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1. 发明申请

US20100252927A1 Pattern-Print Thin-Film Transistors with Top Gate Geometry 有权
标题翻译：带顶栅几何图案印刷薄膜晶体管
公开(公告)号：US20100252927A1
公开(公告)日：2010-10-07
申请号：US12817127
申请日：2010-06-16
申请人： William S. Wong , Rene A. Lujan , Eugene M. Chow
发明人： William S. Wong , Rene A. Lujan , Eugene M. Chow
IPC分类号： H01L29/45
CPC分类号： H01L29/41733 , H01L27/124 , H01L27/1285 , H01L27/1288 , H01L27/1292 , H01L29/42384 , H01L29/4908 , H01L29/66757
摘要： A self-aligned, thin-film, top-gate transistor and method of manufacturing same are disclosed. A first print-patterned mask is formed over a metal layer by digital lithography, for example by printing with a phase change material using a droplet ejector. The metal layer is then etched using the first print-patterned mask to form source and drain electrodes. A semiconductive layer and an insulative layer are formed thereover. A layer of photosensitive material is then deposited and exposed through the substrate, with the source and drain electrodes acting as masks for the exposure. Following development of the photosensitive material, a gate metal layer is deposited. A second print-patterned mask is then formed over the device, again by digital lithography. Etching and removal of the photosensitive material leaves the self-aligned top-gate electrode.
摘要翻译：公开了一种自对准薄膜顶栅晶体管及其制造方法。通过数字光刻在金属层上形成第一印刷图案掩模，例如通过使用液滴喷射器用相变材料进行印刷。然后使用第一印刷图案化掩模蚀刻金属层以形成源极和漏极。在其上形成半导体层和绝缘层。然后将一层感光材料沉积并暴露通过基底，源极和漏极用作曝光的掩模。在感光材料的显影之后，沉积栅极金属层。然后再次通过数字光刻法在器件上形成第二印刷图案掩模。蚀刻和去除感光材料离开自对准顶栅电极。

2. 发明授权

US07344928B2 Patterned-print thin-film transistors with top gate geometry 有权
标题翻译：具有顶栅几何形状的图案印刷薄膜晶体管
公开(公告)号：US07344928B2
公开(公告)日：2008-03-18
申请号：US11193847
申请日：2005-07-28
申请人： William S. Wong , Rene A. Lujan , Eugene M. Chow
发明人： William S. Wong , Rene A. Lujan , Eugene M. Chow
IPC分类号： H01L21/84
CPC分类号： H01L29/41733 , H01L27/124 , H01L27/1285 , H01L27/1288 , H01L27/1292 , H01L29/42384 , H01L29/4908 , H01L29/66757
摘要： A self-aligned, thin-film, top-gate transistor and method of manufacturing same are disclosed. A first print-patterned mask is formed over a metal layer by digital lithography, for example by printing with a phase change material using a droplet ejector. The metal layer is then etched using the first print-patterned mask to form source and drain electrodes. A semiconductive layer and an insulative layer are formed thereover. A layer of photosensitive material is then deposited and exposed through the substrate, with the source and drain electrodes acting as masks for the exposure. Following development of the photosensitive material, a gate metal layer is deposited. A second print-patterned mask is then formed over the device, again by digital lithography. Etching and removal of the photosensitive material leaves the self-aligned top-gate electrode.
摘要翻译：公开了一种自对准薄膜顶栅晶体管及其制造方法。通过数字光刻在金属层上形成第一印刷图案掩模，例如通过使用液滴喷射器用相变材料进行印刷。然后使用第一印刷图案化掩模蚀刻金属层以形成源极和漏极。在其上形成半导体层和绝缘层。然后将一层感光材料沉积并暴露通过基底，源极和漏极用作曝光的掩模。在感光材料的显影之后，沉积栅极金属层。然后再次通过数字光刻法在器件上形成第二印刷图案掩模。蚀刻和去除感光材料离开自对准顶栅电极。

