专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20180208801A1 ELECTROSTATIC DISSIPATIVE SURFACE COATING AND HIGH TEMPERATURE LABEL EMPLOYING SAME 审中-公开
公开(公告)号：US20180208801A1
公开(公告)日：2018-07-26
申请号：US15873534
申请日：2018-01-17
申请人： Polyonics, Inc.
发明人： Kenneth T. Robichaud , Donald P. Nieratko , Delilah F. Adams , Robert H. Guyette, JR.
IPC分类号： C09J7/40
CPC分类号： C09J7/401 , C08G59/4028 , C08K3/041 , C08K2201/001 , C09D163/00 , C09D163/04 , C09D171/12 , C09J7/29 , C09J2201/606 , C09J2203/334 , C09J2205/106 , C09J2463/006 , C09J2479/085 , C09J2479/086 , C08L71/12 , C08L63/00
摘要： An electrostatic dissipative coating composition comprises a phenoxy-epoxy resin system comprising from 40-80 parts by weight to 5-20 parts by weight of an epoxy resin. Carbon nanotubes are dispersed in the phenoxy-epoxy resin system. The coating composition includes at least one isocyanate crosslinking agent and at least one metal catalyst. In a further aspect, a label construction comprising the electrostatic dissipative coating composition is provided.

2. 发明申请

US20180179418A1 ADHERING SEALING MEMBRANES ONTO ELECTRICALLY CONDUCTIVE SUBSTRATES BY MEANS OF INDUCTION 审中-公开
公开(公告)号：US20180179418A1
公开(公告)日：2018-06-28
申请号：US15551585
申请日：2016-03-02
申请人： SIKA TECHNOLOGY AG
发明人： Matthias GÖSSI , Stefan KEISER , Josef LUSSI
IPC分类号： C09J5/06 , C09J7/24 , C09J7/35 , C09J5/08 , C08J9/10 , B32B37/06 , B32B37/12 , B32B15/08
CPC分类号： C09J5/06 , B32B15/08 , B32B37/06 , B32B37/1207 , B32B2037/1215 , C08J9/103 , C08J2203/04 , C08J2207/02 , C08J2331/04 , C08K5/23 , C09J5/08 , C09J7/22 , C09J7/245 , C09J7/35 , C09J2205/102 , C09J2205/114 , C09J2205/31 , C09J2423/00 , C09J2423/04 , C09J2427/006 , C09J2431/00 , C09J2463/006 , C09J2475/006 , E04D5/10 , E04D5/148 , E04D5/149 , E04F15/16 , E04F2201/07
摘要： A method for sealing a substrate having one or a number of electrically conductive surface regions, including the (i) arranging of a sealing membrane, having a plastic layer and an outer adhesive layer made of a melt adhesive, on the substrate, wherein the adhesive layer is facing towards the substrate, (ii) the positioning of an induction heating device over the sealing membrane, and (iii) heating the melt adhesive for the fusion or partial melting thereof by means of the inductive heating of the electrically conductive surface regions with the induction heating device, in order to adhere the sealing membrane to the substrate after cooling. The method facilitates the sealing of substrates with sealing membranes. Same is suitable, in particular, for sealing floors or ceilings or parts thereof.

3. 发明申请

US20170349789A1 SHEET ADHESIVE AND ADHESION PROCESS USING THE SAME 审中-公开
公开(公告)号：US20170349789A1
公开(公告)日：2017-12-07
申请号：US15603860
申请日：2017-05-24
申请人： THREE BOND CO., LTD.
发明人： Hiroshi KIMURA , Yoshihide ARAI
IPC分类号： C09J7/02 , C08K5/13 , C09J175/04 , C09J163/00 , C08K5/17
CPC分类号： C08K5/13 , C08K5/17 , C09J5/04 , C09J7/25 , C09J163/00 , C09J175/04 , C09J175/06 , C09J2201/61 , C09J2463/006 , C09J2475/006 , C08K5/3445 , C08L63/00
摘要： It has conventionally been difficult to achieve a sheet adhesive which adheres in a low temperature (from 20 to 90° C.), and has both of softness and high adhering strength. The present invention realizes a sheet adhesive capable of adhering in a low temperature (from 20 to 90° C.) which exhibits a high adhesiveness in spite of being a soft sheet of thin film, by forming a simulated multiple layer by using an elastomer as a substrate layer, and by forming a reactive layer by means of spraying or application.A sheet adhesive including a substrate layer and a reactive layer, wherein the substrate layer includes a component (A) and a component (B) below, and the reactive layer is formed with a liquid agent including a component (C) below in an amount of from 0.014 by mass to 45% by mass, component (A): a urethane elastomer, component (B): an epoxy resin, component (C): an amine compound and/or phenol compound.

