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1. 发明授权

US09280727B2 Information processing unit, printing control method for printer driver, and computer program product 有权
标题翻译：信息处理单元，打印机驱动程序的打印控制方法和计算机程序产品
公开(公告)号：US09280727B2
公开(公告)日：2016-03-08
申请号：US14597775
申请日：2015-01-15
申请人： Yuu Yamashita , Megumi Okumura , Yusuke Kawatsu , Ken Mitsui , Kanna Iinuma , Naoyuki Urata , Yukihiro Hayakawa , Masahiro Fukuda , Kenichi Fujioka , Teruyoshi Yamamoto , Akira Teruya
发明人： Yuu Yamashita , Megumi Okumura , Yusuke Kawatsu , Ken Mitsui , Kanna Iinuma , Naoyuki Urata , Yukihiro Hayakawa , Masahiro Fukuda , Kenichi Fujioka , Teruyoshi Yamamoto , Akira Teruya
IPC分类号： G06K15/00 , H04N1/00 , H04N1/50 , G06K15/02 , G06F3/12
CPC分类号： G06K15/005 , G06F3/1204 , G06F3/1257 , G06F3/1285 , G06K15/1848 , H04N1/00204 , H04N1/50 , H04N1/6072 , H04N2201/0094
摘要： A information processing unit includes: a control unit configured to control operation processing of individual units through a user interface; a print set value storage unit configured to store a print set value that is set by operation of an operation unit on a basic setting screen displayed on a display unit on which setting relating to the color printing is performed at a basic level and a print detail set value that is set by operation of the operation unit on a detail setting screen as another dialog on which the setting is performed at a detail level under operation control of the control unit; and a print data creating unit configured to create print data of the color printing based on the print set value and the print detail set value under operation control of the control unit.
摘要翻译：信息处理单元包括：控制单元，被配置为通过用户界面来控制各个单元的操作处理; 打印设定值存储单元，其被配置为将基于操作单元的操作设置的打印设定值存储在基本设置画面上，所述基本设定画面显示在与彩色打印有关的设定的基本设置画面上，通过操作单元的操作在细节设置屏幕上设置的设置值作为在控制单元的操作控制下在细节级执行设置的另一个对话框; 以及打印数据生成单元，被配置为基于所述控制单元的操作控制下的所述打印设定值和所述打印细节设定值来创建所述彩色打印的打印数据。

2. 发明申请

US20130003098A1 PRINTER DRIVER 有权
标题翻译：打印机驱动程序
公开(公告)号：US20130003098A1
公开(公告)日：2013-01-03
申请号：US13534197
申请日：2012-06-27
申请人： Yukihiro Hayakawa , Naoyuki Urata , Kanna Iinuma , Kenichi Fujioka , Hiroyuki Abiru , Teruyoshi Yamamoto , Ken Mitsui , Yuu Yamashita
发明人： Yukihiro Hayakawa , Naoyuki Urata , Kanna Iinuma , Kenichi Fujioka , Hiroyuki Abiru , Teruyoshi Yamamoto , Ken Mitsui , Yuu Yamashita
IPC分类号： G06K15/02
CPC分类号： G06F3/1205 , G06F3/1243 , G06F3/1254 , G06F3/1257 , G06F2206/1514
摘要： In a printer driver, combinations of standard print conditions and standard render data are saved as standard patterns, and combinations of standard print conditions and standard render data used for exceptional settings are saved as print application patterns. The print application patterns and the standard patterns are associated with each other. When printing document data, print condition data and render data are spooled by each page, the standard print conditions and the standard render data are compared, and a most similar standard pattern is detected. The print application pattern corresponding to the detected standard pattern is referred to, and print conditions are generated by combining standard print conditions and print conditions of the document data for each page. From the render data of the document data or from the standard render data, print data that can be processed by the printer is generated.
摘要翻译：在打印机驱动程序中，将标准打印条件和标准渲染数据的组合保存为标准模式，并将标准打印条件和用于异常设置的标准渲染数据的组合保存为打印应用程序模式。打印应用程序模式和标准模式相互关联。当打印文档数据时，打印条件数据和渲染数据由每页打印，比较标准打印条件和标准渲染数据，并且检测到最相似的标准图案。参照对应于检测到的标准图案的打印应用程序模式，并且通过组合每页的文档数据的标准打印条件和打印条件来生成打印条件。从文档数据的渲染数据或标准渲染数据，生成可由打印机处理的打印数据。