3. 发明申请

US20080121884A1 Patterned-Print Thin-Film Transistors with Top Gate Geometry 有权
标题翻译：带顶栅几何图案印刷薄膜晶体管
公开(公告)号：US20080121884A1
公开(公告)日：2008-05-29
申请号：US12018794
申请日：2008-01-23
申请人： William S. Wong , Rene A. Lujan , Eugene M. Chow
发明人： William S. Wong , Rene A. Lujan , Eugene M. Chow
IPC分类号： H01L29/04
CPC分类号： H01L29/41733 , H01L27/124 , H01L27/1285 , H01L27/1288 , H01L27/1292 , H01L29/42384 , H01L29/4908 , H01L29/66757
摘要： A self-aligned, thin-film, top-gate transistor and method of manufacturing same are disclosed. A first print-patterned mask is formed over a metal layer by digital lithography, for example by printing with a phase change material using a droplet ejector. The metal layer is then etched using the first print-patterned mask to form source and drain electrodes. A semiconductive layer and an insulative layer are formed thereover. A layer of photosensitive material is then deposited and exposed through the substrate, with the source and drain electrodes acting as masks for the exposure. Following development of the photosensitive material, a gate metal layer is deposited. A second print-patterned mask is then formed over the device, again by digital lithography. Etching and removal of the photosensitive material leaves the self-aligned top-gate electrode.
摘要翻译：公开了一种自对准薄膜顶栅晶体管及其制造方法。通过数字光刻在金属层上形成第一印刷图案掩模，例如通过使用液滴喷射器用相变材料进行印刷。然后使用第一印刷图案化掩模蚀刻金属层以形成源极和漏极。在其上形成半导体层和绝缘层。然后将一层感光材料沉积并暴露通过基底，源极和漏极用作曝光的掩模。在感光材料的显影之后，沉积栅极金属层。然后再次通过数字光刻法在器件上形成第二印刷图案掩模。蚀刻和去除感光材料离开自对准顶栅电极。

4. 发明授权

US07749396B2 Method of manufacturing fine features for thin film transistors 有权
标题翻译：制造薄膜晶体管精细特征的方法
公开(公告)号：US07749396B2
公开(公告)日：2010-07-06
申请号：US11388731
申请日：2006-03-24
申请人： Eugene M. Chow , William S. Wong , Michael Chabinyc , Ana Claudia Arias
发明人： Eugene M. Chow , William S. Wong , Michael Chabinyc , Ana Claudia Arias
IPC分类号： H01B13/00 , C23F1/00
CPC分类号： H01L29/4908 , H01L27/124 , H01L27/1292
摘要： A process for fabricating fine features such as small gate electrodes on a transistor. The process involves the jet-printing of a mask and the plating of a metal to fabricate sub-pixel and standard pixel size features in one layer. Printing creates a small sub-pixel size gap mask for plating a fine feature. A second printed mask may be used to protect the newly formed gate and etch standard pixel size lines connecting the small gates.
摘要翻译：一种在晶体管上制造诸如小栅电极的精细特征的工艺。该方法涉及一种掩模的喷墨印刷和金属镀层，以在一层中制造亚像素和标准像素尺寸特征。打印创建一个小的子像素大小的间隙掩模，用于电镀精细特征。可以使用第二印刷掩模来保护新形成的栅极并蚀刻连接小栅极的标准像素尺寸线。

5. 发明授权

US07524768B2 Method using monolayer etch masks in combination with printed masks 失效
标题翻译：使用单层蚀刻掩模与印刷掩模组合的方法
公开(公告)号：US07524768B2
公开(公告)日：2009-04-28
申请号：US11388718
申请日：2006-03-24
申请人： Eugene M. Chow , William S. Wong , Michael Chabinyc , Jeng Ping Lu , Ana Claudia Arias
发明人： Eugene M. Chow , William S. Wong , Michael Chabinyc , Jeng Ping Lu , Ana Claudia Arias
IPC分类号： H01L21/302
CPC分类号： H01L21/302 , H01L21/0271 , H01L21/0273 , H01L27/124 , H01L27/1288 , H01L27/1292 , H01L29/66765
摘要： A method to pattern films into dimensions smaller than the printed pixel mask size. A printed mask is deposited on a thin film on a substrate. The second mask layer is selectively deposited onto the film, but not to the printed mask. A third mask is then printed onto the substrate to pattern a portion of the second mask. Certain solvents are then used to remove the printed mask but not the mask layer on the thin film. The mask layer is then used to form a pattern on the thin film in combination with etching. The features formed in the thin film are smaller than the smallest dimension of the printed mask. The coated mask layer can be a self-assembled mono-layer or other material that selectively binds to the thin film.
摘要翻译：将薄膜图案尺寸小于印刷像素掩模尺寸的方法。印刷的掩模沉积在基底上的薄膜上。第二掩模层选择性地沉积在膜上，而不是印刷在掩模上。然后将第三掩模印刷到基底上以对第二掩模的一部分进行图案化。然后使用某些溶剂去除印刷的掩模，而不是薄膜上的掩模层。然后将掩模层与蚀刻结合在薄膜上形成图案。形成在薄膜中的特征小于印刷掩模的最小尺寸。涂覆的掩模层可以是选择性地结合薄膜的自组装单层或其它材料。

