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1. 发明申请

US20100092767A1 BONDING METHOD AND BONDED BODY 审中-公开
标题翻译：结合方法和结合体
公开(公告)号：US20100092767A1
公开(公告)日：2010-04-15
申请号：US12577314
申请日：2009-10-12
申请人： Nobuhiro NAITO , Mitsuru SATO , Takatoshi YAMAMOTO , Minehiro IMAMURA
发明人： Nobuhiro NAITO , Mitsuru SATO , Takatoshi YAMAMOTO , Minehiro IMAMURA
IPC分类号： B32B9/04 , B65C9/25 , B29C65/14
CPC分类号： B32B7/12 , B29C35/02 , B29C35/0805 , B29C35/0866 , B29C59/14 , B29C65/14 , B29C65/1403 , B29C65/1406 , B29C65/482 , B29C65/4835 , B29C65/521 , B29C65/523 , B29C65/526 , B29C65/528 , B29C66/1122 , B29C66/45 , B29C66/71 , B29C66/731 , B29C66/73111 , B29C66/73112 , B29C66/7352 , B29C66/73921 , B29C66/73941 , B29C66/91411 , B29C66/919 , B29C66/9241 , B29C66/929 , B29C66/954 , B29C2035/0827 , B29C2035/0877 , B29D11/0073 , B29K2021/00 , B29K2023/00 , B29K2023/06 , B29K2023/083 , B29K2023/086 , B29K2023/12 , B29K2025/00 , B29K2027/06 , B29K2027/08 , B29K2027/12 , B29K2027/16 , B29K2027/18 , B29K2033/04 , B29K2033/08 , B29K2033/12 , B29K2055/02 , B29K2059/00 , B29K2063/00 , B29K2067/00 , B29K2067/006 , B29K2067/06 , B29K2069/00 , B29K2071/00 , B29K2071/12 , B29K2075/00 , B29K2077/00 , B29K2077/10 , B29K2079/08 , B29K2079/085 , B29K2081/06 , B29K2083/00 , B29K2083/005 , B29K2096/005 , B29K2105/0088 , B29K2995/0082 , B29L2031/767 , B32B9/04 , B32B15/04 , B32B15/18 , B32B15/20 , B32B17/06 , B32B27/06 , B32B27/36 , B41J2/14233 , B41J2/161 , B41J2/1623 , C03C23/006 , C03C27/10 , C09J5/06 , C09J183/04 , Y10T428/265 , B29K2081/04 , B29K2067/003 , B29K2031/04 , B29K2029/04 , B29K2025/06 , B29K2023/38 , B29K2023/18 , B29K2023/16 , B29K2021/006 , B29K2009/06
摘要： A bonding method includes applying a liquid material containing silicone materials to at least one of the first base member and the second base member so as to form a liquid film, drying the liquid film so as to obtain a bonding film on the at least one of the first base member and the second base member, heating the bonding film so as to cross-link the silicone materials contained in the bonding film to each other, and applying energy to the bonding film so as to develop adhesiveness around a surface of the bonding film so as to obtain a bonded body in which the first base member and the second base member are bonded to each other with the bonding film interposed between the first base member and the second base member.
摘要翻译：接合方法包括将含有硅酮材料的液体材料施加到第一基底构件和第二基底构件中的至少一个，以便形成液体膜，干燥该液体膜，以便在至少一个第一基底构件和第二基底构件，加热接合膜以将包含在接合膜中的硅氧烷材料彼此交联，并且向接合膜施加能量，以便在接合膜的表面周围形成粘附性以获得其中第一基底构件和第二基底构件彼此接合的接合体，其中接合膜介于第一基底构件和第二基底构件之间。

