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1. 发明授权

US09349558B2 Mechanically acuated heat switch 有权
标题翻译：机械式加热开关
公开(公告)号：US09349558B2
公开(公告)日：2016-05-24
申请号：US13312880
申请日：2011-12-06
申请人： David Eric Schwartz , Sean Roark Garner , Dirk De Bruyker , Ricardo Santos Roque
发明人： David Eric Schwartz , Sean Roark Garner , Dirk De Bruyker , Ricardo Santos Roque
IPC分类号： F28F27/00 , H01H37/02 , H01H57/00 , H01H59/00
CPC分类号： H01H37/02 , H01H57/00 , H01H59/0009
摘要： A heat switch has a first contact, a plug of thermally conductive material, and a mechanical actuator attached to the plug of thermally conductive material, the mechanical actuator arranged to move the plug into contact with the first contact in a first position and to move the plug out of contact with the first contact in a second position responsive to an input signal.
摘要翻译：热开关具有第一接触件，导热材料插塞和附接到导热材料插塞的机械致动器，所述机械致动器被布置成在第一位置移动插头与第一触头接触并移动在响应于输入信号的第二位置中与第一接触件断开接触。

2. 发明授权

US09182454B1 Steered-electron electric-field (SEEF) sensor program 有权
标题翻译：转向电子电场（SEEF）传感器程序
公开(公告)号：US09182454B1
公开(公告)日：2015-11-10
申请号：US13468801
申请日：2012-05-10
申请人： Kirt Reed Williams , Scott Limb , Dirk De Bruyker
发明人： Kirt Reed Williams , Scott Limb , Dirk De Bruyker
IPC分类号： G01R33/02 , G01R1/04 , G01R15/26
CPC分类号： H01J23/09 , G01R33/0213
摘要： Improved electric field (steered-electron electric-field, or SEEF) sensors and methods of manufacturing the same are provided. The SEEF sensors described herein may have increased sensitivity to low-frequency electric fields while being smaller than previously known sensors, and may allow for low-power electric field detection. The invention described herein allows for sensitive, long-term electric field monitoring for applications ranging from personnel detection to underground facility monitoring, as well as extraordinarily small vector sensing (full Poynting vector) for compact direction-finding of emitters of interest. Exemplary electric field sensors may accurately sense, measure, characterize and/or transmit electric field data over a wide frequency range. Importantly, such sensing, measuring, and/or characterizing do not require any physical or resistive contact between the sensor and a source of an electric field.
摘要翻译：提供改进的电场（转向电子电场或SEEF）传感器及其制造方法。本文所述的SEEF传感器可能具有对低频电场的增加的灵敏度，同时小于先前已知的传感器，并且可以允许低功率电场检测。本文所述的发明允许对从人员检测到地下设备监测的应用的敏感的长期电场监测以及用于紧凑的感兴趣的发射器的方向寻找的非常小的矢量感测（全坡普廷矢量）。示例性电场传感器可以在宽的频率范围内精确地感测，测量，表征和/或传输电场数据。重要的是，这种感测，测量和/或表征不需要传感器和电场源之间的任何物理或电阻接触。

