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    • 1. 发明授权
    • Transparent error correcting memory
    • 透明错误纠正内存
    • US07353438B2
    • 2008-04-01
    • US10645861
    • 2003-08-20
    • Wingyu LeungKit Sang TamMikolaj TworekFu-Chieh Hsu
    • Wingyu LeungKit Sang TamMikolaj TworekFu-Chieh Hsu
    • G11C29/00
    • G06F11/1048
    • A memory system with transparent error correction circuitry provides full stuck-at fault coverage for both test data patterns and the corresponding error correction code (ECC) values. The memory system includes a semiconductor memory having a memory array, a memory interface and an error detection/correction unit. The memory array is configured to store test data patterns and corresponding error correction code (ECC) values. The memory interface is configured such that the ECC values are not directly accessible. The error detection/correction unit is configured to correct single-bit errors in the test data patterns and corresponding ECC values. A set of test data patterns associated with the semiconductor memory is selected such that any multiple-bit error in a test data pattern and the corresponding ECC value causes the error detection/correction unit to provide an output data pattern having an error, thereby rendering multiple-bit faults 100% detectable.
    • 具有透明误差校正电路的存储器系统为测试数据模式和相应的纠错码(ECC)值提供完全卡住的故障覆盖。 存储器系统包括具有存储器阵列,存储器接口和错误检测/校正单元的半导体存储器。 存储器阵列被配置为存储测试数据模式和相应的纠错码(ECC)值。 存储器接口被配置为使得ECC值不能直接访问。 错误检测/校正单元被配置为校正测试数据模式中的单位错误和对应的ECC值。 选择与半导体存储器相关联的一组测试数据模式,使得测试数据模式中的任何多位错误和相应的ECC值导致错误检测/校正单元提供具有错误的输出数据模式,从而渲染多个 位错误100%可检测。
    • 2. 发明授权
    • High speed memory system
    • 高速存储系统
    • US07206913B2
    • 2007-04-17
    • US10927157
    • 2004-08-25
    • Fu-Chieh HsuWingyu Leung
    • Fu-Chieh HsuWingyu Leung
    • G06F12/00
    • G06F12/0893G06F12/0855G06F12/0879G06F12/0897G06F12/10G11C7/10G11C7/1018G11C7/1051G11C7/1069G11C7/1078G11C7/1096G11C11/406G11C11/4076G11C11/4096
    • A method and structure for implementing a DRAM memory array as a second level cache memory in a computer system. The computer system includes a central processing unit (CPU), a first level SRAM cache memory, a CPU bus coupled to the CPU, and second level cache memory which includes a DRAM array coupled to the CPU bus. When accessing the DRAM array, row access and column decoding operations are performed in a self-timed asynchronous manner. Predetermined sequences of column select operations are then performed in a synchronous manner with respect to a clock signal. A widened data path is provided to the DRAM array, effectively increasing the data rate of the DRAM array. By operating the DRAM array at a higher data rate than the CPU bus, additional time is provided for precharging the DRAM array. As a result, precharging of the DRAM array is transparent to the CPU bus.
    • 一种用于在计算机系统中实现DRAM存储器阵列作为第二级高速缓冲存储器的方法和结构。 计算机系统包括中央处理单元(CPU),第一级SRAM缓存存储器,耦合到CPU的CPU总线以及包括与CPU总线耦合的DRAM阵列的第二级高速缓冲存储器。 当访问DRAM阵列时,以自定时的异步方式执行行访问和列解码操作。 然后以相对于时钟信号的同步方式执行列选择操作的预定序列。 向DRAM阵列提供加宽的数据路径,有效地增加DRAM阵列的数据速率。 通过以比CPU总线更高的数据速率操作DRAM阵列,为DRAM阵列预充电提供了额外的时间。 因此,DRAM阵列的预充电对于CPU总线是透明的。
    • 3. 发明申请
    • High speed memory system
    • 高速存储系统
    • US20050027929A1
    • 2005-02-03
    • US10927157
    • 2004-08-25
    • Fu-Chieh HsuWingyu Leung
    • Fu-Chieh HsuWingyu Leung
    • G06F12/00G06F12/06G06F12/08
    • G06F12/0893G06F12/0855G06F12/0879G06F12/0897G06F12/10G11C7/10G11C7/1018G11C7/1051G11C7/1069G11C7/1078G11C7/1096G11C11/406G11C11/4076G11C11/4096
    • A method and structure for implementing a DRAM memory array as a second level cache memory in a computer system. The computer system includes a central processing unit (CPU), a first level SRAM cache memory, a CPU bus coupled to the CPU, and second level cache memory which includes a DRAM array coupled to the CPU bus. When accessing the DRAM array, row access and column decoding operations are performed in a self-timed asynchronous manner. Predetermined sequences of column select operations are then performed in a synchronous manner with respect to a clock signal. A widened data path is provided to the DRAM array, effectively increasing the data rate of the DRAM array. By operating the DRAM array at a higher data rate than the CPU bus, additional time is provided for precharging the DRAM array. As a result, precharging of the DRAM array is transparent to the CPU bus.