2. 发明申请

US20100304156A1 BONDING METHOD AND BONDED STRUCTURE 审中-公开
标题翻译：结合方法和结合结构
公开(公告)号：US20100304156A1
公开(公告)日：2010-12-02
申请号：US12778556
申请日：2010-05-12
申请人： Mitsuru SATO , Takatoshi YAMAMOTO , Nobuhiro NAITO , Minehiro IMAMURA
发明人： Mitsuru SATO , Takatoshi YAMAMOTO , Nobuhiro NAITO , Minehiro IMAMURA
IPC分类号： B32B37/12 , B32B9/04
CPC分类号： C09D183/10 , C09J5/02 , C09J2483/008 , Y10T428/31663
摘要： A bonding method includes: preparing a first base material and a second base material to be bonded to each other via a bonding film; forming a liquid coating by supplying a polyester-modified silicone material-containing liquid material onto at least one of the first base material and the second base material, the polyester-modified silicone material being a product of dehydrocondensation reaction between a polyester resin obtained by esterification reaction of trimethylolpropane with terephthalic acid and a silicone material that has a branched polyorganosiloxane backbone having a unit structure represented by chemical formula (1) below at a branched portion, a unit structure represented by at least one of chemical formulae (2) and (3) below at a linking portion, and a unit structure represented by at least one of chemical formulae (4) and (5) below at a terminal portion, wherein R1 each independently represents a methyl group or a phenyl group, and X represents a siloxane residue; drying and/or curing the liquid coating to obtain the bonding film on at least one of the first base material and the second base material; contacting a plasma to the bonding film to develop adhesion near a surface of the bonding film; and contacting the first base material and the second base material via the bonding film developing adhesion, so as to obtain a bonded structure in which the first base material and the second base material are bonded to each other via the bonding film.
摘要翻译：接合方法包括：通过接合膜制备要彼此接合的第一基材和第二基材; 通过将聚酯改性的含硅材料的液体材料供给到第一基材和第二基材中的至少一个上而形成液体涂料，聚酯改性硅酮材料是通过酯化得到的聚酯树脂之间的脱氢缩合反应的产物由分子式表示的具有由下述化学式（1）表示的单元结构的支链聚有机硅氧烷主链的三羟甲基丙烷与对苯二甲酸反应的硅酮材料，由化学式（2）和（3）中的至少一个表示的单元结构）和在末端部分由下述化学式（4）和（5）中的至少一个表示的单元结构，其中R 1各自独立地表示甲基或苯基，X表示硅氧烷残留物干燥和/或固化所述液体涂层，以在所述第一基材和所述第二基材中的至少一个上获得所述接合膜; 使等离子体与接合膜接触以在接合膜的表面附近形成附着力; 并通过接合膜显影粘合使第一基材和第二基材接触，从而获得通过接合膜将第一基材和第二基材彼此接合的接合结构。

3. 发明申请

US20100206474A1 BONDING METHOD AND BONDED STRUCTURE 审中-公开
标题翻译：结合方法和结合结构
公开(公告)号：US20100206474A1
公开(公告)日：2010-08-19
申请号：US12706153
申请日：2010-02-16
申请人： Mitsuru SATO , Takatoshi YAMAMOTO , Nobuhiro NAITO , Minehiro IMAMURA
发明人： Mitsuru SATO , Takatoshi YAMAMOTO , Nobuhiro NAITO , Minehiro IMAMURA
IPC分类号： B32B37/12
CPC分类号： C09J5/02 , C08J5/124 , C08J7/123 , C08J2365/02 , C09J2205/31 , C09J2400/166 , C09J2400/228
摘要： A bonding method includes: forming a liquid coating by supplying a polyester-modified silicone material-containing liquid material onto at least one of a first base material and a second base material prepared beforehand to be bonded to each other via a bonding film; drying and curing the liquid coating to obtain a bonding film on at least one of the first base material and the second base material; imparting energy to the bonding film to develop adhesion near a surface of the bonding film; and contacting the first base material and the second base material via the bonding film so as to obtain a bonded structure in which the first base material and the second base material are bonded to each other via the bonding film.
摘要翻译：粘合方法包括：通过将预先通过接合膜彼此粘合的预先制备的第一基材和第二基材中的至少一种提供含有聚酯改性的含硅材料的液体材料形成液体涂料; 干燥和固化液体涂层，以在第一基材和第二基材中的至少一个上获得粘合膜; 赋予所述接合膜以在所述接合膜的表面附近形成附着力; 并且经由所述接合膜与所述第一基材和所述第二基材接触，以获得其中所述第一基材和所述第二基材经由所述接合膜彼此接合的接合结构。

