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1. 发明申请

US20100092767A1 BONDING METHOD AND BONDED BODY 审中-公开
标题翻译：结合方法和结合体
公开(公告)号：US20100092767A1
公开(公告)日：2010-04-15
申请号：US12577314
申请日：2009-10-12
申请人： Nobuhiro NAITO , Mitsuru SATO , Takatoshi YAMAMOTO , Minehiro IMAMURA
发明人： Nobuhiro NAITO , Mitsuru SATO , Takatoshi YAMAMOTO , Minehiro IMAMURA
IPC分类号： B32B9/04 , B65C9/25 , B29C65/14
CPC分类号： B32B7/12 , B29C35/02 , B29C35/0805 , B29C35/0866 , B29C59/14 , B29C65/14 , B29C65/1403 , B29C65/1406 , B29C65/482 , B29C65/4835 , B29C65/521 , B29C65/523 , B29C65/526 , B29C65/528 , B29C66/1122 , B29C66/45 , B29C66/71 , B29C66/731 , B29C66/73111 , B29C66/73112 , B29C66/7352 , B29C66/73921 , B29C66/73941 , B29C66/91411 , B29C66/919 , B29C66/9241 , B29C66/929 , B29C66/954 , B29C2035/0827 , B29C2035/0877 , B29D11/0073 , B29K2021/00 , B29K2023/00 , B29K2023/06 , B29K2023/083 , B29K2023/086 , B29K2023/12 , B29K2025/00 , B29K2027/06 , B29K2027/08 , B29K2027/12 , B29K2027/16 , B29K2027/18 , B29K2033/04 , B29K2033/08 , B29K2033/12 , B29K2055/02 , B29K2059/00 , B29K2063/00 , B29K2067/00 , B29K2067/006 , B29K2067/06 , B29K2069/00 , B29K2071/00 , B29K2071/12 , B29K2075/00 , B29K2077/00 , B29K2077/10 , B29K2079/08 , B29K2079/085 , B29K2081/06 , B29K2083/00 , B29K2083/005 , B29K2096/005 , B29K2105/0088 , B29K2995/0082 , B29L2031/767 , B32B9/04 , B32B15/04 , B32B15/18 , B32B15/20 , B32B17/06 , B32B27/06 , B32B27/36 , B41J2/14233 , B41J2/161 , B41J2/1623 , C03C23/006 , C03C27/10 , C09J5/06 , C09J183/04 , Y10T428/265 , B29K2081/04 , B29K2067/003 , B29K2031/04 , B29K2029/04 , B29K2025/06 , B29K2023/38 , B29K2023/18 , B29K2023/16 , B29K2021/006 , B29K2009/06
摘要： A bonding method includes applying a liquid material containing silicone materials to at least one of the first base member and the second base member so as to form a liquid film, drying the liquid film so as to obtain a bonding film on the at least one of the first base member and the second base member, heating the bonding film so as to cross-link the silicone materials contained in the bonding film to each other, and applying energy to the bonding film so as to develop adhesiveness around a surface of the bonding film so as to obtain a bonded body in which the first base member and the second base member are bonded to each other with the bonding film interposed between the first base member and the second base member.
摘要翻译：接合方法包括将含有硅酮材料的液体材料施加到第一基底构件和第二基底构件中的至少一个，以便形成液体膜，干燥该液体膜，以便在至少一个第一基底构件和第二基底构件，加热接合膜以将包含在接合膜中的硅氧烷材料彼此交联，并且向接合膜施加能量，以便在接合膜的表面周围形成粘附性以获得其中第一基底构件和第二基底构件彼此接合的接合体，其中接合膜介于第一基底构件和第二基底构件之间。

