会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 8. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08008715B2
    • 2011-08-30
    • US12185630
    • 2008-08-04
    • Yusuke KawaguchiKazuya NakayamaTsuyoshi OhtaTakeshi UchiharaTakahiro KawanoYuji Kato
    • Yusuke KawaguchiKazuya NakayamaTsuyoshi OhtaTakeshi UchiharaTakahiro KawanoYuji Kato
    • H01L29/78
    • H01L29/7813H01L29/42372H01L29/42376H01L29/4238H01L29/7811
    • There is provided a semiconductor device comprising: a first semiconductor layer of a first conductivity type; a second semiconductor layer of a second conductivity type provided on the first semiconductor layer of the first conductivity type; a semiconductor region of the first conductivity type selectively provided on a front surface portion of the second semiconductor layer of the second conductivity type; a first main electrode provided in contact with a surface of the semiconductor region; a second main electrode provided on a side of the first semiconductor layer of the first conductivity type, the side being opposite to the surface on which the second semiconductor layer of the second conductivity type is provided; a gate wiring provided on the second semiconductor layer of the second conductivity type around an element region in which the semiconductor region is provided; a trench penetrating the second semiconductor layer of the second conductivity type to reach the first semiconductor layer of the first conductivity type, and also extending under the element region and the gate wiring; a gate electrode provided inside the trench in the element region with a gate insulating film interposed in between; and a gate electrode lead portion provided inside the trench under the gate wiring with the gate insulating film interposed in between, and contacting the gate wiring and the gate electrode.
    • 提供一种半导体器件,包括:第一导电类型的第一半导体层; 设置在第一导电类型的第一半导体层上的第二导电类型的第二半导体层; 选择性地设置在第二导电类型的第二半导体层的前表面部分上的第一导电类型的半导体区域; 设置成与半导体区域的表面接触的第一主电极; 设置在第一导电类型的第一半导体层的一侧的第二主电极,与设置有第二导电类型的第二半导体层的表面相对的一侧; 围绕设置有半导体区域的元件区域设置在第二导电类型的第二半导体层上的栅极布线; 穿过第二导电类型的第二半导体层的沟槽到达第一导电类型的第一半导体层,并且还在元件区域和栅极布线之下延伸; 设置在所述元件区域的所述沟槽内部的栅电极,其间插入有栅极绝缘膜; 以及栅极引线部分,其设置在栅极布线下方的沟槽内部,栅极绝缘膜介于其间并与栅极布线和栅电极接触。
    • 9. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20090032875A1
    • 2009-02-05
    • US12185630
    • 2008-08-04
    • Yusuke KAWAGUCHIKazuya NakayamaTsuyoshi OhtaTakeshi UchiharaTakahiro KawanoYuji Kato
    • Yusuke KAWAGUCHIKazuya NakayamaTsuyoshi OhtaTakeshi UchiharaTakahiro KawanoYuji Kato
    • H01L29/00
    • H01L29/7813H01L29/42372H01L29/42376H01L29/4238H01L29/7811
    • There is provided a semiconductor device comprising: a first semiconductor layer of a first conductivity type; a second semiconductor layer of a second conductivity type provided on the first semiconductor layer of the first conductivity type; a semiconductor region of the first conductivity type selectively provided on a front surface portion of the second semiconductor layer of the second conductivity type; a first main electrode provided in contact with a surface of the semiconductor region; a second main electrode provided on a side of the first semiconductor layer of the first conductivity type, the side being opposite to the surface on which the second semiconductor layer of the second conductivity type is provided; a gate wiring provided on the second semiconductor layer of the second conductivity type around an element region in which the semiconductor region is provided; a trench penetrating the second semiconductor layer of the second conductivity type to reach the first semiconductor layer of the first conductivity type, and also extending under the element region and the gate wiring; a gate electrode provided inside the trench in the element region with a gate insulating film interposed in between; and a gate electrode lead portion provided inside the trench under the gate wiring with the gate insulating film interposed in between, and contacting the gate wiring and the gate electrode.
    • 提供一种半导体器件,包括:第一导电类型的第一半导体层; 设置在第一导电类型的第一半导体层上的第二导电类型的第二半导体层; 选择性地设置在第二导电类型的第二半导体层的前表面部分上的第一导电类型的半导体区域; 设置成与所述半导体区域的表面接触的第一主电极; 设置在第一导电类型的第一半导体层的一侧的第二主电极,与设置有第二导电类型的第二半导体层的表面相对的一侧; 围绕设置有半导体区域的元件区域设置在第二导电类型的第二半导体层上的栅极布线; 穿过第二导电类型的第二半导体层的沟槽到达第一导电类型的第一半导体层,并且还在元件区域和栅极布线之下延伸; 设置在所述元件区域的所述沟槽内部的栅电极,其间插入有栅极绝缘膜; 以及栅极引线部分,其设置在栅极布线下方的沟槽内部,栅极绝缘膜介于其间并与栅极布线和栅电极接触。
    • 10. 发明授权
    • Power semiconductor device
    • 功率半导体器件
    • US5554862A
    • 1996-09-10
    • US183364
    • 1994-01-19
    • Ichiro OmuraMitsuhiko KitagawaKazuya NakayamaMasakazu Yamaguchi
    • Ichiro OmuraMitsuhiko KitagawaKazuya NakayamaMasakazu Yamaguchi
    • H01L29/745H01L29/749H01L29/74H01L31/111
    • H01L29/7455H01L29/749
    • In a power semiconductor device, an n-base is formed on a p-emitter layer. On the n-base layer, a p-base layer, an n-emitter layer, and a high-concentration p-layer are formed laterally. In the p-base layer, an n-source layer is formed a specified distance apart from the n-emitter layer. In the n-emitter layer, a p-source layer is formed a specified distance apart from the high-concentration p-layer. A first gate electrode is formed via a first gate insulating film on the region sandwiched by the n-source layer and the n-emitter layer. A second gate electrode is formed via a second gate insulating film on the region sandwiched by the high-concentration p-layer and the p-source layer. On the p-emitter layer, a first main electrode is formed. A second main electrode is formed so as to be in contact with the p-base layer, the n-source layer, and the p-source layer.
    • 在功率半导体器件中,在p发射极层上形成n基极。 在n基层上,横向形成p基层,n发射极层和高浓度p层。 在p基层中,n型源层与n型发射极层隔开规定的距离。 在n-发射极层中,与高浓度p层隔开规定的距离形成p源层。 在由n源层和n发射极层夹在的区域上经由第一栅极绝缘膜形成第一栅电极。 在由高浓度p层和p源层夹着的区域上经由第二栅极绝缘膜形成第二栅电极。 在p发射极层上形成第一主电极。 第二主电极形成为与p基层,n源层和p源层接触。