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1. 发明授权

US06834977B2 Light emitting device 失效
标题翻译：发光装置
公开(公告)号：US06834977B2
公开(公告)日：2004-12-28
申请号：US09871699
申请日：2001-06-04
申请人： Yoshinobu Suehiro , Yuji Takahashi , Hideaki Kato , Koichi Kaga , Kiyotaka Teshima , Shunsuke Ohtsuka
发明人： Yoshinobu Suehiro , Yuji Takahashi , Hideaki Kato , Koichi Kaga , Kiyotaka Teshima , Shunsuke Ohtsuka
IPC分类号： F21L400
CPC分类号： G02B6/0068 , G02B6/0018 , G02B6/0028 , G02B6/0051 , H01L2224/48465 , Y10S362/80
摘要： Separate leads and a common lead are provided on the upper and lower surfaces of a substrate. A plurality of LED elements are disposed in an array on the common lead on the upper surface of the substrate. The common lead provided on the upper surface of the substrate is connected to the common lead provided on the lower surface of the substrate through through-hole plating. Heat generated from the plurality of LED elements is transferred through the common lead provided on the upper surface of the substrate and the through-hole plating to the common lead provided on the lower surface of the substrate and is release therefrom into the air. By virtue of this construction, an light emitting device can be realized in which heat radiating properties are homogenized, heat radiation efficiency is improved, and a compact structure is obtained and, thus, the color balance is improved and unfavorable phenomena such as lowering in the output of light emitting elements and shortening of the service life are avoided.
摘要翻译：在基板的上表面和下表面上提供单独的引线和公共引线。多个LED元件以阵列方式设置在基板的上表面上的公共引线上。设置在基板的上表面上的公共引线通过通孔电镀连接到设置在基板的下表面上的公共引线。从多个LED元件产生的热量通过设置在基板的上表面上的公共引线和通孔电镀传递到设置在基板的下表面上的公共引线，并将其从空气中释放。通过这种结构，可以实现散热特性均匀化，散热效率提高，并且获得紧凑结构的发光装置，从而提高了色平衡，并且降低了不利的现象避免了发光元件的输出和使用寿命的缩短。

2. 发明授权

US07768029B2 LED lamp 失效
标题翻译：点灯
公开(公告)号：US07768029B2
公开(公告)日：2010-08-03
申请号：US11892095
申请日：2007-08-20
申请人： Kanae Matsumura , Hideaki Kato , Kiyotaka Teshima , Shunsuke Ohtsuka
发明人： Kanae Matsumura , Hideaki Kato , Kiyotaka Teshima , Shunsuke Ohtsuka
IPC分类号： H01L27/15 , H01L29/22
CPC分类号： H05K3/3442 , F21K9/00 , F21Y2113/13 , F21Y2115/10 , H01L25/0753 , H01L2224/48091 , H05K3/366 , H05K2201/09181 , H05K2201/10106 , Y02P70/613 , H01L2924/00014
摘要： An LED lamp has a package and a plurality of light emitting elements that are electrically connected to a plurality of electrode plates provided in the package and that are sealed with transparent material. A red light emitting element of the plurality of light emitting elements is wire bonded along the longitudinal direction of the package, a green light emitting element and a blue light emitting element are flip-chip bonded with its electrode faced down, and the electrodes are extended to a surface opposite to the light emission surface of the LED lamp while being embedded in the package.
摘要翻译： LED灯具有封装和多个发光元件，其电连接到设置在封装中的多个电极板，并且用透明材料密封。多个发光元件的红色发光元件沿着封装的纵向方向线接合，绿色发光元件和蓝色发光元件与其电极面朝下地倒装芯片接合，并且电极延伸到嵌入在封装体内的与LED灯的发光面相反的表面。

3. 发明申请

US20080001163A1 LED lamp 失效
标题翻译：点灯
公开(公告)号：US20080001163A1
公开(公告)日：2008-01-03
申请号：US11892095
申请日：2007-08-20
申请人： Kanae Matsumura , Hideaki Kato , Kiyotaka Teshima , Shunsuke Ohtsuka
发明人： Kanae Matsumura , Hideaki Kato , Kiyotaka Teshima , Shunsuke Ohtsuka
IPC分类号： H01L33/00
CPC分类号： H05K3/3442 , F21K9/00 , F21Y2113/13 , F21Y2115/10 , H01L25/0753 , H01L2224/48091 , H05K3/366 , H05K2201/09181 , H05K2201/10106 , Y02P70/613 , H01L2924/00014
摘要： An LED lamp has a package and a plurality of light emitting elements that are electrically connected to a plurality of electrode plates provided in the package and that are sealed with transparent material. A red light emitting element of the plurality of light emitting elements is wire bonded along the longitudinal direction of the package, a green light emitting element and a blue light emitting element are flip-chip bonded with its electrode faced down, and the electrodes are extended to a surface opposite to the light emission surface of the LED lamp while being embedded in the package.
摘要翻译： LED灯具有封装和多个发光元件，其电连接到设置在封装中的多个电极板，并且用透明材料密封。多个发光元件的红色发光元件沿着封装的纵向方向线接合，绿色发光元件和蓝色发光元件与其电极面朝下倒装芯片接合，并且电极延伸到嵌入在封装体内的与LED灯的发光面相反的表面。