3. 发明授权

US08241509B2 Capillary-channel probes for liquid pickup, transportation and dispense using stressy metal 有权
标题翻译：用于采用压力金属的液体拾取，运输和分配的毛细管通道探头
公开(公告)号：US08241509B2
公开(公告)日：2012-08-14
申请号：US12428397
申请日：2009-04-22
申请人： Thomas Hantschel , David K. Fork , Eugene M. Chow , Dirk De Bruyker , Michel A. Rosa
发明人： Thomas Hantschel , David K. Fork , Eugene M. Chow , Dirk De Bruyker , Michel A. Rosa
IPC分类号： C40B50/18
CPC分类号： G01N35/1074 , B01J2219/00387 , B01L3/0244 , B01L3/0255 , B01L3/502715 , B01L2300/0819 , B01L2400/025 , B01L2400/0406 , B41J2/14314 , B41J2/16 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1639 , B41J2/1643 , C40B60/14 , G01N35/1009 , G01N2035/00237 , G01N2035/1037 , G03F7/0002 , Y10T436/2575
摘要： Fluidic conduits, which can be used in microarraying systems, dip pen nanolithography systems, fluidic circuits, and microfluidic systems, are disclosed that use channel spring probes that include at least one capillary channel. Formed from spring beams (e.g., stressy metal beams) that curve away from the substrate when released, channels can either be integrated into the spring beams or formed on the spring beams. Capillary forces produced by the narrow channels allow liquid to be gathered, held, and dispensed by the channel spring probes. Because the channel spring beams can be produced using conventional semiconductor processes, significant design flexibility and cost efficiencies can be achieved.
摘要翻译：公开了可用于微阵列系统，浸笔纳米光刻系统，流体回路和微流体系统的流体导管，其使用包括至少一个毛细通道的通道弹簧探针。由释放时从基板弯曲的弹簧梁（例如，应力金属梁）形成，通道可以集成到弹簧梁中或形成在弹簧梁上。由窄通道产生的毛细管力允许液体被通道弹簧探针收集，保持和分配。由于可以使用传统的半导体工艺制造通道弹簧梁，所以可以实现显着的设计灵活性和成本效率。

4. 发明申请

US20100295165A1 STRESS-ENGINEERED INTERCONNECT PACKAGES WITH ACTIVATOR-ASSISTED MOLDS 有权
标题翻译：具有激活器辅助功能的应力工程互连包
公开(公告)号：US20100295165A1
公开(公告)日：2010-11-25
申请号：US12471188
申请日：2009-05-22
申请人： Christopher L. Chua , Bowen Cheng , Eugene M. Chow , Dirk De Bruyker
发明人： Christopher L. Chua , Bowen Cheng , Eugene M. Chow , Dirk De Bruyker
IPC分类号： H01L23/48 , H01L21/50
CPC分类号： H01L21/50 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/0401 , H01L2224/05568 , H01L2224/05599 , H01L2224/1111 , H01L2224/11334 , H01L2224/13005 , H01L2224/13016 , H01L2224/13027 , H01L2224/16105 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/73104 , H01L2224/81903 , H01L2224/83193 , H01L2224/83855 , H01L2224/83859 , H01L2224/83874 , H01L2224/83885 , H01L2224/9211 , H01L2924/00013 , H01L2924/00014 , H01L2924/0002 , H01L2924/01006 , H01L2924/01018 , H01L2924/01024 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/0132 , H01L2924/09701 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/351 , H05K3/321 , H05K3/4015 , H05K2201/0311 , H01L2224/81 , H01L2224/83 , H01L2224/13099 , H01L2224/05099 , H01L2924/01015 , H01L2924/01049 , H01L2924/01031 , H01L2224/13599 , H01L2224/29099 , H01L2224/29599 , H01L2224/05552 , H01L2924/00
摘要： A package has a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, a chemical activator in the interconnect area, and an adhesive responsive to the chemical activator in the interconnect area. A package has a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, a chemical activator on one of either the pad chip or the spring chip, and an adhesive responsive to the chemical activator on the other of either the pad chip or the spring chip. A method includes providing a pad chip having contact pads, providing a spring chip having micro-springs, applying a chemical activator to one of either the pad chip or the spring chip, applying an adhesive responsive to the chemical activator on the other of the pad chip or the spring chip, aligning the pad chip to the spring chip such that the micro-springs will contact the contact pads, and pressing the pad chip and the spring chip together such that the chemical activator at least partially cures the adhesive.
摘要翻译：封装具有具有接触焊盘的焊盘芯片，具有与接触焊盘接触以形成互连的微弹簧的弹簧芯片，微弹簧接触形成互连区域的接触焊盘的区域，互连中的化学活化剂区域，以及响应于互连区域中的化学活化剂的粘合剂。封装具有焊盘芯片，其具有接触焊盘，弹簧芯片，其具有与接触焊盘接触以形成互连的微弹簧，在焊盘芯片或弹簧芯片之一上的化学活化剂以及响应于化学活化剂的粘合剂另一方面是垫片芯片或弹簧芯片。一种方法包括提供具有接触焊盘的焊盘芯片，提供具有微弹簧的弹簧芯片，将化学活化剂施加到衬垫芯片或弹簧芯片中的一个上，在衬垫的另一个上施加响应于化学活化剂的粘合剂芯片或弹簧芯片，将焊盘芯片对准弹簧芯片，使得微弹簧将接触接触焊盘，并将焊盘芯片和弹簧芯片压在一起，使得化学活化器至少部分地固化粘合剂。

