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    • 8. 发明授权
    • Method of fabricating semiconductor circuit devices utilizing multiple
exposures
    • US6159644A
    • 2000-12-12
    • US142077
    • 1998-09-01
    • Hidetoshi SatohYoshinori NakayamaMasahide OkumuraHiroya OhtaNorio Saitou
    • Hidetoshi SatohYoshinori NakayamaMasahide OkumuraHiroya OhtaNorio Saitou
    • G03F7/20H01J37/304G03F9/00
    • G03F7/70616G03F7/70433G03F7/70458G03F7/70633H01J37/3045H01J2237/3175Y10S430/143
    • In a semiconductor circuit device fabricating process in which a reduction image projection exposure apparatus and an electron beam exposure apparatus are in a mixed use in its exposure process, pattern position shift errors for each exposure apparatus are measured and corrected at the time of drawing by means of an electron beam drawing apparatus, thereby enhancing the alignment accuracy.First, a pattern for measuring position shifts is exposed using a stepper and the electron beam drawing apparatus. Then, the position shift errors are measured using an identical coordinate position measuring device. Accidental errors have been mixed in the measurement result at this time. On account of this, measurement data at a certain point are smoothed by taking a summation average with data on the periphery thereof, thus decreasing influences of the accidental errors. Moreover, by inverting positive or negative signs of the data on the position shift errors, the data are made into correction data. Then, the correction data are stored. When an exposure is performed by the electron beam drawing apparatus with the pattern exposed by the stepper as a reference, the correction data for the two apparatuses are transferred to the electron beam drawing apparatus, the two data are added to detected mark positions, and at positions after the addition, pattern position shifts within a wafer surface are determined. At the time of exposure, the exposure is performed at positions obtained by subtracting the correction data from the determined pattern position shifts. This method makes it possible to correct both position shift errors within the wafer surface due to the stepper and position shift errors due to the electron beam drawing apparatus, thus allowing the alignment accuracy to be enhanced. Also, this result makes it possible to enhance yield for products in the fabricating process.
    • 9. 发明授权
    • Electron beam writing method and apparatus for carrying out the same
    • 电子束写入方法及其执行装置
    • US5759423A
    • 1998-06-02
    • US563329
    • 1995-11-28
    • Yasunari SohdaYasuhiro SomedaHiroyuki ItohKatsuhiro KawasakiNorio Saitou
    • Yasunari SohdaYasuhiro SomedaHiroyuki ItohKatsuhiro KawasakiNorio Saitou
    • G03F7/20H01J37/317H01L21/027B44C1/22H01L21/00
    • B82Y10/00B82Y40/00H01J37/3174H01J2237/31776
    • An electron beam writing apparatus comprises: an electron beam source for projecting an electron beam; a first mask provided with a first rectangular aperture for passing the electron beam projected by the electron beam source to shape the electron beam in a primary shaped beam having a rectangular cross section; a second mask provided with a second rectangular aperture for passing the primary shaped beam to shape the primary shaped beam in a secondary shaped beam having a rectangular cross section, and triangular apertures for passing the primary shaped beam to form a secondary shaped beam having a triangular cross section; a first electron beam deflecting system for moving the primary shaped beam on the surface of the second mask; and a second electron beam deflecting system for moving the secondary shaped beam on the surface of a workpiece on which a pattern is to be written. Each of the triangular apertures is formed in a size such that the triangular aperture can be entirely covered with a rectangular image formed by the first shaped beam on the surface of the second mask.
    • 电子束写入装置包括:用于投射电子束的电子束源; 第一掩模,设置有第一矩形孔,用于使由电子束源投影的电子束通过,以将电子束形成为具有矩形横截面的主要形状的梁; 第二掩模,其设置有第二矩形孔,用于使主要成形梁通过,以形成具有矩形截面的次级成形梁的主要成形梁,以及三角形孔,用于使初级成形梁通过以形成具有三角形的二次成形梁 横截面; 第一电子束偏转系统,用于将第一形状光束移动到第二掩模的表面上; 以及用于在待写入图案的工件的表面上移动二次成形光束的第二电子束偏转系统。 每个三角形孔形成为使得三角形孔可以被由第二掩模的表面上的第一成形束形成的矩形图像完全覆盖的尺寸。