4. 发明授权

US07279723B2 LED lamp 失效
标题翻译：点灯
公开(公告)号：US07279723B2
公开(公告)日：2007-10-09
申请号：US10804212
申请日：2004-03-19
申请人： Kanae Matsumura , Hideaki Kato , Kiyotaka Teshima , Shunsuke Ohtsuka
发明人： Kanae Matsumura , Hideaki Kato , Kiyotaka Teshima , Shunsuke Ohtsuka
IPC分类号： H01L29/24 , H01L29/18
CPC分类号： H05K3/3442 , F21K9/00 , F21Y2113/13 , F21Y2115/10 , H01L25/0753 , H01L2224/48091 , H05K3/366 , H05K2201/09181 , H05K2201/10106 , Y02P70/613 , H01L2924/00014
摘要： An LED lamp has a package and a plurality of light emitting elements that are electrically connected to a plurality of electrode plates provided in the package and that are sealed with transparent material. A red light emitting element of the plurality of light emitting elements is wire bonded along the longitudinal direction of the package, a green light emitting element and a blue light emitting element are flip-chip bonded with its electrode faced down, and the electrodes are extended to a surface opposite to the light emission surface of the LED lamp while being embedded in the package.
摘要翻译： LED灯具有封装和多个发光元件，其电连接到设置在封装中的多个电极板，并且用透明材料密封。多个发光元件的红色发光元件沿着封装的纵向方向线接合，绿色发光元件和蓝色发光元件与其电极面朝下地倒装芯片接合，并且电极延伸到嵌入在封装体内的与LED灯的发光面相反的表面。

5. 发明授权

US06872585B2 LED device and manufacturing method thereof 失效
标题翻译： LED装置及其制造方法
公开(公告)号：US06872585B2
公开(公告)日：2005-03-29
申请号：US10842494
申请日：2004-05-11
申请人： Kanae Matsumura , Yuji Takahashi , Hideaki Kato , Shunsuke Ohtsuka
发明人： Kanae Matsumura , Yuji Takahashi , Hideaki Kato , Shunsuke Ohtsuka
IPC分类号： H01L33/00 , H01L25/075 , H01L21/00
CPC分类号： H01L25/0753 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/00014 , H01L2924/00
摘要： In an LED device, an opening portion of a package in which a plurality of five light-emitting elements are mounted is filled with a transparent epoxy resin and sealed with the resin. The transparent epoxy resin is shrunk when cured. Hence, the surface of the transparent epoxy resin is dented in the center portion so that the outer edge portion becomes higher than the center portion. The light-emitting elements located at opposite ends are the highest in element height among the five light-emitting elements. Hence, when the light-emitting elements are mounted at opposite ends of a single row, distances from light-emitting surfaces of the five light-emitting elements to the surface of the transparent epoxy resin are made uniform and luminous intensity distribution characteristics thereof are made uniform. Tips of leads are further bent up along side surfaces of the package. Hence, when the LED device is soldered onto a mount board, solder is deposited even on the up-bent tips of the leads, so that surface tension of solder is balanced on the front and rear of the package. As a result, the LED device can be mounted in a predetermined position while prevented from sliding. In an LED lead frame, hanger leads are provided so as to be extended in three directions of a package. Hence, the electrically conductive leads can be bent stably and accurately without tottering of the package in the process of bending the electrically conductive leads.
摘要翻译：在LED器件中，安装有多个五个发光元件的封装的开口部分填充有透明环氧树脂并用树脂密封。固化后，透明环氧树脂收缩。因此，透明环氧树脂的表面在中心部分凹陷，使得外边缘部分变得高于中心部分。位于相对端的发光元件在五个发光元件中的元件高度最高。因此，当将发光元件安装在单列的相对端时，将五个发光元件的发光表面到透明环氧树脂的表面的距离均匀并且使其发光强度分布特性制服。引线的尖端进一步沿着封装的侧表面弯曲。因此，当将LED器件焊接到安装板上时，甚至在引线的上弯顶端上沉积焊料，使得焊料的表面张力在封装的前部和后部平衡。结果，LED装置可以安装在预定位置，同时防止滑动。在LED引线框架中，提供悬挂引线以在封装的三个方向上延伸。因此，在导电引线弯曲的过程中，导电引线可以稳定且准确地弯曲而不会使封装弯曲。