5. 发明申请

US20080141877A1 DIGITAL PRINTING PLATE AND SYSTEM WITH ELECTROSTATICALLY LATCHED DEFORMABLE MEMBRANES 有权
标题翻译：数字打印板和系统与静电拼接可变形膜
公开(公告)号：US20080141877A1
公开(公告)日：2008-06-19
申请号：US11613159
申请日：2006-12-19
申请人： Dirk De Bruyker , JengPing Lu , Jurgen H. Daniel , Eugene M. Chow , Armin R. Volkel
发明人： Dirk De Bruyker , JengPing Lu , Jurgen H. Daniel , Eugene M. Chow , Armin R. Volkel
IPC分类号： B41M1/10
CPC分类号： B41M1/10 , B41M1/04 , B41M1/06 , H05K3/207 , H05K2201/091 , H05K2203/105
摘要： A printing surface includes a substrate having latching electrodes on a first surface, a spacer layer on the first surface of the substrate, the spacer layer patterned to form wells such that the latching electrodes reside in the wells, a deformable membrane, the membrane having conductive regions, on the spacer layer to enclose the wells, each enclosed well and its associated region of the membrane forming a pixel membrane, and actuation circuitry to actuate the electrodes to cause selected ones of the pixel membranes to remain in a deflected state when the pixel membranes receive an impulse to return to an undeflected state.
摘要翻译：打印表面包括在第一表面上具有锁定电极的基板，在基板的第一表面上的间隔层，图案化的间隔层以形成孔，使得锁定电极驻留在孔中，可变形的膜，该膜具有导电区域，在间隔层上包围孔，每个封闭的井及其膜的相关区域形成像素膜，以及致动电路，用于致动电极，以使像素膜中选定的像素膜保持在偏转状态，当像素膜受到冲击以返回到未偏转的状态。

6. 发明申请

US20050102833A1 RELEASE HEIGHT ADJUSTMENT OF STRESSY METAL DEVICES BY ANNEALING BEFORE AND AFTER RELEASE 有权
标题翻译：通过在发布之前和之后通过退火释放强度金属器件的高度调整
公开(公告)号：US20050102833A1
公开(公告)日：2005-05-19
申请号：US10715978
申请日：2003-11-17
申请人： Thomas Hantschel , David Fork , Dirk De Bruyker , Chinnwen Shih , Jeng Lu , Christopher Chua , Raj Apte , Brent Krusor
发明人： Thomas Hantschel , David Fork , Dirk De Bruyker , Chinnwen Shih , Jeng Lu , Christopher Chua , Raj Apte , Brent Krusor
IPC分类号： G01R1/067 , G01R3/00 , H05K3/40 , H05K1/00
CPC分类号： G01R1/06744 , G01R1/06727 , G01R3/00 , H05K3/4092 , Y10T29/49204 , Y10T29/49208 , Y10T29/49218 , Y10T29/49222
摘要： Spring structures are subjected to pre-release and post-release annealing to tune their tip height to match a specified target. Post-release annealing increases tip height, and pre-release annealing decreases tip height. The amount of tuning is related to the annealing temperature and/or time. Annealing schedules are determined for a pre-fabricated cache of unreleased spring structures such that finished spring structures having a variety of target heights can be economically produced by releasing/annealing the cache according to associated annealing schedules. Selective annealing is performed using lasers and heat absorbing/reflecting materials. Localized annealing is used to generate various spring structure shapes. Both stress-engineered and strain-engineered spring structures are tuned by annealing.
摘要翻译：弹簧结构经受预释放和后释放退火以调节其尖端高度以匹配指定的靶。后释放退火增加尖端高度，并且预释放退火使尖端高度降低。调谐量与退火温度和/或时间有关。对于未发布的弹簧结构的预制缓存来确定退火计划，使得可以通过根据相关联的退火计划释放/退火高速缓存来经济地产生具有各种目标高度的成品弹簧结构。使用激光和吸热/反射材料进行选择性退火。定位退火用于产生各种弹簧结构形状。应力设计和应变工程弹簧结构都通过退火进行调整。

