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1. 发明申请

US20120069627A1 NONVOLATILE SEMICONDUCTOR MEMORY DEVICE 有权
标题翻译：非易失性半导体存储器件
公开(公告)号：US20120069627A1
公开(公告)日：2012-03-22
申请号：US13233679
申请日：2011-09-15
申请人： Yoichi MINEMURA , Takayuki TSUKAMOTO , Takafumi SHIMOTORI , Hiroshi KANNO , Natsuki KIKUCHI , Mitsuru SATO
发明人： Yoichi MINEMURA , Takayuki TSUKAMOTO , Takafumi SHIMOTORI , Hiroshi KANNO , Natsuki KIKUCHI , Mitsuru SATO
IPC分类号： G11C11/00
CPC分类号： G11C5/063 , G11C13/0004 , G11C13/0007 , G11C13/0023 , G11C13/0069 , G11C29/025 , G11C29/028 , G11C2013/0083 , G11C2213/71
摘要： A nonvolatile semiconductor memory device includes: a memory cell array including plural first lines, plural second lines, and plural memory cells each including a variable resistance element; a first decoder connected to at least one ends of the plurality of first lines and configured to select at least one of the first lines; at least one pair of second decoders connected to both ends of the plurality of second lines and configured such that one of the pair of second decoders is selected for selecting the second lines according to a distance between the one of the first lines selected by the first decoder and the both ends of the second lines; and a voltage application circuit configured to apply a certain voltage between the first line and the second line selected by the first decoder and the second decoder.
摘要翻译：非易失性半导体存储器件包括：包括多个第一线，多个第二线和多个存储单元的存储单元阵列，每个存储单元包括可变电阻元件; 第一解码器，连接到所述多条第一线的至少一端，并被配置为选择所述第一线中的至少一条线; 至少一对第二解码器，连接到所述多个第二线路的两端，并且被配置为使得所述一对第二解码器中的一个被选择用于根据所述第一线选择的所述第一线之间的距离来选择所述第二线解码器和第二行的两端; 以及电压施加电路，被配置为在由第一解码器和第二解码器选择的第一线和第二线之间施加一定电压。

2. 发明申请

US20100202186A1 SEMICONDUCTOR MEMORY DEVICE, METHOD OF MANUFACTURING THE SAME, AND METHOD OF SCREENING THE SAME 有权
标题翻译：半导体存储器件，其制造方法及其筛选方法
公开(公告)号：US20100202186A1
公开(公告)日：2010-08-12
申请号：US12705010
申请日：2010-02-12
申请人： Mitsuru SATO , Masanori Komura , Hiroshi Kanno , Kenichi Murooka
发明人： Mitsuru SATO , Masanori Komura , Hiroshi Kanno , Kenichi Murooka
IPC分类号： G11C11/00 , G11C29/00 , H01L45/00 , H01L21/20
CPC分类号： H01L27/1021 , G11C29/832 , G11C29/88 , G11C2213/72 , H01L27/24 , H01L29/0657 , H01L29/868
摘要： A semiconductor memory device includes first and second memory cells each including a variable resistance element and a diode and having a pillar shape, and an insulating layer provided between the first memory cell and the second memory cell and including a void. A central portion of the diode has a smaller width than widths of upper and lower portions of the diode.
摘要翻译：半导体存储器件包括第一和第二存储器单元，每个存储器单元包括可变电阻元件和二极管，并具有柱形形状;以及绝缘层，设置在第一存储单元和第二存储单元之间并且包括空隙。二极管的中心部分的宽度比二极管的上部和下部的宽度小。