3. 发明授权

US08842338B2 Printer driver 有权
标题翻译：打印机驱动程序
公开(公告)号：US08842338B2
公开(公告)日：2014-09-23
申请号：US13534197
申请日：2012-06-27
申请人： Yukihiro Hayakawa , Naoyuki Urata , Kanna Iinuma , Kenichi Fujioka , Hiroyuki Abiru , Teruyoshi Yamamoto , Ken Mitsui , Yuu Yamashita
发明人： Yukihiro Hayakawa , Naoyuki Urata , Kanna Iinuma , Kenichi Fujioka , Hiroyuki Abiru , Teruyoshi Yamamoto , Ken Mitsui , Yuu Yamashita
IPC分类号： G06F15/00 , G06F3/12 , G06K15/00 , G06K15/02
CPC分类号： G06F3/1205 , G06F3/1243 , G06F3/1254 , G06F3/1257 , G06F2206/1514
摘要： In a printer driver, combinations of standard print conditions and standard render data are saved as standard patterns, and combinations of standard print conditions and standard render data used for exceptional settings are saved as print application patterns. The print application patterns and the standard patterns are associated with each other. When printing document data, print condition data and render data are spooled by each page, the standard print conditions and the standard render data are compared, and a most similar standard pattern is detected. The print application pattern corresponding to the detected standard pattern is referred to, and print conditions are generated by combining standard print conditions and print conditions of the document data for each page. From the render data of the document data or from the standard render data, print data that can be processed by the printer is generated.
摘要翻译：在打印机驱动程序中，将标准打印条件和标准渲染数据的组合保存为标准模式，并将标准打印条件和用于异常设置的标准渲染数据的组合保存为打印应用程序模式。打印应用程序模式和标准模式相互关联。当打印文档数据时，打印条件数据和渲染数据由每页打印，比较标准打印条件和标准渲染数据，并且检测到最相似的标准图案。参照对应于检测到的标准图案的打印应用程序模式，并且通过组合每页的文档数据的标准打印条件和打印条件来生成打印条件。从文档数据的渲染数据或标准渲染数据，生成可由打印机处理的打印数据。

4. 发明授权

US07244370B2 Method for producing circuit substrate 失效
标题翻译：电路基板的制造方法
公开(公告)号：US07244370B2
公开(公告)日：2007-07-17
申请号：US10910271
申请日：2004-08-04
申请人： Keiichi Sasaki , Masato Kamiichi , Yukihiro Hayakawa , Ershad Ali Chowdhury
发明人： Keiichi Sasaki , Masato Kamiichi , Yukihiro Hayakawa , Ershad Ali Chowdhury
IPC分类号： G01D15/00 , G11B5/127 , H01B13/00
CPC分类号： H05K1/167 , B41J2/14072 , B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1642 , B41J2/1643 , B41J2/1646 , H05K1/09 , H05K3/06 , H05K3/067 , H05K2201/0317 , H05K2203/0361
摘要： In order to provide a circuit substrate with a satisfactory step coverage by the protective layer and the anti-cavitation film in an edge portion of wirings and a liquid discharge head utilizing such circuit substrate, the invention provides a method for producing a circuit substrate provided, on an insulating surface of a substrate, with a plurality of elements each including a resistive layer and a pair of electrodes formed with a predetermined spacing on said resistive layer, including a step of forming an aluminum electrode wiring layer on the resistive layer, a step of isolating the electrode wiring layer by dry etching into each element, and a step of forming the electrode wiring into a tapered cross section with an etching solution containing phosphoric acid, nitric acid and a chelating agent capable of forming a complex with the wiring metal.
摘要翻译：为了通过利用这种电路基板的布线边缘部分中的保护层和防空穴膜提供令人满意的阶梯覆盖的电路基板，本发明提供一种制造电路基板的方法，在基板的绝缘表面上，多个元件各自包括电阻层和在所述电阻层上以预定间隔形成的一对电极，包括在电阻层上形成铝电极布线层的步骤，步骤通过干蚀刻将电极配线层隔离成各元件，以及通过含有与配线金属形成络合物的磷酸，硝酸和螯合剂的蚀刻液将电极配线形成为锥形截面的工序。