4. 发明申请

US20160137892A1 HYDROPHOBIC POLYURETHANE ADHESIVE 有权
标题翻译：疏水性聚氨酯胶粘剂
公开(公告)号：US20160137892A1
公开(公告)日：2016-05-19
申请号：US14901138
申请日：2014-06-16
申请人： BASF SE
发明人： Berend ELING , Hans-Juergen REESE , Christian KOENIG , Patrick BOLZE
IPC分类号： C09J175/08 , C09J7/02 , C09J5/00
CPC分类号： C09J175/08 , C08G18/3206 , C08G18/3215 , C08G18/36 , C08G18/4891 , C09J5/00 , C09J7/25 , C09J175/04 , C09J175/06 , C09J2463/006 , C09J2475/00
摘要： The present invention relates to a polyurethane adhesive comprising an isocyanate component A and a polyol component B where the isocyanate component A comprises at least one diisocyanate or polyisocyanate and the polyol component B comprises the alkoxylation product of a mixture of castor oil or ricinoleic acid (i), of an aromatic di- or polyol (ii), and of an OH-functional compound having aliphatically bonded OH groups and OH-functionality of from 1 to 8 (iii), and also optionally of a compound (iv), selected from the group consisting of cyclic anhydrides of dicarboxylic acids, and optionally of a compound (v) selected from the group consisting of cyclic mono- or diesters. The present invention further relates to a process for adhesive bonding with use of the polyurethane adhesive of the invention, to an item adhesive-bonded with the use of the polyurethane adhesive, and to the use of said item in the construction of wind turbines.
摘要翻译：本发明涉及包含异氰酸酯组分A和多元醇组分B的聚氨酯粘合剂，其中异氰酸酯组分A包含至少一种二异氰酸酯或多异氰酸酯，多元醇组分B包含蓖麻油或蓖麻油酸的混合物的烷氧基化产物）和芳族二元或多元醇（ii）的OH官能化合物和具有1至8个（iii）的脂族键合的OH基团和OH官能团的OH-官能化合物，以及任选的化合物（iv），选自由二羧酸的环酸酐和任选的选自环状单或二酯的化合物（v）组成的组。本发明还涉及使用本发明的聚氨酯粘合剂与使用聚氨酯粘合剂粘合的物品以及所述物品在风力涡轮机结构中的用途的粘合方法。

5. 发明申请

US20140329061A1 Durable Hydrophilic Dry Adhesives with Hierarchical Structure and Method of Making 审中-公开
标题翻译：具有分层结构和制备方法的耐久亲水干粘合剂
公开(公告)号：US20140329061A1
公开(公告)日：2014-11-06
申请号：US13565295
申请日：2012-08-02
申请人： Jue Lu , Parviz Soroushian , Amirpasha Peyvandi
发明人： Jue Lu , Parviz Soroushian , Amirpasha Peyvandi
IPC分类号： C09J179/02 , C09J7/00 , B05D3/06
CPC分类号： C09J179/02 , B05D5/08 , B05D2201/02 , B05D2502/005 , B05D2503/00 , B05D2518/00 , B05D2518/10 , C09J7/00 , C09J2201/626 , C09J2423/106 , C09J2433/006 , C09J2463/006 , C09J2475/006 , C09J2479/023 , C09J2479/083 , C09J2483/006 , Y10T428/24851
摘要： Provided is a method of making durable hydrophilic and hierarchical structures containing nano and micro features used as dry adhesives. The method includes introduction of hydrophilic, nanostructured features on the micro-scale tips of fibrillar arrays through UV/Ozone (UVO) and oxygen plasma treatment; the method also includes further coating of the hierarchical structure with a polyelectrolyte via electrostatically-driven self-assembly to improve the hydrophilic stability of the treated fibril tip surfaces.
摘要翻译：提供了一种制备耐久的亲水和分层结构的方法，其包含用作干燥粘合剂的纳米和微观特征。该方法包括通过UV / Ozone（UVO）和氧等离子体处理在纤维阵列的微尺度尖端上引入亲水性，纳米结构特征; 该方法还包括通过静电驱动的自组装进一步用聚电解质涂覆层状结构，以改善经处理的原纤维末端表面的亲水稳定性。

