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    • 1. 发明授权
    • Room temperature-curable polymeric composition
    • 室温可固化聚合物组合物
    • US4675365A
    • 1987-06-23
    • US848986
    • 1986-04-07
    • Yoshio InoueMasatoshi AraiTakeo InoueAtsushi YaginumaTetsuo Tomizawa
    • Yoshio InoueMasatoshi AraiTakeo InoueAtsushi YaginumaTetsuo Tomizawa
    • C08L71/00C08G65/32C08G75/04C08G77/00C08G77/42C08G77/46C08L71/02C09K3/10
    • C08G75/04
    • The room temperature-curable polymeric composition is prepared by admixing (a) a polyether terminated at both molecular chain ends each with a mercapto group with (b) a 3-methacryloxypropyl silane having at least two hydrolyzable groups, e.g. alkoxy groups, in a molecule and (c) a 1,1,3,3-tetramethyl guanidino-containing organosilicon compound. The component (b) first reacts with the mercapto group of the component (a) to introduce silicon-bonded hydrolyzable groups to the molecular chain ends of the polyether and the silicon-bonded hydrolyzable groups pertain to the crosslinking reaction with the atmospheric moisture. The composition has good storability and workability and is capable of giving a cured rubbery elastomer without the addition of a toxic lead compound as a curing catalyst which is indispensable in the conventional polyether-based room temperature-curable polymeric compositions.
    • 室温可固化的聚合物组合物是通过将(a)在两个分子链端各自带有巯基的聚醚与(b)具有至少两个可水解基团的3-甲基丙烯酰氧基丙基硅烷混合来制备的。 烷氧基,和(c)含有1,1,3,3-四甲基胍基的有机硅化合物。 组分(b)首先与组分(a)的巯基反应以将导致硅键合的可水解基团引入到聚醚的分子链末端,硅键合的可水解基团涉及与大气湿气的交联反应。 该组合物具有良好的储存性和可加工性,并且能够在不添加有毒铅化合物作为固化催化剂的情况下得到固化的橡胶弹性体,其在常规的聚醚基室温可固化聚合物组合物中是必不可少的。
    • 4. 发明授权
    • Organosilicon compound and a room temperature curable organopolysiloxane
composition formulated therewith
    • 有机硅化合物和与之配制的室温可固化的有机聚硅氧烷组合物
    • US4579963A
    • 1986-04-01
    • US710128
    • 1985-03-11
    • Masatoshi AraiKoji FutatsumoriTakeo InoueShinichi Sato
    • Masatoshi AraiKoji FutatsumoriTakeo InoueShinichi Sato
    • C07F7/18C08L83/04C07F7/04C07F7/08C07F7/10
    • C07F7/1824C08L83/04
    • The invention provides a novel class of organosilicon compounds useful as a curing agent in a room temperature curable organopolysiloxane composition, which is represented by the general structural formulaR.sub.2 CH--CR.dbd.C(OR)--O--Si(R.sup.1).sub.3-m (O--CR.dbd.CH--R).sub.m,in which each R is a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group independently from the others, R.sup.1, if any, is a substituted or unsubstituted monovalent hydrocarbon group and the suffix m is 2 or 3. The compound can readily be synthesized by the reaction of an .alpha.,.beta.-unsaturated ester compound represented by the general formulaR.sub.2 C.dbd.CR--CO--OR,and an alkenyloxy-containing silane compound represented by the general formulaHSi(R.sup.1).sub.3-m (O--CR.dbd.CH--R).sub.m,in which R.sup.1, R and m each have the meaning as defined above, in the presence of a rhodium compound as a catalyst. The room temperature curable composition is formulated with (a) 100 parts by weight of a diorganopolysiloxane terminated at both molecular chain ends each with a silanolic hydroxy group and having a viscosity in the range from 100 to 1,000,000 centistokes at 25.degree. C.; (b) from 2 to 40 parts by weight of the novel organosilicon compound and (c) from 0.01 to 10 parts by weight of a curing accelerator which is preferably a 2-guanidino-containing organosilicon compound.
