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1. 发明授权

US06590347B2 Light-emitting element matrix array 失效
公开(公告)号：US06590347B2
公开(公告)日：2003-07-08
申请号：US09937041
申请日：2001-09-20
申请人： Seiji Ohno , Yukihisa Kusuda , Shunsuke Ohtsuka , Yasunao Kuroda , Takahisa Arima , Hideaki Saitou
发明人： Seiji Ohno , Yukihisa Kusuda , Shunsuke Ohtsuka , Yasunao Kuroda , Takahisa Arima , Hideaki Saitou
IPC分类号： G09G310
CPC分类号： B41J2/45 , H01L27/153 , H01L33/0016
摘要： The cost of a light-emitting element matrix array is reduced by implementing a function equivalent to a light-emitting thyristor by elements different therefrom. A plurality of combinational element are arrayed in one line. The plurality of combinational elements are divided into groups n by n. The bases of transistors included in each group are separately connected to base-selecting lines and the anodes of light-emitting diodes included in each group are commonly connected to one anode terminal every group.

2. 发明授权

US06535234B2 Method for setting quantity of light of light-emitting element array 有权
公开(公告)号：US06535234B2
公开(公告)日：2003-03-18
申请号：US09937042
申请日：2001-09-20
申请人： Seiji Ohno , Yukihisa Kusuda , Shunsuke Ohtsuka , Yasunao Kuroda , Takahisa Arima , Hideaki Saitou
发明人： Seiji Ohno , Yukihisa Kusuda , Shunsuke Ohtsuka , Yasunao Kuroda , Takahisa Arima , Hideaki Saitou
IPC分类号： B41J2385
CPC分类号： B41J2/45
摘要： A method for setting the amount of light in an array of light-emitting thyristors, each thyristor having I-L characteristic in which a luminous efficiency is decreased in a lower current field, is provided. According to the method, the amount of light emitted from a light-emitting thyristor is set so that a predetermined exposure energy may be obtained without decreasing a luminous efficiency of a light-emitting thyristor. The density D of a current to be supplied to the light-emitting thyristor to obtain a predetermined exposure energy is selected so as to satisfy the range of 3×Dth

3. 发明授权

US06831673B2 Optical write head, and method of assembling the same 有权
标题翻译：光写头，及其组装方法
公开(公告)号：US06831673B2
公开(公告)日：2004-12-14
申请号：US09825889
申请日：2001-04-05
申请人： Masahide Wakisaka , Takahisa Arima , Harunobu Yoshida , Yukihisa Kusuda , Seiji Oono , Yasunao Kuroda
发明人： Masahide Wakisaka , Takahisa Arima , Harunobu Yoshida , Yukihisa Kusuda , Seiji Oono , Yasunao Kuroda
IPC分类号： B41J245
CPC分类号： B41J2/451 , H01L27/153 , H01L33/58 , H01L2224/05553 , H01L2224/45144 , H01L2224/48137 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01028 , H01L2924/12041 , H01L2924/1301 , H01L2924/00014 , H01L2924/00
摘要： In an optical write head, a rod lens array, a substrate support member for supporting a substrate, and a driver circuit board are fixedly held by a support member. The support member and the substrate support member are formed from metallic material, and a frame of the rod lens array is formed from a glass plate. Further, distance between a light-emitting section of a light-emitting device array and a light-incident end face of the rod lens array is adjusted, by means of rotating eccentric pins. Further, light-emitting device array chips are die-bonded on the substrate bonded at predetermined positions on the substrate support member while the position of the substrate support member is taken as a reference plane.
摘要翻译：在光写入头中，杆状透镜阵列，用于支撑衬底的衬底支撑构件和驱动器电路板由支撑构件固定地保持。支撑构件和基板支撑构件由金属材料形成，并且杆状透镜阵列的框架由玻璃板形成。此外，通过旋转的偏心销来调节发光元件阵列的发光部和棒状透镜阵列的入射端面之间的距离。此外，发光装置阵列芯片被芯片接合在基板支撑构件上的预定位置处的基板上，同时将基板支撑构件的位置作为基准面。