5. 发明申请

US20060068570A1 Structure with through hole, production method thereof, and liquid discharge head 有权
公开(公告)号：US20060068570A1
公开(公告)日：2006-03-30
申请号：US11272869
申请日：2005-11-15
申请人： Yukihiro Hayakawa , Genzo Momma , Masato Kamiichi
发明人： Yukihiro Hayakawa , Genzo Momma , Masato Kamiichi
IPC分类号： H01L21/20
CPC分类号： B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1642 , H01L23/481 , H01L29/0657 , H01L2924/0002 , H01L2924/00
摘要： A structure is constructed having a through hole in a substrate of silicon or the like by a decreased number of steps in production and with improved reliability. A silicon nitride film is formed in contact with an upper surface of a silicon oxide film at least on a portion of the substrate near the edge of a through hole, thereby improving step coverage of the silicon nitride film. The silicon oxide film and silicon nitride film function as a membrane during formation of the through hole by etching from the back side of the substrate.

6. 发明申请

US20050078152A1 Circuit board and liquid discharging apparatus 有权
标题翻译：电路板和液体排放装置
公开(公告)号：US20050078152A1
公开(公告)日：2005-04-14
申请号：US10968901
申请日：2004-10-21
申请人： Keiichi Sasaki , Masato Kamiichi , Ershad Chowdhury , Yukihiro Hayakawa
发明人： Keiichi Sasaki , Masato Kamiichi , Ershad Chowdhury , Yukihiro Hayakawa
IPC分类号： B41J2/05 , H01C17/065 , H01C17/28 , H05K1/16 , H05K3/02
CPC分类号： H01C17/065 , H01C17/281 , H05K1/167 , H05K3/02 , Y10T29/49126
摘要： A circuit board for a liquid discharging apparatus in which coating performance of a protective layer and a cavitation resistive film on a heat generating element is excellent and durability is excellent and a manufacturing method of such a circuit board are provided. A surface portion of a wiring material layer is processed so that an etching speed of the surface portion is made higher than that of the material forming the wiring material layer. It is desirable to execute a process for forming at least one selected from a fluoride, a chloride, and a nitride of the material forming the wiring material layer into the surface portion of the wiring material layer.
摘要翻译：一种用于液体排放装置的电路板，其中发热元件上的保护层和空穴电阻膜的涂层性能优异且耐久性优异，并且提供了这种电路板的制造方法。处理布线材料层的表面部分，使得表面部分的蚀刻速度高于形成布线材料层的材料的蚀刻速度。期望的是，将形成布线材料层的材料的氟化物，氯化物和氮化物中的至少一种形成到布线材料层的表面部分中。

