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1. 发明申请

US20060118598A1 Bonding apparatus and bonding method 审中-公开
标题翻译：接合装置和接合方法
公开(公告)号：US20060118598A1
公开(公告)日：2006-06-08
申请号：US11291838
申请日：2005-12-02
申请人： Yusuke Chikamori , Naoaki Ogure , Hideki Tateishi , Yukio Fukunaga , Hiroyuki Ueyama
发明人： Yusuke Chikamori , Naoaki Ogure , Hideki Tateishi , Yukio Fukunaga , Hiroyuki Ueyama
IPC分类号： B23K1/00 , B23K5/00 , B23K20/14
CPC分类号： B23K20/023 , B23K2101/40
摘要： A bonding apparatus can bond contacts of electronic components directly to each other without the need for solder. The bonding apparatus include a hermetically sealed processing chamber, a plurality of bases for holding at least two workpieces having respective bonding regions in the processing chamber, a gas inlet for introducing a processing gas to clean the bonding regions into the processing chamber, a pressure controller for controlling a predetermined pressure to be developed in the processing chamber, a heater for heating the workpieces in the processing chamber, and a bonding unit for pressing and bonding the bonding regions of the workpieces to each other in the processing chamber.
摘要翻译：接合装置可以将电子部件的触点彼此直接接合而不需要焊料。接合装置包括密封处理室，用于在处理室中保持具有各自的接合区域的至少两个工件的多个基座，用于引入处理气体以将接合区域引入处理室的气体入口，压力控制器用于控制处理室中要显影的预定压力，用于加热处理室中的工件的加热器，以及用于在处理室中将工件的接合区域彼此压合并粘合的接合单元。

2. 发明申请

US20060076387A1 Joining method and apparatus 审中-公开
标题翻译：连接方法和装置
公开(公告)号：US20060076387A1
公开(公告)日：2006-04-13
申请号：US11235178
申请日：2005-09-27
申请人： Naoaki Ogure , Yusuke Chikamori
发明人： Naoaki Ogure , Yusuke Chikamori
IPC分类号： A47J36/02
CPC分类号： H01L21/67092 , B23K20/02 , B23K20/24 , B23K35/007 , H01L24/27 , H01L24/29 , H01L24/75 , H01L24/83 , H01L2224/29101 , H01L2224/29339 , H01L2224/7901 , H01L2224/83801 , H01L2224/8384 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01059 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/15747 , H01L2924/00 , H01L2924/3512
摘要： A joining method, which can perform high quality joining at a practical cost, without applying a high temperature or a great compressive load, and without introducing a joining inhibitor, such as a metal oxide, between members to be joined, is provided. This joining method has a joining step of bonding together a plurality of members W1, W2, which are to be joined, metallurgically in a solid phase state, and comprises a contact step of bringing a liquid organic acid L into contact with surfaces to be joined of the members W1, W2 to be joined. By this measure, a non-metallic substance, such as an oxide, covering the surfaces to be joined of the members W1, W2 to be joined is reduced, and thereby converted into a water-soluble complex for removal, whereby metals as materials are exposed at the surfaces to be joined of the members W1, W2 to be joined. Such surfaces to be joined are contacted with each other, whereby the members W1, W2 to be joined can be joined together at a low contact surface pressure and a low temperature.
摘要翻译：提供一种接合方法，其可以在不施加高温或高压缩载荷的情况下以实际成本实现高质量接合，并且不在待接合部件之间引入诸如金属氧化物的接合抑制剂。该接合方法具有将待接合的多个构件W 1，W 2 2以固相冶金方式结合在一起的接合步骤，并且包括将液体有机酸L与要连接的构件W 1，W 2 2的待接合表面接触的接触步骤。通过这种措施，可以减少覆盖待接合的构件W 1，W 2 2的待接合表面的非金属物质，例如氧化物，并且从而转化成用于除去的水溶性络合物，由此作为材料的金属在要接合的构件W 1，W 2 2的待连接表面处露出。待接合的这些表面彼此接触，由此待接合的构件W 1，W 2 2可以在低接触表面压力和低温下接合在一起。