6. 发明申请

US20140319497A1 PHOTOCURABLE ADHESIVE FILM FOR ORGANIC ELECTRONIC DEVICE SEAL, ORGANIC ELECTRONIC DEVICE, AND METHOD FOR SEALING SAME 有权
标题翻译：用于有机电子设备密封的有机粘合膜，有机电子器件及其密封方法
公开(公告)号：US20140319497A1
公开(公告)日：2014-10-30
申请号：US14263677
申请日：2014-04-28
申请人： LG CHEM, LTD.
发明人： Yoon Gyung CHO , Hyun Jee YOO , Jung Sup SHIM , Suk Ky CHANG
IPC分类号： H01L51/52 , C09J133/10
CPC分类号： H01L51/5253 , C08G18/003 , C08G18/6229 , C08G18/7642 , C08G59/68 , C08G2170/40 , C08L33/06 , C09J7/00 , C09J7/10 , C09J133/066 , C09J133/12 , C09J133/14 , C09J163/00 , C09J175/04 , C09J2203/326 , C09J2205/31 , C09J2433/00 , C09J2433/006 , C09J2463/00 , C09J2463/006 , H01L51/5246 , H01L51/5259 , C08F220/14 , C08F2220/1875 , C08F220/20
摘要： Provided are a photocurable pressure-sensitive adhesive composition including an acrylic polymer, an epoxy resin, and a cationic photopolymerization initiator, an organic electronic device having an encapsulant including a photocured product of the composition using a curable pressure-sensitive adhesive film which is a film-state product including the composition, and a method for manufacturing an organic electronic device using the curable pressure-sensitive adhesive film. Particularly, due to the method including laminating a photocurable pressure-sensitive adhesive film including a curable pressure-sensitive adhesive layer including an acrylic polymer, an epoxy resin, and a cationic photopolymerization initiator to an top substrate, and radiating light to an entire surface of the curable pressure-sensitive adhesive layer to perform photocuring, and laminating the photocured curable pressure-sensitive adhesive layer to a bottom substrate on which an organic light emitting element is formed to cover an entire surface of the organic light emitting element, mechanical strength and a simple process caused by photocuring to the organic light emitting element without direct light irradiation may be achieved, and a lifespan of the element may be increased.
摘要翻译：提供一种包含丙烯酸类聚合物，环氧树脂和阳离子光聚合引发剂的光固化型压敏粘合剂组合物，具有包含该组合物的光固化产物的密封剂的有机电子器件，该组合物使用作为膜的可固化压敏粘合剂膜包括该组合物的状态产品和使用该可固化压敏粘合剂膜的有机电子器件的制造方法。特别地，由于包括将包括丙烯酸类聚合物，环氧树脂和阳离子光聚合引发剂的可固化压敏粘合剂层的光固化性粘合剂膜层压到顶层基板上的方法，并且将光照射到可固化压敏粘合剂层进行光固化，并将光固化型可固化压敏粘合剂层层压到其上形成有机发光元件的底部基板上以覆盖有机发光元件的整个表面，机械强度和可以实现在没有直接光照射的情况下通过光固化到有机发光元件而引起的简单处理，并且可以增加元件的寿命。

