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1. 发明授权

US07055937B2 Heat generating resistant element film, substrate for ink jet head utilizing the same, ink jet head and ink jet apparatus 失效
标题翻译：耐发热元件膜，利用其的喷墨头用基板，喷墨头和喷墨装置
公开(公告)号：US07055937B2
公开(公告)日：2006-06-06
申请号：US10745607
申请日：2003-12-29
申请人： Hiroyuki Suzuki , Yukihiro Hayakawa , Yoshinori Kawasaki , Ichiro Saito , Sakai Yokoyama , Toshiyasu Sakai
发明人： Hiroyuki Suzuki , Yukihiro Hayakawa , Yoshinori Kawasaki , Ichiro Saito , Sakai Yokoyama , Toshiyasu Sakai
IPC分类号： B41J2/05
CPC分类号： B41J2/1603 , B41J2/14129 , B41J2/1604 , B41J2/1631 , B41J2/1642 , B41J2/1646
摘要： The invention provides a heat generating resistant element having a high durability and a high resistance suitable for constituting an electrothermal converting member in an ink jet head or an ink jet apparatus. There is employed, as the heat generating resistant element, a film constituted of Cr, Si and N, having a composition of Cr: 15 to 20 at. %, Si: 40 to 60 at. % and N: 20 to 45 at. %, which constitute 100 at. % or substantially 100 at. %.
摘要翻译：本发明提供一种具有高耐久性和高阻力的耐发热性元件，其适用于在喷墨头或喷墨装置中构成电热转换构件。作为耐发热性元素，使用由Cr，Si和N构成的膜，其组成为Cr：15〜20at。％，Si：40〜60at。％和N：20至45 at。％，构成100。％或大致100英寸％。

2. 发明授权

US06964471B2 Heating resistor film, recording head substrate, recording head, and recording apparatus 有权
标题翻译：加热电阻膜，记录头基板，记录头和记录装置
公开(公告)号：US06964471B2
公开(公告)日：2005-11-15
申请号：US10270527
申请日：2002-10-16
申请人： Seiichi Tamura , Genzo Momma , Yukihiro Hayakawa , Yoshinori Kawasaki
发明人： Seiichi Tamura , Genzo Momma , Yukihiro Hayakawa , Yoshinori Kawasaki
IPC分类号： B41J2/05 , B41J2/14 , H01C7/00
CPC分类号： B41J2/14129 , B41J2202/03
摘要： To provide a heating resistor film having a sufficiently high durability to repetitive pulse applications, a recording head substrate including the heating resistor film, a recording head, and a recording apparatus. A heating resistor film that generates heat energy using currents flowing from a wire in a heat acting portion of a recording head substrate, is made of amorphous tantalum silicon nitride having a sheet resistance of 200 Ω/□ to 400 Ω/□, and has a thickness of 30 nm to 80 nm.
摘要翻译：为了提供对重复脉冲应用具有足够高的耐久性的加热电阻膜，包括加热电阻膜，记录头和记录装置的记录头基板。使用从记录头基板的热作用部分中的线流动的电流产生热能的加热电阻膜由具有200Ω/□至400Ω/□的薄层电阻的非晶态氮化钽氮化硅制成，并且具有厚度为30nm至80nm。

3. 发明授权

US08842338B2 Printer driver 有权
标题翻译：打印机驱动程序
公开(公告)号：US08842338B2
公开(公告)日：2014-09-23
申请号：US13534197
申请日：2012-06-27
申请人： Yukihiro Hayakawa , Naoyuki Urata , Kanna Iinuma , Kenichi Fujioka , Hiroyuki Abiru , Teruyoshi Yamamoto , Ken Mitsui , Yuu Yamashita
发明人： Yukihiro Hayakawa , Naoyuki Urata , Kanna Iinuma , Kenichi Fujioka , Hiroyuki Abiru , Teruyoshi Yamamoto , Ken Mitsui , Yuu Yamashita
IPC分类号： G06F15/00 , G06F3/12 , G06K15/00 , G06K15/02
CPC分类号： G06F3/1205 , G06F3/1243 , G06F3/1254 , G06F3/1257 , G06F2206/1514
摘要： In a printer driver, combinations of standard print conditions and standard render data are saved as standard patterns, and combinations of standard print conditions and standard render data used for exceptional settings are saved as print application patterns. The print application patterns and the standard patterns are associated with each other. When printing document data, print condition data and render data are spooled by each page, the standard print conditions and the standard render data are compared, and a most similar standard pattern is detected. The print application pattern corresponding to the detected standard pattern is referred to, and print conditions are generated by combining standard print conditions and print conditions of the document data for each page. From the render data of the document data or from the standard render data, print data that can be processed by the printer is generated.
摘要翻译：在打印机驱动程序中，将标准打印条件和标准渲染数据的组合保存为标准模式，并将标准打印条件和用于异常设置的标准渲染数据的组合保存为打印应用程序模式。打印应用程序模式和标准模式相互关联。当打印文档数据时，打印条件数据和渲染数据由每页打印，比较标准打印条件和标准渲染数据，并且检测到最相似的标准图案。参照对应于检测到的标准图案的打印应用程序模式，并且通过组合每页的文档数据的标准打印条件和打印条件来生成打印条件。从文档数据的渲染数据或标准渲染数据，生成可由打印机处理的打印数据。