4. 发明申请

US20100304157A1 BONDING METHOD AND BONDED STRUCTURE 审中-公开
标题翻译：结合方法和结合结构
公开(公告)号：US20100304157A1
公开(公告)日：2010-12-02
申请号：US12779249
申请日：2010-05-13
申请人： Mitsuru SATO , Takatoshi YAMAMOTO , Nobuhiro NAITO , Minehiro IMAMURA
发明人： Mitsuru SATO , Takatoshi YAMAMOTO , Nobuhiro NAITO , Minehiro IMAMURA
IPC分类号： B32B27/06 , B32B37/02 , B32B9/04
CPC分类号： C09J5/02 , C09J2483/00 , Y10T156/10 , Y10T428/31663
摘要： A bonding method includes: forming a liquid coating by supplying a polyester-modified silicone material-containing liquid material onto at least one of a first base material and a second base material prepared beforehand to be bonded to each other via a bonding film, the polyester-modified silicone material being a product of dehydrocondensation reaction between a polyester resin obtained by esterification reaction of trimethylolpropane with terephthalic acid and a silicone material that has a branched polyorganosiloxane backbone having a unit structure represented by chemical formula (1) below at a branched portion, a unit structure represented by at least one of chemical formulae (2) and (3) below at a linking portion, and a unit structure represented by at least one of chemical formulae (4) and (5) below at a terminal portion, wherein R1 each independently represents a methyl group or a phenyl group, and X represents a siloxane residue; drying and/or curing the liquid coating to obtain the bonding film on at least one of the first base material and the second base material; imparting energy to the bonding film to develop adhesion near a surface of the bonding film; and contacting the first base material and the second base material via the bonding film developing adhesion, so as to obtain a bonded structure in which the first base material and the second base material are bonded to each other via the bonding film.
摘要翻译：粘合方法包括：通过将预先通过接合膜相互粘合的第一基材和第二基材中的至少一种提供含有聚酯改性的含硅材料的液体材料形成液体涂料，聚酯改性的硅氧烷材料是通过三羟甲基丙烷与对苯二甲酸的酯化反应获得的聚酯树脂与具有由下述化学式（1）表示的单元结构的支化聚有机硅氧烷骨架的分支部分的硅氧烷材料之间的脱氢反应的产物，在连接部分由下面的化学式（2）和（3）中的至少一个表示的单元结构，以及在末端部分由下面的化学式（4）和（5）中的至少一个表示的单元结构，其中 R1各自独立地表示甲基或苯基，X表示硅氧烷残基; 干燥和/或固化所述液体涂层，以在所述第一基材和所述第二基材中的至少一个上获得所述接合膜; 赋予所述接合膜以在所述接合膜的表面附近形成附着力; 并通过接合膜显影粘合使第一基材和第二基材接触，从而获得通过接合膜将第一基材和第二基材彼此接合的接合结构。