3. 发明授权

US07799425B2 Composite nanoparticles method for producing the same 失效
标题翻译：复合纳米粒子的制备方法
公开(公告)号：US07799425B2
公开(公告)日：2010-09-21
申请号：US10587335
申请日：2005-02-04
申请人： Yusuke Chikamori , Naoaki Ogure
发明人： Yusuke Chikamori , Naoaki Ogure
IPC分类号： B32B5/16
CPC分类号： B22F1/0018 , B22F1/0062 , B22F2998/10 , B82Y30/00 , Y10S977/773 , Y10S977/83 , Y10T428/2991 , B22F9/30 , B22F9/22
摘要： A composite nanoparticle makes it possible to significantly lower the temperature to separate an organic substance from a core and uniformly sinter the cores, and can be applied to bonding that replaces soldering. The composite nanoparticle includes a metal component as a core, and an organic substance surrounding the metal component and bonded to it by physical adsorption. The composite nanoparticles can be produced by allowing an inorganic metal salt and an organic material to coexist, and heating the inorganic metal salt and the organic material to a predetermined temperature and holding them at the temperature for a predetermined time so that the inorganic metal salt is decomposed to produce metal nanoparticles. Thus, an organic substance is bonded to the metal nanoparticles by physical adsorption without forming an organometallic compound through a reaction between the metal nanoparticles and the organic substance.
摘要翻译：复合纳米颗粒使得可以显着降低温度以将有机物质与芯分离并均匀地烧结芯，并且可以应用于替代焊接的粘合。复合纳米颗粒包括作为核心的金属组分和围绕金属组分并通过物理吸附结合到其上的有机物质。复合纳米颗粒可以通过使无机金属盐和有机材料共存，并将无机金属盐和有机材料加热到预定温度并将其保持在预定时间，使得无机金属盐为分解生成金属纳米粒子。因此，通过物理吸附将有机物质与金属纳米粒子结合，通过金属纳米粒子与有机物质的反应形成有机金属化合物。

4. 发明授权

US06387182B1 Apparatus and method for processing substrate 失效
标题翻译：基板处理装置及方法
公开(公告)号：US06387182B1
公开(公告)日：2002-05-14
申请号：US09517699
申请日：2000-03-02
申请人： Kuniaki Horie , Yukio Fukunaga , Naoaki Ogure , Tsutomu Nakada , Masahito Abe , Mitsunao Shibasaki , Hidenao Suzuki , Yuji Araki , Kiwamu Tsukamoto
发明人： Kuniaki Horie , Yukio Fukunaga , Naoaki Ogure , Tsutomu Nakada , Masahito Abe , Mitsunao Shibasaki , Hidenao Suzuki , Yuji Araki , Kiwamu Tsukamoto
IPC分类号： B05C2100
CPC分类号： C23C16/45574 , C23C16/409 , C23C16/45514 , C23C16/45561 , C23C16/45563 , C23C16/4557
摘要： A substrate processing apparatus forms a thin film of high-dielectric or ferroelectric such as barium/strontium titanates, or a copper film for wiring on a substrate, and has a gas ejection head for individually introducing at least two gases including a material gas and ejecting the gases toward a substrate to be processed. The gas ejection head has at least two gas passageways for individually introducing the two gases, and at least two temperature control devices for individually controlling temperatures of the gases flowing through the gas passageways.
摘要翻译：基板处理装置在基板上形成诸如钡/锶钛酸盐或铜箔的高电介质或铁电薄膜，并且具有气体喷射头，用于分别引入包括材料气体的至少两种气体并喷射朝向待处理基板的气体。气体喷射头具有用于分别引入两种气体的至少两个气体通道和用于单独控制流过气体通道的气体的温度的至少两个温度控制装置。