3. 发明申请

US20130075805A1 METHOD FOR MANUFACTURING NONVOLATILE SEMICONDUCTOR STORAGE DEVICE AND NONVOLATILE SEMICONDUCTOR STORAGE DEVICE 有权
标题翻译：制造非易失性半导体存储器件和非易失性半导体存储器件的方法
公开(公告)号：US20130075805A1
公开(公告)日：2013-03-28
申请号：US13419984
申请日：2012-03-14
申请人： Mitsuru SATO , Megumi ISHIDUKI , Masaru KIDOH , Atsushi KONNO , Yoshihiro AKUTSU , Masaru KITO , Yoshiaki FUKUZUMI , Ryota KATSUMATA
发明人： Mitsuru SATO , Megumi ISHIDUKI , Masaru KIDOH , Atsushi KONNO , Yoshihiro AKUTSU , Masaru KITO , Yoshiaki FUKUZUMI , Ryota KATSUMATA
IPC分类号： H01L29/792 , H01L21/425
CPC分类号： H01L29/7926 , H01L21/265 , H01L27/11582 , H01L29/0676 , H01L29/66833
摘要： According to one embodiment, a method for manufacturing a nonvolatile semiconductor storage device includes; forming a first and a second stacked bodies; forming a through hole penetrating through the first stacked body, a second portion communicating with the first portion and penetrating through a select gate, and a third portion communicating with the second portion and penetrating through a second insulating layer; forming a memory film, a gate insulating film, and a channel body; forming a third insulating layer inside the channel body; forming a first embedded portion above a boundary portion inside the third portion; exposing the channel body by removing part of the first embedded portion and part of the third insulating layer in the third portion; and embedding a second embedded portion including silicon having higher impurity concentration than the first embedded portion above the first embedded portion inside the third portion.
摘要翻译：根据一个实施例，一种用于制造非易失性半导体存储装置的方法包括：形成第一和第二堆叠体; 形成穿过所述第一层叠体的通孔，与所述第一部分连通并穿过选择栅极的第二部分，以及与所述第二部分连通并穿透第二绝缘层的第三部分; 形成记忆膜，栅极绝缘膜和通道体; 在通道体内形成第三绝缘层; 在第三部分内部的边界部分上方形成第一嵌入部分; 通过去除第三部分中的第一嵌入部分和第三绝缘层的一部分的一部分来暴露通道体; 以及在所述第三部分内部嵌入包含比所述第一嵌入部分上方的所述第一嵌入部分杂质浓度高的硅的第二嵌入部分。

4. 发明申请

US20110037046A1 RESISTANCE-CHANGE MEMORY AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：电阻变化记忆及其制造方法
公开(公告)号：US20110037046A1
公开(公告)日：2011-02-17
申请号：US12834255
申请日：2010-07-12
申请人： Mitsuru SATO , Kohichi Kubo , Chikayoshi Kamata , Noriko Bota
发明人： Mitsuru SATO , Kohichi Kubo , Chikayoshi Kamata , Noriko Bota
IPC分类号： H01L45/00 , H01L21/02
CPC分类号： H01L45/04 , H01L27/2409 , H01L27/2463 , H01L45/124 , H01L45/146 , H01L45/1616
摘要： According to one embodiment, a resistance-change memory includes a laminated structure in which a lower electrode, an insulating film and an upper electrode are stacked, and a resistance-change film provided on a side surface of the laminated structure, and configured to store data in accordance with an electric resistance change.
摘要翻译：根据一个实施例，电阻变化存储器包括堆叠下电极，绝缘膜和上电极的层压结构，以及设置在层压结构的侧表面上的电阻变化膜，数据根据电阻变化。

