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    • 3. 发明授权
    • Solid-state image sensor and manufacturing method thereof
    • 固态图像传感器及其制造方法
    • US06215139B1
    • 2001-04-10
    • US09129697
    • 1998-08-05
    • Yoshinori IidaHidetoshi Nozaki
    • Yoshinori IidaHidetoshi Nozaki
    • H01L31062
    • H01L27/14683H01L27/14609
    • An amplifying solid-state image sensor includes a semiconductor substrate, and a plurality of unit pixels arranged on the semiconductor substrate in a two-dimensional manner, in which each of the plurality of unit pixels includes a photodiode for performing the photoelectric conversion, a storage diode for storing electric signal charge obtained by the photodiode, an amplifying transistor for amplifying the electric signal charge stored in the storage diode, and a signal reading section for reading a signal voltage from the amplifying transistor, and in which each of the plurality of unit pixels has a first active region and a second active region in which the second active region has the same conductivity type as that of the semiconductor substrate and an impurity concentration higher than that of the semiconductor substrate, the photodiode in each of the unit pixels is formed in the first active region, and the amplifying transistor is formed in the second region. With this configuration, it is preferable the photodiode has near a surface thereof a pinned photodiode structure in which a photodiode surface high-concentrated impurity region is formed.
    • 放大固态图像传感器包括半导体衬底和以二维方式布置在半导体衬底上的多个单位像素,其中多个单位像素中的每一个包括用于进行光电转换的光电二极管,存储器 用于存储由光电二极管获得的电信号电荷的二极管,用于放大存储在存储二极管中的电信号电荷的放大晶体管,以及用于从放大晶体管读取信号电压的信号读取部分,其中多个单元 像素具有第一有源区和第二有源区,其中第二有源区具有与半导体衬底的导电类型相同的导电类型,并且杂质浓度高于半导体衬底的杂质浓度,形成每个单位像素中的光电二极管 在第一有源区中,放大晶体管形成在第二区域中。 根据该结构,光电二极管的表面附近形成有光电二极管表面的高浓度杂质区域的钉扎光电二极管结构,
    • 5. 发明授权
    • Back-illuminated type solid-state imaging device and method of manufacturing the same
    • 背照式固体摄像装置及其制造方法
    • US08716822B2
    • 2014-05-06
    • US13363801
    • 2012-02-01
    • Risako UenoKazuhiro SuzukiHideyuki FunakiYoshinori Iida
    • Risako UenoKazuhiro SuzukiHideyuki FunakiYoshinori Iida
    • H01L31/0232
    • H01L27/1464H01L27/14621H01L27/14627H01L27/1463H01L27/14689
    • A solid-state imaging device according to an embodiment includes: a plurality of pixels arranged on a first face of a first semiconductor layer, each of the pixels including a photoelectric conversion element converting light entering through a second face of the first semiconductor layer on the opposite side from the first face into a signal charge, the photoelectric conversion element having a pn junction formed with a first semiconductor region formed on the first face and a second semiconductor region formed on a surface of the first semiconductor region; pixel separating regions separating the pixels from one another and formed between the pixels, each of the pixel separating regions including a second semiconductor layer covering faces in contact with the photoelectric conversion elements, and an insulating film with a lower refractive index than a refractive index of the second semiconductor layer to cover the second semiconductor layer.
    • 根据实施例的固态成像装置包括:布置在第一半导体层的第一面上的多个像素,每个像素包括光电转换元件,其转换通过第一半导体层的第二面进入的光 所述光电转换元件具有形成在所述第一面上形成的第一半导体区域的pn结,以及形成在所述第一半导体区域的表面上的第二半导体区域; 像素分离区域,彼此分离并形成在像素之间,每个像素分隔区域包括覆盖与光电转换元件接触的面的第二半导体层,以及折射率低于折射率的绝缘膜 第二半导体层覆盖第二半导体层。
    • 6. 发明申请
    • SOLID-STATE IMAGING DEVICE
    • 固态成像装置
    • US20110175187A1
    • 2011-07-21
    • US12875534
    • 2010-09-03
    • Risako UenoKazuhiro SuzukiHideyuki FunakiYoshinori IidaTatsuo ShimizuMasamichi Suzuki
    • Risako UenoKazuhiro SuzukiHideyuki FunakiYoshinori IidaTatsuo ShimizuMasamichi Suzuki
    • H01L27/146
    • H01L27/1464H01L27/1462H01L27/14629
    • Certain embodiments provide a solid-state imaging device including: a photoelectric converting unit that includes a semiconductor layer of a second conductivity type provided on a semiconductor substrate of a first conductivity type, converts incident light entering a first surface of the semiconductor substrate into signal charges, and stores the signal charges; a readout circuit that reads the signal charges stored by the photoelectric converting unit; an antireflection structure that is provided on the first surface of the semiconductor substrate to cover the semiconductor layer of the photoelectric converting unit, includes a fixed charge film that retains fixed charges being non-signal charges, and prevents reflection of the incident light; and a hole storage region that is provided between the photoelectric converting unit and the antireflection structure, and stores holes being non-signal charges.
