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    • 6. 发明申请
    • HEAT-CURABLE POWDER COATING COMPOSITION
    • 热固性粉末涂料组合物
    • US20110274833A1
    • 2011-11-10
    • US13127261
    • 2009-11-06
    • Johan F.G.A. JansenLeendert Jan MolhoekJan Pieter Drijfhout
    • Johan F.G.A. JansenLeendert Jan MolhoekJan Pieter Drijfhout
    • B05D1/00B05D7/06B05D3/02C09D167/03C09D133/06
    • B05D1/06C08J7/047C08J2467/06C08K5/0025C08K5/10C09D5/03C09D5/033C09D5/036C09D167/06C08L2666/18
    • The invention relates to a one component heat curable powder coating composition system for being cured at a temperature from 60 to 130° C. comprising: a thermal initiation system and a resin system, wherein the reactivity of the thermal initiation system is such that the thermal initiation system provides a geltime between 2.5 and 1000 minutes at 60° C. in butane diol-dimethacrylate as measured according to DIN 16945 using 1 wt % of the thermal initiation system in 99 wt % of butane diol-dimethacrylate, wherein the amount of thermal initiation system is chosen such that when the powder coating composition is applied to a substrate and cured at a temperature of 130° C. for 20 minutes, the coating resists at least 50 acetone double rubs, wherein the resin system comprises a resin and a co-crosslinker, wherein the resin contains reactive unsaturations and wherein said reactive unsaturations are carbon carbon double bonds connected directly to an electron withdrawing group, wherein the co-crosslinker is chosen from methacrylates, vinyl esters, vinyl ethers, vinyl amides, alkyne ethers, alkyne esters, alkyne amides, alkyne amines, propargyl ethers, propargyl ethers, propargyl esters, itaconates, enamines and mixtures thereof, wherein the weight per unsaturation in the resin system is between 100 and 1000 g/mole as determined using 1H NMR.
    • 本发明涉及一种在60至130℃的温度下固化的单组分可热固化粉末涂料组合物体系,包括:热引发体系和树脂体系,其中热引发体系的反应性使得热 引发体系在丁二醇 - 二甲基丙烯酸酯中在60℃下提供2.5至1000分钟的凝胶时间,其根据DIN 16945测量,其使用在99重量%丁二醇 - 二甲基丙烯酸酯中的1重量%的热引发体系,其中热量 选择引发体系,使得当将粉末涂料组合物施加到基材上并在130℃的温度下固化20分钟时,涂层抗拒至少50次丙酮双摩擦,其中树脂体系包含树脂和共混物 - 交联剂,其中所述树脂含有反应性不饱和度,并且其中所述反应性不饱和度是直接连接到吸电子基团的碳碳双键,其中 共交联剂选自甲基丙烯酸酯,乙烯基酯,乙烯基醚,乙烯基酰胺,炔烃,炔烃,炔烃,炔烃,炔丙基醚,炔丙基醚,炔丙基酯,衣康酸酯,烯胺和其混合物,其中每个不饱和度 在树脂体系中,使用1 H NMR确定为100〜1000g / mol。