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    • 10. 发明授权
    • Back grinding sheet
    • 背面磨片
    • US09443751B2
    • 2016-09-13
    • US14430647
    • 2013-09-17
    • LINTEC CORPORATION
    • Tomochika TominagaKazuyuki Tamura
    • H01L21/683C09D133/14C09J7/02
    • H01L21/6836C08G18/6229C08G18/672C08G18/8116C08G2170/40C08K5/37C09D133/14C09J7/29C09J175/16C09J2201/606C09J2201/622C09J2203/326C09J2205/102C09J2433/00C09J2433/001C09J2433/006C09J2475/00C09J2475/006H01L2221/68327H01L2221/6834Y10T428/24826Y10T428/2848
    • The present invention relates to a back grinding sheet (BG sheet) (1a, 1b, 1c) having an unevenness-absorbing layer (12) on a substrate (11), in which the unevenness-absorbing layer is a layer formed of a film-forming composition containing (A) a urethane (meth)acrylate and (B) a polymerizable monomer except component (A) and the layer satisfies the following requirements (a) to (c): (a) a loss tangent at 70° C. measured at a frequency of 1 Hz is 1.5 or more, (b) a relaxation rate 300 seconds after a square (1 cm×1 cm) of the unevenness-absorbing layer is compressed at 25° C. and a compressive load of 10 N is 30% or less, and (c) a storage elastic modulus at 25° C. measured at a frequency of 1 Hz is 1.0 to 10.0 MPa. The BG sheet of the present invention has excellent absorptivity of uneven portions such as bumps in a semiconductor wafer and can suppress formation of gaps between bumps and the BG sheet and simultaneously suppress a phenomenon where the resin layer (unevenness-absorbing layer) of a BG sheet oozes from the edges of a roll when the BG sheet is wound up in the form of roll.
    • 本发明涉及在基板(11)上具有凹凸吸收层(12)的背面研磨片(BG片)(1a,1b,1c),其中,所述不平坦性吸收层是由膜形成的层 (A)氨基甲酸酯(甲基)丙烯酸酯和(B)除了组分(A)之外的可聚合单体和该层的组合物满足以下要求(a)至(c):(a)70℃下的损耗角正切 以1Hz的频率测量为1.5以上,(b)在25℃下压缩不平坦吸收层的正方形(1cm×1cm)后的弛豫速度300秒,压缩载荷10 N为30%以下,(c)以1Hz的频率测定的25℃下的储能弹性模量为1.0〜10.0MPa。 本发明的BG片材具有对半导体晶片中的凸块等不均匀部分的吸收性优异,并且可以抑制凸块与BG片材之间的间隙的形成,同时抑制BG的树脂层(凹凸吸收层)的现象 当BG片以卷的形式卷绕时,片从辊的边缘渗出。