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    • 6. 发明授权
    • Room temperature-curable organopolysiloxane composition
    • 室温可固化的有机聚硅氧烷组合物
    • US4618646A
    • 1986-10-21
    • US753319
    • 1985-07-09
    • Toshio TakagoMasatoshi AraiKoji Futatsumori
    • Toshio TakagoMasatoshi AraiKoji Futatsumori
    • C09K3/10C08K3/00C08K5/5425C08L71/02C08L83/00C08L83/04C08L83/06C08K3/10
    • C08L83/04C08G77/14C08G77/16C08G77/20C08G77/26
    • The room temperature-curable (RTV) organopolysiloxane composition of the invention comprises, in addition to the conventional components of a diorganopolysiloxane terminated at both molecular chain ends each with a silanolic hydroxy group, a hydrolyzable organosilicon compound having two or more hydrolyzable groups in a molecule and a filler, an organosilicon-modified polyoxyalkylene compound, of which the organosilicon-containing terminal groups have at least one hydrolyzable group so as to pertain to the crosslinking reaction in its part. By virtue of this unique additive component, the composition is quite free from the disadvantage of sagging when the composition is applied to building works and the like and still retains excellent adhesive properties to the substrate surface in contrast to the difficulty in the conventional RTV compositions in which reducing of the phenomenon of sagging and retention of the strong adhesive strength are hardly compatible.
    • 本发明的室温固化型(RTV)有机聚硅氧烷组合物除了在分子链末端以硅烷醇羟基封端的二有机聚硅氧烷的常规组分外,还包括在分子中具有两个或多个可水解基团的可水解的有机硅化合物 和有机硅改性的聚氧化烯化合物,其中含有机硅的端基具有至少一个可水解基团以与其部分的交联反应相关的填料。 由于这种独特的添加剂组分,组合物相当于在将组合物施用于建筑工程等时下垂的缺点,并且与常规RTV组合物的难度相比仍然保持对基材表面的优异的粘合性能。 这种减少下垂现象和保持强粘合强度几乎不相容。
    • 10. 发明授权
    • Organosilicon compound and a room temperature curable organopolysiloxane
composition formulated therewith
    • 有机硅化合物和与之配制的室温可固化的有机聚硅氧烷组合物
    • US4579963A
    • 1986-04-01
    • US710128
    • 1985-03-11
    • Masatoshi AraiKoji FutatsumoriTakeo InoueShinichi Sato
    • Masatoshi AraiKoji FutatsumoriTakeo InoueShinichi Sato
    • C07F7/18C08L83/04C07F7/04C07F7/08C07F7/10
    • C07F7/1824C08L83/04
    • The invention provides a novel class of organosilicon compounds useful as a curing agent in a room temperature curable organopolysiloxane composition, which is represented by the general structural formulaR.sub.2 CH--CR.dbd.C(OR)--O--Si(R.sup.1).sub.3-m (O--CR.dbd.CH--R).sub.m,in which each R is a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group independently from the others, R.sup.1, if any, is a substituted or unsubstituted monovalent hydrocarbon group and the suffix m is 2 or 3. The compound can readily be synthesized by the reaction of an .alpha.,.beta.-unsaturated ester compound represented by the general formulaR.sub.2 C.dbd.CR--CO--OR,and an alkenyloxy-containing silane compound represented by the general formulaHSi(R.sup.1).sub.3-m (O--CR.dbd.CH--R).sub.m,in which R.sup.1, R and m each have the meaning as defined above, in the presence of a rhodium compound as a catalyst. The room temperature curable composition is formulated with (a) 100 parts by weight of a diorganopolysiloxane terminated at both molecular chain ends each with a silanolic hydroxy group and having a viscosity in the range from 100 to 1,000,000 centistokes at 25.degree. C.; (b) from 2 to 40 parts by weight of the novel organosilicon compound and (c) from 0.01 to 10 parts by weight of a curing accelerator which is preferably a 2-guanidino-containing organosilicon compound.
    • 本发明提供了一种新型的有机硅化合物,其用作室温可固化的有机聚硅氧烷组合物中的固化剂,其由通式结构式R2CH-CR = C(OR)-O-Si(R1)3-m -CR = CH-R)m,其中每个R是氢原子或取代或未取代的单价烃基,其中R 1,如果有的话是取代或未取代的一价烃基,并且后缀m是2或 该化合物可以容易地通过由通式R2C = CR-CO-OR表示的α,β-不饱和酯化合物与由通式HSi(R1)3表示的含烯氧基的硅烷化合物的反应合成 -m(O-CR = CH-R)m,其中R1,R和m各自具有如上定义的含义,在铑化合物作为催化剂存在下。 室温可固化组合物配制为(a)100重量份在两个分子链末端终止的二有机聚硅氧烷,每个分子链端均具有硅烷醇羟基,并且在25℃下的粘度范围为100至1,000,000厘沲。 (b)2〜40重量份的新型有机硅化合物和(c)0.01〜10重量份优选含有2-胍基的有机硅化合物的固化促进剂。