4. 发明授权

US07244370B2 Method for producing circuit substrate 失效
标题翻译：电路基板的制造方法
公开(公告)号：US07244370B2
公开(公告)日：2007-07-17
申请号：US10910271
申请日：2004-08-04
申请人： Keiichi Sasaki , Masato Kamiichi , Yukihiro Hayakawa , Ershad Ali Chowdhury
发明人： Keiichi Sasaki , Masato Kamiichi , Yukihiro Hayakawa , Ershad Ali Chowdhury
IPC分类号： G01D15/00 , G11B5/127 , H01B13/00
CPC分类号： H05K1/167 , B41J2/14072 , B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1642 , B41J2/1643 , B41J2/1646 , H05K1/09 , H05K3/06 , H05K3/067 , H05K2201/0317 , H05K2203/0361
摘要： In order to provide a circuit substrate with a satisfactory step coverage by the protective layer and the anti-cavitation film in an edge portion of wirings and a liquid discharge head utilizing such circuit substrate, the invention provides a method for producing a circuit substrate provided, on an insulating surface of a substrate, with a plurality of elements each including a resistive layer and a pair of electrodes formed with a predetermined spacing on said resistive layer, including a step of forming an aluminum electrode wiring layer on the resistive layer, a step of isolating the electrode wiring layer by dry etching into each element, and a step of forming the electrode wiring into a tapered cross section with an etching solution containing phosphoric acid, nitric acid and a chelating agent capable of forming a complex with the wiring metal.
摘要翻译：为了通过利用这种电路基板的布线边缘部分中的保护层和防空穴膜提供令人满意的阶梯覆盖的电路基板，本发明提供一种制造电路基板的方法，在基板的绝缘表面上，多个元件各自包括电阻层和在所述电阻层上以预定间隔形成的一对电极，包括在电阻层上形成铝电极布线层的步骤，步骤通过干蚀刻将电极配线层隔离成各元件，以及通过含有与配线金属形成络合物的磷酸，硝酸和螯合剂的蚀刻液将电极配线形成为锥形截面的工序。

5. 发明申请

US20060068570A1 Structure with through hole, production method thereof, and liquid discharge head 有权
公开(公告)号：US20060068570A1
公开(公告)日：2006-03-30
申请号：US11272869
申请日：2005-11-15
申请人： Yukihiro Hayakawa , Genzo Momma , Masato Kamiichi
发明人： Yukihiro Hayakawa , Genzo Momma , Masato Kamiichi
IPC分类号： H01L21/20
CPC分类号： B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1642 , H01L23/481 , H01L29/0657 , H01L2924/0002 , H01L2924/00
摘要： A structure is constructed having a through hole in a substrate of silicon or the like by a decreased number of steps in production and with improved reliability. A silicon nitride film is formed in contact with an upper surface of a silicon oxide film at least on a portion of the substrate near the edge of a through hole, thereby improving step coverage of the silicon nitride film. The silicon oxide film and silicon nitride film function as a membrane during formation of the through hole by etching from the back side of the substrate.

6. 发明申请

US20050078152A1 Circuit board and liquid discharging apparatus 有权
标题翻译：电路板和液体排放装置
公开(公告)号：US20050078152A1
公开(公告)日：2005-04-14
申请号：US10968901
申请日：2004-10-21
申请人： Keiichi Sasaki , Masato Kamiichi , Ershad Chowdhury , Yukihiro Hayakawa
发明人： Keiichi Sasaki , Masato Kamiichi , Ershad Chowdhury , Yukihiro Hayakawa
IPC分类号： B41J2/05 , H01C17/065 , H01C17/28 , H05K1/16 , H05K3/02
CPC分类号： H01C17/065 , H01C17/281 , H05K1/167 , H05K3/02 , Y10T29/49126
摘要： A circuit board for a liquid discharging apparatus in which coating performance of a protective layer and a cavitation resistive film on a heat generating element is excellent and durability is excellent and a manufacturing method of such a circuit board are provided. A surface portion of a wiring material layer is processed so that an etching speed of the surface portion is made higher than that of the material forming the wiring material layer. It is desirable to execute a process for forming at least one selected from a fluoride, a chloride, and a nitride of the material forming the wiring material layer into the surface portion of the wiring material layer.
摘要翻译：一种用于液体排放装置的电路板，其中发热元件上的保护层和空穴电阻膜的涂层性能优异且耐久性优异，并且提供了这种电路板的制造方法。处理布线材料层的表面部分，使得表面部分的蚀刻速度高于形成布线材料层的材料的蚀刻速度。期望的是，将形成布线材料层的材料的氟化物，氯化物和氮化物中的至少一种形成到布线材料层的表面部分中。