2. 发明申请

US20100304156A1 BONDING METHOD AND BONDED STRUCTURE 审中-公开
标题翻译：结合方法和结合结构
公开(公告)号：US20100304156A1
公开(公告)日：2010-12-02
申请号：US12778556
申请日：2010-05-12
申请人： Mitsuru SATO , Takatoshi YAMAMOTO , Nobuhiro NAITO , Minehiro IMAMURA
发明人： Mitsuru SATO , Takatoshi YAMAMOTO , Nobuhiro NAITO , Minehiro IMAMURA
IPC分类号： B32B37/12 , B32B9/04
CPC分类号： C09D183/10 , C09J5/02 , C09J2483/008 , Y10T428/31663
摘要： A bonding method includes: preparing a first base material and a second base material to be bonded to each other via a bonding film; forming a liquid coating by supplying a polyester-modified silicone material-containing liquid material onto at least one of the first base material and the second base material, the polyester-modified silicone material being a product of dehydrocondensation reaction between a polyester resin obtained by esterification reaction of trimethylolpropane with terephthalic acid and a silicone material that has a branched polyorganosiloxane backbone having a unit structure represented by chemical formula (1) below at a branched portion, a unit structure represented by at least one of chemical formulae (2) and (3) below at a linking portion, and a unit structure represented by at least one of chemical formulae (4) and (5) below at a terminal portion, wherein R1 each independently represents a methyl group or a phenyl group, and X represents a siloxane residue; drying and/or curing the liquid coating to obtain the bonding film on at least one of the first base material and the second base material; contacting a plasma to the bonding film to develop adhesion near a surface of the bonding film; and contacting the first base material and the second base material via the bonding film developing adhesion, so as to obtain a bonded structure in which the first base material and the second base material are bonded to each other via the bonding film.
摘要翻译：接合方法包括：通过接合膜制备要彼此接合的第一基材和第二基材; 通过将聚酯改性的含硅材料的液体材料供给到第一基材和第二基材中的至少一个上而形成液体涂料，聚酯改性硅酮材料是通过酯化得到的聚酯树脂之间的脱氢缩合反应的产物由分子式表示的具有由下述化学式（1）表示的单元结构的支链聚有机硅氧烷主链的三羟甲基丙烷与对苯二甲酸反应的硅酮材料，由化学式（2）和（3）中的至少一个表示的单元结构）和在末端部分由下述化学式（4）和（5）中的至少一个表示的单元结构，其中R 1各自独立地表示甲基或苯基，X表示硅氧烷残留物干燥和/或固化所述液体涂层，以在所述第一基材和所述第二基材中的至少一个上获得所述接合膜; 使等离子体与接合膜接触以在接合膜的表面附近形成附着力; 并通过接合膜显影粘合使第一基材和第二基材接触，从而获得通过接合膜将第一基材和第二基材彼此接合的接合结构。

3. 发明申请

US20100206474A1 BONDING METHOD AND BONDED STRUCTURE 审中-公开
标题翻译：结合方法和结合结构
公开(公告)号：US20100206474A1
公开(公告)日：2010-08-19
申请号：US12706153
申请日：2010-02-16
申请人： Mitsuru SATO , Takatoshi YAMAMOTO , Nobuhiro NAITO , Minehiro IMAMURA
发明人： Mitsuru SATO , Takatoshi YAMAMOTO , Nobuhiro NAITO , Minehiro IMAMURA
IPC分类号： B32B37/12
CPC分类号： C09J5/02 , C08J5/124 , C08J7/123 , C08J2365/02 , C09J2205/31 , C09J2400/166 , C09J2400/228
摘要： A bonding method includes: forming a liquid coating by supplying a polyester-modified silicone material-containing liquid material onto at least one of a first base material and a second base material prepared beforehand to be bonded to each other via a bonding film; drying and curing the liquid coating to obtain a bonding film on at least one of the first base material and the second base material; imparting energy to the bonding film to develop adhesion near a surface of the bonding film; and contacting the first base material and the second base material via the bonding film so as to obtain a bonded structure in which the first base material and the second base material are bonded to each other via the bonding film.
摘要翻译：粘合方法包括：通过将预先通过接合膜彼此粘合的预先制备的第一基材和第二基材中的至少一种提供含有聚酯改性的含硅材料的液体材料形成液体涂料; 干燥和固化液体涂层，以在第一基材和第二基材中的至少一个上获得粘合膜; 赋予所述接合膜以在所述接合膜的表面附近形成附着力; 并且经由所述接合膜与所述第一基材和所述第二基材接触，以获得其中所述第一基材和所述第二基材经由所述接合膜彼此接合的接合结构。

4. 发明申请

US20100304157A1 BONDING METHOD AND BONDED STRUCTURE 审中-公开
标题翻译：结合方法和结合结构
公开(公告)号：US20100304157A1
公开(公告)日：2010-12-02
申请号：US12779249
申请日：2010-05-13
申请人： Mitsuru SATO , Takatoshi YAMAMOTO , Nobuhiro NAITO , Minehiro IMAMURA
发明人： Mitsuru SATO , Takatoshi YAMAMOTO , Nobuhiro NAITO , Minehiro IMAMURA
IPC分类号： B32B27/06 , B32B37/02 , B32B9/04
CPC分类号： C09J5/02 , C09J2483/00 , Y10T156/10 , Y10T428/31663
摘要： A bonding method includes: forming a liquid coating by supplying a polyester-modified silicone material-containing liquid material onto at least one of a first base material and a second base material prepared beforehand to be bonded to each other via a bonding film, the polyester-modified silicone material being a product of dehydrocondensation reaction between a polyester resin obtained by esterification reaction of trimethylolpropane with terephthalic acid and a silicone material that has a branched polyorganosiloxane backbone having a unit structure represented by chemical formula (1) below at a branched portion, a unit structure represented by at least one of chemical formulae (2) and (3) below at a linking portion, and a unit structure represented by at least one of chemical formulae (4) and (5) below at a terminal portion, wherein R1 each independently represents a methyl group or a phenyl group, and X represents a siloxane residue; drying and/or curing the liquid coating to obtain the bonding film on at least one of the first base material and the second base material; imparting energy to the bonding film to develop adhesion near a surface of the bonding film; and contacting the first base material and the second base material via the bonding film developing adhesion, so as to obtain a bonded structure in which the first base material and the second base material are bonded to each other via the bonding film.
摘要翻译：粘合方法包括：通过将预先通过接合膜相互粘合的第一基材和第二基材中的至少一种提供含有聚酯改性的含硅材料的液体材料形成液体涂料，聚酯改性的硅氧烷材料是通过三羟甲基丙烷与对苯二甲酸的酯化反应获得的聚酯树脂与具有由下述化学式（1）表示的单元结构的支化聚有机硅氧烷骨架的分支部分的硅氧烷材料之间的脱氢反应的产物，在连接部分由下面的化学式（2）和（3）中的至少一个表示的单元结构，以及在末端部分由下面的化学式（4）和（5）中的至少一个表示的单元结构，其中 R1各自独立地表示甲基或苯基，X表示硅氧烷残基; 干燥和/或固化所述液体涂层，以在所述第一基材和所述第二基材中的至少一个上获得所述接合膜; 赋予所述接合膜以在所述接合膜的表面附近形成附着力; 并通过接合膜显影粘合使第一基材和第二基材接触，从而获得通过接合膜将第一基材和第二基材彼此接合的接合结构。