5. 发明申请

US20100304157A1 BONDING METHOD AND BONDED STRUCTURE 审中-公开
标题翻译：结合方法和结合结构
公开(公告)号：US20100304157A1
公开(公告)日：2010-12-02
申请号：US12779249
申请日：2010-05-13
申请人： Mitsuru SATO , Takatoshi YAMAMOTO , Nobuhiro NAITO , Minehiro IMAMURA
发明人： Mitsuru SATO , Takatoshi YAMAMOTO , Nobuhiro NAITO , Minehiro IMAMURA
IPC分类号： B32B27/06 , B32B37/02 , B32B9/04
CPC分类号： C09J5/02 , C09J2483/00 , Y10T156/10 , Y10T428/31663
摘要： A bonding method includes: forming a liquid coating by supplying a polyester-modified silicone material-containing liquid material onto at least one of a first base material and a second base material prepared beforehand to be bonded to each other via a bonding film, the polyester-modified silicone material being a product of dehydrocondensation reaction between a polyester resin obtained by esterification reaction of trimethylolpropane with terephthalic acid and a silicone material that has a branched polyorganosiloxane backbone having a unit structure represented by chemical formula (1) below at a branched portion, a unit structure represented by at least one of chemical formulae (2) and (3) below at a linking portion, and a unit structure represented by at least one of chemical formulae (4) and (5) below at a terminal portion, wherein R1 each independently represents a methyl group or a phenyl group, and X represents a siloxane residue; drying and/or curing the liquid coating to obtain the bonding film on at least one of the first base material and the second base material; imparting energy to the bonding film to develop adhesion near a surface of the bonding film; and contacting the first base material and the second base material via the bonding film developing adhesion, so as to obtain a bonded structure in which the first base material and the second base material are bonded to each other via the bonding film.
摘要翻译：粘合方法包括：通过将预先通过接合膜相互粘合的第一基材和第二基材中的至少一种提供含有聚酯改性的含硅材料的液体材料形成液体涂料，聚酯改性的硅氧烷材料是通过三羟甲基丙烷与对苯二甲酸的酯化反应获得的聚酯树脂与具有由下述化学式（1）表示的单元结构的支化聚有机硅氧烷骨架的分支部分的硅氧烷材料之间的脱氢反应的产物，在连接部分由下面的化学式（2）和（3）中的至少一个表示的单元结构，以及在末端部分由下面的化学式（4）和（5）中的至少一个表示的单元结构，其中 R1各自独立地表示甲基或苯基，X表示硅氧烷残基; 干燥和/或固化所述液体涂层，以在所述第一基材和所述第二基材中的至少一个上获得所述接合膜; 赋予所述接合膜以在所述接合膜的表面附近形成附着力; 并通过接合膜显影粘合使第一基材和第二基材接触，从而获得通过接合膜将第一基材和第二基材彼此接合的接合结构。

6. 发明申请

US20100092788A1 BONDING METHOD AND BONDED BODY 审中-公开
标题翻译：结合方法和结合体
公开(公告)号：US20100092788A1
公开(公告)日：2010-04-15
申请号：US12577266
申请日：2009-10-12
申请人： Nobuhiro NAITO , Mitsuru SATO , Takatoshi YAMAMOTO , Minehiro IMAMURA
发明人： Nobuhiro NAITO , Mitsuru SATO , Takatoshi YAMAMOTO , Minehiro IMAMURA
IPC分类号： B32B27/00 , B32B37/06
CPC分类号： B41J2/161 , B41J2/1623 , Y10T428/31663
摘要： A bonding method includes: a) applying a liquid material containing a silicone material to at least one of the first base member and the second base member so as to form a liquid film on the at least one of the base members; b) drying the liquid film so as to obtain the bonding film on the at least one of the first base member and the second base member; c) bringing plasma into contact with the bonding film so as to develop adhesiveness around a surface of the bonding film; and d) bringing the first base member and the second base member into contact with each other in a manner to interpose the bonding film on which adhesiveness is developed therebetween so as to obtain a bonded body in which the first base member and the second base member are bonded to each other with the bonding film interposed therebetween.
摘要翻译：粘合方法包括：a）将含有硅酮材料的液体材料施加到第一基底构件和第二基底构件中的至少一个，以在至少一个基底构件上形成液体膜; b）干燥所述液膜以在所述第一基底和所述第二基底构件中的至少一个上获得接合膜; c）使等离子体与接合膜接触，以便在接合膜的表面附近产生粘附性; 以及d）使所述第一基底构件和所述第二基底构件彼此接触，以便在其间形成有粘合性的接合薄膜的间隔，从而获得其中所述第一基底构件和所述第二基底构件彼此接合，并且其间插入接合膜。