    • 本发明提供了一种新型的有机硅化合物,其用作室温可固化的有机聚硅氧烷组合物中的固化剂,其由通式结构式R2CH-CR = C(OR)-O-Si(R1)3-m -CR = CH-R)m,其中每个R是氢原子或取代或未取代的单价烃基,其中R 1,如果有的话是取代或未取代的一价烃基,并且后缀m是2或 该化合物可以容易地通过由通式R2C = CR-CO-OR表示的α,β-不饱和酯化合物与由通式HSi(R1)3表示的含烯氧基的硅烷化合物的反应合成 -m(O-CR = CH-R)m,其中R1,R和m各自具有如上定义的含义,在铑化合物作为催化剂存在下。 室温可固化组合物配制为(a)100重量份在两个分子链末端终止的二有机聚硅氧烷,每个分子链端均具有硅烷醇羟基,并且在25℃下的粘度范围为100至1,000,000厘沲。 (b)2〜40重量份的新型有机硅化合物和(c)0.01〜10重量份优选含有2-胍基的有机硅化合物的固化促进剂。
    • 5. 发明授权
    • Room temperature-curable organopolysiloxane composition
    • 室温可固化的有机聚硅氧烷组合物
    • US4629775A
    • 1986-12-16
    • US758164
    • 1985-07-23
    • Masatoshi AraiTakeo InoueKoji Yokoo
    • Masatoshi AraiTakeo InoueKoji Yokoo
    • C08L83/00C07F7/18C08K5/00C08K5/548C08L83/04C08L83/06C08G77/06
    • C08K5/0091C07F7/1836C07F7/184C08L83/04C08G77/16
    • The room temperature-curable organopolysiloxane composition of the invention can be cured into a rubbery elastomer which exhibits strong adhesion to the surface of a substrate made of, for example, a plastic resin even without the use of a primer or other adhesion aid. The composition comprises, in addition to the conventional ingredients of a silanolic hydroxy-terminated diorganopolysiloxane and alkoxy-containing organosilicon compound, a special organosilicon compound having, in a molecule, at least one group of the formula(R.sup.1 O).sub.3-n (Me).sub.n Si--C.sub.3 H.sub.6 --S--CO--NH--,in which Me is a methyl group, R.sup.1 is a methyl or an ethyl group and n is zero or 1, and a titanium chelate compound represented by the general formula ##STR1## in which Q is a divalent organosilicon-containing group, R.sup.2 is an alkyl group having 1 to 3 carbon atoms and R.sup.3 is the same as R.sup.2 or R.sup.2 O.
    • 本发明的室温可固化的有机基聚硅氧烷组合物可以固化成即使不使用底漆或其它粘合助剂也能显示出对由例如塑料树脂制成的基材表面的强粘合性的橡胶状弹性体。 除了硅烷醇羟基封端的二有机聚硅氧烷和含烷氧基的有机硅化合物的常规成分之外,组合物还包含在分子中具有至少一个式(R 1)3-n(Me)的基团的特殊有机硅化合物, nSi-C 3 H 6 -S-CO-NH-,其中Me是甲基,R 1是甲基或乙基,n是0或1,和由通式“IMAGE”表示的钛螯合物,其中Q 是含二价含有机硅基团,R 2为碳原子数为1〜3的烷基,R 3为与R 2或R 2 O相同的基团。
    • 9. 发明授权
    • Process for producing spherical inorganic particle
    • 球形无机粒子的制造方法
    • US08117867B2
    • 2012-02-21
    • US11990485
    • 2006-08-09
    • Shigeo YamaguchiTakeo Inoue
    • Shigeo YamaguchiTakeo Inoue
    • C03B19/10C03B9/00C03B37/00
    • C03B19/102C01P2004/03C01P2004/32C09C1/28C09C3/006C09C3/041C09C3/043C09C3/12
    • A process for producing spherical inorganic particles which have high flowability, can be incorporated in a high proportion, and are useful as a filler for composite substrates such as printed wiring boards and encapsulating materials. Also provided is a process for producing spherical inorganic particles which have high flowability and can be incorporated in a high proportion and which are useful as a filler for encapsulating materials and give an encapsulating material having high electrical insulating properties. One of the processes for producing spherical inorganic particles comprises: (a1) pulverizing a silicate-containing inorganic material to form a pulverization product; (b1) heating the pulverization product in an atomized state to form the pulverization product into spherical particles; (c1) spraying water over the spherical particles to cool them while maintaining the atomized state of the spherical particles; and (d1) collecting the spherical particles. The other process, which is for producing spherical glass particles, comprises: a pulverization step in which a silicate-containing vitreous material is pulverized to form a pulverization product; an acid treatment step in which the pulverization product is contacted with an acid; and a sphering step in which the pulverization product is heated in a suspended state and formed into spherical particles.