5. 发明申请

US20100092788A1 BONDING METHOD AND BONDED BODY 审中-公开
标题翻译：结合方法和结合体
公开(公告)号：US20100092788A1
公开(公告)日：2010-04-15
申请号：US12577266
申请日：2009-10-12
申请人： Nobuhiro NAITO , Mitsuru SATO , Takatoshi YAMAMOTO , Minehiro IMAMURA
发明人： Nobuhiro NAITO , Mitsuru SATO , Takatoshi YAMAMOTO , Minehiro IMAMURA
IPC分类号： B32B27/00 , B32B37/06
CPC分类号： B41J2/161 , B41J2/1623 , Y10T428/31663
摘要： A bonding method includes: a) applying a liquid material containing a silicone material to at least one of the first base member and the second base member so as to form a liquid film on the at least one of the base members; b) drying the liquid film so as to obtain the bonding film on the at least one of the first base member and the second base member; c) bringing plasma into contact with the bonding film so as to develop adhesiveness around a surface of the bonding film; and d) bringing the first base member and the second base member into contact with each other in a manner to interpose the bonding film on which adhesiveness is developed therebetween so as to obtain a bonded body in which the first base member and the second base member are bonded to each other with the bonding film interposed therebetween.
摘要翻译：粘合方法包括：a）将含有硅酮材料的液体材料施加到第一基底构件和第二基底构件中的至少一个，以在至少一个基底构件上形成液体膜; b）干燥所述液膜以在所述第一基底和所述第二基底构件中的至少一个上获得接合膜; c）使等离子体与接合膜接触，以便在接合膜的表面附近产生粘附性; 以及d）使所述第一基底构件和所述第二基底构件彼此接触，以便在其间形成有粘合性的接合薄膜的间隔，从而获得其中所述第一基底构件和所述第二基底构件彼此接合，并且其间插入接合膜。

6. 发明申请

US20070091312A1 METHOD FOR MANUFACTURING OPTICAL MODULE, POSITIONING APPARATUS, EVALUATION METHOD AND EVALUATION APPARATUS FOR EVALUATING OPTICAL MODULE 失效
标题翻译：制造光学模块，定位装置，评估方法和评估光学模块评估装置的方法
公开(公告)号：US20070091312A1
公开(公告)日：2007-04-26
申请号：US11536768
申请日：2006-09-29
申请人： Nobuhiro NAITO , Akira MIYAMAE
发明人： Nobuhiro NAITO , Akira MIYAMAE
IPC分类号： G01B11/00
CPC分类号： H01L31/0203 , G02B6/4204 , G02B6/4206 , G02B6/4225 , H01S5/005 , H01S5/02284 , H01S5/02296
摘要： A method for evaluating an optical module, the optical module including a light emitting element and a supporting member for supporting an end of an optical fiber for communications, by which relative positions of the light emitting element and the supporting member are evaluated, the method including the steps of (a) supporting an end of an optical fiber for evaluation at the supporting member; (b) propagating light emitted from the light emitting element through the optical fiber for evaluation; and (c) detecting the amount of only a portion of components of light including an optical axis thereof emitted from the light emitting element by a photodetector provided at the other end of the optical fiber for evaluation.
摘要翻译：一种用于评估光学模块的方法，所述光学模块包括发光元件和用于支撑用于通信的光纤的端部的支撑构件，由此评估发光元件和支撑构件的相对位置，所述方法包括（a）在支撑构件处支撑用于评估的光纤的端部的步骤; （b）通过光纤传播从发光元件发射的光用于评估; 以及（c）通过设置在光纤的另一端的光电检测器来检测包括从发光元件发射的光轴的光的分量的一部分的量，用于评估。

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