6. 发明授权

US09281268B2 Method for fabricating multi-chip module with multi-level interposer 有权
标题翻译：用多层插入器制造多芯片模块的方法
公开(公告)号：US09281268B2
公开(公告)日：2016-03-08
申请号：US13517591
申请日：2012-06-13
申请人： Eugene M. Chow , John E. Cunningham , James G. Mitchell , Ivan Shubin
发明人： Eugene M. Chow , John E. Cunningham , James G. Mitchell , Ivan Shubin
IPC分类号： H05K3/20 , H01L23/498 , H01L21/48 , H01L21/683 , H01L23/13 , H01L23/14 , H01L23/544 , H01L23/00 , H01L25/065 , H01L23/15
CPC分类号： H01L23/49811 , H01L21/4853 , H01L21/6835 , H01L23/13 , H01L23/147 , H01L23/15 , H01L23/49827 , H01L23/544 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/0652 , H01L2221/68309 , H01L2221/68345 , H01L2223/54426 , H01L2223/54473 , H01L2224/13 , H01L2224/13016 , H01L2224/131 , H01L2224/136 , H01L2224/16237 , H01L2224/81005 , H01L2224/81007 , H01L2224/81136 , H01L2224/81138 , H01L2224/81141 , H01L2224/81191 , H01L2224/81192 , H01L2224/81801 , H01L2224/81901 , H01L2924/0001 , H01L2924/01006 , H01L2924/01033 , H01L2924/01075 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15156 , H01L2924/15787 , Y10T29/49165 , Y10T29/49204 , Y10T29/49895 , Y10T29/49947 , H01L2924/00012 , H01L2224/13099 , H01L2924/00
摘要： A multi-level interposer plate and a multi-chip module (MCM) that includes the multi-level interposer plate are described. First surfaces and second surfaces in different regions of the multi-level interposer plate have associated, different thicknesses. Moreover, first micro-spring connectors and second micro-spring connectors are respectively disposed on the first surfaces and the second surfaces. In the MCM, a given one of the first surfaces of the multi-level interposer plate faces a bridge chip in a first layer in an array of chips in the MCM so that first connectors, disposed on the bridge chip, mechanically and electrically couple to the first micro-spring connectors. Similarly, a given one of the second surfaces of the multi-level interposer plate faces an island chip in a second layer in the array of chips so that second connectors, disposed on the island chip, mechanically and electrically couple to the second micro-spring connectors.
摘要翻译：描述了包括多层插入板的多层插入板和多芯片模块（MCM）。多层插入板的不同区域中的第一表面和第二表面具有相关联的不同厚度。此外，第一微弹簧连接器和第二微弹簧连接器分别设置在第一表面和第二表面上。在MCM中，多级插入板的给定的一个第一表面面向MCM中芯片阵列的第一层中的桥式芯片，使得设置在桥式芯片上的第一连接器机械地和电耦合到第一个微型弹簧连接器。类似地，多层插入板的给定的一个第二表面面向芯片阵列中的第二层中的岛状芯片，使得设置在岛状芯片上的第二连接器机械地和电耦合到第二微型弹簧连接器

