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1. 发明申请

US20100243134A1 BONDING METHOD AND BONDED STRUCTURE 有权
标题翻译：结合方法和结合结构
公开(公告)号：US20100243134A1
公开(公告)日：2010-09-30
申请号：US12729533
申请日：2010-03-23
申请人： Minehiro IMAMURA , Kazuhiro GOMI
发明人： Minehiro IMAMURA , Kazuhiro GOMI
IPC分类号： B32B37/02
CPC分类号： C09J5/06 , H01L2224/27334 , H01L2224/2929 , H01L2224/293 , H01L2224/83851 , H01L2924/1461 , H01L2924/00
摘要： A method includes: preparing a transfer base material to have repellency against a silicone material- and conductive particle-containing liquid material; applying the liquid material to a transfer base material surface to form a liquid coating, and drying the liquid coating to obtain a bonding film; imparting energy to the bonding film to develop adhesion near a surface thereof, bonding the transfer base material to a first base material, and then separating the transfer and first base materials to transfer the bonding film to the first base material; thereafter imparting energy to the bonding film to develop adhesion near another surface of the bonding film, and bonding the first base material to a second base material to obtain a temporarily bonded structure; and applying pressure to the temporarily bonded structure to finalize the bonding and electrically connect a first terminal and a second terminal via the conductive particles.
摘要翻译：一种方法包括：制备转印基材以对硅氧烷材料和含导电颗粒的液体材料具有排斥性; 将液体材料施加到转印基材表面以形成液体涂料，并干燥该液体涂料以获得接合膜; 赋予所述接合膜的能量以在其表面附近形成粘附，将所述转印基材接合到第一基材，然后分离所述转印和第一基材以将所述接合膜转印到所述第一基材; 然后向接合膜施加能量以在接合膜的另一个表面附近发生粘合，并将第一基材接合到第二基材以获得临时结合的结构; 对暂时接合的结构施加压力，以最终化接合，并通过导电颗粒电连接第一端子和第二端子。

2. 发明授权

US07599415B2 Light source device, lighting device, monitor device, and projector 有权
标题翻译：光源装置，照明装置，监视装置和投影仪
公开(公告)号：US07599415B2
公开(公告)日：2009-10-06
申请号：US12024668
申请日：2008-02-01
申请人： Kunihiko Takagi , Minehiro Imamura , Akira Egawa
发明人： Kunihiko Takagi , Minehiro Imamura , Akira Egawa
IPC分类号： H01S3/10 , H01S3/04
CPC分类号： H01S3/025 , G02F1/37 , G02F2001/3546 , G02F2203/60 , H01S3/0401 , H01S3/042 , H01S3/09415 , H01S3/109 , H04N9/3129 , H04N9/3161
摘要： A light source device includes a light source section for supplying a laser beam, a wavelength conversion element for converting a wavelength of the laser beam from the light source section, a temperature measuring section for measuring temperature, a temperature adjusting section for adjusting the temperature of the wavelength conversion element in accordance with a result of the measurement by the temperature measuring section, and a thermal diffusion section for diffusing heat to be conducted to the wavelength conversion element, wherein the thermal diffusion section is provided with a first surface disposed on a side of the wavelength conversion element and a second surface disposed on an opposite side to the first surface, and the temperature measuring section is provided to a part of the thermal diffusion section, which is located on a side of the second surface and has higher thermal conductivity of the thermal diffusion section between the side of the first surface and the side of the second surface than the other part of the thermal diffusion section.
摘要翻译：光源装置包括用于提供激光束的光源部分，用于转换来自光源部分的激光束的波长的波长转换元件，用于测量温度的温度测量部分，用于调节温度的温度的温度调节部分所述波长转换元件根据由所述温度测量部分测量的结果，以及热扩散部分，用于扩散导热到所述波长转换元件的热量，其中所述热扩散部分设置有设置在所述波长转换元件的一侧的第一表面的波长转换元件和设置在与第一表面相反的一侧的第二表面，并且温度测量部分设置在热扩散部分的位于第二表面侧并具有较高导热性的部分的热扩散部分在第一表面和侧面之间的第二表面比热扩散部分的另一部分。

