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1. 发明申请

US20060118598A1 Bonding apparatus and bonding method 审中-公开
标题翻译：接合装置和接合方法
公开(公告)号：US20060118598A1
公开(公告)日：2006-06-08
申请号：US11291838
申请日：2005-12-02
申请人： Yusuke Chikamori , Naoaki Ogure , Hideki Tateishi , Yukio Fukunaga , Hiroyuki Ueyama
发明人： Yusuke Chikamori , Naoaki Ogure , Hideki Tateishi , Yukio Fukunaga , Hiroyuki Ueyama
IPC分类号： B23K1/00 , B23K5/00 , B23K20/14
CPC分类号： B23K20/023 , B23K2101/40
摘要： A bonding apparatus can bond contacts of electronic components directly to each other without the need for solder. The bonding apparatus include a hermetically sealed processing chamber, a plurality of bases for holding at least two workpieces having respective bonding regions in the processing chamber, a gas inlet for introducing a processing gas to clean the bonding regions into the processing chamber, a pressure controller for controlling a predetermined pressure to be developed in the processing chamber, a heater for heating the workpieces in the processing chamber, and a bonding unit for pressing and bonding the bonding regions of the workpieces to each other in the processing chamber.
摘要翻译：接合装置可以将电子部件的触点彼此直接接合而不需要焊料。接合装置包括密封处理室，用于在处理室中保持具有各自的接合区域的至少两个工件的多个基座，用于引入处理气体以将接合区域引入处理室的气体入口，压力控制器用于控制处理室中要显影的预定压力，用于加热处理室中的工件的加热器，以及用于在处理室中将工件的接合区域彼此压合并粘合的接合单元。

2. 发明申请

US20060076387A1 Joining method and apparatus 审中-公开
标题翻译：连接方法和装置
公开(公告)号：US20060076387A1
公开(公告)日：2006-04-13
申请号：US11235178
申请日：2005-09-27
申请人： Naoaki Ogure , Yusuke Chikamori
发明人： Naoaki Ogure , Yusuke Chikamori
IPC分类号： A47J36/02
CPC分类号： H01L21/67092 , B23K20/02 , B23K20/24 , B23K35/007 , H01L24/27 , H01L24/29 , H01L24/75 , H01L24/83 , H01L2224/29101 , H01L2224/29339 , H01L2224/7901 , H01L2224/83801 , H01L2224/8384 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01059 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/15747 , H01L2924/00 , H01L2924/3512
摘要： A joining method, which can perform high quality joining at a practical cost, without applying a high temperature or a great compressive load, and without introducing a joining inhibitor, such as a metal oxide, between members to be joined, is provided. This joining method has a joining step of bonding together a plurality of members W1, W2, which are to be joined, metallurgically in a solid phase state, and comprises a contact step of bringing a liquid organic acid L into contact with surfaces to be joined of the members W1, W2 to be joined. By this measure, a non-metallic substance, such as an oxide, covering the surfaces to be joined of the members W1, W2 to be joined is reduced, and thereby converted into a water-soluble complex for removal, whereby metals as materials are exposed at the surfaces to be joined of the members W1, W2 to be joined. Such surfaces to be joined are contacted with each other, whereby the members W1, W2 to be joined can be joined together at a low contact surface pressure and a low temperature.
摘要翻译：提供一种接合方法，其可以在不施加高温或高压缩载荷的情况下以实际成本实现高质量接合，并且不在待接合部件之间引入诸如金属氧化物的接合抑制剂。该接合方法具有将待接合的多个构件W 1，W 2 2以固相冶金方式结合在一起的接合步骤，并且包括将液体有机酸L与要连接的构件W 1，W 2 2的待接合表面接触的接触步骤。通过这种措施，可以减少覆盖待接合的构件W 1，W 2 2的待接合表面的非金属物质，例如氧化物，并且从而转化成用于除去的水溶性络合物，由此作为材料的金属在要接合的构件W 1，W 2 2的待连接表面处露出。待接合的这些表面彼此接触，由此待接合的构件W 1，W 2 2可以在低接触表面压力和低温下接合在一起。