7. 发明授权

US6143190A Method of producing a through-hole, silicon substrate having a through-hole, device using such a substrate, method of producing an ink-jet print head, and ink-jet print head 失效
标题翻译：通孔的制造方法，具有通孔的硅基板，使用该基板的装置，喷墨打印头的制造方法以及喷墨打印头
公开(公告)号：US6143190A
公开(公告)日：2000-11-07
申请号：US967732
申请日：1997-11-12
申请人： Takayuki Yagi , Junichi Kobayashi , Yasushi Kawasumi , Genzo Momma , Kenji Makino , Kei Fujita , Yasushi Matsuno , Yukihiro Hayakawa , Masahiro Takizawa
发明人： Takayuki Yagi , Junichi Kobayashi , Yasushi Kawasumi , Genzo Momma , Kenji Makino , Kei Fujita , Yasushi Matsuno , Yukihiro Hayakawa , Masahiro Takizawa
IPC分类号： B41J2/05 , B41J2/16 , B81B3/00 , B81C1/00 , G01B21/30 , G01N37/00 , G01Q60/38 , G01Q70/16 , H01L21/28 , H01L21/302 , H01L21/306 , H01L21/3065 , B44C1/22
CPC分类号： B81C1/00087 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1639 , B41J2/1642 , B41J2/1646 , B41J2202/13 , B81B2201/052
摘要： The invention provides a method of producing a through-hole, a substrate used to produce a through-hole, a substrate having a through-hole, and a device using such a through-hole or a substrate having such a through-hole, which are characterized in that: a through-hole can be produced only by etching a silicon substrate from its back side; the opening length d can be precisely controlled to a desired value regardless of the variations in the silicon wafer thickness, and the orientation flat angle, and also regardless of the type of a silicon crystal orientation-dependent anisotropic etchant employed; high productivity, high production reproducibility, and ease of production can be achieved; a high-liberality can be achieved in the shape of the opening end even if temperature treatment is performed at a high temperature for a long time; and a high-precision through-hole can be produced regardless of the shape of a device formed on the surface of a substrate.
摘要翻译：本发明提供一种制造通孔的方法，用于制造通孔的基板，具有通孔的基板以及使用这种通孔的装置或具有这种通孔的基板，其中其特征在于：只能通过从其背面蚀刻硅衬底来制造通孔; 无论硅晶片厚度和取向平面角度的变化如何，也可以将开口长度d精确地控制到期望值，并且不管所采用的取决于硅晶体取向的各向异性蚀刻剂的类型如何; 可以实现高生产率，高生产重现性和易生产性; 即使长时间在高温下进行温度处理，也可以在开口形状中实现高自由度; 并且可以产生高精度通孔，而不管形成在基板表面上的器件的形状如何。

8. 发明申请

US20090073228A1 THROUGH-HOLE FORMING METHOD, INKJET HEAD, AND SILICON SUBSTRATE 失效
标题翻译：通孔形成方法，喷头和硅基板
公开(公告)号：US20090073228A1
公开(公告)日：2009-03-19
申请号：US12197499
申请日：2008-08-25
申请人： Keiichi Sasaki , Yukihiro Hayakawa
发明人： Keiichi Sasaki , Yukihiro Hayakawa
IPC分类号： B41J2/015 , H01L21/00 , H01L23/58
CPC分类号： H01L21/308 , B41J2/1603 , B41J2/1629 , B41J2/1631 , B41J2/1642 , B41J2202/13 , H01L29/06
摘要： A through-hole forming method includes steps of forming a first impurity region (102a) around a region where a through-hole is to be formed in the first surface of a silicon substrate (101), the first impurity region (102) being higher in impurity concentration than the silicon substrate (101), forming a second impurity region (102b) at a position adjacent to the first impurity region (102a) in the depth direction of the silicon substrate (101), the second impurity region (102b) being higher in impurity concentration than the first impurity region (102a), forming an etch stop layer (103) on the first surface, forming an etch mask layer (104) having an opening on the second surface of the silicon substrate (101) opposite to the first surface, and etching the silicon substrate (101) until at least the etch stop layer (103) is exposed via the opening.
摘要翻译：通孔形成方法包括以下步骤：在硅衬底（101）的第一表面中形成在要形成通孔的区域周围的第一杂质区域（102a），第一杂质区域（102）更高在所述硅衬底（101）的深度方向上与所述第一杂质区（102a）相邻的位置形成第二杂质区（102b），所述第二杂质区（102b）杂质浓度高于第一杂质区（102a），在第一表面上形成蚀刻停止层（103），形成在硅衬底（101）的第二表面上具有开口的蚀刻掩模层（104）并且蚀刻硅衬底（101），直到至少蚀刻停止层（103）经由开口露出。