5. 发明授权

US6036783A Liquid material vaporizer apparatus and gas ejection device 失效
标题翻译：液体材料蒸发器和排气装置
公开(公告)号：US6036783A
公开(公告)日：2000-03-14
申请号：US834593
申请日：1997-04-07
申请人： Yukio Fukunaga , Takeshi Murakami , Naoaki Ogure , Akihisa Hongo
发明人： Yukio Fukunaga , Takeshi Murakami , Naoaki Ogure , Akihisa Hongo
IPC分类号： C23C16/44 , C23C16/448 , C23C16/455 , C23C16/00
CPC分类号： C23C16/4557 , C23C16/4486 , C23C16/45565
摘要： A vaporizer apparatus enables efficient vaporization of a liquid material for the production of high dielectric thin film devices by allowing a sufficient dwell time for complete vaporization of the feed liquid. The vaporizer apparatus also prevents degradation of the feed gas after vaporization and provides a stable supply of the vaporized feed gas to the substrate. The vaporizer apparatus comprises an outer member having a cylindrical inner surface, and an inner member having a cylindrical outer surface opposing the cylindrical inner surface of the outer member. A feed material passage having a spiral configuration is formed on at least one of the cylindrical inner surface and the cylindrical outer surface. The feed material passage communicates with a feed liquid entry opening and a feed gas exit opening. A heating device is provided for heating at least one of the outer member and inner member.
摘要翻译：蒸发器装置能够通过允许足够的停留时间来充分蒸发进料液体，从而有效地蒸发用于生产高介电薄膜装置的液体材料。汽化器装置还防止蒸发后的进料气体的劣化并且提供稳定的气化进料气体供应到基材。蒸发器装置包括具有圆柱形内表面的外部构件和具有与外部构件的圆柱形内表面相对的圆柱形外表面的内部构件。在圆柱形内表面和圆柱形外表面中的至少一个上形成具有螺旋构造的进给材料通道。进料材料通道与进料液入口和进料气体出口开口连通。提供加热装置用于加热外部构件和内部构件中的至少一个。

6. 发明授权

US5862605A Vaporizer apparatus 失效
标题翻译：气化装置
公开(公告)号：US5862605A
公开(公告)日：1999-01-26
申请号：US862155
申请日：1997-05-22
申请人： Kuniaki Horie , Naoaki Ogure , Yukio Fukunaga , Akihisa Hongo
发明人： Kuniaki Horie , Naoaki Ogure , Yukio Fukunaga , Akihisa Hongo
IPC分类号： B01D1/00 , C23C16/448 , F26B19/00
CPC分类号： B01D1/00 , C23C16/4481
摘要： Heat can be supplied effectively to a porous member of a vaporizer apparatus so that a vaporizing operation can be carried out smoothly and efficiently. The vaporizer apparatus includes a vaporizer section having a porous member including a liquid receiving surface and a vapor discharge surface. A feed supply section supplies a liquid feed material to the liquid receiving surface of the porous member. A heating medium passage is in thermal contact with the porous member. A heating medium supply system flows a heating medium of a temperature higher than a vaporization temperature of the liquid feed material through the heating medium passage.
摘要翻译：可以有效地将热量提供给蒸发器装置的多孔构件，从而可以平稳有效地进行蒸发操作。蒸发器装置包括具有包括液体接收表面和蒸汽排放表面的多孔构件的蒸发器部分。供给部供给液体供给材料到多孔构件的液体接收表面。加热介质通道与多孔构件热接触。加热介质供应系统通过加热介质通道流动高于液体进料的蒸发温度的加热介质。