3. 发明申请

US20080187014A1 LIGHT SOURCE DEVICE, LIGHTING DEVICE, MONITOR DEVICE, AND PROJECTOR 有权
标题翻译：光源设备，照明设备，监视器设备和投影仪
公开(公告)号：US20080187014A1
公开(公告)日：2008-08-07
申请号：US12024668
申请日：2008-02-01
申请人： Kunihiko TAKAGI , Minehiro IMAMURA , Akira EGAWA
发明人： Kunihiko TAKAGI , Minehiro IMAMURA , Akira EGAWA
IPC分类号： H01S3/04
CPC分类号： H01S3/025 , G02F1/37 , G02F2001/3546 , G02F2203/60 , H01S3/0401 , H01S3/042 , H01S3/09415 , H01S3/109 , H04N9/3129 , H04N9/3161
摘要： A light source device includes a light source section for supplying a laser beam, a wavelength conversion element for converting a wavelength of the laser beam from the light source section, a temperature measuring section for measuring temperature, a temperature adjusting section for adjusting the temperature of the wavelength conversion element in accordance with a result of the measurement by the temperature measuring section, and a thermal diffusion section for diffusing heat to be conducted to the wavelength conversion element, wherein the thermal diffusion section is provided with a first surface disposed on a side of the wavelength conversion element and a second surface disposed on an opposite side to the first surface, and the temperature measuring section is provided to a part of the thermal diffusion section, which is located on a side of the second surface and has higher thermal conductivity of the thermal diffusion section between the side of the first surface and the side of the second surface than the other part of the thermal diffusion section.
摘要翻译：光源装置包括用于提供激光束的光源部分，用于转换来自光源部分的激光束的波长的波长转换元件，用于测量温度的温度测量部分，用于调节温度的温度的温度调节部分所述波长转换元件根据由所述温度测量部分测量的结果，以及热扩散部分，用于扩散导热到所述波长转换元件的热量，其中所述热扩散部分设置有设置在所述波长转换元件的一侧的第一表面的波长转换元件和设置在与第一表面相反的一侧的第二表面，并且温度测量部分设置在热扩散部分的位于第二表面侧并且具有较高导热性的部分的热扩散部分在第一表面和侧面之间的第二表面比热扩散部分的另一部分。

4. 发明申请

US20100243145A1 BONDING METHOD AND BONDED STRUCTURE 审中-公开
标题翻译：结合方法和结合结构
公开(公告)号：US20100243145A1
公开(公告)日：2010-09-30
申请号：US12729491
申请日：2010-03-23
申请人： Minehiro IMAMURA , Kazuhiro GOMI
发明人： Minehiro IMAMURA , Kazuhiro GOMI
IPC分类号： B32B38/10
CPC分类号： C09D183/10 , B05B17/0638 , C09J5/02 , C09J2483/008 , H01L51/0024 , H01L51/56 , H01L2227/323 , H01L2227/326
摘要： A bonding method includes: preparing a first base material to have liquid repellency against a silicone material-containing liquid material; applying the liquid material to a surface of the first base material to form a liquid coating in a predetermined shape, and drying the liquid coating to obtain a bonding film with the predetermined shape; imparting energy to the bonding film to develop adhesion near a surface of the bonding film, and bonding the first base material to a second base material via the bonding film, and then separating the first and second base materials from each other to transfer the bonding film to the second base material; and imparting energy to the bonding film after the transfer to develop adhesion near a surface of the bonding film, and bonding the second base material to a third base material via the bonding film to obtain a bonded structure.
摘要翻译：接合方法包括：制备第一基材以对含有硅酮材料的液体材料具有疏液性; 将液体材料施加到第一基材的表面以形成预定形状的液体涂层，并干燥该液体涂层以获得具有预定形状的接合膜; 赋予所述接合膜以在所述接合膜的表面附近形成附着力的能量，并且经由所述接合膜将所述第一基材接合到第二基材，然后将所述第一基材与所述第二基材分离，以将所述接合膜到第二基材; 并且在转印之后向接合膜赋予能量以在接合膜的表面附近形成附着力，并且经由接合膜将第二基材接合到第三基材以获得接合结构。