    • 一种用于在计算机系统中实现DRAM存储器阵列作为第二级高速缓冲存储器的方法和结构。 计算机系统包括中央处理单元(CPU),第一级SRAM缓存存储器,耦合到CPU的CPU总线以及包括与CPU总线耦合的DRAM阵列的第二级高速缓冲存储器。 当访问DRAM阵列时,以自定时的异步方式执行行访问和列解码操作。 然后以相对于时钟信号的同步方式执行列选择操作的预定序列。 向DRAM阵列提供加宽的数据路径,有效地增加了DRAM阵列的数据速率。 通过以比CPU总线更高的数据速率操作DRAM阵列,为DRAM阵列预充电提供了额外的时间。 因此,DRAM阵列的预充电对于CPU总线是透明的。
    • 5. 发明授权
    • DRAM cell fabricated using a modified logic process and method for operating same
    • 使用改进的逻辑处理和操作方法制造的DRAM单元
    • US06509595B1
    • 2003-01-21
    • US09427383
    • 1999-10-25
    • Wingyu LeungFu-Chieh Hsu
    • Wingyu LeungFu-Chieh Hsu
    • H01L31119
    • H01L27/10852G11C5/147G11C8/08G11C11/4074G11C11/4085G11C2207/104H01L27/1085H01L27/10873H01L28/91
    • A memory system that includes a dynamic random access memory (DRAM) cell that includes an access transistor and a storage capacitor. The storage capacitor of the DRAM cell is fabricated by forming a polysilicon crown electrode, a dielectric layer overlying the polysilicon crown, and a polysilicon plate electrode overlying the dielectric layer. A first set of thermal cycles are performed during the formation of the storage capacitor to form and anneal the elements of the capacitor structure. After the first set of thermal cycles are complete, shallow P+ and/or N+ regions are formed by ion implantation, and metal salicide is formed. As a result, the relatively high first set of thermal cycles required to form the capacitor structure does not adversely affect the shallow P+ and N+ regions or the metal salicide. A second set of thermal cycles, which are comparable to or less than the first set of thermal cycles, are performed during the formation of the shallow regions and the metal salicide. The DRAM cell is operated in response to a word line driver that is controlled to provide a positive boosted voltage and a negative boosted voltage to the word line, thereby controlling access to the DRAM cell. The positive boosted voltage is greater than Vdd but less than Vdd plus the absolute value of a transistor threshold voltage Vt. Similarly, the negative boosted voltage generator is less than VSS by an amount less than Vt.
    • 一种包括动态随机存取存储器(DRAM)单元的存储器系统,其包括存取晶体管和存储电容器。 DRAM单元的存储电容器通过形成多晶硅冠状电极,覆盖多晶硅冠的电介质层和覆盖在电介质层上的多晶硅板电极来制造。 在形成存储电容器期间执行第一组热循环以形成和退火电容器结构的元件。 在第一组热循环完成后,通过离子注入形成浅的P +和/或N +区,形成金属硅化物。 结果,形成电容器结构所需的相对较高的第一组热循环不会对浅的P +和N +区域或金属硅化物产生不利影响。 在浅区域和金属硅化物的形成期间执行第二组热循环,其与第一组热循环相当或者小于第一组热循环。 响应于字线驱动器操作DRAM单元,该字线驱动器被控制以向该字线提供正升压电压和负升压电压,从而控制对DRAM单元的访问。 正升压电压大于Vdd但小于Vdd加上晶体管阈值电压Vt的绝对值,类似地,负升压电压小于VSS的量小于Vt。
    • 6. 发明授权
    • Termination circuits for reduced swing signal lines and methods for
operating same
    • 用于减少摆动信号线的终端电路及其操作方法
    • US5729152A
    • 1998-03-17
    • US549610
    • 1995-10-27
    • Wingyu LeungWinston LeeFu-Chieh Hsu
    • Wingyu LeungWinston LeeFu-Chieh Hsu
    • G11C11/41G06F3/00G06F12/16G06F13/16G06F13/40G11C7/00G11C11/401G11C11/407G11C11/417G11C29/00G11C29/04H04L25/02H03K17/16
    • H04L25/028G06F13/40G06F13/4072G06F13/4077H04L25/026H04L25/0292Y02B60/1228Y02B60/1235
    • A memory device which utilizes a plurality of memory modules coupled in parallel to a master I/O module through a single directional asymmetrical signal swing (DASS) bus. This structure provides an I/O scheme having symmetrical swing around half the supply voltage, high through-put, high data bandwidth, short access time, low latency and high noise immunity. The memory device utilizes improved column access circuitry including an improved address sequencing circuit and a data amplifier within each memory module. The memory device includes a resynchronization circuit which allows the device to operate either synchronously and asynchronously using the same pins. Each memory module has independent address and command decoders to enable independent operation. Thus, each memory module is activated by commands on the DASS bus only when a memory access operation is performed within the particular memory module. The memory device includes redundant memory modules to replace defective memory modules. Replacement can be carried out through commands on the DASS bus. The memory device can be configured to simultaneously write a single input data stream to multiple memory modules or to perform high-speed interleaved read and write operations. In one embodiment, multiple memory devices are coupled to a common, high-speed I/O bus without requiring large bus drivers and complex bus receivers in the memory modules.
    • 一种存储器件,其利用通过单向非对称信号摆幅(DASS)总线并联到主I / O模块的多个存储器模块。 这种结构提供了一个在电源电压的一半左右,高输入,高数据带宽,短访问时间,低延迟和高抗噪声的对称摆动的I / O方案。 存储器件利用改进的列存取电路,包括改进的地址排序电路和每个存储器模块内的数据放大器。 存储器件包括再同步电路,其允许器件使用相同的引脚同步和异步地操作。 每个存储器模块具有独立的地址和命令解码器,以实现独立操作。 因此,只有当在特定存储器模块内执行存储器访问操作时,每个存储器模块才被DASS总线上的命令激活。 存储器件包括用于替换有缺陷的存储器模块的冗余存储器模块。 可以通过DASS总线上的命令进行更换。 存储器件可被配置为将单个输入数据流同时写入多个存储器模块或执行高速交错读写操作。 在一个实施例中,多个存储器件耦合到公共的高速I / O总线,而不需要存储器模块中的大的总线驱动器和复杂的总线接收器。