4. 发明授权

US06300224B1 Methods of dicing semiconductor wafer into chips, and structure of groove formed in dicing area 有权
标题翻译：将半导体晶片切割成芯片的方法以及在切割区域中形成的凹槽的结构
公开(公告)号：US06300224B1
公开(公告)日：2001-10-09
申请号：US09806262
申请日：2001-03-28
申请人： Takahisa Arima , Yukihisa Kusuda
发明人： Takahisa Arima , Yukihisa Kusuda
IPC分类号： H01L2146
CPC分类号： H01L21/78 , H01L2224/48463 , H01L2924/10156
摘要： A method for dicing a semiconductor wafer into chips is provided, in which the peeling-off of a hard protective film on the surface of a semiconductor substrate may be avoided. Two parallel grooves are formed at a dicing area around a chip by an etching process. Then, SiO2 film is deposited on the GaAs substrate as a protective film. At this time, a bending portion at the interface between the protective films on the inner surface of the groove and the surface of the substrate. When the part between two grooves is cut by a dicing blade, a stress to the protective film caused by the edge of the blade is concentrated to the bending portion, resulting in a crack along the bending portion.
摘要翻译：提供了一种将半导体晶片切割成芯片的方法，其中可以避免半导体衬底的表面上的硬保护膜的剥离。通过蚀刻工艺在芯片周围的切割区域形成两个平行的沟槽。然后，将SiO 2膜作为保护膜沉积在GaAs衬底上。此时，在槽的内表面上的保护膜与基板的表面之间的界面处的弯曲部分。当通过切割刀片切割两个凹槽之间的部分时，由刀片边缘引起的对保护膜的应力集中到弯曲部分，导致沿着弯曲部分的裂纹。

5. 发明授权

US4708372A Cross piping construction 失效
标题翻译：十字管道施工
公开(公告)号：US4708372A
公开(公告)日：1987-11-24
申请号：US709207
申请日：1985-03-07
申请人： Takahisa Arima , Susumu Ninomiya , Yuji Horikawa , Tadasi Aoki
发明人： Takahisa Arima , Susumu Ninomiya , Yuji Horikawa , Tadasi Aoki
IPC分类号： F16L41/02 , F16L41/00
CPC分类号： F16L41/021
摘要： A cross piping for a header in a boiling water reactor has a main pipe coaxially connected to a center branch pipe at a cross portion. A plurality of transversely extending branch pipes also connect to this cross portion. The cross portion has a reduced diameter with respect to the main distributor pipe. In one embodiment, the cross portion is in the shape of a hemisphere having a radius equal to that of the main distributor pipe, the center of the hemispherical surface being positioned adjacent an upstream intersection of the main distributor pipe axis and an extension of the circumferential surfaces of the branch pipes. In another embodiment, the cross portion has a throttle portion which is either a flat surface or a curved surface.
摘要翻译：沸水反应器中的集管的十字管道具有在十字部分同轴连接到中心分支管的主管。多个横向延伸的支管也连接到该十字部分。交叉部分相对于主分配器管具有减小的直径。在一个实施例中，十字形部分的半球形状具有与主分配器管的半径相等的半径，半球形表面的中心位于主分配器管轴线和圆周方向的延伸部分的上游交叉点附近支管表面。在另一个实施例中，十字形部分具有节流部分，其是平坦表面或曲面。

6. 发明申请

US20090196818A1 MULTIFERROIC ELEMENT 审中-公开
标题翻译：多元素
公开(公告)号：US20090196818A1
公开(公告)日：2009-08-06
申请号：US12299778
申请日：2007-04-12
申请人： Yoshinori Tokura , Takahisa Arima , Yoshio Kaneko
发明人： Yoshinori Tokura , Takahisa Arima , Yoshio Kaneko
IPC分类号： C01G37/02 , C01G49/00 , C01G53/00 , C01G51/00
CPC分类号： H01L43/10 , G11B9/02 , G11C11/16 , G11C11/1675 , G11C11/22 , G11C11/2275 , H01L27/222
摘要： A multiferroic element having a simple structure in which orientation of electric polarization or magnetization of a solid state material can be controlled by applying a magnetic field or an electric field, respectively. By applying an external magnetic field to a multiferroic solid state material that exhibits ferroelectricity and ferromagnetism having a spin structure such that the orientation of spin is rotating along the outside surface of a cone (apex angle α at the top of the cone is in a range of 0
摘要翻译：一种具有简单结构的多铁素体元件，其中分别通过施加磁场或电场来控制固态材料的电极化或取向。通过将外部磁场施加到显示具有自旋结构的铁电性和铁磁性的多铁性固体材料，使得旋转取向沿锥体的外表面旋转（锥顶部的顶角α在一定范围内） 0 <α<= 90度），可以控制具有与外部施加的磁场的方向基本垂直的取向的电极化。同时，通过对多铁性固态材料施加外部电场，可以控制基本上垂直于外部施加电场方向的取向的磁化。

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