6. 发明授权

US06812481B2 LED device and manufacturing method thereof 失效
标题翻译： LED装置及其制造方法
公开(公告)号：US06812481B2
公开(公告)日：2004-11-02
申请号：US10231067
申请日：2002-08-30
申请人： Kanae Matsumura , Yuji Takahashi , Hideaki Kato , Shunsuke Ohtsuka
发明人： Kanae Matsumura , Yuji Takahashi , Hideaki Kato , Shunsuke Ohtsuka
IPC分类号： H01L2906
CPC分类号： H01L25/0753 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/00014 , H01L2924/00
摘要： In an LED device, an opening portion of a package in which a plurality of five light-emitting elements are mounted is filled with a transparent epoxy resin and sealed with the resin. The transparent epoxy resin is shrunk when cured. Hence, the surface of the transparent epoxy resin is dented in the center portion so that the outer edge portion becomes higher than the center portion. The light-emitting elements located at opposite ends are the highest in element height among the five light emitting element. Hence, when the light-emitting elements are mounted at opposite ends of a single row, distances from light-emitting surfaces of the five light-emitting elements to the surface of the transparent epoxy resin are made uniform and luminous intensity distribution characteristics thereof are made uniform. Tips of leads are further bent up along side surfaces of the package. Hence, when the LED device is soldered onto a mount board, solder is deposited even on the up-bent tips of the leads, so that surface tension of solder is balanced on the front and rear of the package. As a result, the LED device can be mounted in a predetermined position while prevented from sliding. In an LED lead frame, hanger leads are provided so as to be extended in three directions of a package. Hence, the electrically conductive leads can be bent stably and accurately without tottering of the package in the process of bending the electrically conductive leads.
摘要翻译：在LED器件中，安装有多个五个发光元件的封装的开口部分填充有透明环氧树脂并用树脂密封。固化后，透明环氧树脂收缩。因此，透明环氧树脂的表面在中心部分凹陷，使得外边缘部分变得高于中心部分。位于相对端的发光元件在五个发光元件中的元件高度最高。因此，当将发光元件安装在单列的相对端时，将五个发光元件的发光表面到透明环氧树脂的表面的距离均匀并且使其发光强度分布特性制服。引线的尖端进一步沿着封装的侧表面弯曲。因此，当将LED器件焊接到安装板上时，甚至在引线的上弯顶端上沉积焊料，使得焊料的表面张力在封装的前部和后部平衡。结果，LED装置可以安装在预定位置，同时防止滑动。在LED引线框架中，提供悬挂引线以在封装的三个方向上延伸。因此，在导电引线弯曲的过程中，导电引线可以稳定且准确地弯曲而不会使封装弯曲。

7. 发明申请

US20050030762A1 Light-emitting diode lamp 失效
标题翻译：发光二极管灯
公开(公告)号：US20050030762A1
公开(公告)日：2005-02-10
申请号：US10911643
申请日：2004-08-05
申请人： Hideaki Kato , Kanae Matsumura , Shunsuke Ohtsuka
发明人： Hideaki Kato , Kanae Matsumura , Shunsuke Ohtsuka
IPC分类号： H01L23/12 , H01L25/075 , H01L33/48 , H05K3/34 , B60Q1/00
CPC分类号： H05K3/3442 , H01L25/0753 , H01L2224/48091 , H01L2224/48227 , H05K2201/10106 , H05K2201/1084 , H05K2201/10931 , Y02P70/613 , H01L2924/00014
摘要： A notch portion 7A is disposed on a formation surface of a wiring pattern 7 and is located in a contact point with a wiring pattern 9 of an outside substrate 8, so that a solder 9a melted by reflow soldering slowly flows up along an edge of the notch portion 7A, improving a solder-joint performance. The notch portion 7A is formed in a recess shape as formed by cutting away the substrate 6 and as a result, the melted solder stays in the recess portion, which prevents the melted solder from moving up over the notch portion 7A.
摘要翻译：切口部7A设置在布线图案7的形成面上，与外部基板8的布线图案9的接触点配置，使得通过回流焊接而熔化的焊料9a缓慢地沿着切口部7A，提高焊接性能。切口部7A形成为通过切除基板6而形成的凹部形状，结果，熔融的焊料滞留在凹部中，防止熔融的焊料向上移动到切口部7A上方。