7. 发明授权

US06793794B2 Substrate plating apparatus and method 有权
标题翻译：基板电镀装置及方法
公开(公告)号：US06793794B2
公开(公告)日：2004-09-21
申请号：US10098415
申请日：2002-03-18
申请人： Akihisa Hongo , Naoaki Ogure , Hiroyuki Ueyama , Junitsu Yamakawa , Mizuki Nagai , Kenichi Suzuki , Atsushi Chono , Satoshi Sendai , Koji Mishima
发明人： Akihisa Hongo , Naoaki Ogure , Hiroyuki Ueyama , Junitsu Yamakawa , Mizuki Nagai , Kenichi Suzuki , Atsushi Chono , Satoshi Sendai , Koji Mishima
IPC分类号： C25D500
CPC分类号： C25D21/14 , C25D7/12 , C25D17/001
摘要： The present invention relates to a substrate plating apparatus for plating a substrate in a plating bath containing plating solution. An insoluble anode is disposed in the plating bath opposite the substrate. The substrate plating apparatus comprises a circulating vessel or dummy vessel provided separate from the plating bath, with a soluble anode and a cathode disposed in the circulating vessel or dummy vessel. An anion exchange film or selective cation exchange film is disposed between the anode and cathode and isolates the same, wherein metal ions are generated in the circulating vessel or dummy vessel by flowing current between the soluble anode and the cathode therein, and the generated metal ions are supplied to the plating bath. The substrate plating apparatus can also comprise an ion exchange film or neutral porous diaphragm disposed between the substrate and anode in the plating bath, wherein the ion exchange film or neutral porous diaphragm divides the plating bath into a substrate region and an anode region.
摘要翻译：本发明涉及一种用于在含有电镀液的电镀液中电镀基板的基板电镀装置。不同的阳极设置在与基底相对的电镀槽中。基板电镀装置包括与电镀槽分开设置的循环容器或虚拟容器，其中可溶性阳极和阴极设置在循环容器或假容器中。阴极交换膜或选择性阳离子交换膜设置在阳极和阴极之间，并隔离其中，其中通过在可溶性阳极和阴极之间流动电流而在循环容器或虚拟容器中产生金属离子，并且所产生的金属离子被供应到电镀浴。基板电镀装置还可以包括设置在电镀槽中的基板和阳极之间的离子交换膜或中性多孔隔膜，其中离子交换膜或中性多孔隔膜将电镀槽分成衬底区域和阳极区域。

8. 发明授权

US06365017B1 Substrate plating device 有权
标题翻译：基板电镀装置
公开(公告)号：US06365017B1
公开(公告)日：2002-04-02
申请号：US09530805
申请日：2000-05-05
申请人： Akihisa Hongo , Naoaki Ogure , Hiroyuki Ueyama , Junitsu Yamakawa , Mizuki Nagai , Kenichi Suzuki , Atsushi Chono , Satoshi Sendai , Koji Mishima
发明人： Akihisa Hongo , Naoaki Ogure , Hiroyuki Ueyama , Junitsu Yamakawa , Mizuki Nagai , Kenichi Suzuki , Atsushi Chono , Satoshi Sendai , Koji Mishima
IPC分类号： C25D1700
CPC分类号： C25D21/14 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/02
摘要： The present invention relates to a substrate plating apparatus for plating a substrate in a plating bath containing plating solution. An insoluble anode is disposed in the plating bath opposite the substrate. The substrate plating apparatus comprises a circulating vessel or dummy vessel provided separate from the plating bath, with a soluble anode and a cathode disposed in the circulating vessel or dummy vessel. An anion exchange film or selective cation exchange film is disposed between the anode and cathode and isolates the same, wherein metal ions are generated in the circulating vessel or dummy vessel by flowing current between the soluble anode and the cathode therein, and the generated metal ions are supplied to the plating bath. The substrate plating apparatus can also comprise an ion exchange film or neutral porous diaphragm disposed between the substrate and anode in the plating bath, wherein the ion exchange film or neutral porous diaphragm divides the plating bath into a substrate region and an anode region.
摘要翻译：本发明涉及一种用于在含有电镀液的电镀液中电镀基板的基板电镀装置。不同的阳极设置在与基底相对的电镀槽中。基板电镀装置包括与电镀槽分开设置的循环容器或虚拟容器，其中可溶性阳极和阴极设置在循环容器或假容器中。阴极交换膜或选择性阳离子交换膜设置在阳极和阴极之间，并隔离其中，其中通过在可溶性阳极和阴极之间流动电流而在循环容器或虚拟容器中产生金属离子，并且所产生的金属离子被供应到电镀浴。基板电镀装置还可以包括设置在电镀槽中的基板和阳极之间的离子交换膜或中性多孔隔膜，其中离子交换膜或中性多孔隔膜将电镀槽分成衬底区域和阳极区域。

