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    • 8. 发明授权
    • Surface light-emitting element and self-scanning type light-emitting device
    • 表面发光元件和自扫描型发光元件
    • US06180960B2
    • 2001-01-30
    • US09043106
    • 1998-11-04
    • Yukihisa KusudaSeiij OhnoShunsuke Ohtsuka
    • Yukihisa KusudaSeiij OhnoShunsuke Ohtsuka
    • H01L3300
    • B41J2/45B41J2/451B41J2002/453H01L27/153H01L33/0016H01L33/145H01L33/20H01L33/38H01L33/385Y10S257/918
    • A surface light-emitting element having improved external light emission efficiency and a self-scanning light-emitting device using this surface light-emitting element are provided. To improve external light-emission efficiency, the light-emitting center is shifted to an area where there is no light shielding layer thereon. To achieve this, an insulating layer is provided on the electrode portion above which there is a light-shielding layer at a portion making contact with the semiconductor layer thereunder so as to prevent the injected current from flowing from that electrode portion. To increase the amount of light emission, the peripheral length of the electrode is increased. With an electrode of the same area, the larger the peripheral length, the larger becomes the amount of light emission because the current injected from the electrode is distributed evenly over the entire surface, causing light to emit evenly. When the surface light-emitting element is a surface light-emitting thyristor of the PNPN structure, it is necessary to have such a construction that part of the injected current is prevented from flowing toward the gate electrode to improve external light emission efficiency. The self-scanning light-emitting device of this invention is accomplished by using this type of surface light-emitting element.
    • 提供具有改善的外部发光效率的表面发光元件和使用该表面发光元件的自扫描型发光装置。 为了提高外部发光效率,发光中心转移到其上没有遮光层的区域。 为了实现这一点,在电极部分上设置绝缘层,在其上方,在与其下面的半导体层接触的部分处具有遮光层,以防止注入的电流从该电极部分流出。 为了增加发光量,电极的周长增加。 对于具有相同面积的电极,周长越长,由于从电极注入的电流均匀分布在整个表面上,导致光均匀发射,所以发光量越大。 当表面发光元件是PNPN结构的表面发光晶闸管时,需要具有这样的结构,即防止部分注入电流流向栅电极以提高外部发光效率。 本发明的自扫描型发光装置通过使用这种类型的表面发光元件来实现。
    • 9. 发明授权
    • Process of producing thin film transistor array
    • 制造薄膜晶体管阵列的工艺
    • US5756371A
    • 1998-05-26
    • US439444
    • 1995-05-11
    • Seiji OhnoYukihisa Kusuda
    • Seiji OhnoYukihisa Kusuda
    • G02F1/136G02F1/1368H01L21/28H01L21/336H01L21/77H01L21/84H01L29/78H01L29/786H01L21/00
    • H01L21/28008H01L27/1214H01L29/66765
    • A process of manufacture has the steps of forming a metal film on the insulating substrate, applying photoresist on the metal film, exposing the photoresist to light to form a photoresist pattern by developing, etching the metal film with the photoresist pattern as an etching mask, forming an insulating film on the insulating substrate by making the insulating substrate with the photoresist pattern contact a liquid-phase deposition treatment liquid, and removing the photoresist pattern or the combination of the photoresist pattern and the insulating film thereon. Through these steps, the metal film for use as the metal wiring to effect contact with the electrode of the TFT is buried in the surface of the insulating substrate. Consequently, the resistance of the metal wiring can greatly be reduced. Thereby, it is produced a thin film transistor capable of rendering an large area, large capacity display possible and free from a difference in level.
    • 制造方法具有以下步骤:在绝缘基板上形成金属膜,在金属膜上施加光致抗蚀剂,通过显影,用光致抗蚀剂图案蚀刻金属膜作为蚀刻掩模,使光致抗蚀剂曝光以形成光致抗蚀剂图案, 通过使具有光致抗蚀剂图案的绝缘基板与液相沉积处理液接触,以及去除光致抗蚀剂图案或其上的光致抗蚀剂图案和绝缘膜的组合,在绝缘基板上形成绝缘膜。 通过这些步骤,用作与TFT的电极接触的金属布线的金属膜被埋在绝缘基板的表面中。 因此,可以大大降低金属布线的电阻。 由此,制造出能够呈现大面积,大容量显示成为可能而且没有电平差的薄膜晶体管。