    • 某些实施例提供了一种固态成像装置,包括:光电转换单元,其包括设置在第一导电类型的半导体衬底上的第二导电类型的半导体层,将入射到半导体衬底的第一表面的入射光转换为信号电荷 ,并存储信号费用; 读出由光电转换单元存储的信号电荷的读出电路; 设置在半导体衬底的第一表面上以覆盖光电转换单元的半导体层的抗反射结构包括:固定电荷膜,其保持作为非信号电荷的固定电荷,并防止入射光的反射; 以及设置在光电转换单元和抗反射结构之间的孔存储区域,并且存储非信号电荷的空穴。
    • 8. 发明授权
    • Infrared sensor, infrared camera, method of driving infrared sensor, and method of driving infrared camera
    • 红外传感器,红外摄像机,红外线传感器的驱动方法以及红外摄像机的驱动方法
    • US07361899B2
    • 2008-04-22
    • US11532771
    • 2006-09-18
    • Yoshinori Iida
    • Yoshinori Iida
    • G01J5/20H01L27/14H01L31/00
    • G01J1/46G01J5/24H01L27/14649H04N5/33
    • An infrared sensor includes an imaging area including infrared detection pixels; row selection lines; a signal line; a row selection circuit generating a column voltage in the signal line; a column amplifier including a first amplifying transistor which generates an amplification voltage obtained by amplifying the column voltage and a first clamp circuit which holds threshold voltage information of the first amplifying transistor in its gate; a removing circuit including a second amplifying transistor and a second clamp circuit which holds threshold voltage information of the second amplifying transistor in its gate, the removing circuit being connected to the column amplifier to remove a bias component from the amplification voltage; and a reading circuit reading an output voltage from the column amplifier, the output voltage is obtained by excluding at least the bias component from the amplification voltage.
    • 红外线传感器包括:包含红外线检测像素的摄像区域; 行选择行; 信号线 在所述信号线中产生列电压的行选择电路; 列放大器,包括产生通过放大列电压而获得的放大电压的第一放大晶体管和保持其栅极中第一放大晶体管的阈值电压信息的第一钳位电路; 去除电路,包括第二放大晶体管和第二钳位电路,其在其栅极中保持第二放大晶体管的阈值电压信息,去除电路连接到列放大器以从放大电压去除偏置分量; 以及从列放大器读取输出电压的读取电路,通过从放大电压中至少排除偏置分量来获得输出电压。
    • 9. 发明申请
    • INFRARED SENSOR, INFRARED CAMERA, METHOD OF DRIVING INFRARED SENSOR, AND METHOD OF DRIVING INFRARED CAMERA
    • 红外传感器,红外摄像机,驱动红外传感器的方法和驱动红外摄像机的方法
    • US20070145274A1
    • 2007-06-28
    • US11532771
    • 2006-09-18
    • Yoshinori Iida
    • Yoshinori Iida
    • H01L27/14G01T1/24G01J5/20H01L31/00
    • G01J1/46G01J5/24H01L27/14649H04N5/33
    • An infrared sensor includes an imaging area including infrared detection pixels; row selection lines; a signal line; a row selection circuit generating a column voltage in the signal line; a column amplifier including a first amplifying transistor which generates an amplification voltage obtained by amplifying the column voltage and a first clamp circuit which holds threshold voltage information of the first amplifying transistor in its gate; a removing circuit including a second amplifying transistor and a second clamp circuit which holds threshold voltage information of the second amplifying transistor in its gate, the removing circuit being connected to the column amplifier to remove a bias component from the amplification voltage; and a reading circuit reading an output voltage from the column amplifier, the output voltage is obtained by excluding at least the bias component from the amplification voltage.
    • 红外线传感器包括:包含红外线检测像素的摄像区域; 行选择行; 信号线 在所述信号线中产生列电压的行选择电路; 列放大器,包括产生通过放大列电压而获得的放大电压的第一放大晶体管和保持其栅极中第一放大晶体管的阈值电压信息的第一钳位电路; 去除电路,包括第二放大晶体管和第二钳位电路,其在其栅极中保持第二放大晶体管的阈值电压信息,去除电路连接到列放大器以从放大电压去除偏置分量; 以及从列放大器读取输出电压的读取电路,通过从放大电压中至少排除偏置分量来获得输出电压。