7. 发明授权

US6143190A Method of producing a through-hole, silicon substrate having a through-hole, device using such a substrate, method of producing an ink-jet print head, and ink-jet print head 失效
标题翻译：通孔的制造方法，具有通孔的硅基板，使用该基板的装置，喷墨打印头的制造方法以及喷墨打印头
公开(公告)号：US6143190A
公开(公告)日：2000-11-07
申请号：US967732
申请日：1997-11-12
申请人： Takayuki Yagi , Junichi Kobayashi , Yasushi Kawasumi , Genzo Momma , Kenji Makino , Kei Fujita , Yasushi Matsuno , Yukihiro Hayakawa , Masahiro Takizawa
发明人： Takayuki Yagi , Junichi Kobayashi , Yasushi Kawasumi , Genzo Momma , Kenji Makino , Kei Fujita , Yasushi Matsuno , Yukihiro Hayakawa , Masahiro Takizawa
IPC分类号： B41J2/05 , B41J2/16 , B81B3/00 , B81C1/00 , G01B21/30 , G01N37/00 , G01Q60/38 , G01Q70/16 , H01L21/28 , H01L21/302 , H01L21/306 , H01L21/3065 , B44C1/22
CPC分类号： B81C1/00087 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1639 , B41J2/1642 , B41J2/1646 , B41J2202/13 , B81B2201/052
摘要： The invention provides a method of producing a through-hole, a substrate used to produce a through-hole, a substrate having a through-hole, and a device using such a through-hole or a substrate having such a through-hole, which are characterized in that: a through-hole can be produced only by etching a silicon substrate from its back side; the opening length d can be precisely controlled to a desired value regardless of the variations in the silicon wafer thickness, and the orientation flat angle, and also regardless of the type of a silicon crystal orientation-dependent anisotropic etchant employed; high productivity, high production reproducibility, and ease of production can be achieved; a high-liberality can be achieved in the shape of the opening end even if temperature treatment is performed at a high temperature for a long time; and a high-precision through-hole can be produced regardless of the shape of a device formed on the surface of a substrate.
摘要翻译：本发明提供一种制造通孔的方法，用于制造通孔的基板，具有通孔的基板以及使用这种通孔的装置或具有这种通孔的基板，其中其特征在于：只能通过从其背面蚀刻硅衬底来制造通孔; 无论硅晶片厚度和取向平面角度的变化如何，也可以将开口长度d精确地控制到期望值，并且不管所采用的取决于硅晶体取向的各向异性蚀刻剂的类型如何; 可以实现高生产率，高生产重现性和易生产性; 即使长时间在高温下进行温度处理，也可以在开口形状中实现高自由度; 并且可以产生高精度通孔，而不管形成在基板表面上的器件的形状如何。

8. 发明申请

US20090073228A1 THROUGH-HOLE FORMING METHOD, INKJET HEAD, AND SILICON SUBSTRATE 失效
标题翻译：通孔形成方法，喷头和硅基板
公开(公告)号：US20090073228A1
公开(公告)日：2009-03-19
申请号：US12197499
申请日：2008-08-25
申请人： Keiichi Sasaki , Yukihiro Hayakawa
发明人： Keiichi Sasaki , Yukihiro Hayakawa
IPC分类号： B41J2/015 , H01L21/00 , H01L23/58
CPC分类号： H01L21/308 , B41J2/1603 , B41J2/1629 , B41J2/1631 , B41J2/1642 , B41J2202/13 , H01L29/06
摘要： A through-hole forming method includes steps of forming a first impurity region (102a) around a region where a through-hole is to be formed in the first surface of a silicon substrate (101), the first impurity region (102) being higher in impurity concentration than the silicon substrate (101), forming a second impurity region (102b) at a position adjacent to the first impurity region (102a) in the depth direction of the silicon substrate (101), the second impurity region (102b) being higher in impurity concentration than the first impurity region (102a), forming an etch stop layer (103) on the first surface, forming an etch mask layer (104) having an opening on the second surface of the silicon substrate (101) opposite to the first surface, and etching the silicon substrate (101) until at least the etch stop layer (103) is exposed via the opening.
摘要翻译：通孔形成方法包括以下步骤：在硅衬底（101）的第一表面中形成在要形成通孔的区域周围的第一杂质区域（102a），第一杂质区域（102）更高在所述硅衬底（101）的深度方向上与所述第一杂质区（102a）相邻的位置形成第二杂质区（102b），所述第二杂质区（102b）杂质浓度高于第一杂质区（102a），在第一表面上形成蚀刻停止层（103），形成在硅衬底（101）的第二表面上具有开口的蚀刻掩模层（104）并且蚀刻硅衬底（101），直到至少蚀刻停止层（103）经由开口露出。