7. 发明授权

US08869695B2 Anilox metering system for electrographic printing 有权
标题翻译：用于电印的网纹计量系统
公开(公告)号：US08869695B2
公开(公告)日：2014-10-28
申请号：US12566518
申请日：2009-09-24
申请人： Eugene M. Chow , Jing Zhou , Gerald A. Domoto , Grace T. Brewington
发明人： Eugene M. Chow , Jing Zhou , Gerald A. Domoto , Grace T. Brewington
IPC分类号： B41F9/10 , B41F31/04 , B41M1/42 , G03G15/10
CPC分类号： G03G15/104
摘要： An embodiment is a method and apparatus to meter ink for electrographic printing. An ink loading mechanism having an anilox roller fills ink from an ink supply into cells in the anilox roller having a plurality of valleys and lands that form the cells. The ink loading mechanism causes the valleys to be full or nearly full with the ink. The anilox roller rotates in a first direction. A blanket roller rotationally engaged with the anilox roller pulls the ink out of the cells and causes the valleys to be partially filled. The blanket roller rotates in a second direction. A first cleaning blade cleans tops of the lands of the cells.Another embodiment is a method and apparatus to meter ink for electrographic printing. An ink loading mechanism having an anilox roller fills ink from an ink supply into cells in the anilox roller having a plurality of valleys and lands forming the cells. The ink loading mechanism causes the valleys to be full or nearly full with the ink. The anilox roller rotates in a first direction. A soft blade positioned slightly below surface of the lands removes ink from the cells and causes the valleys the partially filled as the anilox roller rotates. A hard blade positioned at the surface of the lands to clean residue of ink on the surface of the lands as the anilox roller rotates.
摘要翻译：一个实施例是一种用于电印印刷墨水的方法和装置。具有网纹辊的墨水装载机构将油墨从墨水供给装入具有形成该单元的多个谷和平台的网纹辊中的单元中。墨水装载机构使墨水充满或接近满。网纹辊沿第一方向旋转。与网纹辊旋转地接合的橡皮布辊将墨水从电池中拉出并导致谷部分地被填充。橡皮布滚筒沿第二个方向旋转。第一清洁刀片清洁细胞的脊部的顶部。另一个实施例是一种计量油墨用于电印印刷的方法和装置。具有网纹辊的墨水装载机构将油墨从墨水供给装入具有形成单元的多个谷底的网纹辊中的单元中。墨水装载机构使墨水充满或接近满。网纹辊沿第一方向旋转。稍微位于焊盘表面下方的软刀片从电池中取出墨水，并使网纹辊旋转时部分填充的谷物。位于平台表面的硬刀片，以在网纹辊旋转时清洁焊盘表面上的油墨残留物。

8. 发明授权

US08405198B2 Stress-engineered interconnect packages with activator-assisted molds 有权
标题翻译：具有活化剂辅助模具的应力设计互连封装
公开(公告)号：US08405198B2
公开(公告)日：2013-03-26
申请号：US12471188
申请日：2009-05-22
申请人： Christopher L. Chua , Bowen Cheng , Eugene M. Chow , Dirk De Bruyker
发明人： Christopher L. Chua , Bowen Cheng , Eugene M. Chow , Dirk De Bruyker
IPC分类号： H01L23/52
CPC分类号： H01L21/50 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/0401 , H01L2224/05568 , H01L2224/05599 , H01L2224/1111 , H01L2224/11334 , H01L2224/13005 , H01L2224/13016 , H01L2224/13027 , H01L2224/16105 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/73104 , H01L2224/81903 , H01L2224/83193 , H01L2224/83855 , H01L2224/83859 , H01L2224/83874 , H01L2224/83885 , H01L2224/9211 , H01L2924/00013 , H01L2924/00014 , H01L2924/0002 , H01L2924/01006 , H01L2924/01018 , H01L2924/01024 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/0132 , H01L2924/09701 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/351 , H05K3/321 , H05K3/4015 , H05K2201/0311 , H01L2224/81 , H01L2224/83 , H01L2224/13099 , H01L2224/05099 , H01L2924/01015 , H01L2924/01049 , H01L2924/01031 , H01L2224/13599 , H01L2224/29099 , H01L2224/29599 , H01L2224/05552 , H01L2924/00
摘要： A package has a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, a chemical activator in the interconnect area, and an adhesive responsive to the chemical activator in the interconnect area. A package has a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, a chemical activator on one of either the pad chip or the spring chip, and an adhesive responsive to the chemical activator on the other of either the pad chip or the spring chip. A method includes providing a pad chip having contact pads, providing a spring chip having micro-springs, applying a chemical activator to one of either the pad chip or the spring chip, applying an adhesive responsive to the chemical activator on the other of the pad chip or the spring chip, aligning the pad chip to the spring chip such that the micro-springs will contact the contact pads, and pressing the pad chip and the spring chip together such that the chemical activator at least partially cures the adhesive.
摘要翻译：封装具有具有接触焊盘的焊盘芯片，具有与接触焊盘接触以形成互连的微弹簧的弹簧芯片，微弹簧接触形成互连区域的接触焊盘的区域，互连中的化学活化剂区域，以及响应于互连区域中的化学活化剂的粘合剂。封装具有焊盘芯片，其具有接触焊盘，弹簧芯片，其具有与接触焊盘接触以形成互连的微弹簧，在焊盘芯片或弹簧芯片之一上的化学活化剂以及响应于化学活化剂的粘合剂另一方面是垫片芯片或弹簧芯片。一种方法包括提供具有接触焊盘的焊盘芯片，提供具有微弹簧的弹簧芯片，将化学活化剂施加到衬垫芯片或弹簧芯片中的一个上，在衬垫的另一个上施加响应于化学活化剂的粘合剂芯片或弹簧芯片，将焊盘芯片对准弹簧芯片，使得微弹簧将接触接触焊盘，并将焊盘芯片和弹簧芯片压在一起，使得化学活化器至少部分地固化粘合剂。