7. 发明授权

US08130072B2 Vanadium oxide thermal microprobes 有权
标题翻译：氧化钒热敏微波
公开(公告)号：US08130072B2
公开(公告)日：2012-03-06
申请号：US12467089
申请日：2009-05-15
申请人： Dirk De Bruyker , Michal V. Wolkin
发明人： Dirk De Bruyker , Michal V. Wolkin
IPC分类号： H01C7/00
CPC分类号： H01G5/0136 , G01K1/14 , G01K7/226 , H01C7/008 , H01C17/06533 , H01G5/18 , Y10T29/49085
摘要： A temperature probe includes a substrate, a cantilever body portion formed on the substrate, having an anchor portion held in contact to the substrate and a free end portion extending out of the surface of the substrate, and a sputter-deposited thermistor sensor portion located at the free end portion of the cantilever body portion.
摘要翻译：温度探针包括基板，形成在基板上的悬臂主体部分，具有与基板保持接触的锚固部分和从基板的表面延伸出的自由端部分，以及溅射沉积的热敏电阻传感器部分，位于悬臂主体部分的自由端部分。

8. 发明授权

US08039938B2 Airgap micro-spring interconnect with bonded underfill seal 有权
标题翻译：气隙微弹簧互连带粘合底部填充密封
公开(公告)号：US08039938B2
公开(公告)日：2011-10-18
申请号：US12471163
申请日：2009-05-22
申请人： Christopher L. Chua , Bowen Cheng , Eugene M. Chow , Dirk De Bruyker
发明人： Christopher L. Chua , Bowen Cheng , Eugene M. Chow , Dirk De Bruyker
IPC分类号： H01L23/495 , H01L23/02 , H01L23/52 , H01L23/48 , H01L23/34
CPC分类号： H01L21/563 , H01L24/01 , H01L24/13 , H01L24/17 , H01L24/81 , H01L25/0657 , H01L33/62 , H01L2224/13016 , H01L2224/1703 , H01L2224/17051 , H01L2224/17505 , H01L2224/17517 , H01L2224/73204 , H01L2224/81192 , H01L2224/81855 , H01L2224/81902 , H01L2224/83192 , H01L2225/06527 , H01L2225/06575 , H01L2225/06593 , H01L2924/01006 , H01L2924/01018 , H01L2924/01024 , H01L2924/01042 , H01L2924/01045 , H01L2924/014 , H01L2924/09701 , H01L2924/10329 , H01L2924/14 , H01L2924/181 , H01L2924/351 , H01L2924/00
摘要： A package includes a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, an assembly material between the pad chip and the spring chip arranged to form a gap between the pad chip and the spring chip, and an underfill material in a portion of the gap to form a mold from the pad chip and the spring chip. A package includes a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, an assembly material between the pad chip and the spring chip arranged to form a gap between the pad chip and the spring chip, an underfill material in the gap to form a mold from the pad chip and the spring chip, and at least one wall between the underfill material and the interconnect area. A method of assembling a package includes aligning a pad chip with a spring chip to form at least one interconnect in an interconnect area, adhering the pad chip to the spring chip so that there is a gap between the pad chip and the spring chip, dispensing underfill material into the gap to seal the interconnect area from an environment external to the package, and curing the underfill material to form a solid mold.
摘要翻译：封装包括具有接触焊盘的焊盘芯片，具有与接触焊盘接触以形成互连的微弹簧的弹簧芯片，微弹簧接触形成互连区域的接触焊盘的区域，焊盘之间的组合材料芯片和布置成在垫片芯片和弹簧芯片之间形成间隙的弹簧芯片，以及在间隙的一部分中的底部填充材料，以从垫片芯片和弹簧芯片形成模具。封装包括具有接触焊盘的焊盘芯片，具有与接触焊盘接触以形成互连的微弹簧的弹簧芯片，微弹簧接触形成互连区域的接触焊盘的区域，焊盘之间的组合材料芯片和弹簧芯片布置成在垫片芯片和弹簧芯片之间形成间隙，间隙中的底部填充材料从垫片芯片和弹簧芯片形成模具，以及底部填充材料和互连件之间的至少一个壁区。组装包装的方法包括将衬垫芯片与弹簧芯片对准以在互连区域中形成至少一个互连，将焊盘芯片粘附到弹簧芯片，使得在垫片芯片和弹簧芯片之间存在间隙，分配将填充材料填充到间隙中以将互连区域与包装外部的环境密封，并固化底部填充材料以形成固体模具。

