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    • 4. 发明授权
    • Detecting defective ejector in digital lithography system
    • 在数字光刻系统中检测有缺陷的喷射器
    • US07514114B2
    • 2009-04-07
    • US11218416
    • 2005-09-01
    • William S. WongSteven E. ReadyAna Claudia Arias
    • William S. WongSteven E. ReadyAna Claudia Arias
    • C23C16/52B05D5/12
    • B41J29/393
    • A digital lithography system prints a large-area electronic device by dividing the overall device printing process into a series of discrete feature printing sub-processes, where each feature printing sub-process involves printing both a predetermined portion (feature) of the device in a designated substrate area, and an associated test pattern in a designated test area that is remote from the feature. At the end of each feature printing sub-process, the test pattern is analyzed, e.g., using a camera and associated imaging system, to verify that the test pattern has been successfully printed. A primary ejector is used until an unsuccessfully printed test pattern is detected, at which time a secondary (reserve) ejector replaces the primary ejector and reprints the feature associated with the defective test pattern. When multiple printheads are used in parallel, analysis of the test pattern is used to efficiently identify the location of a defective ejector.
    • 数字光刻系统通过将整个设备打印过程划分成一系列离散特征打印子过程来打印大面积电子设备,其中每个特征打印子过程涉及将设备的预定部分(特征)打印在一个 指定的基板区域以及远离该特征的指定测试区域中的关联测试图案。 在每个特征打印子过程结束时,分析测试图案,例如使用相机和相关联的成像系统来验证测试图案是否已被成功打印。 使用初级喷射器,直到检测到未成功打印的测试图案,此时次要(预留)喷射器取代主喷射器并重印与缺陷测试图案相关的特征。 当并行使用多个打印头时,使用测试图案的分析来有效地识别有缺陷的喷射器的位置。
    • 6. 发明授权
    • Patterned-print thin-film transistors with top gate geometry
    • 具有顶栅几何形状的图案印刷薄膜晶体管
    • US07344928B2
    • 2008-03-18
    • US11193847
    • 2005-07-28
    • William S. WongRene A. LujanEugene M. Chow
    • William S. WongRene A. LujanEugene M. Chow
    • H01L21/84
    • H01L29/41733H01L27/124H01L27/1285H01L27/1288H01L27/1292H01L29/42384H01L29/4908H01L29/66757
    • A self-aligned, thin-film, top-gate transistor and method of manufacturing same are disclosed. A first print-patterned mask is formed over a metal layer by digital lithography, for example by printing with a phase change material using a droplet ejector. The metal layer is then etched using the first print-patterned mask to form source and drain electrodes. A semiconductive layer and an insulative layer are formed thereover. A layer of photosensitive material is then deposited and exposed through the substrate, with the source and drain electrodes acting as masks for the exposure. Following development of the photosensitive material, a gate metal layer is deposited. A second print-patterned mask is then formed over the device, again by digital lithography. Etching and removal of the photosensitive material leaves the self-aligned top-gate electrode.
    • 公开了一种自对准薄膜顶栅晶体管及其制造方法。 通过数字光刻在金属层上形成第一印刷图案掩模,例如通过使用液滴喷射器用相变材料进行印刷。 然后使用第一印刷图案化掩模蚀刻金属层以形成源极和漏极。 在其上形成半导体层和绝缘层。 然后将一层感光材料沉积并暴露通过基底,源极和漏极用作曝光的掩模。 在感光材料的显影之后,沉积栅极金属层。 然后再次通过数字光刻法在器件上形成第二印刷图案掩模。 蚀刻和去除感光材料离开自对准顶栅电极。
    • 9. 发明授权
    • Geometry and design for conformal electronics
    • 适形电子学的几何和设计
    • US08492876B2
    • 2013-07-23
    • US12253390
    • 2008-10-17
    • William S. WongBrent S. KrusorRobert A. Street
    • William S. WongBrent S. KrusorRobert A. Street
    • H01L29/06
    • H05K3/0044G02F2201/56H01L27/14603H01L27/14692H01L27/14812H01L29/78603
    • A method of forming a three-dimensional electronic device includes forming at least one electronic device on a two-dimensional, flexible substrate, the electronic device being formed according to a three-dimensional structure, cutting the two-dimensional, flexible substrate, the cuts being located to allow the two-dimensional substrate to be shaped, the cuts having at least one stress relief feature, and shaping the two-dimensional, flexible substrate to form the three-dimensional structure, the stress relief features arranged to alleviate stress in the three-dimensional structure. A method of forming a three-dimensional electronic device includes forming at least one electronic device on a two-dimensional, flexible substrate, the electronic device being formed according to a three-dimensional structure, cutting the two-dimensional, flexible substrate, the cuts being arranged to as to increase a radius of curvature to meet a stress relief parameter when the substrate is shaped, and shaping the two-dimensional, flexible substrate to form the three-dimensional structure. A three-dimensional electronic device having an electronic device formed on a flexible substrate, the flexible substrate formed into a three-dimensional structure, wedged-shaped portions removed from the substrate to allow the substrate to be formed into the three-dimensional structure, and a stress relief feature arranged adjacent to the wedge-shaped portions.
    • 形成三维电子器件的方法包括在二维柔性基板上形成至少一个电子器件,该电子器件根据三维结构形成,切割二维柔性基片,切割 被设置成允许二维基底成形,切口具有至少一个应力消除特征,并且成形二维柔性基底以形成三维结构,应力消除特征被设置为减轻二维基底中的应力 三维结构。 形成三维电子器件的方法包括在二维柔性基板上形成至少一个电子器件,该电子器件根据三维结构形成,切割二维柔性基片,切割 被布置成当基底成形时增加曲率半径以满足应力消除参数,并且将二维柔性基底成形以形成三维结构。 一种具有形成在柔性基板上的电子器件的三维电子器件,形成为三维结构的柔性衬底,从衬底移除楔形部分以使衬底形成三维结构;以及 紧邻楔形部分布置的应力消除特征。