    • 具有高流动性的球形无机颗粒的制造方法可以高比例地掺入,可用作印刷线路板和封装材料等复合基板的填料。 还提供了一种生产具有高流动性并且可以高比例地掺入的球形无机颗粒的方法,它可用作密封材料的填料,并得到具有高电绝缘性的封装材料。 生产球形无机颗粒的方法之一包括:(a1)粉碎含硅酸盐的无机材料以形成粉碎产物; (b1)以雾化状态加热粉碎物,形成粉碎物为球状粒子; (c1)在保持球状颗粒的雾化状态的同时将水喷洒在球形颗粒上以冷却它们; 和(d1)收集球形颗粒。 用于制造球形玻璃颗粒的另一方法包括:粉碎步骤,其中将含硅酸盐的玻璃质材料粉碎以形成粉碎产物; 酸处理步骤,其中所述粉碎产物与酸接触; 和粉碎产物在悬浮状态下加热并形成球形颗粒的纺丝步骤。
    • 10. 发明申请
    • Echo Prevention Circuit, Filter Coefficient Setting Method, and Recording Medium with Program Recorded
    • US20070205932A1
    • 2007-09-06
    • US11681643
    • 2007-03-02
    • Takeo InoueHideki OhashiYoshitaka Onaya
    • Takeo InoueHideki OhashiYoshitaka Onaya
    • H03M1/66
    • H04M9/082
    • An echo prevention circuit comprises a filter that is inputted with a first digital signal, the filter outputting second and third digital signals; a first DA converter that converts the second digital signal into a first analog signal and outputs the first analog signal; a second DA converter that converts the third digital signal into a second analog signal and outputs the second analog signal; an input/output terminal that outputs the first analog signal or that is inputted with a third analog signal; a subtracting circuit that outputs a fourth analog signal acquired by subtracting the second analog signal from a signal generated by combining the first analog signal and the third analog signal; an amplification circuit that amplifies the signal output from the subtracting circuit and outputs the amplified signal; an AD converter that converts the signal output from the amplification circuit into a digital signal and outputs the digital signal; a response signal acquiring unit that inputs a first signal to the first DA converter to acquire a first response signal from the input of the first DA converter to the output of the AD converter, the response signal acquiring unit inputting a second signal to the second DA converter to acquire a second response signal from the input of the second DA converter to the output of the AD converter; and a filter coefficient setting unit that sets filter coefficients to the filter based on the first and second response signals such that the fourth analog signal becomes a signal generated by removing or attenuating the first analog signal from the signal generated by combining the first analog signal and the third analog signal, the amplification circuit setting a gain to a first gain in response to a first control signal input before acquiring the first and second response signals, the amplification circuit setting the gain to a second gain larger than the first gain in response to a second control signal input after acquiring the first and second response signals.