7. 发明申请

US20100052042A1 SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：半导体存储器件及其制造方法
公开(公告)号：US20100052042A1
公开(公告)日：2010-03-04
申请号：US12561451
申请日：2009-09-17
申请人： Hiroyasu TANAKA , Ryota KATSUMATA , Hideaki AOCHI , Masaru KIDO , Masaru KITO , Mitsuru SATO
发明人： Hiroyasu TANAKA , Ryota KATSUMATA , Hideaki AOCHI , Masaru KIDO , Masaru KITO , Mitsuru SATO
IPC分类号： H01L29/792 , H01L21/336
CPC分类号： H01L29/792 , H01L21/8221 , H01L27/0688 , H01L27/105 , H01L27/11548 , H01L27/11551 , H01L27/11556 , H01L27/11575 , H01L27/11578 , H01L27/11582 , H01L29/7881 , H01L29/7926
摘要： The semiconductor memory device of the present invention includes a plurality of memory strings having a plurality of electrically reprogrammable memory cells connected in series, the memory strings having a column shaped semiconductor, a first insulation film formed around the column shaped semiconductor, a charge accumulation layer formed around the first insulation film, a second insulation film formed around the charge accumulation film and a plurality of electrodes formed around the second insulation film, a bit line connected to one end of the memory strings via a plurality of selection transistors, and a conducting layer extending in two dimensions and in which the plurality of electrodes of the memory strings and the plurality of electrodes of different memory strings are shared respectively, wherein each end part of the conducting layer is formed in step shapes in a direction parallel with the bit line.
摘要翻译：本发明的半导体存储器件包括具有串联连接的多个电可再编程存储器单元的多个存储器串，具有列形半导体的存储器串，形成在柱状半导体周围的第一绝缘膜，电荷累积层形成在第一绝缘膜周围，形成在电荷累积膜周围的第二绝缘膜和围绕第二绝缘膜形成的多个电极，经由多个选择晶体管连接到存储器串的一端的位线，以及导电分别在存储器串的多个电极和不同的存储器串的多个电极中分别共享，其中导电层的每个端部在平行于位线的方向上形成为台阶形状。

8. 发明申请

US20090317617A1 BASE MEMBER WITH BINDING FILM, BONDING METHOD, AND BONDED STRUCTURE 审中-公开
标题翻译：具有结合膜的基座部件，接合方法和结合结构
公开(公告)号：US20090317617A1
公开(公告)日：2009-12-24
申请号：US12484316
申请日：2009-06-15
申请人： Mitsuru SATO , Takatoshi YAMAMOTO
发明人： Mitsuru SATO , Takatoshi YAMAMOTO
IPC分类号： C09J7/02 , B32B37/00
CPC分类号： H05K3/321 , B32B37/12 , B32B2309/02 , B32B2310/0472 , B32B2310/0831 , B41J2/161 , B41J2/1623 , B41J2/1631 , B41J2/1634 , B41J2/1643 , B41J2/1645 , B41J2/1646 , C09J7/20 , H05K3/4015 , H05K2203/1105 , H05K2203/121 , Y10T428/28 , Y10T428/2804
摘要： A bonding film-formed base member includes a base member and a bonding film formed by supplying a liquid material containing a metal complex on a surface of the base member and then drying and burning the liquid material. The bonding film includes a metal atom and a leaving group made of an organic component. In the bonding-film formed base member, energy is applied to at least a partial region of a surface of the bonding film to eliminate the leaving group present near the surface of the bonding film from the bonding film so as to allow the at least a partial region of the surface to have adhesion to an object intended to be bonded to the bonding film-formed base member.
摘要翻译：接合膜形成的基底构件包括基底构件和通过在基底构件的表面上供给含有金属络合物的液体材料，然后干燥和燃烧液体材料而形成的接合膜。接合膜包括金属原子和由有机组分制成的离去基团。在接合膜形成的基底部件中，能量被施加到接合膜的表面的至少一部分区域，以消除接合膜表面附近存在的离开基团，从而允许至少一个表面的局部区域具有与要接合到接合膜形成的基底构件的物体的粘合性。