9. 发明授权

US07055937B2 Heat generating resistant element film, substrate for ink jet head utilizing the same, ink jet head and ink jet apparatus 失效
标题翻译：耐发热元件膜，利用其的喷墨头用基板，喷墨头和喷墨装置
公开(公告)号：US07055937B2
公开(公告)日：2006-06-06
申请号：US10745607
申请日：2003-12-29
申请人： Hiroyuki Suzuki , Yukihiro Hayakawa , Yoshinori Kawasaki , Ichiro Saito , Sakai Yokoyama , Toshiyasu Sakai
发明人： Hiroyuki Suzuki , Yukihiro Hayakawa , Yoshinori Kawasaki , Ichiro Saito , Sakai Yokoyama , Toshiyasu Sakai
IPC分类号： B41J2/05
CPC分类号： B41J2/1603 , B41J2/14129 , B41J2/1604 , B41J2/1631 , B41J2/1642 , B41J2/1646
摘要： The invention provides a heat generating resistant element having a high durability and a high resistance suitable for constituting an electrothermal converting member in an ink jet head or an ink jet apparatus. There is employed, as the heat generating resistant element, a film constituted of Cr, Si and N, having a composition of Cr: 15 to 20 at. %, Si: 40 to 60 at. % and N: 20 to 45 at. %, which constitute 100 at. % or substantially 100 at. %.
摘要翻译：本发明提供一种具有高耐久性和高阻力的耐发热性元件，其适用于在喷墨头或喷墨装置中构成电热转换构件。作为耐发热性元素，使用由Cr，Si和N构成的膜，其组成为Cr：15〜20at。％，Si：40〜60at。％和N：20至45 at。％，构成100。％或大致100英寸％。

10. 发明申请

US20050031996A1 Method for producing circuit substrate 失效
标题翻译：电路基板的制造方法
公开(公告)号：US20050031996A1
公开(公告)日：2005-02-10
申请号：US10910271
申请日：2004-08-04
申请人： Keiichi Sasaki , Masato Kamiichi , Yukihiro Hayakawa , Ershad Chowdhury
发明人： Keiichi Sasaki , Masato Kamiichi , Yukihiro Hayakawa , Ershad Chowdhury
IPC分类号： B41J2/14 , B41J2/16 , G03F7/00 , H05K1/09 , H05K1/16 , H05K3/02 , H05K3/06 , H05K3/28
CPC分类号： H05K1/167 , B41J2/14072 , B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1642 , B41J2/1643 , B41J2/1646 , H05K1/09 , H05K3/06 , H05K3/067 , H05K2201/0317 , H05K2203/0361
摘要： In order to provide a circuit substrate with a satisfactory step coverage by the protective layer and the anti-cavitation film in an edge portion of wirings and a liquid discharge head utilizing such circuit substrate, the invention provides a method for producing a circuit substrate provided, on an insulating surface of a substrate, with a plurality of elements each including a resistive layer and a pair of electrodes formed with a predetermined spacing on said resistive layer, including a step of forming an aluminum electrode wiring layer on the resistive layer, a step of isolating the electrode wiring layer by dry etching into each element, and a step of forming the electrode wiring into a tapered cross section with an etching solution containing phosphoric acid, nitric acid and a chelating agent capable of forming a complex with the wiring metal.
摘要翻译：为了通过利用这种电路基板的布线边缘部分中的保护层和防空穴膜提供令人满意的阶梯覆盖的电路基板，本发明提供一种制造电路基板的方法，在基板的绝缘表面上，多个元件各自包括电阻层和在所述电阻层上以预定间隔形成的一对电极，包括在电阻层上形成铝电极布线层的步骤，步骤通过干蚀刻将电极配线层隔离成各元件，以及通过含有与配线金属形成络合物的磷酸，硝酸和螯合剂的蚀刻液将电极配线形成为锥形截面的工序。

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