9. 发明授权

US08399296B2 Airgap micro-spring interconnect with bonded underfill seal 有权
标题翻译：气隙微弹簧互连带粘合底部填充密封
公开(公告)号：US08399296B2
公开(公告)日：2013-03-19
申请号：US13269609
申请日：2011-10-09
申请人： Christopher L. Chua , Bowen Cheng , Eugene M. Chow , Dirk De Bruyker
发明人： Christopher L. Chua , Bowen Cheng , Eugene M. Chow , Dirk De Bruyker
IPC分类号： H01L21/00 , H01L23/34
CPC分类号： H01L21/563 , H01L24/01 , H01L24/13 , H01L24/17 , H01L24/81 , H01L25/0657 , H01L33/62 , H01L2224/13016 , H01L2224/1703 , H01L2224/17051 , H01L2224/17505 , H01L2224/17517 , H01L2224/73204 , H01L2224/81192 , H01L2224/81855 , H01L2224/81902 , H01L2224/83192 , H01L2225/06527 , H01L2225/06575 , H01L2225/06593 , H01L2924/01006 , H01L2924/01018 , H01L2924/01024 , H01L2924/01042 , H01L2924/01045 , H01L2924/014 , H01L2924/09701 , H01L2924/10329 , H01L2924/14 , H01L2924/181 , H01L2924/351 , H01L2924/00
摘要： A method of assembling a package includes aligning a pad chip with a spring chip to form at least one interconnect in an interconnect area, adhering the pad chip to the spring chip so that there is a gap between the pad chip and the spring chip, dispensing underfill material into the gap to seal the interconnect area from an environment external to the package, and curing the underfill material to form a solid mold.
摘要翻译：组装包装的方法包括将衬垫芯片与弹簧芯片对准以在互连区域中形成至少一个互连，将焊盘芯片粘附到弹簧芯片，使得在垫片芯片和弹簧芯片之间存在间隙，分配将填充材料填充到间隙中以将互连区域与包装外部的环境密封，并固化底部填充材料以形成固体模具。

10. 发明授权

US08393785B2 Nanocalorimeter based on thermal probes 有权
标题翻译：基于热探针的纳米尺度计
公开(公告)号：US08393785B2
公开(公告)日：2013-03-12
申请号：US12467072
申请日：2009-05-15
申请人： Dirk De Bruyker , Francisco E. Torres , Michal V. Wolkin , Gregory B. Anderson , Eugene M. Chow
发明人： Dirk De Bruyker , Francisco E. Torres , Michal V. Wolkin , Gregory B. Anderson , Eugene M. Chow
IPC分类号： G01N25/20 , G01K17/04
CPC分类号： G01K17/006 , B82Y35/00 , G01K2211/00
摘要： A nanocalorimeter includes a merging layer having, a drop placement area for holding drops to be merged and a thermal equilibration area. A measurement layer includes a substrate, and a temperature probe on the substrate, wherein the temperature probe extends out of the surface of the substrate to come into operative contact with the thermal equilibration area when the measurement layer is placed in operative association with the merging layer. The nanocalorimeter is configured to have the merging layer and the measurement layer non-integrated, making the measurement layer reusable.
摘要翻译：纳米尺度计包括具有用于保持要合并的液滴的液滴放置区域和热平衡区域的合并层。测量层包括衬底和衬底上的温度探针，其中当测量层与合并层可操作地相关联时，温度探针从衬底的表面延伸出来以与热平衡区域操作接触。纳米尺度计被配置为具有合并层和测量层非集成，使得测量层可重复使用。

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