9. 发明申请

US20050031996A1 Method for producing circuit substrate 失效
标题翻译：电路基板的制造方法
公开(公告)号：US20050031996A1
公开(公告)日：2005-02-10
申请号：US10910271
申请日：2004-08-04
申请人： Keiichi Sasaki , Masato Kamiichi , Yukihiro Hayakawa , Ershad Chowdhury
发明人： Keiichi Sasaki , Masato Kamiichi , Yukihiro Hayakawa , Ershad Chowdhury
IPC分类号： B41J2/14 , B41J2/16 , G03F7/00 , H05K1/09 , H05K1/16 , H05K3/02 , H05K3/06 , H05K3/28
CPC分类号： H05K1/167 , B41J2/14072 , B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1642 , B41J2/1643 , B41J2/1646 , H05K1/09 , H05K3/06 , H05K3/067 , H05K2201/0317 , H05K2203/0361
摘要： In order to provide a circuit substrate with a satisfactory step coverage by the protective layer and the anti-cavitation film in an edge portion of wirings and a liquid discharge head utilizing such circuit substrate, the invention provides a method for producing a circuit substrate provided, on an insulating surface of a substrate, with a plurality of elements each including a resistive layer and a pair of electrodes formed with a predetermined spacing on said resistive layer, including a step of forming an aluminum electrode wiring layer on the resistive layer, a step of isolating the electrode wiring layer by dry etching into each element, and a step of forming the electrode wiring into a tapered cross section with an etching solution containing phosphoric acid, nitric acid and a chelating agent capable of forming a complex with the wiring metal.
摘要翻译：为了通过利用这种电路基板的布线边缘部分中的保护层和防空穴膜提供令人满意的阶梯覆盖的电路基板，本发明提供一种制造电路基板的方法，在基板的绝缘表面上，多个元件各自包括电阻层和在所述电阻层上以预定间隔形成的一对电极，包括在电阻层上形成铝电极布线层的步骤，步骤通过干蚀刻将电极配线层隔离成各元件，以及通过含有与配线金属形成络合物的磷酸，硝酸和螯合剂的蚀刻液将电极配线形成为锥形截面的工序。

10. 发明授权

US06467884B1 Substrate unit for liquid discharging head, method for producing the same, liquid discharging head, cartridge, and image forming apparatus 有权
标题翻译：液体排放头用基板单元，其制造方法，排液头，筒和图像形成装置
公开(公告)号：US06467884B1
公开(公告)日：2002-10-22
申请号：US09643931
申请日：2000-08-23
申请人： Fumio Murooka , Kei Fujita , Yukihiro Hayakawa , Makoto Terui
发明人： Fumio Murooka , Kei Fujita , Yukihiro Hayakawa , Makoto Terui
IPC分类号： B41J205
CPC分类号： B41J2/14129 , B41J2/1601 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1631 , H05K3/28
摘要： To provide a substrate unit for liquid discharging head, a method for producing the same, a liquid discharging head, a cartridge, and an image forming apparatus. The substrate unit for liquid discharging head is for a head which gives thermal energy to the liquid for film boiling, to discharge droplets of the liquid from its discharge port. The substrate unit includes an electrothermal transducer provided on the substrate surface to generate thermal energy, a pair of electrode wiring circuits provided on the substrate surface and connected to the transducer, first protective layer formed over the substantially entire surface of the substrate to cover a pair of the electrode wiring circuits and transducer, and second protective layer formed over the first protective layer to cover the transducer and the area where the transducer is connected to the wiring circuit, in which a pair of the electrode wiring circuits are 1800 to 2400 Å thick, and the portion of the first protective layer covered by the second protective layer is 2600 to 3400 Å thick and thicker than the portion of the first protective layer not covered by the second protective layer.
摘要翻译：提供一种用于排液头的基板单元，其制造方法，液体排放头，盒和图像形成装置。用于喷液头的基板单元用于向液体进行薄膜沸腾的热能，以从其排出口排出液体的液滴。基板单元包括设置在基板表面上以产生热能的电热换能器，设置在基板表面上并连接到换能器的一对电极布线电路，形成在基板的基本整个表面上以覆盖一对的第一保护层的电极布线电路和传感器;以及第二保护层，形成在第一保护层上以覆盖换能器和传感器连接到布线电路的区域，其中一对电极布线电路的厚度为1800至2400埃并且由第二保护层覆盖的第一保护层的部分比未被第二保护层覆盖的第一保护层的部分厚2600至3400。

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