7. 发明申请

US20140106207A1 SWELLING TAPE FOR FILLING GAP 审中-公开
标题翻译：填充胶带
公开(公告)号：US20140106207A1
公开(公告)日：2014-04-17
申请号：US14042187
申请日：2013-09-30
申请人： LG Chem, LTD.
发明人： Se Ra Kim , Suk Ky Chang , Hyo Sook Joo , Yoon Tae Hwang , Se Woo Yang , Joon Hyung Kim , Sung Jong Kim
IPC分类号： H01M2/10
CPC分类号： H01M2/1094 , C09J7/22 , C09J2201/28 , C09J2201/606 , C09J2203/33 , C09J2401/006 , C09J2433/006 , C09J2463/006 , C09J2475/006 , H01M2/14 , H01M2/16 , H01M2/347 , H01M10/0422 , H01M10/0431 , H01M10/049 , Y10T428/24802
摘要： A swelling tape for filling a gap, a method of manufacturing the swelling tape for filling a gap, a method of filling a gap, an electrode assembly and a secondary battery are provided. For example, the swelling tape can be applied inside a gap in which a fluid exists so as to fill the gap by becoming a 3D form, and can be useful at anchoring a subject in which the gap is formed, as necessary.
摘要翻译：提供用于填充间隙的膨胀带，制造用于填充间隙的膨胀带的方法，填充间隙的方法，电极组件和二次电池。例如，膨胀带可以应用在存在流体的间隙内，以便通过成为3D形状填充间隙，并且可以有必要根据需要锚定形成间隙的对象。

8. 发明申请

US20120244351A1 MULTILAYER RESIN SHEET AND METHOD FOR PRODUCING THE SAME, METHOD FOR PRODUCING CURED MULTILAYER RESIN SHEET, AND HIGHLY THERMALLY CONDUCTIVE RESIN SHEET LAMINATE AND METHOD FOR PRODUCING THE SAME 审中-公开
标题翻译：多层树脂片及其制造方法，固化多层树脂片的制造方法和高导热性树脂层压板及其制造方法
公开(公告)号：US20120244351A1
公开(公告)日：2012-09-27
申请号：US13498583
申请日：2010-09-28
申请人： Hideyuki Katagi , Yoshitaka Takezawa , Tomoo Nishiyama , Naoki Hara , Hiroyuki Tanaka , Kensuke Yoshihara , Masayoshi Joumen , Hiroyuki Takahashi
发明人： Hideyuki Katagi , Yoshitaka Takezawa , Tomoo Nishiyama , Naoki Hara , Hiroyuki Tanaka , Kensuke Yoshihara , Masayoshi Joumen , Hiroyuki Takahashi
IPC分类号： B32B7/10 , B32B37/12 , B29C39/12 , B29C35/08 , C09J179/08 , B32B15/088
CPC分类号： C09J177/00 , B32B7/02 , B32B7/12 , B32B15/088 , B32B15/092 , B32B27/08 , B32B27/20 , B32B27/26 , B32B27/28 , B32B27/34 , B32B27/38 , B32B2250/40 , B32B2264/10 , B32B2264/102 , B32B2307/206 , B32B2307/302 , B32B2307/304 , B32B2307/306 , B32B2457/00 , B32B2457/04 , B32B2457/20 , C08G59/621 , C08G73/14 , C08K3/013 , C08L63/00 , C08L2203/20 , C09J7/25 , C09J179/08 , C09J2461/00 , C09J2463/00 , C09J2463/006 , C09J2477/00 , C09J2479/086 , F21K9/00 , F21Y2115/10 , H01L23/051 , H01L23/145 , H01L23/49822 , H01L23/49833 , H01L24/33 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/07802 , H01L2924/12041 , H01L2924/12042 , H01L2924/1301 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , Y10T156/10 , Y10T428/28 , Y10T428/2896 , Y10T428/31522 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： A multilayer resin sheet is constituted by including a resin layer containing an epoxy resin having a mesogenic skeleton, a curing agent and an inorganic filler, and an insulating adhesive layer formed on at least either of the surfaces of the resin layer.A cured multilayer resin sheet originated from the multilayer resin sheet has high thermal conductivity, good insulation and adhesive strength, and, further, superior thermal shock resistance, and is suitable as an electric insulating material to be used for an electric or electronic device.
摘要翻译：多层树脂片通过包括含有介晶骨架的环氧树脂的树脂层，固化剂和无机填料以及形成在树脂层的至少任一表面上的绝缘粘合剂层构成。来自多层树脂片的固化多层树脂片具有高导热性，良好的绝缘性和粘合强度，并且还具有优异的耐热冲击性，并且适合用作电气或电子器件的电绝缘材料。