9. 发明申请

US20120068144A1 RESISTANCE RANDOM ACCESS MEMORY 有权
标题翻译：电阻随机存取存储器
公开(公告)号：US20120068144A1
公开(公告)日：2012-03-22
申请号：US13097375
申请日：2011-04-29
申请人： Ryota FUJITSUKA , Masahiro KIYOTOSHI , Katsuyuki SEKINE , Mitsuru SATO
发明人： Ryota FUJITSUKA , Masahiro KIYOTOSHI , Katsuyuki SEKINE , Mitsuru SATO
IPC分类号： H01L45/00
CPC分类号： H01L45/146 , G11C11/5685 , G11C13/0007 , G11C2213/72 , H01L45/1233
摘要： According to one embodiment, there are provided a first electrode, a second electrode, first and second variable-resistance layers that are arranged between the first electrode and the second electrode, and at least one non variable-resistance layer that is arranged so that positions of the first and second variable-resistance layers between the first electrode and the second electrode are symmetrical to each other.
摘要翻译：根据一个实施例，提供了布置在第一电极和第二电极之间的第一电极，第二电极，第一和第二可变电阻层，以及至少一个非可变电阻层，其被布置成使得位置在第一电极和第二电极之间的第一和第二可变电阻层彼此对称。

10. 发明申请

US20090068452A1 BASE MEMBER WITH BONDING FILM, BONDING METHOD AND BONDED BODY 审中-公开
标题翻译：具有粘结膜的基座部件，接合方法和粘结体
公开(公告)号：US20090068452A1
公开(公告)日：2009-03-12
申请号：US12208635
申请日：2008-09-11
申请人： Mitsuru SATO
发明人： Mitsuru SATO
IPC分类号： B32B7/12 , B32B37/06 , B32B37/10
CPC分类号： B32B38/004 , B32B38/0008 , B32B38/145 , B32B2037/246 , B32B2309/02 , B32B2309/105 , B32B2309/12 , B32B2309/68 , B32B2310/0831 , B32B2310/14 , B32B2311/00 , B32B2457/00 , B32B2457/08 , Y10T156/10 , Y10T428/265 , Y10T428/28 , Y10T428/2848
摘要： A base member with a bonding film that can be firmly bonded to an object with high dimensional accuracy and efficiently bonded to the object at a low temperature, a bonding method which is capable of efficiently bonding such a base member and the object at a low temperature, and a bonded body formed by firmly bonding the base member and the object with high dimensional accuracy and therefore being capable of providing high reliability are provided. The base member is adapted to be bonded to an object through the bonding film thereof. The base member includes a substrate, and a bonding film provided on the substrate, the bonding film containing metal atoms and leaving groups each composed of an organic ingredient, and having a surface, wherein when energy is applied to at least a predetermined region of the surface of the bonding film, the leaving groups, which exist in the vicinity of the surface within the region, are removed from the bonding film so that the region develops a bonding property with respect to the object.
摘要翻译：具有能够以高尺寸精度牢固地结合到物体并且在低温下有效地结合到物体的接合膜的基底构件，能够在低温下有效地接合这种基底构件和物体的接合方法并且提供了通过以高尺寸精度牢固地接合基底构件和物体并因此能够提供高可靠性而形成的粘结体。基底构件适于通过其粘合膜与物体结合。基材包括基材和设置在基材上的接合膜，所述接合膜包含各自由有机成分组成的金属原子和离去基团，并且具有表面，其中当能量施加至至少一个预定区域时，存在于该区域内的表面附近的接合膜的表面，离开基团从接合膜去除，使得该区域相对于物体形成接合性。

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