3. 发明授权

US07799425B2 Composite nanoparticles method for producing the same 失效
标题翻译：复合纳米粒子的制备方法
公开(公告)号：US07799425B2
公开(公告)日：2010-09-21
申请号：US10587335
申请日：2005-02-04
申请人： Yusuke Chikamori , Naoaki Ogure
发明人： Yusuke Chikamori , Naoaki Ogure
IPC分类号： B32B5/16
CPC分类号： B22F1/0018 , B22F1/0062 , B22F2998/10 , B82Y30/00 , Y10S977/773 , Y10S977/83 , Y10T428/2991 , B22F9/30 , B22F9/22
摘要： A composite nanoparticle makes it possible to significantly lower the temperature to separate an organic substance from a core and uniformly sinter the cores, and can be applied to bonding that replaces soldering. The composite nanoparticle includes a metal component as a core, and an organic substance surrounding the metal component and bonded to it by physical adsorption. The composite nanoparticles can be produced by allowing an inorganic metal salt and an organic material to coexist, and heating the inorganic metal salt and the organic material to a predetermined temperature and holding them at the temperature for a predetermined time so that the inorganic metal salt is decomposed to produce metal nanoparticles. Thus, an organic substance is bonded to the metal nanoparticles by physical adsorption without forming an organometallic compound through a reaction between the metal nanoparticles and the organic substance.
摘要翻译：复合纳米颗粒使得可以显着降低温度以将有机物质与芯分离并均匀地烧结芯，并且可以应用于替代焊接的粘合。复合纳米颗粒包括作为核心的金属组分和围绕金属组分并通过物理吸附结合到其上的有机物质。复合纳米颗粒可以通过使无机金属盐和有机材料共存，并将无机金属盐和有机材料加热到预定温度并将其保持在预定时间，使得无机金属盐为分解生成金属纳米粒子。因此，通过物理吸附将有机物质与金属纳米粒子结合，通过金属纳米粒子与有机物质的反应形成有机金属化合物。

4. 发明申请

US20070160837A1 Composite nanoparticles and method for producing the same 失效
标题翻译：复合纳米颗粒及其制备方法
公开(公告)号：US20070160837A1
公开(公告)日：2007-07-12
申请号：US10587335
申请日：2005-02-04
申请人： Yusuke Chikamori , Naoki Ogure
发明人： Yusuke Chikamori , Naoki Ogure
IPC分类号： B05D7/00 , B32B5/16
CPC分类号： B22F1/0018 , B22F1/0062 , B22F2998/10 , B82Y30/00 , Y10S977/773 , Y10S977/83 , Y10T428/2991 , B22F9/30 , B22F9/22
摘要： A composite nanoparticle makes it possible to significantly lower the temperature to separate an organic substance from a core and uniformly sinter the cores, and can be applied to bonding that replaces soldering. The composite nanoparticle (10) comprises a metal component (12) as a core, and an organic substance (14) surrounding the metal component (12) and bonded to it by physical adsorption. The composite nanoparticles can be produced by allowing an inorganic metal salt and an organic material to coexist, and heating the inorganic metal salt and the organic material to a predetermined temperature and holding them at the temperature for a predetermined time so that the inorganic metal salt is decomposed to produce metal nanoparticles and an organic substance is bonded to the metal nanoparticles by physical adsorption without forming an organometallic compound through a reaction between the metal nanoparticles and the organic substance.
摘要翻译：复合纳米颗粒使得可以显着降低温度以将有机物质与芯分离并均匀地烧结芯，并且可以应用于替代焊接的粘合。复合纳米颗粒（10）包括作为芯的金属组分（12）和围绕金属组分（12）并通过物理吸附结合到其上的有机物质（14）。复合纳米颗粒可以通过使无机金属盐和有机材料共存，并将无机金属盐和有机材料加热到预定温度并将其保持在预定时间，使得无机金属盐为分解生成金属纳米粒子，通过物理吸附将有机物质与金属纳米粒子结合，通过金属纳米粒子与有机物质的反应形成有机金属化合物。

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