9. 发明申请

US20080271911A1 Submerged Electrode and Material Thereof 审中-公开
标题翻译：浸没电极及其材料
公开(公告)号：US20080271911A1
公开(公告)日：2008-11-06
申请号：US10567151
申请日：2004-08-04
申请人： Naoaki Ogure , Manabu Tsujimura
发明人： Naoaki Ogure , Manabu Tsujimura
IPC分类号： H01R11/00 , H05K1/00
CPC分类号： C02F1/46109 , C02F1/46114 , C02F2001/46138 , C02F2001/46152 , C02F2101/308 , C02F2103/34 , Y10T29/49117
摘要： [Problems] To provide an electrode that is stable in liquid and is capable of processing a large volume of liquid and a small electrode that is capable of processing a large volume of liquid at high speed; provide a liquid processor and method of processing liquid in which the electrode is used; provide and electrode material being hard to be damaged by thermal stress; and provide an electrode, liquid processor and method of processing liquid in which the electrode material is used.[Means for solving problems] An electrode of configuration resulting from coating solid pieces of 5 to 60 mm size with electrically conductive diamond, supporting them on supports and bringing the same into contact with each other so as to realize current passage as a whole is used in various electrochemical process. Also, an electrode including (1) electrically conductive substrate, (2) covering layer covering the electrically conductive substrate and (3) electrically conductive diamond particles fixed on the covering layer, wherein each of the electrically conductive diamond particles is partially brought into contact with the electrically conductive substrate and another portion thereof is partially exposed on the surface of the covering layer. Further, an electrode material, wherein an entire side surface of columnar or tubular substrate is coated with electrically conductive diamond is used.
摘要翻译： [问题]提供一种在液体中稳定并能够加工大量液体的电极和能够高速加工大量液体的小电极; 提供液体处理器和处理使用电极的液体的方法; 提供并且难以被热应力损坏的电极材料; 并提供电极，液体处理器和处理使用电极材料的液体的方法。 [解决问题的方法]使用导电金刚石涂覆5〜60mm尺寸的实心片，将其支撑在支撑体上并使其彼此接触以实现整体的电流通过的结构电极被使用在各种电化学过程中。此外，包括（1）导电基板，（2）覆盖导电基板的覆盖层的电极和（3）固定在覆盖层上的导电金刚石颗粒，其中每个导电金刚石颗粒部分地与导电性基板和其另一部分部分露出在覆盖层的表面上。此外，使用其中柱状或管状基板的整个侧表面涂覆有导电金刚石的电极材料。

10. 发明授权

US06391775B1 Method of forming embedded copper interconnections and embedded copper interconnection structure 失效
标题翻译：形成嵌入式铜互连和嵌入式铜互连结构的方法
公开(公告)号：US06391775B1
公开(公告)日：2002-05-21
申请号：US09660411
申请日：2000-09-12
申请人： Naoaki Ogure , Hiroaki Inoue
发明人： Naoaki Ogure , Hiroaki Inoue
IPC分类号： H01L2144
CPC分类号： H01L21/7684 , H01L21/288 , H01L21/76888 , H01L23/53233 , H01L2924/0002 , H01L2924/00
摘要： Embedded interconnections of copper are formed by forming an insulating layer, forming embedded interconnections of copper in the insulating layer, making an exposed upper surface of the insulating layer and an exposed surface of the embedded interconnections of copper coplanar according to chemical mechanical polishing, and forming a protective silver film on the exposed surface of the embedded interconnections of copper. These steps are repeated on the existing insulating layer thereby to produce multiple layers of embedded interconnections of copper. The exposed surface of the embedded interconnections of copper is plated with silver according to immersion plating.
摘要翻译：铜的嵌入式互连通过形成绝缘层而形成，在绝缘层中形成铜的嵌入互连，根据化学机械抛光使绝缘层的暴露的上表面和铜共面的嵌入式互连的暴露表面，以及形成在铜的嵌入式互连的暴露表面上的保护性银膜。在现有的绝缘层上重复这些步骤，从而产生多层铜的嵌入互连。根据浸镀法，铜的嵌入互连的暴露表面镀银。

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