xie
IPC分类号： B32B7/12 , C09J7/02 , B32B37/12 , B32B27/36 , B32B27/00 , B32B27/38 , B32B27/30 , B32B27/40 , B32B5/00 , B32B38/16
CPC分类号： C08J5/125 , B29C61/003 , B29C61/0616 , B29C65/482 , B29C65/5021 , B29C65/5057 , B29C65/522 , B29C65/523 , B29C65/526 , B29C66/45 , B29C66/71 , B29C66/73117 , B29C66/742 , B29C66/8322 , B32B1/00 , B32B7/04 , B32B27/38 , B32B2307/734 , C08J7/12 , C08J2363/00 , C08J2400/22 , C08L63/00 , C09J7/25 , C09J2463/006 , F16B11/006 , Y10T156/10 , Y10T428/265 , Y10T428/2813 , Y10T428/31504 , Y10T428/31511 , Y10T428/31551 , Y10T428/31786 , Y10T428/31855 , Y10T428/31935 , B29K2081/04 , B29K2075/00 , B29K2067/00 , B29K2063/00 , B29K2031/04 , B29K2029/04 , B29K2027/06 , B29K2023/083
摘要： An exemplary embodiment discloses a shape memory polymer material (SMP) including a glue material chemically grafted onto a surface of the SMP material wherein the SMP material is capable of transforming between a permanent shape and a temporary shape.
摘要翻译：一个示例性实施例公开了一种形状记忆聚合物材料（SMP），其包括化学接枝到SMP材料的表面上的胶料，其中SMP材料能够在永久形状和临时形状之间转变。

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