5. 发明申请

US20100092767A1 BONDING METHOD AND BONDED BODY 审中-公开
标题翻译：结合方法和结合体
公开(公告)号：US20100092767A1
公开(公告)日：2010-04-15
申请号：US12577314
申请日：2009-10-12
申请人： Nobuhiro NAITO , Mitsuru SATO , Takatoshi YAMAMOTO , Minehiro IMAMURA
发明人： Nobuhiro NAITO , Mitsuru SATO , Takatoshi YAMAMOTO , Minehiro IMAMURA
IPC分类号： B32B9/04 , B65C9/25 , B29C65/14
CPC分类号： B32B7/12 , B29C35/02 , B29C35/0805 , B29C35/0866 , B29C59/14 , B29C65/14 , B29C65/1403 , B29C65/1406 , B29C65/482 , B29C65/4835 , B29C65/521 , B29C65/523 , B29C65/526 , B29C65/528 , B29C66/1122 , B29C66/45 , B29C66/71 , B29C66/731 , B29C66/73111 , B29C66/73112 , B29C66/7352 , B29C66/73921 , B29C66/73941 , B29C66/91411 , B29C66/919 , B29C66/9241 , B29C66/929 , B29C66/954 , B29C2035/0827 , B29C2035/0877 , B29D11/0073 , B29K2021/00 , B29K2023/00 , B29K2023/06 , B29K2023/083 , B29K2023/086 , B29K2023/12 , B29K2025/00 , B29K2027/06 , B29K2027/08 , B29K2027/12 , B29K2027/16 , B29K2027/18 , B29K2033/04 , B29K2033/08 , B29K2033/12 , B29K2055/02 , B29K2059/00 , B29K2063/00 , B29K2067/00 , B29K2067/006 , B29K2067/06 , B29K2069/00 , B29K2071/00 , B29K2071/12 , B29K2075/00 , B29K2077/00 , B29K2077/10 , B29K2079/08 , B29K2079/085 , B29K2081/06 , B29K2083/00 , B29K2083/005 , B29K2096/005 , B29K2105/0088 , B29K2995/0082 , B29L2031/767 , B32B9/04 , B32B15/04 , B32B15/18 , B32B15/20 , B32B17/06 , B32B27/06 , B32B27/36 , B41J2/14233 , B41J2/161 , B41J2/1623 , C03C23/006 , C03C27/10 , C09J5/06 , C09J183/04 , Y10T428/265 , B29K2081/04 , B29K2067/003 , B29K2031/04 , B29K2029/04 , B29K2025/06 , B29K2023/38 , B29K2023/18 , B29K2023/16 , B29K2021/006 , B29K2009/06
摘要： A bonding method includes applying a liquid material containing silicone materials to at least one of the first base member and the second base member so as to form a liquid film, drying the liquid film so as to obtain a bonding film on the at least one of the first base member and the second base member, heating the bonding film so as to cross-link the silicone materials contained in the bonding film to each other, and applying energy to the bonding film so as to develop adhesiveness around a surface of the bonding film so as to obtain a bonded body in which the first base member and the second base member are bonded to each other with the bonding film interposed between the first base member and the second base member.
摘要翻译：接合方法包括将含有硅酮材料的液体材料施加到第一基底构件和第二基底构件中的至少一个，以便形成液体膜，干燥该液体膜，以便在至少一个第一基底构件和第二基底构件，加热接合膜以将包含在接合膜中的硅氧烷材料彼此交联，并且向接合膜施加能量，以便在接合膜的表面周围形成粘附性以获得其中第一基底构件和第二基底构件彼此接合的接合体，其中接合膜介于第一基底构件和第二基底构件之间。

6. 发明申请

US20080080185A1 LASER SOURCE DEVICE, IMAGE DISPLAY DEVICE EQUIPPED WITH THE LASER SOURCE DEVICE, AND MONITOR DEVICE 有权
标题翻译：激光源装置，装有激光源装置的图像显示装置和监视装置
公开(公告)号：US20080080185A1
公开(公告)日：2008-04-03
申请号：US11536496
申请日：2006-09-28
申请人： Keiko KUMAGAI , Minehiro IMAMURA
发明人： Keiko KUMAGAI , Minehiro IMAMURA
IPC分类号： H01S5/00
CPC分类号： H01S5/14 , H01S3/08059 , H01S3/109 , H01S5/0071 , H01S5/1096 , H01S5/4025 , H04N9/3105 , H04N9/3161
摘要： A laser source device provided with a light source, a wavelength conversion element, an external resonator, and an optical path conversion element. The wavelength conversion element is disposed inside the resonance structure, the second laser beam is taken out on the second optical path by the optical path conversion element and is led to a direction substantially the same as the proceeding direction of the first laser beam, and is used with the first laser beam as the output light beam. The selectively reflective film and the reflective surface for taking out the second laser beam are integrated.
摘要翻译：一种设置有光源，波长转换元件，外部谐振器和光路转换元件的激光源装置。波长转换元件设置在谐振结构内部，第二激光束通过光路转换元件在第二光路上取出，并被引导到与第一激光束的行进方向基本相同的方向，并且是与第一激光束一起用作输出光束。选择性反射膜和用于取出第二激光束的反射表面被集成。