5. 发明申请

US20100092788A1 BONDING METHOD AND BONDED BODY 审中-公开
标题翻译：结合方法和结合体
公开(公告)号：US20100092788A1
公开(公告)日：2010-04-15
申请号：US12577266
申请日：2009-10-12
申请人： Nobuhiro NAITO , Mitsuru SATO , Takatoshi YAMAMOTO , Minehiro IMAMURA
发明人： Nobuhiro NAITO , Mitsuru SATO , Takatoshi YAMAMOTO , Minehiro IMAMURA
IPC分类号： B32B27/00 , B32B37/06
CPC分类号： B41J2/161 , B41J2/1623 , Y10T428/31663
摘要： A bonding method includes: a) applying a liquid material containing a silicone material to at least one of the first base member and the second base member so as to form a liquid film on the at least one of the base members; b) drying the liquid film so as to obtain the bonding film on the at least one of the first base member and the second base member; c) bringing plasma into contact with the bonding film so as to develop adhesiveness around a surface of the bonding film; and d) bringing the first base member and the second base member into contact with each other in a manner to interpose the bonding film on which adhesiveness is developed therebetween so as to obtain a bonded body in which the first base member and the second base member are bonded to each other with the bonding film interposed therebetween.
摘要翻译：粘合方法包括：a）将含有硅酮材料的液体材料施加到第一基底构件和第二基底构件中的至少一个，以在至少一个基底构件上形成液体膜; b）干燥所述液膜以在所述第一基底和所述第二基底构件中的至少一个上获得接合膜; c）使等离子体与接合膜接触，以便在接合膜的表面附近产生粘附性; 以及d）使所述第一基底构件和所述第二基底构件彼此接触，以便在其间形成有粘合性的接合薄膜的间隔，从而获得其中所述第一基底构件和所述第二基底构件彼此接合，并且其间插入接合膜。

6. 发明申请

US20090317617A1 BASE MEMBER WITH BINDING FILM, BONDING METHOD, AND BONDED STRUCTURE 审中-公开
标题翻译：具有结合膜的基座部件，接合方法和结合结构
公开(公告)号：US20090317617A1
公开(公告)日：2009-12-24
申请号：US12484316
申请日：2009-06-15
申请人： Mitsuru SATO , Takatoshi YAMAMOTO
发明人： Mitsuru SATO , Takatoshi YAMAMOTO
IPC分类号： C09J7/02 , B32B37/00
CPC分类号： H05K3/321 , B32B37/12 , B32B2309/02 , B32B2310/0472 , B32B2310/0831 , B41J2/161 , B41J2/1623 , B41J2/1631 , B41J2/1634 , B41J2/1643 , B41J2/1645 , B41J2/1646 , C09J7/20 , H05K3/4015 , H05K2203/1105 , H05K2203/121 , Y10T428/28 , Y10T428/2804
摘要： A bonding film-formed base member includes a base member and a bonding film formed by supplying a liquid material containing a metal complex on a surface of the base member and then drying and burning the liquid material. The bonding film includes a metal atom and a leaving group made of an organic component. In the bonding-film formed base member, energy is applied to at least a partial region of a surface of the bonding film to eliminate the leaving group present near the surface of the bonding film from the bonding film so as to allow the at least a partial region of the surface to have adhesion to an object intended to be bonded to the bonding film-formed base member.
摘要翻译：接合膜形成的基底构件包括基底构件和通过在基底构件的表面上供给含有金属络合物的液体材料，然后干燥和燃烧液体材料而形成的接合膜。接合膜包括金属原子和由有机组分制成的离去基团。在接合膜形成的基底部件中，能量被施加到接合膜的表面的至少一部分区域，以消除接合膜表面附近存在的离开基团，从而允许至少一个表面的局部区域具有与要接合到接合膜形成的基底构件的物体的粘合性。

7. 发明申请

US20100304159A1 BONDING METHOD AND BONDED STRUCTURE 审中-公开
标题翻译：结合方法和结合结构
公开(公告)号：US20100304159A1
公开(公告)日：2010-12-02
申请号：US12777342
申请日：2010-05-11
申请人： Mitsuru SATO , Takatoshi YAMAMOTO
发明人： Mitsuru SATO , Takatoshi YAMAMOTO
IPC分类号： B32B9/04 , B32B37/12
CPC分类号： C09J5/06 , B41J2/161 , B41J2/1623 , C08G59/1494 , C08G59/306 , C08G77/14 , C08G77/16 , C08G77/38 , C09J163/00
摘要： A bonding method includes: forming a liquid coating by supplying an epoxy-modified silicone material-containing liquid material onto at least one of a first base material and a second base material prepared beforehand to be bonded to each other via a bonding film; drying and/or curing the liquid coating to obtain the bonding film on at least one of the first base material and the second base material; imparting energy to the bonding film to develop adhesion near a surface of the bonding film; and contacting the first base material and the second base material via the bonding film with developed adhesion, so as to obtain a bonded structure in which the first base material and the second base material are bonded to each other via the bonding film.
摘要翻译：接合方法包括：通过将预先通过接合膜彼此接合而制备的预先制备的环氧改性的含硅材料的液体材料供给到至少一个第一基材和第二基材上来形成液体涂层; 干燥和/或固化所述液体涂层，以在所述第一基材和所述第二基材中的至少一个上获得所述接合膜; 赋予所述接合膜以在所述接合膜的表面附近形成附着力; 并且通过所述接合膜以显影的粘附力使所述第一基材和所述第二基材接触，从而获得其中所述第一基材和所述第二基材通过所述接合膜相互结合的接合结构。