8. 发明授权

US07285803B2 Light-emitting diode lamp having a terminal portion with a notch portion 失效
标题翻译：发光二极管灯，具有带切口部的端子部
公开(公告)号：US07285803B2
公开(公告)日：2007-10-23
申请号：US10911643
申请日：2004-08-05
申请人： Hideaki Kato , Kanae Matsumura , Shunsuke Ohtsuka
发明人： Hideaki Kato , Kanae Matsumura , Shunsuke Ohtsuka
IPC分类号： H01L33/00
CPC分类号： H05K3/3442 , H01L25/0753 , H01L2224/48091 , H01L2224/48227 , H05K2201/10106 , H05K2201/1084 , H05K2201/10931 , Y02P70/613 , H01L2924/00014
摘要： A notch portion 7A is disposed on a formation surface of a wiring pattern 7 and is located in a contact point with a wiring pattern 9 of an outside substrate 8, so that a solder 9a melted by reflow soldering slowly flows up along an edge of the notch portion 7A, improving a solder-joint performance. The notch portion 7A is formed in a recess shape as formed by cutting away the substrate 6 and as a result, the melted solder stays in the recess portion, which prevents the melted solder from moving up over the notch portion 7A.
摘要翻译：切口部分7A设置在布线图案7的形成表面上并且位于与外部基板8的布线图案9的接触点中，使得通过回流焊接熔化的焊料9a沿边缘向上流动的切口部7A，提高焊接性能。切口部7A形成为通过切除基板6而形成的凹部形状，结果，熔融的焊料滞留在凹部中，防止熔融的焊料向上移动到切口部7A上方。

9. 发明授权

US06614055B1 Surface light-emitting element and self-scanning type light-emitting device 有权
标题翻译：表面发光元件和自扫描型发光元件
公开(公告)号：US06614055B1
公开(公告)日：2003-09-02
申请号：US09710246
申请日：2000-11-10
申请人： Yukihisa Kusuda , Seiij Ohno , Shunsuke Ohtsuka
发明人： Yukihisa Kusuda , Seiij Ohno , Shunsuke Ohtsuka
IPC分类号： H01L2974
CPC分类号： B41J2/45 , B41J2/451 , B41J2002/453 , H01L27/153 , H01L33/0016 , H01L33/145 , H01L33/20 , H01L33/38 , H01L33/385 , Y10S257/918
摘要： A surface light-emitting element having improved external light emission efficiency and a self-scanning light-emitting device using this surface light-emitting element are provided. To improve external light-emission efficiency, the light-emitting center is shifted to an area where there is no light shielding layer thereon. When the surface light-emitting element is a surface light-emitting thyristor of the PNPN structure, it is necessary to have such a construction that part of the injected current is prevented from flowing toward the gate electrode to improve external light emission efficiency. The self-scanning light-emitting device of this invention is accomplished by using this type of surface light-emitting element.
摘要翻译：提供具有改善的外部发光效率的表面发光元件和使用该表面发光元件的自扫描型发光装置。为了提高外部发光效率，发光中心转移到其上没有遮光层的区域。当表面发光元件是PNPN结构的表面发光晶闸管时，需要具有这样的结构，即防止部分注入电流流向栅电极以提高外部发光效率。本发明的自扫描型发光装置通过使用这种类型的表面发光元件来实现。

10. 发明授权

US06590347B2 Light-emitting element matrix array 失效
公开(公告)号：US06590347B2
公开(公告)日：2003-07-08
申请号：US09937041
申请日：2001-09-20
申请人： Seiji Ohno , Yukihisa Kusuda , Shunsuke Ohtsuka , Yasunao Kuroda , Takahisa Arima , Hideaki Saitou
发明人： Seiji Ohno , Yukihisa Kusuda , Shunsuke Ohtsuka , Yasunao Kuroda , Takahisa Arima , Hideaki Saitou
IPC分类号： G09G310
CPC分类号： B41J2/45 , H01L27/153 , H01L33/0016
摘要： The cost of a light-emitting element matrix array is reduced by implementing a function equivalent to a light-emitting thyristor by elements different therefrom. A plurality of combinational element are arrayed in one line. The plurality of combinational elements are divided into groups n by n. The bases of transistors included in each group are separately connected to base-selecting lines and the anodes of light-emitting diodes included in each group are commonly connected to one anode terminal every group.

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