7. 发明申请

US20100304156A1 BONDING METHOD AND BONDED STRUCTURE 审中-公开
标题翻译：结合方法和结合结构
公开(公告)号：US20100304156A1
公开(公告)日：2010-12-02
申请号：US12778556
申请日：2010-05-12
申请人： Mitsuru SATO , Takatoshi YAMAMOTO , Nobuhiro NAITO , Minehiro IMAMURA
发明人： Mitsuru SATO , Takatoshi YAMAMOTO , Nobuhiro NAITO , Minehiro IMAMURA
IPC分类号： B32B37/12 , B32B9/04
CPC分类号： C09D183/10 , C09J5/02 , C09J2483/008 , Y10T428/31663
摘要： A bonding method includes: preparing a first base material and a second base material to be bonded to each other via a bonding film; forming a liquid coating by supplying a polyester-modified silicone material-containing liquid material onto at least one of the first base material and the second base material, the polyester-modified silicone material being a product of dehydrocondensation reaction between a polyester resin obtained by esterification reaction of trimethylolpropane with terephthalic acid and a silicone material that has a branched polyorganosiloxane backbone having a unit structure represented by chemical formula (1) below at a branched portion, a unit structure represented by at least one of chemical formulae (2) and (3) below at a linking portion, and a unit structure represented by at least one of chemical formulae (4) and (5) below at a terminal portion, wherein R1 each independently represents a methyl group or a phenyl group, and X represents a siloxane residue; drying and/or curing the liquid coating to obtain the bonding film on at least one of the first base material and the second base material; contacting a plasma to the bonding film to develop adhesion near a surface of the bonding film; and contacting the first base material and the second base material via the bonding film developing adhesion, so as to obtain a bonded structure in which the first base material and the second base material are bonded to each other via the bonding film.
摘要翻译：接合方法包括：通过接合膜制备要彼此接合的第一基材和第二基材; 通过将聚酯改性的含硅材料的液体材料供给到第一基材和第二基材中的至少一个上而形成液体涂料，聚酯改性硅酮材料是通过酯化得到的聚酯树脂之间的脱氢缩合反应的产物由分子式表示的具有由下述化学式（1）表示的单元结构的支链聚有机硅氧烷主链的三羟甲基丙烷与对苯二甲酸反应的硅酮材料，由化学式（2）和（3）中的至少一个表示的单元结构）和在末端部分由下述化学式（4）和（5）中的至少一个表示的单元结构，其中R 1各自独立地表示甲基或苯基，X表示硅氧烷残留物干燥和/或固化所述液体涂层，以在所述第一基材和所述第二基材中的至少一个上获得所述接合膜; 使等离子体与接合膜接触以在接合膜的表面附近形成附着力; 并通过接合膜显影粘合使第一基材和第二基材接触，从而获得通过接合膜将第一基材和第二基材彼此接合的接合结构。

8. 发明申请

US20100206474A1 BONDING METHOD AND BONDED STRUCTURE 审中-公开
标题翻译：结合方法和结合结构
公开(公告)号：US20100206474A1
公开(公告)日：2010-08-19
申请号：US12706153
申请日：2010-02-16
申请人： Mitsuru SATO , Takatoshi YAMAMOTO , Nobuhiro NAITO , Minehiro IMAMURA
发明人： Mitsuru SATO , Takatoshi YAMAMOTO , Nobuhiro NAITO , Minehiro IMAMURA
IPC分类号： B32B37/12
CPC分类号： C09J5/02 , C08J5/124 , C08J7/123 , C08J2365/02 , C09J2205/31 , C09J2400/166 , C09J2400/228
摘要： A bonding method includes: forming a liquid coating by supplying a polyester-modified silicone material-containing liquid material onto at least one of a first base material and a second base material prepared beforehand to be bonded to each other via a bonding film; drying and curing the liquid coating to obtain a bonding film on at least one of the first base material and the second base material; imparting energy to the bonding film to develop adhesion near a surface of the bonding film; and contacting the first base material and the second base material via the bonding film so as to obtain a bonded structure in which the first base material and the second base material are bonded to each other via the bonding film.
摘要翻译：粘合方法包括：通过将预先通过接合膜彼此粘合的预先制备的第一基材和第二基材中的至少一种提供含有聚酯改性的含硅材料的液体材料形成液体涂料; 干燥和固化液体涂层，以在第一基材和第二基材中的至少一个上获得粘合膜; 赋予所述接合膜以在所述接合膜的表面附近形成附着力; 并且经由所述接合膜与所述第一基材和所述第二基材接触，以获得其中所述第一基材和所述第二基材经由所述接合膜彼此接合的接合结构。