9. 发明申请

US20110311783A1 MULTILAYER ADHESIVE FOR THERMAL REVERSIBLE JOINING OF SUBSTRATES 有权
标题翻译：多层粘合剂用于热可逆接合基板
公开(公告)号：US20110311783A1
公开(公告)日：2011-12-22
申请号：US13220135
申请日：2011-08-29
申请人： Tao Xie , Xingcheng Xiao , Ruomiao Wang , Hamid G. Kia , Jessica A. Schroeder , Todd E. Durocher
发明人： Tao Xie , Xingcheng Xiao , Ruomiao Wang , Hamid G. Kia , Jessica A. Schroeder , Todd E. Durocher
IPC分类号： B32B3/00 , B32B7/12
CPC分类号： B32B27/12 , B32B7/12 , C09J5/06 , C09J7/35 , C09J163/00 , C09J2201/128 , C09J2463/00 , C09J2463/006 , Y10T428/24612 , Y10T428/24628 , Y10T428/24744 , Y10T428/24942 , Y10T428/28 , Y10T428/2848 , Y10T428/2861 , Y10T428/287 , Y10T428/31511 , Y10T428/3154 , Y10T428/31678
摘要： One embodiment of the invention includes a multilayer dry adhesive system capable of reversible joining of rigid substrates.
摘要翻译：本发明的一个实施方案包括能够刚性接合刚性基材的多层干燥粘合剂体系。

10. 发明授权

US06852409B2 Radiation-cured correction tape 失效
标题翻译：辐射固化矫正胶带
公开(公告)号：US06852409B2
公开(公告)日：2005-02-08
申请号：US10071497
申请日：2002-02-08
申请人： Creg G. Bradley , Peter D. Gabriele , Teresa B. Hopper , Michael T. Nowak
发明人： Creg G. Bradley , Peter D. Gabriele , Teresa B. Hopper , Michael T. Nowak
IPC分类号： B32B27/16 , B32B27/00 , C09J7/02
CPC分类号： C09J7/22 , C09J7/38 , C09J2433/00 , C09J2463/00 , C09J2463/006 , Y10T428/14 , Y10T428/1452 , Y10T428/1467 , Y10T428/1471 , Y10T428/1476 , Y10T428/28 , Y10T428/2809 , Y10T428/2848
摘要： A multilayer pressure sensitive correction tape useful for masking handwritten and/or printed characters comprising a release liner, a masking layer and a pressure sensitive adhesive layer, wherein at least one of the layers is cured by radiation. In a preferred embodiment of the invention, the masking layer and pressure sensitive adhesive layer comprise formulations of reactive monomers or oligomers which are radiation-cured after the formulations are applied to the correction tape assembly. In a more preferred embodiment of the invention the masking layer and pressure sensitive adhesive layer formulations contain no volatile solvents when these formulations are applied to the correction tape assembly. The radiation-cured layers are essentially insoluble in organic solvents and water, and the radiation-cured layers exhibit improved film toughness and improved resistance to ink “bleed through”. Additionally, the present invention is directed to a process for making such a multilayer correction tape having at least one radiation cured layer.
摘要翻译：一种用于掩蔽包含释放衬垫，掩蔽层和压敏粘合剂层的手写和/或印刷字符的多层压敏校正带，其中至少一层通过辐射固化。在本发明的优选实施方案中，掩蔽层和压敏粘合剂层包含反应性单体或低聚物的制剂，其在配制剂施用于校正带组件之后被辐射固化。在本发明的更优选的实施方案中，当将这些制剂施用于校正带组件时，掩蔽层和压敏粘合剂层配方不含挥发性溶剂。辐射固化层基本上不溶于有机溶剂和水，并且辐射固化层表现出改善的膜韧性和改善的耐油墨“渗透”性。另外，本发明涉及制造这种具有至少一个辐射固化层的多层校正带的方法。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式