8. 发明申请

US20110273518A1 LIQUID DROPLET EJECTION HEAD AND LIQUID DROPLET EJECTION APPARATUS 有权
标题翻译：液滴喷射头和液滴喷射装置
公开(公告)号：US20110273518A1
公开(公告)日：2011-11-10
申请号：US13104268
申请日：2011-05-10
申请人： Mitsuru SATO , Takatoshi YAMAMOTO
发明人： Mitsuru SATO , Takatoshi YAMAMOTO
IPC分类号： B41J2/045
CPC分类号： B41J2/1433 , B41J2/14274 , B41J2/1612 , B41J2/162 , B41J2/1623 , B41J2/1645 , B41J2/1646
摘要： An ink jet type recording head includes a substrate, a nozzle plate having nozzles, and a sealing sheet, and the substrate and the nozzle plate are bonded to each other through a bonding film, and the substrate and the sealing sheet are bonded to each other through a bonding film. These bonding films are each obtained by drying and/or curing a liquid material containing an epoxy-modified silicone material. Further, by applying energy to each bonding film, the surface thereof is activated, and therefore, each bonding film exhibits a bonding property. By this bonding property, the substrate is bonded to the nozzle plate and to the sealing sheet.
摘要翻译：喷墨型记录头包括基板，具有喷嘴的喷嘴板和密封片，并且基板和喷嘴板通过接合膜彼此接合，并且基板和密封片彼此接合通过粘合膜。这些接合膜各自通过干燥和/或固化含有环氧改性的有机硅材料的液体材料而获得。此外，通过向每个接合膜施加能量，其表面被激活，因此每个接合膜都具有接合性。通过这种粘合特性，将基板粘合到喷嘴板和密封片上。

9. 发明申请

US20090186242A1 METHOD OF FORMING BONDED BODY AND BONDED BODY 有权
标题翻译：形成粘结体和粘结体的方法
公开(公告)号：US20090186242A1
公开(公告)日：2009-07-23
申请号：US12358531
申请日：2009-01-23
申请人： Mitsuru SATO , Takatoshi YAMAMOTO
发明人： Mitsuru SATO , Takatoshi YAMAMOTO
IPC分类号： B32B15/20 , B32B37/00
CPC分类号： B32B37/12 , B32B37/24 , B32B2037/1223 , B32B2037/246 , B32B2309/02 , B32B2309/04 , B32B2309/105 , B32B2309/12 , B32B2457/00 , Y10T428/12882
摘要： A method of forming a bonded body comprised of a first base member, a second base member, and a first bonding film and a second bonding film provided between the first base member and the second base member is provided. The first bonding film and the second bonding film are constituted mainly of copper. The method is comprised of: forming the first bonding film on the first base member by using a chemical vapor-film formation method; forming the second bonding film on the second base member by using a chemical vapor-film formation method; bringing the first bonding film formed on the first base member into contact with the second bonding film formed on the second base member so that the first bonding film faces the second bonding film; and applying a compressive force to the first base member and the second base member so that the first bonding film and the second bonding film are bonded together to thereby obtain the bonded body. Two base members can be firmly and efficiently bonded together with high dimensional accuracy at a low temperature, and the two base members can be efficiently separated (peeled off) to each other after use of the bonded body. Further, a bonded body is also provided.
摘要翻译：提供一种形成由第一基底构件，第二基底构件和第一接合膜构成的接合体的方法和设置在第一基底构件和第二基底构件之间的第二接合薄膜。第一接合膜和第二接合膜主要由铜构成。该方法包括：通过使用化学气相成膜法在第一基底构件上形成第一接合膜; 通过使用化学气相成膜法在第二基底构件上形成第二接合膜; 使形成在第一基底构件上的第一接合膜与形成在第二基底构件上的第二接合膜接触，使得第一接合膜面向第二接合膜; 并且向第一基底构件和第二基底构件施加压缩力，使得第一接合膜和第二接合膜接合在一起，从而获得接合体。两个基底构件可以在低温下以高尺寸精度牢固有效地粘合在一起，并且在使用粘合体之后可以将两个基底构件彼此有效地分离（剥离）。此外，还提供了粘合体。