9. 发明授权

US07561612B2 Laser source device, image display device equipped with the laser source device, and monitor device 有权
标题翻译：激光源装置，装有激光源装置的图像显示装置和监视装置
公开(公告)号：US07561612B2
公开(公告)日：2009-07-14
申请号：US11536496
申请日：2006-09-28
申请人： Keiko Kumagai , Minehiro Imamura
发明人： Keiko Kumagai , Minehiro Imamura
IPC分类号： H01S3/10 , H01S3/081 , H01S3/08
CPC分类号： H01S5/14 , H01S3/08059 , H01S3/109 , H01S5/0071 , H01S5/1096 , H01S5/4025 , H04N9/3105 , H04N9/3161
摘要： A laser source device provided with a light source, a wavelength conversion element, an external resonator, and an optical path conversion element. The wavelength conversion element is disposed inside the resonance structure, the second laser beam is taken out on the second optical path by the optical path conversion element and is led to a direction substantially the same as the proceeding direction of the first laser beam, and is used with the first laser beam as the output light beam. The selectively reflective film and the reflective surface for taking out the second laser beam are integrated.
摘要翻译：一种设置有光源，波长转换元件，外部谐振器和光路转换元件的激光源装置。波长转换元件设置在谐振结构内部，第二激光束通过光路转换元件在第二光路上取出，并被引导到与第一激光束的行进方向基本相同的方向，并且是与第一激光束一起用作输出光束。选择性反射膜和用于取出第二激光束的反射表面被集成。

10. 发明授权

US08182641B2 Bonding method and bonded structure 有权
标题翻译：粘结方法和粘结结构
公开(公告)号：US08182641B2
公开(公告)日：2012-05-22
申请号：US12729533
申请日：2010-03-23
申请人： Minehiro Imamura , Kazuhiro Gomi
发明人： Minehiro Imamura , Kazuhiro Gomi
IPC分类号： B32B7/14 , B32B37/06 , B32B37/10 , B32B38/10 , B29C65/52 , B32B37/02 , B32B38/18
CPC分类号： C09J5/06 , H01L2224/27334 , H01L2224/2929 , H01L2224/293 , H01L2224/83851 , H01L2924/1461 , H01L2924/00
摘要： A method includes: preparing a transfer base material to have repellency against a silicone material- and conductive particle-containing liquid material; applying the liquid material to a transfer base material surface to form a liquid coating, and drying the liquid coating to obtain a bonding film; imparting energy to the bonding film to develop adhesion near a surface thereof, bonding the transfer base material to a first base material, and then separating the transfer and first base materials to transfer the bonding film to the first base material; thereafter imparting energy to the bonding film to develop adhesion near another surface of the bonding film, and bonding the first base material to a second base material to obtain a temporarily bonded structure; and applying pressure to the temporarily bonded structure to finalize the bonding and electrically connect a first terminal and a second terminal via the conductive particles.
摘要翻译：一种方法包括：制备转印基材以对硅氧烷材料和含导电颗粒的液体材料具有排斥性; 将液体材料施加到转印基材表面以形成液体涂料，并干燥该液体涂料以获得接合膜; 赋予所述接合膜的能量以在其表面附近形成粘附，将所述转印基材接合到第一基材，然后分离所述转印和第一基材以将所述接合膜转印到所述第一基材; 然后向接合膜施加能量以在接合膜的另一表面附近发生粘合，并将第一基材接合到第二基材以获得临时结合的结构; 对暂时接合的结构施加压力，以最终化接合，并通过导电颗粒电连接第一端子和第二端子。

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