9. 发明申请

US20100290501A1 NANOCALORIMETER BASED ON THERMAL PROBES 有权
标题翻译：基于热探测器的南极运动
公开(公告)号：US20100290501A1
公开(公告)日：2010-11-18
申请号：US12467072
申请日：2009-05-15
申请人： Dirk De Bruyker , Francisco E. Torres , Michal V. Wolkin , Gregory B. Anderson , Eugene M. Chow
发明人： Dirk De Bruyker , Francisco E. Torres , Michal V. Wolkin , Gregory B. Anderson , Eugene M. Chow
IPC分类号： G01K17/00
CPC分类号： G01K17/006 , B82Y35/00 , G01K2211/00
摘要： A nanocalorimeter includes a merging layer having, a drop placement area for holding drops to be merged and a thermal equilibration area. A measurement layer includes a substrate, and a temperature probe on the substrate, wherein the temperature probe extends out of the surface of the substrate to come into operative contact with the thermal equilibration area when the measurement layer is placed in operative association with the merging layer. The nanocalorimeter is configured to have the merging layer and the measurement layer non-integrated, making the measurement layer reusable.
摘要翻译：纳米尺度计包括具有用于保持要合并的液滴的液滴放置区域和热平衡区域的合并层。测量层包括衬底和衬底上的温度探针，其中当测量层与合并层可操作地相关联时，温度探针从衬底的表面延伸出来以与热平衡区域操作接触。纳米尺度计被配置为具有合并层和测量层非集成，使得测量层可重复使用。

10. 发明授权

US07833800B2 Thermal sensing with bridge circuitry 有权
标题翻译：具有桥接电路的热感测
公开(公告)号：US07833800B2
公开(公告)日：2010-11-16
申请号：US11167612
申请日：2005-06-27
申请人： Alan Bell , Richard H. Bruce , Eric Peeters , Michal V. Wolkin , Dirk De Bruyker
发明人： Alan Bell , Richard H. Bruce , Eric Peeters , Michal V. Wolkin , Dirk De Bruyker
IPC分类号： G01N33/00
CPC分类号： G01K7/30 , G01K17/00 , G01N25/482
摘要： Thermal sensing devices can include two subsets of thermal sensors connected in a bridge by circuitry on the same support layer or surface with the sensors. Each thermal sensor can be formed in a patterned layer of semiconductor material, and the bridge circuitry can include leads formed in a patterned layer of conductive material, over or under the semiconductor layer. In one implementation, the bridge circuitry includes conductive portions that extend across and electrically contact the lower surface of each sensor's semiconductor slab. The bridge circuitry can also include pads that can be electrically contacted, such as by pogo pins. The device's reaction surface can be spaced apart from or over the thermal sensors. The device's components can be shaped and positioned so that the bridge's offset voltage is below the sensitivity level required for an application, such as by left-right symmetry about an axis.
摘要翻译：热感测装置可以包括通过与传感器相同的支撑层或表面上的电路在桥中连接的两个热传感器子集。每个热传感器可以形成在半导体材料的图案化层中，并且桥接电路可以包括形成在导电材料的图案化层中的引线，在半导体层之上或之下。在一个实施方式中，桥接电路包括导电部分，其延伸并且电接触每个传感器的半导体板的下表面。桥接电路还可以包括可以电接触的焊盘，例如通过弹簧销。设备的反应表面可以与热传感器间隔开或超过热传感器。该装置的部件可以被成形和定位，使得桥的偏移电压低于应用所需的灵敏度水平，例如通过关于轴的左右对称。

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