10. 发明申请

US20090186215A1 METHOD OF FORMING BONDED BODY AND BONDED BODY 有权
标题翻译：形成粘结体和粘结体的方法
公开(公告)号：US20090186215A1
公开(公告)日：2009-07-23
申请号：US12358689
申请日：2009-01-23
申请人： Mitsuru SATO , Takatoshi YAMAMOTO
发明人： Mitsuru SATO , Takatoshi YAMAMOTO
IPC分类号： B32B37/16
CPC分类号： B32B37/00 , B23K20/02 , B23K2101/40 , B32B7/04 , B32B7/12 , B32B15/043 , B32B15/08 , B32B27/08 , B32B27/283 , B32B38/0008 , B32B2038/0092 , B32B2255/06 , B32B2255/10 , B32B2255/205 , B32B2255/28 , B32B2307/202 , B32B2307/302 , B32B2307/308 , B32B2307/54 , B32B2310/14 , B32B2457/00 , B32B2457/18 , B32B2457/202 , B32B2457/206 , C23C16/18 , C23C16/30 , Y10T428/265
摘要： A method of forming a bonded body comprised of a first base member, a second base member, and a first bonding film and a second bonding film provided between the first base member and the second base member is provided. The first bonding film and the second bonding film are constituted of copper and an organic component, and an amount of copper contained in each of the first bonding film and the second bonding film is 90 atom % or higher but lower than 99 atom % at an atomic ratio. The method is comprised of: forming the first bonding film on the first base member by using a chemical vapor-film formation method; forming the second bonding film on the second base member by using a chemical vapor-film formation method; bringing the first bonding film formed on the first base member into contact with the second bonding film formed on the second base member so that the first bonding film faces the second bonding film; and applying a compressive force to the first base member and the second base member so that the first bonding film and the second bonding film are bonded together to thereby obtain the bonded body. Two base members can be firmly and efficiently bonded together with high dimensional accuracy at a low temperature, and the two base members can be efficiently separated (peeled off) to each other after use of the bonded body. Further, a bonded body is also provided.
摘要翻译：提供一种形成由第一基底构件，第二基底构件和第一接合膜构成的接合体的方法和设置在第一基底构件和第二基底构件之间的第二接合薄膜。第一接合膜和第二接合膜由铜和有机成分构成，并且在第一接合膜和第二接合膜中的每一个中的铜量为90原子％以上且低于99原子％原子比。该方法包括：通过使用化学气相成膜法在第一基底构件上形成第一接合膜; 通过使用化学气相成膜法在第二基底构件上形成第二接合膜; 使形成在第一基底构件上的第一接合膜与形成在第二基底构件上的第二接合膜接触，使得第一接合膜面向第二接合膜; 并且向第一基底构件和第二基底构件施加压缩力，使得第一接合膜和第二接合膜接合在一起，从而获得接合体。两个基底构件可以在低温下以高尺寸精度牢固有效地粘合在一起，并且在使用粘合体之后可以将两个基底构件彼此有效地分离（剥离）。此外，还提供了粘合体。

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